JPH0817772A - Rotary substrate washing device - Google Patents

Rotary substrate washing device

Info

Publication number
JPH0817772A
JPH0817772A JP17330194A JP17330194A JPH0817772A JP H0817772 A JPH0817772 A JP H0817772A JP 17330194 A JP17330194 A JP 17330194A JP 17330194 A JP17330194 A JP 17330194A JP H0817772 A JPH0817772 A JP H0817772A
Authority
JP
Japan
Prior art keywords
substrate
brush
cleaning
cleaning liquid
supply nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17330194A
Other languages
Japanese (ja)
Inventor
Yoshio Matsumura
吉雄 松村
Satoru Tanaka
悟 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP17330194A priority Critical patent/JPH0817772A/en
Publication of JPH0817772A publication Critical patent/JPH0817772A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To provide a rotary substrate washing device which can reduce washing time and switch between a washing using a brash and a washing with out using the brush as needed. CONSTITUTION:An elevation plate 32 is mounted, via an interlocking member 31, to the outer periphery of a washing liquid supply nozzle 21 for supplying washing liquid onto the surface of a substrate W which is retained at a rotary stand. With the elevation plate 32, a guide shaft 33 being provided on the lower surface is inserted to a bearing 34 provided at an arm 22 and at the same time is screwed into a screw shaft 36 which is rotated and driven by a motor 35 provided inside the arm 22. The elevation late 32 is raised or lowered according to the rotation of the screw shaft 36, thus switching the brush 30 to a position Q1 where it operates on the surface of the substrate W and a position Q2 where it does not operates on the surface of the substrate W.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、回転する基板表面に洗
浄液を供給して基板表面を洗浄する回転式基板洗浄装置
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rotary substrate cleaning apparatus for supplying a cleaning liquid to a rotating substrate surface to clean the substrate surface.

【0002】[0002]

【従来の技術】従来、この種の基板洗浄装置は、基板を
回転可能に保持する回転保持部材と、回転保持部材に保
持された基板表面に超音波振動が付与された洗浄液を供
給する洗浄液供給ノズルと、洗浄液供給ノズルとは別に
設けられたブラシとから構成されている。まず、ブラシ
を基板表面に接する位置まで移動し、基板を回転させな
がら、基板表面に洗浄液を供給してブラシを揺動させる
ことにより、基板表面に付着している比較的大きいパー
ティクルが除去される。次に、ブラシを基板上方から退
避させた後、洗浄液供給ノズルを基板上方に移動し、回
転する基板表面に向けて洗浄液を供給しながら洗浄液供
給ノズルを揺動させることにより、基板表面に付着して
いる細かいパーティクルが除去される。
2. Description of the Related Art Conventionally, a substrate cleaning apparatus of this type has a rotation holding member for rotatably holding a substrate and a cleaning liquid supply for supplying a cleaning liquid with ultrasonic vibration applied to the surface of the substrate held by the rotation holding member. It is composed of a nozzle and a brush provided separately from the cleaning liquid supply nozzle. First, the brush is moved to a position in contact with the substrate surface, the cleaning liquid is supplied to the substrate surface while the substrate is rotated, and the brush is swung to remove relatively large particles adhering to the substrate surface. . Next, after the brush is retracted from above the substrate, the cleaning liquid supply nozzle is moved above the substrate, and the cleaning liquid supply nozzle is swung while supplying the cleaning liquid toward the rotating substrate surface, thereby adhering to the substrate surface. Fine particles are removed.

