JPH08174659A - Production of tape for tab - Google Patents

Abstract

PURPOSE: To produce a tape for TAB reducing the warp quantity of a copper clad laminated tape and capable of enhancing electric reliability at the time of the mounting of an IC. CONSTITUTION: In a method for producing a tape for TAB consisting of a base film layer, an adhesive layer and a protective layer, a polyimide film produced by a usual technique is equally stretched uniaxially and the uniaxially stretched polyimide film is processed so that the stretching direction thereof is set to a longitudinal direction to be used as a base film layer 12 and an adhesive layer 14 and a protective layer 16 are provided on the base film layer 12 to produce the tape 10 for TAB.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a TAB tape, and more specifically, TAB (Tape Automated Bonding).
The present invention relates to a method for producing a TAB tape having a three-layer structure of a base film layer, an adhesive layer, and a protective layer used in the method.

[0002]

2. Description of the Related Art The TAB method, which is one of the mounting techniques for ICs, has been adopted in recent years as a mounting method for driving liquid crystal display ICs and the like due to demands for downsizing of electronic devices. In such a TAB system, a TAB tape having a three-layer structure including a base film layer, an adhesive layer, and a protective layer is used. This TAB tape is punched, copper foil laminated, adhesive cured,
Circuit formation, plating, inner lead bonding,
The IC is mounted through processing steps such as resin sealing, punching, and outer lead bonding.

By the way, one of the methods for manufacturing a TAB tape is described.
Thirdly, there is a method in which a protective layer with an adhesive is superposed on the base film layer and pressure-bonded thereto, and a polyimide film is preferably used as the base film layer. After peeling off the protective layer from the TAB tape obtained by this production method, copper foil is superposed instead of the protective layer and heat-bonded to produce a copper-clad laminated tape.

[0004]

However, the copper-clad laminated tape obtained by this method has different dimensional change behaviors due to changes in temperature and humidity in the base film layer and the copper layer, so that the copper-clad laminated tape is different. However, there is a problem in that the electrical connection portion such as outer lead bonding is distorted due to the warp, which lowers the electrical reliability of the circuit.

Therefore, the present inventors provide a method of manufacturing a TAB tape which solves the above problems, reduces the amount of warpage of a copper-clad laminated tape, and improves the electrical reliability during IC mounting. As a result of intensive studies for the purpose, the present invention has been achieved.

[0006]

The gist of the method for producing a TAB tape according to the present invention is to provide a method for producing a TAB tape comprising a base film layer, an adhesive layer and a protective layer. The layer is obtained by stretching a resin film in a uniaxial direction and then processing the stretching direction in the longitudinal direction.

In the method for manufacturing a TAB tape, the base film layer is a resin film stretched uniaxially under heating.

Further, in the method for manufacturing a TAB tape, the base film layer is formed by annealing a resin film after stretching the resin film in a uniaxial direction.

Further, in the method for producing a TAB tape, the stretching ratio is 10 to 100% when the treatment conditions for uniaxially stretching the resin film are sufficiently higher than the glass transition temperature of the resin film. , Preferably 20 to 70%.

Further, in such a method for producing a TAB tape, when the treatment condition for uniaxially stretching the resin film is a temperature range close to or lower than the glass transition temperature of the resin film, the stretching is performed. The magnification is 30 to 80%, preferably 40 to 60%.

Further, in such a method for manufacturing a TAB tape, the coefficient of linear expansion in the width direction with respect to the longitudinal direction of the resin film is 1.2 times or more the coefficient of linear expansion of the conductor layer forming the circuit of the TAB tape. To treat the resin film.

Further, in the method of manufacturing the TAB tape, the resin film is a polyimide film.

[0013]

In the method for producing a TAB tape according to the present invention, a resin film is stretched in a uniaxial direction and then cut so that the stretching direction is the longitudinal direction, and the cut film is used as the base film layer. , In particular, the resin film may be stretched uniaxially under heating, or the resin film may be stretched uniaxially and then annealed, and then cut so that the stretching direction becomes the longitudinal direction. What was done is used as a base film layer.
In this way, by stretching the resin film uniaxially to give anisotropy to the orientation in the molecule and orienting the molecule in the stretching direction, the resin film is cut so that the stretching direction becomes the longitudinal direction. By thus obtaining the base film, the coefficient of linear expansion in the width direction with respect to the longitudinal direction of the base film can be increased.

Since the resin film shrinks when it is stretched and then heated, the resin film is stretched uniaxially and then annealed to heat the resin film at an appropriate temperature to heat the resin film. Shrinkage is removed. Then, the obtained resin film is cut and processed with the stretching direction being the longitudinal direction and used for the base film layer of the TAB tape. It is particularly preferable to perform the annealing treatment in the manufacturing process of the TAB tape in order to mount the IC well.