【0003】また、洗浄液供給ノズルにブラシを取り付
けた洗浄装置として、例えば、特開平5−15857号
公報に記載されたものが知られている。この装置は、基
板を回転可能に保持する回転保持部材と、回転保持部材
に保持された基板表面に洗浄液を供給する洗浄液供給ノ
ズルと、洗浄液供給ノズルの周囲に回転自在に配置され
たブラシとを備えている。回転する基板表面に洗浄液供
給ノズルから洗浄液を供給するとともに、ブラシを基板
表面に摺接させた状態で、洗浄液供給ノズルとブラシと
を基板表面に沿って揺動させることにより、基板の全面
にわたり洗浄液とブラシとによる洗浄が行われる。
As a cleaning device in which a brush is attached to the cleaning liquid supply nozzle, for example, a cleaning device described in Japanese Patent Laid-Open No. 15857/1993 is known. This apparatus includes a rotation holding member that rotatably holds a substrate, a cleaning liquid supply nozzle that supplies a cleaning liquid to the surface of the substrate held by the rotation holding member, and a brush that is rotatably arranged around the cleaning liquid supply nozzle. I have it. The cleaning liquid is supplied to the rotating substrate surface from the cleaning liquid supply nozzle, and the cleaning liquid supply nozzle and the brush are swung along the substrate surface while the brush is in sliding contact with the substrate surface, thereby cleaning the entire surface of the substrate. And cleaning with a brush.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、上述し
た従来装置には次のような問題点がある。すなわち、前
者の従来装置では、ブラシによる洗浄と洗浄液供給ノズ
ルによる洗浄とが別々に行われているので、洗浄に要す
る時間が長く、さらに、基板の大型化にともない、洗浄
に要する処理時間が長いものであった。
However, the above-mentioned conventional apparatus has the following problems. That is, in the former conventional apparatus, since the cleaning with the brush and the cleaning with the cleaning liquid supply nozzle are performed separately, the time required for cleaning is long, and further, the processing time required for cleaning is long with the increase in size of the substrate. It was.

【0005】また、後者の従来装置では、洗浄液の拡散
作用とブラシの摺接作用とによって基板表面を洗浄して
いるだけなので、その洗浄効果が弱く、基板表面に付着
した細かいパーティクルを除去しきれない。また、洗浄
効果が弱いので、基板の大型化に伴い、基板の洗浄に要
する処理時間が長いものであった。
Further, in the latter conventional apparatus, since the substrate surface is only cleaned by the diffusion action of the cleaning liquid and the sliding contact action of the brush, the cleaning effect is weak and fine particles adhering to the substrate surface cannot be completely removed. Absent. Further, since the cleaning effect is weak, the processing time required for cleaning the substrate is long as the size of the substrate is increased.

【0006】さらに、基板表面から除去すべきパーティ
クルの種類や基板そのものの材質等によっては、ブラシ
洗浄による基板表面への影響を避けるために、ブラシを
用いた洗浄とブラシを用いない洗浄とに使い分けること
が可能な装置が望まれている。しかし、後者の従来装置
ではブラシと洗浄液供給ノズルが一体に構成されている
ので、ブラシと洗浄液供給ノズルとを使い分けることが
できなかった。
Further, depending on the type of particles to be removed from the surface of the substrate, the material of the substrate itself, etc., in order to avoid the influence of the brush cleaning on the surface of the substrate, cleaning with a brush and cleaning without a brush are used separately. There is a need for a device that is capable of doing so. However, in the latter conventional device, since the brush and the cleaning liquid supply nozzle are integrally formed, it is not possible to properly use the brush and the cleaning liquid supply nozzle.

【0007】本発明は、このような事情に鑑みてなされ
たものであって、洗浄時間を短縮でき、かつ必要に応じ
てブラシ洗浄とブラシを用いない洗浄とを切り替えるこ
とができる回転式基板洗浄装置を提供することにある。
The present invention has been made in view of the above circumstances, and can shorten the cleaning time, and can switch between brush cleaning and cleaning without using a brush as needed. To provide a device.

【0008】[0008]

【課題を解決するための手段】本発明は、上記目的を達
成するために次のような構成をとる。すなわち、請求項
1に記載の回転式基板洗浄装置は、回転する基板表面に
洗浄液を供給して基板表面を洗浄する回転式基板洗浄装
置において、基板を回転可能に保持する基板回転保持手
段と、前記の基板回転保持手段によって保持された基板
表面に超音波振動が付与された洗浄液を供給する洗浄液
供給ノズルと、前記洗浄液供給ノズルの周囲に配置さ
れ、基板表面を洗浄するブラシと、前記ブラシが基板表
面に洗浄効果を及ぼす作用位置と、前記ブラシが基板表
面に洗浄効果を及ぼさない非作用位置とにわたって前記
ブラシの位置を切り替える切替手段と、を備えたもので
ある。
The present invention has the following constitution in order to achieve the above object. That is, the rotary substrate cleaning apparatus according to claim 1 is a rotary substrate cleaning apparatus for cleaning a substrate surface by supplying a cleaning liquid to a rotating substrate surface, and a substrate rotation holding unit for rotatably holding the substrate, A cleaning liquid supply nozzle for supplying a cleaning liquid to which ultrasonic vibration is applied to the substrate surface held by the substrate rotation holding means, a brush disposed around the cleaning liquid supply nozzle and cleaning the substrate surface, and the brush are A switching means for switching the position of the brush between an operating position where the cleaning effect is exerted on the substrate surface and a non-operating position where the brush exerts no cleaning effect on the substrate surface is provided.

【0009】また、請求項2記載の回転式基板洗浄装置
は、請求項1に記載の装置において、前記ブラシが、前
記洗浄液供給ノズルに対して昇降自在に配置され、前記
切替手段が、前記ブラシを昇降させることによって前記
ブラシを前記作用位置と前記非作用位置とにわたって切
り替えるものである。
According to a second aspect of the present invention, there is provided the rotary substrate cleaning apparatus according to the first aspect, wherein the brush is arranged so as to be movable up and down with respect to the cleaning liquid supply nozzle, and the switching means is the brush. By moving up and down, the brush is switched between the working position and the non-working position.

【0010】さらに、請求項3記載の回転式基板洗浄装
置は、請求項1に記載の装置において、前記ブラシが、
前記洗浄液供給ノズルに対して固定配置され、前記切替
手段が、前記ブラシと前記洗浄液供給ノズルとを一体に
昇降させることによって前記ブラシを前記作用位置と前
記非作用位置とにわたって切り替えるものである。
Further, the rotary substrate cleaning apparatus according to claim 3 is the apparatus according to claim 1, wherein the brush is
Fixedly arranged with respect to the cleaning liquid supply nozzle, the switching means switches the brush between the working position and the non-working position by raising and lowering the brush and the cleaning liquid supply nozzle integrally.

【0011】[0011]

【作用】請求項1の発明の作用は次のとおりである。ま
ず、基板回転保持手段によって基板が保持される。次
に、切替手段によってブラシが基板表面に作用する位置
に位置決めされた状態で、洗浄液供給ノズルから基板表
面に超音波振動が付与された洗浄液が供給される。そし
て、基板回転保持手段によって基板が回転されながら、
ブラシによる摺接洗浄と超音波振動が付与された洗浄液
とによる基板表面の洗浄が同時に行われる。
The operation of the invention of claim 1 is as follows. First, the substrate is held by the substrate rotation holding means. Next, in a state in which the brush is positioned at a position where the brush acts on the substrate surface by the switching means, the cleaning liquid to which ultrasonic vibration is applied is supplied to the substrate surface from the cleaning liquid supply nozzle. Then, while the substrate is rotated by the substrate rotation holding means,
The cleaning of the sliding surface with a brush and the cleaning of the substrate surface with the cleaning liquid to which ultrasonic vibration is applied are performed simultaneously.

【0012】ブラシを用いない洗浄の場合は、切替手段
によってブラシが基板表面に作用しない位置に切り替え
られた状態で、洗浄液供給ノズルから基板表面に超音波
振動が付与された洗浄液が供給される。そして、基板回
転保持手段によって基板が回転されながら、超音波振動
が付与された洗浄液による基板表面の洗浄が行われる。
In the case of cleaning without using a brush, the cleaning liquid supplied with ultrasonic vibration is supplied to the substrate surface from the cleaning liquid supply nozzle in a state where the brush is switched to a position where it does not act on the substrate surface by the switching means. Then, while the substrate is rotated by the substrate rotation holding means, the substrate surface is cleaned with the cleaning liquid to which ultrasonic vibration is applied.

【0013】また、請求項2の発明によれば、切替手段
によって、洗浄液供給ノズルに対して昇降自在に配置さ
れたブラシが下降され、ブラシが作用位置に位置決めさ
れる。一方、ブラシを用いない洗浄の場合は、切替手段
によって、洗浄液供給ノズルをその位置に保持した状態
でブラシが上昇され、ブラシが非作用位置に切り替えら
れる。
According to the second aspect of the present invention, the brush arranged to be movable up and down with respect to the cleaning liquid supply nozzle is lowered by the switching means, and the brush is positioned at the working position. On the other hand, in the case of cleaning without using a brush, the brush is raised by the switching means while the cleaning liquid supply nozzle is held at that position, and the brush is switched to the non-acting position.

【0014】さらに、請求項3の発明によれば、切替手
段によって、洗浄液供給ノズルとブラシとが一体に下降
され、ブラシが作用位置に位置決めされる。一方、ブラ
シを用いない洗浄の場合は、切替手段によって、洗浄液
供給ノズルとブラシとが一体に上昇され、ブラシが非作
用位置に切り替えられる。
Further, according to the invention of claim 3, the cleaning liquid supply nozzle and the brush are integrally lowered by the switching means, and the brush is positioned at the working position. On the other hand, in the case of cleaning without using a brush, the cleaning liquid supply nozzle and the brush are integrally lifted by the switching means, and the brush is switched to the non-acting position.