Specifically, in the present invention, the coefficient of linear expansion in the width direction with respect to the longitudinal direction of the resin film is TA.
It is preferably 1.2 times or more the linear expansion coefficient of a conductor layer such as a copper foil used for forming the circuit of the B tape. The linear expansion coefficient of the resin film in the width direction is determined by the processing conditions for uniaxially stretching the resin film in the longitudinal direction, that is, the stretching temperature and the stretching ratio. Then, the linear expansion coefficient in the width direction with respect to the longitudinal direction of the resin film, by using the film having the linear expansion coefficient as the base film layer, the effect of the present invention, that is,
It is possible to obtain the effect of reducing the amount of warpage when the copper-clad laminated tape is manufactured. This effect is more effectively exhibited when a polyimide film is used as the resin film.

In order to obtain the effects of the present invention, the polyimide film used as the base film layer, that is, the polyimide film that has been annealed when the base film layer of the TAB tape is annealed is used as described above. The coefficient of linear expansion must be maintained. Further, in order to process the TAB tape by using such a polyimide film as a base film layer, it is necessary that the flatness of the film is not impaired. However, even if the polyimide film is uniaxially stretched in the longitudinal direction, when the stretching ratio is too small, the effect of stretching on the anisotropy of molecular orientation disappears due to the annealing treatment, and it is increased by uniaxial stretching. The linear expansion coefficient in the width direction with respect to the longitudinal direction of the film cannot be maintained. Further, if the stretching ratio is too large, the flatness of the film will be impaired by the annealing treatment.

Therefore, in the present invention, the stretching temperature and the stretching ratio, which are the processing conditions of the uniaxial stretching, are further examined, and the stretching ratio is 10 to 100%, preferably in the temperature range sufficiently higher than the glass transition temperature of the resin film. Is 20-70%
In the temperature range close to or lower than the glass transition temperature of the resin film, the stretching ratio is 30 to 80%, preferably 40 to 60%, and the resin film is uniaxially stretched in the longitudinal direction. By uniaxially stretching under such treatment conditions, it is possible to obtain a polyimide film in which the above-mentioned linear expansion coefficient is maintained even when an annealing treatment is performed and the flatness of the film is not impaired.

The present invention is characterized by using the polyimide film thus obtained as a base film layer, and T obtained by the production method of the present invention.
By using the AB tape, it is possible to manufacture a copper-clad laminated tape having a small amount of warp in the width direction with respect to the longitudinal direction of the tape.

That is, in the copper-clad laminated tape, the protective layer of the TAB tape is removed, a copper foil is superposed thereon and heated, and the adhesive layer is cured to fix the base film layer and the copper foil. It is produced by. Therefore, the linear expansion coefficient in the width direction with respect to the longitudinal direction of the polyimide film used as the base film layer is 1.2 times or more the linear expansion coefficient of the copper foil. After fixing the film layer and copper foil,
The amount of shrinkage of the base film layer in the width direction with respect to the longitudinal direction due to cooling becomes larger than the amount of shrinkage of the copper foil, and some warpage occurs with the copper foil facing outward. However, with time, the polyimide film, which is the base film layer, expands due to moisture absorption, while the copper foil, which is the conductor layer, hardly changes in size due to moisture absorption. As a result, the dimensional change rates of the two become almost the same, and the amount of warpage in the width direction of the copper-clad laminated tape becomes small. Then, by producing a copper clad laminated tape having a small amount of warp in the width direction of the tape, which is a particular problem at the time of mounting the IC, the electrical reliability at the time of mounting the IC can be improved.

In order to produce a copper-clad laminated tape having a small amount of warp generated on the tape, it is possible to increase the linear expansion coefficient of the polyimide film used as the base film layer isotropically. The elastic modulus becomes smaller as the value becomes larger, and a polyimide film having a small elastic modulus loses rigidity of the film and cannot bear the weight of the IC. Therefore, it is difficult to use a polyimide film having a large linear expansion coefficient isotropically as the base film layer of the TAB tape.

Therefore, as described above, the polyimide film is uniaxially stretched and used so that the stretching direction is the longitudinal direction, whereby the linear expansion coefficient is increased only in the width direction with respect to the longitudinal direction of the film, and the longitudinal direction of the film is increased. It is possible to obtain a polyimide film having a high elasticity in the direction and a stiffness that can be used as a base film layer. That is, a copper clad laminated tape having a small amount of warp in the width direction of the tape can be produced, and a polyimide film that can be suitably used as a base film layer of a TAB tape can be obtained.

[0022]

EXAMPLES Examples of the method for producing a TAB tape according to the present invention will be described in detail below.