【0015】[0015]

【実施例】以下、図面を参照して本発明の実施例を説明
する。図1は本発明に係る回転式基板洗浄装置の一実施
例の一部切り欠き斜視図、図2はノズル先端の縦断面
図、図3は図2のA−A矢視図である。
Embodiments of the present invention will be described below with reference to the drawings. 1 is a partially cutaway perspective view of an embodiment of a rotary substrate cleaning apparatus according to the present invention, FIG. 2 is a vertical sectional view of a nozzle tip, and FIG. 3 is a view taken along the line AA of FIG.

【0016】本実施例の回転式基板洗浄装置は、角型基
板(以下、単に「基板」という)Wを回転可能に保持す
る基板回転保持機構10と、基板回転保持機構10に保
持された基板Wの表面を洗浄する基板洗浄機構20とを
備えている。以下、各部の構成を説明する。
The rotary substrate cleaning apparatus of the present embodiment comprises a substrate rotation holding mechanism 10 for rotatably holding a square substrate (hereinafter simply referred to as “substrate”) W, and a substrate held by the substrate rotation holding mechanism 10. And a substrate cleaning mechanism 20 for cleaning the surface of W. The configuration of each unit will be described below.

【0017】基板回転保持機構10は、基板Wをその表
面が水平になる姿勢で保持する回転台11と、この回転
台11に回転軸12を介して連動連結された図示しない
モータとを備えている。モータの回転駆動により回転台
11上に保持された基板Wが鉛直方向の軸芯P1 周りで
回転される。回転台11の上面に複数個の位置決めピン
13が設けられている。この位置決めピン13間に基板
Wの4隅が当接され、基板Wの中央部が略軸芯P1 に位
置するように位置決めされる。回転台11は飛散防止用
カップ14で覆われている。このカップ14は基板Wの
表面から飛散する洗浄液を受け止めて排出するものであ
る。
The substrate rotation holding mechanism 10 comprises a turntable 11 for holding the substrate W in a posture in which the surface of the substrate W is horizontal, and a motor (not shown) linked to the turntable 11 via a rotary shaft 12. There is. The substrate W held on the turntable 11 is rotated about the vertical axis P 1 by the rotational driving of the motor. A plurality of positioning pins 13 are provided on the upper surface of the turntable 11. The four corners of the substrate W are brought into contact with each other between the positioning pins 13, and the central portion of the substrate W is positioned so as to be positioned substantially on the axis P 1 . The turntable 11 is covered with a scattering prevention cup 14. The cup 14 receives and discharges the cleaning liquid scattered from the surface of the substrate W.

【0018】基板洗浄機構20は、回転台11に保持さ
れた基板Wの表面に洗浄液を供給する洗浄液供給ノズル
21を備えている。この洗浄液供給ノズル21は、カッ
プ14の外方に回転軸芯P1 と平行な回転軸芯P2 周り
で揺動自在に設けられたアーム22に支持されている。
アーム22は支持部材23に片持ち支持され、この支持
部材23が図示しないモータに連結されている。このモ
ータを正逆方向に回転駆動することにより、洗浄液供給
ノズル21が基板Wの上方の待機位置と基板Wの上方か
ら外れた退避位置とにわたって揺動駆動される。また、
支持部材23は、昇降自在に設けられ、待機位置におい
て洗浄液供給ノズル21を待機位置から後述する作用位
置とにわたって昇降させるものである。
The substrate cleaning mechanism 20 includes a cleaning liquid supply nozzle 21 for supplying a cleaning liquid to the surface of the substrate W held on the turntable 11. The cleaning liquid supply nozzle 21 is supported by an arm 22 provided outside the cup 14 so as to be swingable around a rotation axis P 2 parallel to the rotation axis P 1 .
The arm 22 is cantilevered by a support member 23, and the support member 23 is connected to a motor (not shown). By rotating the motor in the forward and reverse directions, the cleaning liquid supply nozzle 21 is rockably driven between a standby position above the substrate W and a retracted position separated from above the substrate W. Also,
The support member 23 is provided so as to be able to move up and down, and raises and lowers the cleaning liquid supply nozzle 21 at the standby position from the standby position to an operation position described later.

【0019】洗浄液供給ノズル21は、図2、図3に示
すように、その下面に開口された吐出口21aを備えて
いる。また、その内部に超音波振動子24を備え、超音
波振動が付与された洗浄液を吐出口21aから基板Wに
供給できるように構成されている。
As shown in FIGS. 2 and 3, the cleaning liquid supply nozzle 21 has a discharge port 21a opened on the lower surface thereof. In addition, an ultrasonic vibrator 24 is provided inside thereof, and the cleaning liquid to which ultrasonic vibration is applied can be supplied to the substrate W from the ejection port 21a.

【0020】洗浄液供給ノズル21の外周に、ナイロン
樹脂等を材料とする毛が植設されたブラシ30が昇降自
在に設けられている。このブラシ30は、連結部材31
を介して昇降プレート32に取り付けられている。昇降
プレート32は、その下面に設けられたガイド軸33が
アーム22に配備された軸受34に内嵌されるととも
に、アーム22の内部に配備されたモータ35によって
回転駆動されるネジ軸36に螺合されている。モータ3
5とネジ軸36とは、本発明の切替手段の相当し、ネジ
軸36の回転によって昇降プレート32が昇降されるこ
とにより、ブラシ30が基板Wの表面に洗浄効果を及ぼ
す作用位置Q1 と、ブラシ30が基板Wの表面に洗浄効
果を及ぼさない非作用位置Q2 とにわたって切り替えら
れる。ここで、前記作用位置Q1 は、ブラシ30の先端
が基板Wの表面に接する位置だけでなく、その先端が基
板Wの表面に接していないが極めて近接していることに
より洗浄液による洗浄効果が高められる位置をも含む。
A brush 30 having bristles made of nylon resin or the like is planted around the outer periphery of the cleaning liquid supply nozzle 21 so as to be movable up and down. This brush 30 has a connecting member 31.
It is attached to the elevating plate 32 via. The elevating plate 32 has a guide shaft 33 provided on the lower surface thereof fitted in a bearing 34 provided in the arm 22 and a screw shaft 36 which is rotationally driven by a motor 35 provided in the arm 22. Have been combined. Motor 3
5 and the screw shaft 36 is equivalent to the switching means of the present invention, by elevating plate 32 is raised and lowered by rotation of the screw shaft 36, and the working position Q 1 which brush 30 exerts a cleaning effect on the surface of the substrate W , The brush 30 is switched over to the non-acting position Q 2 which does not exert a cleaning effect on the surface of the substrate W. Here, the action position Q 1 is not only the position where the tip of the brush 30 is in contact with the surface of the substrate W, but the tip is not in contact with the surface of the substrate W but is extremely close to it, so that the cleaning effect by the cleaning liquid is Also includes the elevated position.

【0021】次に、洗浄動作を説明する。まず、回転台
11上に基板Wを搬入し、その位置決めピン13間に基
板Wの中央部が略軸芯P1 に位置するように位置決めす
る。次に、アーム22を上昇させた状態で洗浄液供給ノ
ズル21を退避位置から待機位置まで揺動変位させる。
さらに、ブラシ30を基板Wの表面に接する(あるいは
近接する)ように作用位置Q1 まで下降させる。そし
て、洗浄液供給ノズル21から超音波振動が付与された
洗浄液を基板Wの表面に向けて供給する。そして、回転
台11を回転させて基板Wを回転させながら、ブラシ3
0を作用位置Q1 に保ったままでアーム22を基板Wの
表面に沿って揺動変位させ、ブラシ30による摺接洗浄
と超音波振動が付与された洗浄液とにより基板Wの表面
全面が洗浄される。
Next, the cleaning operation will be described. First, the substrate W is loaded on the turntable 11 and positioned between the positioning pins 13 so that the central portion of the substrate W is located at the substantially axis P 1 . Next, the cleaning liquid supply nozzle 21 is swingably displaced from the retracted position to the standby position while the arm 22 is raised.
Further, the brush 30 is lowered to the working position Q 1 so as to come into contact with (or come close to) the surface of the substrate W. Then, the cleaning liquid to which ultrasonic vibration is applied is supplied from the cleaning liquid supply nozzle 21 toward the surface of the substrate W. Then, while rotating the turntable 11 to rotate the substrate W, the brush 3
While keeping 0 at the working position Q 1 , the arm 22 is oscillated and displaced along the surface of the substrate W, and the entire surface of the substrate W is cleaned by the sliding contact cleaning by the brush 30 and the cleaning liquid to which ultrasonic vibration is applied. It