As shown in FIG. 1, the TAB tape 10 is composed of a base film layer 12, an adhesive layer 14, and a protective layer 16. An example of a method for manufacturing the TAB tape 10 is as follows. After forming the adhesive layer 14 by applying an adhesive to the surface of the layer 16, the adhesive layer 1
The base film layer 12 is attached to 4 and manufactured.

Although various conditions for manufacturing the TAB tape are not particularly limited, specifically, for example, first,
An adhesive having a predetermined composition has a thickness of 5 after drying on the protective layer 16.
To 50 μm, more preferably 10 to 30 μm, and heat-dried at 100 to 150 ° C. for 1 to 15 minutes to semi-cure the adhesive layer, and the adhesive layer 14 on the protective layer 16. Then, a protective layer with an adhesive is formed.
Then, the base film layer 12 is overlaid on the adhesive surface of the protective layer with the adhesive, and 0.1 kgf at 20 to 180 ° C.
The TAB tape 10 is manufactured by pressure bonding under the condition of not less than / cm ² .

At this time, as shown in FIG. 1, the protective layer with the adhesive is slit to a constant width, and the polyimide film is slit so that the width of the polyimide film is wider than that of the protective layer. When the protective layers are overlapped and pressure-bonded, a TAB tape having no adhesive layer on both ends of the tape can be produced, which is preferable.

After the protective layer 16 of the obtained TAB tape 10 is peeled off, a conductor layer 18 such as a copper foil is heat-bonded to the surface of the transferred adhesive layer 14 as shown in FIG. Thus, the copper-clad laminated tape 20 is manufactured.

The adhesive layer 14 and the protective layer 16 used for manufacturing the TAB tape 10 are not particularly limited, and conventionally known ones can be used. For example, as the adhesive, epoxy-based or phenol-based adhesives are preferably used. Further, as the protective layer, a polyethylene terephthalate or polypropylene film is preferably used in view of the balance of peelability, strength, heat resistance, price of the adhesive.

Next, the base film layer 12 used for manufacturing the TAB tape 10 is manufactured as follows. That is, as shown in FIG. 3, the polyimide film 22 manufactured by a normal method is uniformly pulled and stretched in the uniaxial direction. Polyimide film 2
When 2 is stretched, it is preferable to stretch the polyimide film 22 under heating, and the heating temperature is not particularly limited, but a range from near the glass transition temperature to a high temperature is more preferable. The heating temperature and the draw ratio are not particularly limited, but in order to obtain a predetermined effect, the treatment is performed within a certain range. Next, the polyimide film 22 is uniaxially stretched, and then the polyimide film 24 is annealed.

The annealing treatment is a treatment method of heating at a constant temperature and holding it for a certain period of time to remove the distortion caused by molding. For example, the annealing treatment is performed by heating at 400 ° C. for 1 minute under the condition. Is not particularly limited and is appropriately set depending on the composition of the film and the like. In this annealing treatment, when the polyimide film 22 is stretched, strain remains inside, and when the polyimide film 24 having residual strain is heated, the residual strain is released and a large dimensional change occurs. This is performed to remove the residual strain and obtain the polyimide film 24 having good dimensional stability. Therefore, the annealing treatment is indispensable in the process of manufacturing the TAB tape, and is a treatment that cannot be omitted in order to remove the heat shrinkage of the film and to mount the IC well.

Since the annealed polyimide film 24 is cut in the uniaxially stretched direction with the longitudinal direction being the stretched direction, as shown by the dashed line in FIG. 4, a plurality of base film layers 12 are manufactured. is there.

Next, in the present invention, the base film layer 1
The polyimide film 24 used as No. 2 will be described. The polyimide film 24 is formed such that the linear expansion coefficient in the width direction with respect to the longitudinal direction of the film is 1.2 times or more the linear expansion coefficient of the copper foil even after the annealing treatment. The polyimide film 24 having such a coefficient of linear expansion in the width direction can be obtained by uniaxially stretching the polyimide film 22 obtained by a known method in the longitudinal direction of the film.

Specifically, the polyimide film 22 obtained by a known method is used as the raw material tetracarboxylic dianhydride component and diamine component either individually or as a mixture of two or more thereof, and organic polarities are used. A polyamic acid solution is obtained by reacting all tetracarboxylic dianhydride components and all diamine components in a solvent in a substantially equimolar amount, and the polyamic acid solution is cast or coated to form a film chemical. Target and /
Alternatively, it is obtained by thermal imidization.

More specifically, pyromellitic dianhydride (hereinafter referred to as PMDA) as an acid dianhydride component alone or as PMDA 1

Embedded image A mixture of one or more of the acid dianhydrides shown in 1 above is used, and diaminodiphenyl ether (hereinafter referred to as DADPE) is used alone as the diamine component, or DA
DPE and 2

Embedded image (However, X is F, Cl, Br, CH ₃ , CH ₃ O, CF
₃ is shown. A polyimide film obtained by using a mixture of one or two or more of the linear diamine compounds shown in (4) is preferably used. The mixing ratio is arbitrary, but as the acid dianhydride component, P in the total acid dianhydride component is used.
It is preferable to mix and use the MDA in a molar ratio of 10 to 40%. As the diamine component, it is preferable to use a mixture of DADPE in the total diamine component in a molar ratio of 20 to 80%.