【0022】この際、ブラシ洗浄と超音波洗浄とを同時
に行っているので、従来のブラシ洗浄後に超音波洗浄を
行う場合に比べて洗浄時間を短縮することができる。ま
たブラシ洗浄と超音波振動が付与されていない洗浄液と
による同時洗浄を行う場合に比べても洗浄効果が高いの
で、洗浄時間を短縮することができる。
At this time, since the brush cleaning and the ultrasonic cleaning are performed at the same time, the cleaning time can be shortened as compared with the conventional case where the ultrasonic cleaning is performed after the brush cleaning. Further, since the cleaning effect is higher than that in the case where the brush cleaning and the cleaning liquid to which ultrasonic vibration is not applied are simultaneously performed, the cleaning time can be shortened.

【0023】一方、ブラシ30を用いずに超音波洗浄だ
けを行う場合は、洗浄液供給ノズル21を作用位置Q1
に保持した状態で、モータ35を駆動してネジ軸36回
転させ、昇降プレート32を上昇させることにより、ブ
ラシ30が作用位置Q1 から非作用位置Q2 に切り替え
られる。すなわち、ブラシ30が基板Wの表面から離れ
るので、この状態で洗浄液供給ノズル21から超音波振
動が付与された洗浄液を基板Wの表面に向けて供給し、
基板Wを回転させながらアーム22を基板Wの表面に沿
って揺動変位させることにより、超音波振動が付与され
た洗浄液による基板Wの表面全面が洗浄される。
On the other hand, when only ultrasonic cleaning is performed without using the brush 30, the cleaning liquid supply nozzle 21 is moved to the operating position Q 1
The motor 30 is driven to rotate the screw shaft 36 to raise the elevating plate 32, and the brush 30 is switched from the operating position Q 1 to the non-operating position Q 2 . That is, since the brush 30 is separated from the surface of the substrate W, the cleaning liquid to which ultrasonic vibration is applied is supplied from the cleaning liquid supply nozzle 21 toward the surface of the substrate W in this state,
By swinging and displacing the arm 22 along the surface of the substrate W while rotating the substrate W, the entire surface of the substrate W is cleaned by the cleaning liquid to which ultrasonic vibration is applied.

【0024】上記のように、基板Wに発生するパーティ
クルの種類や基板Wそのものの材質等に応じてブラシ3
0を用いた洗浄とブラシ30を用いない洗浄とを選択す
ることができる。
As described above, the brush 3 is used depending on the type of particles generated on the substrate W and the material of the substrate W itself.
It is possible to select the cleaning using 0 and the cleaning not using the brush 30.

【0025】なお、上記実施例ではモータ35に連結さ
れたネジ軸36によって、ブラシ30を昇降させていた
が、本発明はこれに限らず、例えば、図4に示すよう
に、昇降プレート32’をリンク機構60を介してエア
ーシリンダ61に連結して、ブラシ30を昇降させるよ
うにしてもよい。すなわち、エアーシリンダ61の伸縮
駆動で一対の揺動リンク機構62を支点a周りに揺動さ
せて昇降プレート32’を昇降させることにより、ブラ
シ30を作用位置Q1 と非作用位置Q2 とにわたって切
り替えるようにしてもよい。また、上記実施例では洗浄
液供給ノズル21に対してブラシ30を昇降自在に設け
たが、本発明はこれに限らず、例えば、図5に示すよう
に、洗浄液供給ノズル21にブラシ30を一体に取り付
けてこれらを支持するアーム22を昇降させるようにし
てもよい。すなわち、アーム22を軸芯P2 周りで揺動
変位させるモータ65を、立設されたガイドレール66
に案内される昇降支持部材67に取り付け、昇降支持部
材67をモータ68に連結されたネジ軸69に螺合す
る。モータ68を駆動してネジ軸69を回転させ、昇降
支持部材67とともにアーム22を昇降させることによ
り、ブラシ30を作用位置Q1 と非作用位置Q2 とにわ
たって切り替えるようにしてもよい。ブラシ30を非作
用位置Q2 に変位させると、これに伴って洗浄液供給ノ
ズル21も上昇するが、非作用位置Q2 はそれほど高い
位置ではないので、洗浄液供給ノズル21による洗浄効
果が極端に低下することはない。
Although the brush 30 is moved up and down by the screw shaft 36 connected to the motor 35 in the above embodiment, the present invention is not limited to this. For example, as shown in FIG. May be connected to the air cylinder 61 via the link mechanism 60 to move the brush 30 up and down. That is, when the air cylinder 61 is expanded and contracted, the pair of swing link mechanisms 62 are swung around the fulcrum a to raise and lower the raising and lowering plate 32 ′, so that the brush 30 is extended between the operating position Q 1 and the non-operating position Q 2. You may make it switch. Further, in the above-described embodiment, the brush 30 is provided to be movable up and down with respect to the cleaning liquid supply nozzle 21, but the present invention is not limited to this. For example, as shown in FIG. 5, the brush 30 is integrated with the cleaning liquid supply nozzle 21. You may make it attach and detach and raise and lower the arm 22 which supports these. That is, the motor 65 for swinging and displacing the arm 22 around the axis P 2 is installed on the guide rail 66 that is installed upright.
It is attached to the elevating and lowering support member 67 which is guided by the above, and the elevating and lowering support member 67 is screwed to the screw shaft 69 connected to the motor 68. The brush 30 may be switched between the operating position Q 1 and the non-operating position Q 2 by driving the motor 68 to rotate the screw shaft 69 and moving the arm 22 together with the lifting support member 67. When the brush 30 is displaced to the non-acting position Q 2 , the cleaning liquid supply nozzle 21 also rises accordingly, but the non-acting position Q 2 is not so high, so the cleaning effect of the cleaning liquid supply nozzle 21 is extremely reduced. There is nothing to do.