The thickness of the polyimide film 22 is preferably 25 to 200 μm, more preferably 50 to 12 μm.
The one having a thickness of 5 μm is used.

Further, the polyimide film 22 is subjected to an appropriate treatment (for example, on the surface and / or inside) for the purpose of improving the adhesion to the adhesive layer and the transportability of the film.
Heat treatment, corona discharge treatment, addition of inorganic filler, etc.) may be performed.

The polyimide film 22 obtained by such a known method is uniaxially stretched to impart anisotropy to the orientation in the molecule. As a result, the molecules are oriented in the stretching direction to increase the linear expansion coefficient in the direction perpendicular to the stretching direction of the film, and the film is used as a base film layer in the present invention by cutting the film with the stretching direction being the longitudinal direction. The polyimide film 24 having the above-mentioned linear expansion coefficient can be obtained.

Further, before the polyimide film 24 thus obtained by uniaxial stretching is cut and used as the base film layer of the TAB tape, an annealing treatment is usually performed. Depending on (stretching temperature and stretch ratio), the effect of the uniaxial stretching may disappear by the annealing treatment, and the flatness of the film may be impaired. Therefore, in order to obtain the base film layer preferably used in the present invention, it is important to set the processing conditions for such uniaxial stretching.

The treatment conditions for this uniaxial stretching can be set arbitrarily, but in order to obtain the polyimide film 24 used as the base film layer in the present invention,
There is a preferred stretching ratio depending on the stretching temperature.

That is, when the stretching temperature is sufficiently higher than the glass transition temperature of the film, the stretching ratio is 10
It is preferable that the film is uniaxially stretched in the longitudinal direction of the film in the range of -100%, preferably 20-70%. If the draw ratio is less than 10% at such a draw temperature, the anisotropy of the molecular orientation given by the uniaxial draw disappears due to the annealing treatment essential for removing the heat shrinkage of the film. Further, if the stretching ratio exceeds 100%, the flatness of the film will be impaired by the annealing treatment.

When the stretching temperature is close to or lower than the glass transition point of the film, the stretching ratio is 30.
It is preferable to set it in the range of -80%, preferably 40-60% and uniaxially stretch. For the same reason as above, uniaxially stretching at such a stretching ratio does not eliminate the effect of stretching due to the annealing treatment and does not impair the flatness of the film.

Therefore, by uniaxially stretching under such treatment conditions, the linear expansion coefficient in the direction perpendicular to the stretching direction of the polyimide film is 1.2 times that of the copper foil even after the annealing treatment. The polyimide film which is above and which does not impair the flatness of a film can be obtained. The polyimide film uniaxially stretched under such conditions can be suitably used as a base film layer by subjecting it to an anneal treatment after uniaxially stretching.

The uniaxial stretching method is not particularly limited, and a general method such as a roll stretching method can be used.

Then, the polyimide film 24 thus obtained is cut as a base film layer by cutting the polyimide film 24 in the longitudinal direction, and as described above, the adhesive layer 14 and the protective layer are provided on the base film layer 12. By forming the layer 16, the TAB tape 10 can be manufactured.

The method for producing the TAB tape is not limited to the above-mentioned method. For example, the uniaxially stretched polyimide film is not cut, but is protected with an adhesive by slitting the polyimide film in a predetermined width in the stretching direction. The layers may be overlapped with each other at regular intervals and pressure-bonded, and then slits may be formed between the protective layers of the polyimide film so that the both ends of the TAB tape have the same width. Any other method, an adhesive layer on the base film layer,
Although a protective layer may be formed, it is preferable that there is no adhesive layer at both ends of the TAB tape in view of workability in the TAB processing step.

As the resin film used as the base film layer, other than the polyimide film,
For example, a polyester film, a polyamide film, or the like can be used, and it is possible to uniaxially stretch the base film layer in the same manner as above, but a polyimide film is particularly preferably used.

The TAB tape thus obtained is preferably used for producing a copper-clad laminated tape in the TAB processing step, and by manufacturing the TAB tape by the method of the present invention, it can be mounted on an IC. It is possible to improve the electrical reliability in the.

That is, using the TAB tape obtained by the manufacturing method of the present invention, the copper-clad laminated tape 2 shown in FIG. 2 is used.
When 0 was produced, the copper-clad laminated tape 20 had a linear expansion coefficient in the width direction with respect to the longitudinal direction of the film of the base film layer that was 1.2 times or more the linear expansion coefficient of the copper foil. As shown in FIG. 5, there is a slight warpage a with the copper foil 18 on the outside. However, since the base film layer (polyimide film) 12 expands due to moisture absorption over time, as a result, there is almost no warpage a as shown by the chain double-dashed line in the figure, and a copper clad laminate with a small amount of warpage in the width direction of the tape The tape 20 can be obtained.

Then, a circuit is formed by etching the copper layer of the copper clad laminated tape, and then the IC is mounted through the processing steps of plating, inner lead bonding, resin sealing, and outer lead bonding. The copper-clad laminated tape produced using the TAB tape obtained by the production method of the present invention has a small amount of warp in the width direction of the tape and does not cause distortion in an electrical connection portion such as outer lead bonding. The electrical reliability at the time of mounting can be improved.

Although the copper-clad laminated tape is used here, it is not always necessary to use the copper foil as the conductor layer forming the circuit in the TAB method, and other conductor layers can be used. In that case, the coefficient of linear expansion in the width direction with respect to the longitudinal direction of the polyimide film may be 1.2 times or more the coefficient of linear expansion of the conductor layer used. In addition, it is needless to say that the method of forming the adhesive layer, the protective layer, and the conductor layer is not particularly limited, and the effects of the present invention can be obtained even when they are formed by various other various methods.

Although the embodiments of the method for manufacturing the TAB tape according to the present invention have been described above, the present invention is not limited to these embodiments. For example, an adhesive is applied on a polyimide film. You may make it dry and provide a protective layer on it. In the method for producing a TAB tape, when a thermoplastic polyimide film having adhesiveness is used as a base film layer, a TAB tape including a base film layer, an adhesive layer, and a protective layer is not produced. It is also possible to produce a two-layer copper-clad laminated tape by stacking and laminating copper foil on the polyimide film. In addition, the present invention can be carried out in a mode in which various improvements, changes and modifications are made based on the knowledge of those skilled in the art without departing from the spirit of the present invention.

Hereinafter, the present invention will be described more specifically with reference to Examples, but the present invention is not limited to these Examples. In the examples, DMF is N, N-dimethylformamide. The average linear expansion coefficient of the copper foil in the temperature range of 100 to 200 ° C. is 17 ppm.

Example 1 PDA: DADPE: BTDA: PMDA 2: 1:
Polymerization was performed in a DMF solvent at a molar ratio of 2: 1 to obtain a polyamic acid solution, and the polyamic acid solution was formed into a film and chemically imidized to obtain a polyimide film having a thickness of 75 μm. The obtained polyimide film has an isotropic in-plane linear expansion coefficient, and the average linear expansion coefficient in the temperature range of 100 to 200 ° C. is 19 ppm in both the longitudinal direction and the width direction.
And was 1.1 times the linear expansion coefficient of the copper foil. Also,
The glass transition temperature was 350 ° C.

This polyimide film was uniaxially stretched in the longitudinal direction of the film at a stretching ratio of 40% in an atmosphere of 220 ° C., annealed for 1 minute in an atmosphere of 400 ° C., and then slit into a width of 35 mm. After uniaxial stretching, the annealed film had an average linear expansion coefficient in the temperature range of 100 to 200 ° C. of 17 ppm in the stretching direction and 22 ppm in the width direction, and the linear expansion coefficient in the film width direction was the linear expansion coefficient of the copper foil. It was 1.3 times that of. This 3
Using a polyimide film having a width of 5 mm as a base film layer, a TAB tape was manufactured by the following method according to the conventional method.

That is, an adhesive was applied to a polyethylene terephthalate film for a protective layer, the surface of which was treated with a release agent, so that the thickness after drying was about 20 μm, and the temperature was 150 ° C.
And dried for 10 minutes to obtain a protective layer with an adhesive. The protective layer with an adhesive was slit to a width of 26 mm and pressure-bonded to the center of the base film layer at 40 ° C. to prepare a TAB tape. As the adhesive, bisphenol A type epoxy resin (E1001 / Yukaka Shell Epoxy Co., Ltd.) 50
Part, cresol novolac type epoxy resin (180H6
5 / Oilized Shell Epoxy Co., Ltd.) 10 parts, Polyamide resin (M1276 / Nippon Rilsan Co., Ltd.) 40 parts, Diaminodiphenylsulfone 7 parts, Dicyandiamide 2 parts, Toluene 35 parts, Isopropyl alcohol 15 parts .