【0026】[0026]

【発明の効果】以上の説明から明らかなように、請求項
1に記載の発明によれば、ブラシ洗浄と超音波洗浄とを
同時に行うことができるので、洗浄効果が高く洗浄時間
を短縮することができる。また、切替手段によって、ブ
ラシが基板の表面に作用する位置と基板の表面に作用し
ない位置とにわたって切り替えることができるので、基
板に発生するパーティクルの種類や基板そのものの材質
等に応じてブラシを用いた洗浄とブラシを用いない洗浄
とを選択することができる。
As is apparent from the above description, according to the first aspect of the present invention, since the brush cleaning and the ultrasonic cleaning can be performed at the same time, the cleaning effect is high and the cleaning time is shortened. You can Further, since the switching means can switch between a position where the brush acts on the surface of the substrate and a position where it does not act on the surface of the substrate, the brush can be used according to the type of particles generated on the substrate and the material of the substrate itself. It is possible to select between the conventional cleaning and the cleaning without using the brush.

【0027】また、請求項2に記載の発明によれば、ブ
ラシを用いない洗浄の場合は、切替手段によって、洗浄
液供給ノズルを作用位置に保持した状態でブラシだけが
非作用位置に上昇されるので、洗浄液供給ノズルを基板
の表面により接近させた状態で洗浄液供給ノズルから基
板表面に超音波振動が付与された洗浄液を供給すること
ができ、より洗浄能力を高くできる。
According to the second aspect of the invention, in the case of cleaning without using the brush, only the brush is raised to the non-acting position by the switching means while the washing liquid supply nozzle is held at the working position. Therefore, it is possible to supply the cleaning liquid to which ultrasonic vibration is applied to the surface of the substrate from the cleaning liquid supply nozzle in a state where the cleaning liquid supply nozzle is closer to the surface of the substrate, and the cleaning ability can be further enhanced.

【0028】また、請求項3の発明によれば、切替手段
によって、洗浄液供給ノズルとブラシとが一体となって
作用位置から非作用位置に切り替えられるので、洗浄液
供給ノズルに対してブラシを昇降自在に配置する必要が
なく、昇降機構を簡単に構成することができる。
According to the third aspect of the invention, since the cleaning liquid supply nozzle and the brush are integrally switched by the switching means from the working position to the non-working position, the brush can be raised and lowered with respect to the cleaning liquid supply nozzle. The elevating mechanism can be easily configured without the need to arrange the elevating mechanism.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る回転式基板洗浄装置の一実施例の
一部切り欠き斜視図である。
FIG. 1 is a partially cutaway perspective view of an embodiment of a rotary substrate cleaning apparatus according to the present invention.

【図2】ノズル先端の縦断面図である。FIG. 2 is a vertical sectional view of a nozzle tip.