Remove the protective layer of this TAB tape,
After laminating a 26 mm wide copper foil on the adhesive layer at 120 ° C, the adhesive is heated and cured to produce a copper-clad laminated tape, and the amount of warp in the width direction with respect to the longitudinal direction of the copper-clad laminated tape is measured. did. The amount of warpage is measured by cutting the copper-clad laminated tape into a length of 40 mm at 20 ° C. and 65%.
Left for 24 hours in this environment, and the copper-clad laminated tape in the moisture-absorption state is allowed to stand still on a horizontal surface with the base film layer down.
The height from the horizontal plane of the four corners when the central part was pressed was measured. The average value of the height from the horizontal surface of the four corners was taken as the amount of warpage in the width direction of the copper-clad laminated tape, and the results are shown in Table 1.

[0056]

[Table 1]

Example 2 Example 1 except that the stretching ratio during uniaxial stretching was 60%.
A polyimide film used as a base film layer was obtained in the same manner as in. After uniaxial stretching, the average linear expansion coefficient in the temperature range of 100 to 200 ° C. of this annealed film is 15 ppm in the stretching direction and 32 ppm in the width direction.
The linear expansion coefficient in the film width direction was 1.9 times the linear expansion coefficient of the copper foil. Hereinafter, a TAB tape was produced in the same manner as in Example 1, and further a copper clad laminated tape was produced. With respect to the obtained copper-clad laminated tape, the amount of warpage in the width direction was measured in the same manner as in Example 1, and the results are shown in Table 1.

Comparative Example 1 Example 1 except that the stretching ratio during uniaxial stretching was 20%.
A polyimide film used as a base film layer was obtained in the same manner as in. After uniaxial stretching, the average linear expansion coefficient of the annealed film in the temperature range of 100 to 200 ° C. is 19 ppm in the drawing direction and 19 ppm in the width direction, and the linear expansion coefficient in the film width direction is the linear expansion coefficient of the copper foil. It was 1.1 times, and the linear expansion coefficient was not increased by stretching. Hereinafter, a TAB tape was produced in the same manner as in Example 1, and further a copper clad laminated tape was produced. With respect to the obtained copper-clad laminated tape, the amount of warpage in the width direction was measured in the same manner as in Example 1, and the results are shown in Table 1.

Comparative Example 2 Example 1 except that the stretching ratio during uniaxial stretching was 90%.
A polyimide film used as a base film layer was obtained in the same manner as in. After uniaxial stretching, the annealed film has an average linear expansion coefficient in the temperature range of 100 to 200 ° C. of 12 ppm in the stretching direction and 27 ppm in the width direction.
The linear expansion coefficient in the film width direction was 3.5 times the linear expansion coefficient of the copper foil. However, the flatness of the film was impaired, and the same procedure as in Example 1 was repeated below.
When the B tape was produced, the TAB tape could not be produced.

Example 3 A polyimide film used as a base film layer was obtained in the same manner as in Example 1 except that the atmosphere temperature during uniaxial stretching was 450 ° C. and the stretching ratio was 20%. 100-200 of this film annealed after uniaxial stretching
The average linear expansion coefficient in the temperature range of ℃ is 17p in the stretching direction.
pm, 22 ppm in the width direction, and the linear expansion coefficient in the film width direction was 1.3 times the linear expansion coefficient of the copper foil. Hereinafter, a TAB tape was produced in the same manner as in Example 1, and further a copper clad laminated tape was produced. With respect to the obtained copper-clad laminated tape, the amount of warpage in the width direction was measured in the same manner as in Example 1, and the results are shown in Table 2.

[0061]

[Table 2]

Example 4 A polyimide film used as a base film layer was obtained in the same manner as in Example 1 except that the atmosphere temperature during uniaxial stretching was 450 ° C. and the stretching ratio was 30%. 100-200 of this film annealed after uniaxial stretching
The average linear expansion coefficient in the temperature range of ℃ is 16p in the stretching direction.
pm, 26 ppm in the width direction, and the linear expansion coefficient in the film width direction was 1.5 times the linear expansion coefficient of the copper foil. Hereinafter, a TAB tape was produced in the same manner as in Example 1, and further a copper clad laminated tape was produced. With respect to the obtained copper-clad laminated tape, the amount of warpage in the width direction was measured in the same manner as in Example 1, and the results are shown in Table 2.

Example 5 A polyimide film used as a base film layer was obtained in the same manner as in Example 1 except that the atmosphere temperature during uniaxial stretching was 450 ° C. and the stretching ratio was 70%. 100-200 of this film annealed after uniaxial stretching
The average linear expansion coefficient in the temperature range of ℃ is 14p in the stretching direction.
pm, 35 ppm in the width direction, and the linear expansion coefficient in the film width direction was 2.1 times the linear expansion coefficient of the copper foil. Hereinafter, a TAB tape was produced in the same manner as in Example 1, and further a copper clad laminated tape was produced. With respect to the obtained copper-clad laminated tape, the amount of warpage in the width direction was measured in the same manner as in Example 1, and the results are shown in Table 2.

Comparative Example 3 A polyimide film used as a base film layer was obtained in the same manner as in Example 1 except that the atmosphere temperature during uniaxial stretching was 450 ° C. and the stretching ratio was 5%. After uniaxial stretching, this film annealed is 100 to 200 ° C.
The average linear expansion coefficient in the temperature range is 18 pp in the stretching direction.
m was 19 ppm in the width direction, the linear expansion coefficient in the film width direction was 1.1 times the linear expansion coefficient of the copper foil, and the linear expansion coefficient was not increased by stretching. Hereinafter, a TAB tape was produced in the same manner as in Example 1, and further a copper clad laminated tape was produced. With respect to the obtained copper-clad laminated tape, the amount of warpage in the width direction was measured in the same manner as in Example 1, and the results are shown in Table 2.

Comparative Example 4 A polyimide film used as a base film layer was obtained in the same manner as in Example 1 except that the atmosphere temperature during uniaxial stretching was 450 ° C. and the stretching ratio was 110%. After uniaxial stretching, 100 to 20 of this annealed film
The average linear expansion coefficient in the temperature range of 0 ° C is 7p in the stretching direction.
pm, 70 ppm in the width direction, and the linear expansion coefficient in the film width direction was 4.1 times the linear expansion coefficient of the copper foil. However, the flatness of the film was impaired, and when a TAB tape was produced in the same manner as in Example 1 below, the TAB tape could not be produced.

Comparative Example 5 PDA: DADPE: BTDA: PMDA 2: 1:
A polyimide film having a film thickness of 75 μm similar to that of Example 1 obtained by polymerizing at a molar ratio of 2: 1 was obtained. The polyimide film thus obtained was annealed in an atmosphere of 400 ° C. for 1 minute and then slit into a width of 35 mm. Using this 35mm width polyimide film as the base film layer,
Hereinafter, a TAB tape was produced in the same manner as in Example 1, and further a copper clad laminated tape was produced. With respect to the obtained copper-clad laminated tape, the amount of warpage in the width direction was measured in the same manner as in Example 1, and the results are shown in Tables 1 and 2.

From Tables 1 and 2, the stretching temperature is 220 ° C., that is, in the temperature range lower than the glass transition temperature, the stretching ratio is 40% and 60%, and the stretching temperature is 45%.
In the temperature range of 0 ° C., that is, higher than the glass transition temperature, the copper-clad laminated tape having a small warp amount can be produced by uniaxially stretching under the treatment conditions of the stretching ratio of 20%, 30% and 70%. Recognize. Further, it can be seen that the warp amount of the copper-clad laminated tape is smaller when the stretching temperature is 450 ° C. than when the stretching temperature is 220 ° C. Especially 45
The one using a polyimide film uniaxially stretched at a draw ratio of 30% in an atmosphere of 0 ° C. (Example 4) is more warped than the one produced by a conventional method (Comparative Example 5). The amount is 42% lower than that of conventional products.
It can be said that the electrical reliability during C mounting is significantly improved.

When the stretching ratio is 20% at a stretching temperature of 220 ° C. or 5% at a stretching temperature of 450 ° C.,
It can be seen that there is almost no difference from the case of producing without stretching as in the conventional case, and that if the stretching ratio is too small, the effect of stretching disappears after the annealing treatment. If the draw ratio is too high (90% at 220 ° C, 450 ° C
However, it is not possible to produce a TAB tape. However, it is understood that the larger the draw ratio is, the larger the effect of drawing is, as long as the flatness is not impaired.

Example 6 PDA: DADPE: PMDA was polymerized in DMF at a molar ratio of 1: 3: 4 to obtain a polyamic acid solution, and the polyamic acid solution was formed into a film and chemically imidized. Then, a polyimide film having a film thickness of 75 μm was obtained. The obtained polyimide film has an in-plane linear expansion coefficient isotropic,
The average linear expansion coefficient in the temperature range of 100 to 200 ° C. was 14 ppm in both the longitudinal direction and the width direction, which was 0.8 times the linear expansion coefficient of the copper foil. The glass transition temperature is 44
It was 0 ° C.

This polyimide film was uniaxially stretched by 60% in an atmosphere of 450 ° C., annealed in an atmosphere of 400 ° C. for 1 minute, and then slit into a width of 35 mm. After uniaxial stretching, 10 of this film annealed
The average linear expansion coefficient in the temperature range of 0 to 200 ° C. was 7 ppm in the stretching direction and 21 ppm in the width direction, and the linear expansion coefficient in the film width direction was 1.2 times the linear expansion coefficient of the copper foil. Using this 35 mm wide polyimide film as a base film layer, a TAB tape was prepared in the same manner as in Example 1 and a copper clad laminated tape was prepared. With respect to the obtained copper-clad laminated tape, the amount of warpage in the width direction was measured in the same manner as in Example 1, and the results are shown in Table 3.
It was shown to.