【図3】図2のA−A矢視図である。FIG. 3 is a view as viewed in the direction of arrows AA in FIG. 2;

【図4】その他の実施例の要部を示す図である。FIG. 4 is a diagram showing a main part of another embodiment.

【図5】その他の実施例の要部を示す図である。FIG. 5 is a diagram showing a main part of another embodiment.

【符号の説明】[Explanation of symbols]

10 … 基板回転保持機構 20 … 基板洗浄機構 21 … 洗浄液供給ノズル 22 … アーム 24 … 超音波振動子 30 … ブラシ 32 … 昇降プレート Q1 … 作用位置 Q2 … 非作用位置 W … 基板10 ... substrate rotation holding mechanism 20 ... substrate cleaning mechanism 21 ... cleaning liquid supply nozzle 22 ... arm 24 ... ultrasonic oscillator 30 ... brush 32 ... elevating plate Q 1 ... operative position Q 2 ... inactive position W ... substrate

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 回転する基板表面に洗浄液を供給して基
板表面を洗浄する回転式基板洗浄装置において、 基板を回転可能に保持する基板回転保持手段と、 前記の基板回転保持手段によって保持された基板表面に
超音波振動が付与された洗浄液を供給する洗浄液供給ノ
ズルと、 前記洗浄液供給ノズルの周囲に配置され、基板表面を洗
浄するブラシと、 前記ブラシが基板表面に洗浄効果を及ぼす作用位置と、
前記ブラシが基板表面に洗浄効果を及ぼさない非作用位
置とにわたって前記ブラシの位置を切り替える切替手段
と、 を備えたことを特徴とする回転式基板洗浄装置。
1. A rotary substrate cleaning apparatus for supplying a cleaning liquid to a rotating substrate surface to clean the substrate surface, wherein the substrate rotation holding means holds the substrate rotatably, and the substrate rotation holding means holds the substrate. A cleaning liquid supply nozzle that supplies a cleaning liquid to which ultrasonic vibration is applied to the substrate surface, a brush that is arranged around the cleaning liquid supply nozzle and cleans the substrate surface, and an operating position where the brush exerts a cleaning effect on the substrate surface. ,
A rotary substrate cleaning apparatus comprising: a switching unit that switches the position of the brush between a non-acting position where the brush does not exert a cleaning effect on the substrate surface.
【請求項2】 請求項1に記載の装置において、 前記ブラシは、前記洗浄液供給ノズルに対して昇降自在
に配置され、 前記切替手段は、前記ブラシを昇降させることによって
前記ブラシを前記作用位置と前記非作用位置とにわたっ
て切り替える回転式基板洗浄装置。
2. The apparatus according to claim 1, wherein the brush is disposed so as to be movable up and down with respect to the cleaning liquid supply nozzle, and the switching unit moves the brush to the working position by moving the brush up and down. A rotary substrate cleaning apparatus that switches over to the non-acting position.
【請求項3】 請求項1に記載の装置において、 前記ブラシは、前記洗浄液供給ノズルに対して固定配置
され、 前記切替手段は、前記ブラシと前記洗浄液供給ノズルと
を一体に昇降させることによって前記ブラシを前記作用
位置と前記非作用位置とにわたって切り替える回転式基
板洗浄装置。
3. The apparatus according to claim 1, wherein the brush is fixedly arranged with respect to the cleaning liquid supply nozzle, and the switching unit raises and lowers the brush and the cleaning liquid supply nozzle integrally with each other. A rotary substrate cleaning apparatus that switches a brush between the operating position and the non-operating position.
JP17330194A 1994-06-30 1994-06-30 Rotary substrate washing device Pending JPH0817772A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17330194A JPH0817772A (en) 1994-06-30 1994-06-30 Rotary substrate washing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17330194A JPH0817772A (en) 1994-06-30 1994-06-30 Rotary substrate washing device

Publications (1)

Publication Number Publication Date
JPH0817772A true JPH0817772A (en) 1996-01-19

Family

ID=15957912

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17330194A Pending JPH0817772A (en) 1994-06-30 1994-06-30 Rotary substrate washing device

Country Status (1)

Country Link
JP (1) JPH0817772A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003502840A (en) * 1999-06-10 2003-01-21 ラム リサーチ コーポレーション Method and system for cleaning a semiconductor wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003502840A (en) * 1999-06-10 2003-01-21 ラム リサーチ コーポレーション Method and system for cleaning a semiconductor wafer

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