[0071]

[Table 3]

Comparative Example 6 A polyimide film having a film thickness of 75 μm was obtained in the same manner as in Example 5 by polymerizing PDA: DADPE: PMDA in a molar ratio of 1: 3: 4. 4 on the obtained polyimide film
After annealing for 1 minute in the atmosphere of 00 ° C, 3
Slit to a width of 5 mm. Using this 35 mm wide polyimide film as a base film layer, a TAB tape was prepared in the same manner as in Example 1 and a copper clad laminated tape was prepared. With respect to the obtained copper-clad laminated tape, the amount of warpage in the width direction was measured in the same manner as in Example 1, and the results are shown in Table 3.

From Tables 1, 2 and 3, the higher the stretching temperature and the larger the stretching ratio within the range where the flatness of the film is not impaired, the greater the effect of stretching and the smaller the warp amount of the copper clad laminated tape. It can be seen that the degree of effect depends on the composition of the polyimide film.

[0074]

The method of manufacturing the TAB tape of the present invention comprises:
It is characterized by using a polyimide film uniaxially stretched in the longitudinal direction of the film as a base film layer, the linear expansion coefficient in the width direction with respect to the longitudinal direction of the base film layer by such a manufacturing method, a conductor layer forming a circuit. A TAB tape having a coefficient of linear expansion of 1.2 times or more (for example, copper foil) can be manufactured. As described above, the polyimide film having a large linear expansion coefficient only in the width direction of the film becomes a elastic film that maintains the elastic modulus in the longitudinal direction of the film and can be suitably used as a base film layer.

When a copper foil or the like is attached to the TAB tape, the base film layer shrinks due to heating immediately after the adhesive is hardened, but expands due to moisture absorption over time. As a result, the dimensional change rates of the base film layer and the copper foil are substantially the same, and the amount of warpage in the width direction of the copper-clad laminated tape can be reduced. This eliminates the distortion of the electrical connection portion during IC mounting, which is mainly caused by the warpage of the copper-clad laminated tape in the width direction, and improves the electrical reliability during IC mounting.

That is, according to the manufacturing method of the present invention, it is possible to manufacture a copper-clad laminated tape in which the amount of warp in the width direction of the tape can be reduced, and the electrical reliability is improved.
C mounting technology can be provided.

[Brief description of drawings]

FIG. 1 is an enlarged perspective explanatory view showing an example of a method for manufacturing a TAB tape according to the present invention.

FIG. 2 is an enlarged perspective explanatory view showing one process of producing a copper-clad laminated tape using the TAB tape.

FIG. 3 is an enlarged perspective explanatory view showing an example of uniaxially stretching a polyimide film in the present invention.

FIG. 4 is an enlarged perspective explanatory view showing an example of producing a base film layer by cutting a uniaxially stretched polyimide film in the present invention.

FIG. 5 is an enlarged perspective explanatory view showing a warped state of the copper-clad laminated tape.

[Explanation of symbols]

 10; TAB tape 12; base film layer (polyimide film) 14; adhesive layer 16; protective layer 18; conductor layer (copper foil) 20; copper-clad laminated tape 22, 24; polyimide film

Continuation of front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location // B29K 77:00 B29L 9:00

Claims (7)

[Claims] 1. A method for producing a TAB tape comprising a base film layer, an adhesive layer and a protective layer, wherein the base film layer is obtained by stretching a resin film in a uniaxial direction and then stretching the resin film in a longitudinal direction. A method for producing a TAB tape, which is processed. 2. The method of manufacturing a TAB tape according to claim 1, wherein the base film layer is a resin film stretched uniaxially under heating. 3. The production of a TAB tape according to claim 1, wherein the base film layer is formed by uniaxially stretching a resin film and then subjecting it to an annealing treatment. Method. 4. The stretching ratio is 10 to 100% when the treatment condition for stretching the resin film in a uniaxial direction is a temperature range sufficiently higher than the glass transition temperature of the resin film.
It is preferably 20 to 70%, and the method for producing a TAB tape according to claim 2. 5. The treatment condition for uniaxially stretching the resin film is within a temperature range close to or lower than the glass transition temperature of the resin film,
The method for producing a TAB tape according to claim 2, wherein the draw ratio is 30 to 80%, preferably 40 to 60%. 6. The resin film is processed so that the linear expansion coefficient in the width direction with respect to the longitudinal direction of the resin film is 1.2 times or more the linear expansion coefficient of the conductor layer forming the circuit of the TAB tape. A method for manufacturing a TAB tape according to any one of claims 1 to 5. 7. The method of manufacturing a TAB tape according to claim 1, wherein the resin film is a polyimide film.