JPH08172249A - Chip part mounting board - Google Patents

Abstract

PURPOSE: To provide a chip part mounted board that enhances a heat radiation of the mounted chip parts and increases a strength. CONSTITUTION: A chip part mounted board 10 includes a plate material 11 composed of a conductive material being a base, an insulation layer 12 formed on a surface of this plate material and a conductive pattern formed on this insulation layer. The board 10 further comprises a heat radiation hole 14 passing through the insulation layer just under the chip parts extending through the plate material, and a thermal conductive material that fills this heat radiation hole and abuts against a lower surface of the chip parts and an inner surface of the heat radiation hole of the plate material.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting board for mounting chip parts such as IC chips and various semiconductor chips.

[0002]

2. Description of the Related Art Conventionally, in such a mounting board,
By mounting the chip component at the mounting position on the front surface of the printed circuit board and connecting the lead terminals of the chip component to the conductive pattern formed on the front or back surface of the printed circuit board by soldering, the chip component Implementation is being done. That is, in such a printed board, an insulating layer is formed on a plate material serving as a base material, and a conductive pattern is provided on the insulating layer by a copper foil or the like.

If the chip component is a chip component that generates a relatively large amount of heat such as a motor driving IC and a power IC, a heat conductive adhesive is applied to the lower surface of the chip component in advance. Then, by bringing the lower surface of this chip component into contact with the surface of the printed circuit board, the heat of the chip component is
Heat is radiated by letting it escape to the surface of the printed circuit board via a heat conductive adhesive. Alternatively, a heat dissipation conductive pattern made of copper foil is provided on the mounting position of the printed circuit board, and the heat dissipation conductive pattern and the chip component are connected by solder, so that heat is released from the solder to the heat dissipation conductive pattern. As a result, heat is radiated.

[0004]

However, in such a heat dissipation method for chip parts, the heat conductivity is not so good because the insulating layer exists between the plate material as the base material and the chip parts. Therefore, there is a problem in heat dissipation of the chip component.

In view of the above points, an object of the present invention is to provide a chip component mounting board which improves the heat dissipation of the mounted chip components.

[0006]

According to the present invention, the above object is to provide a base plate material having excellent thermal conductivity, an insulating layer formed on the surface of the plate material, and an insulating layer formed on the insulating layer. The conductive pattern, the mounting position of the component provided on the conductive pattern, a heat dissipation hole that penetrates the insulating layer into the plate material immediately below the mounting position of the chip component, and fills the heat dissipation hole. It is achieved by a chip component mounting board, which comprises a heat conductive material that comes into contact with the lower surface of the chip component and the inner surface of the heat dissipation hole of the plate member.

In the chip component mounting board according to the present invention, preferably, the plate member is an iron plate, and the heat dissipation hole is a through hole vertically penetrating the plate member.

In the chip component mounting board according to the present invention, preferably, the plate material is an iron plate, and the heat dissipation hole is a half-drilled hole extending downward from the upper surface of the plate material to a midpoint.

In the chip component mounting board according to the present invention, preferably, the heat conductive material is solder.

In the chip component mounting board according to the present invention, preferably, the heat conductive material is a heat conductive adhesive.

[0011]

According to the above construction, the lower surface of the chip component comes into contact with the heat conductive material, and this heat conductive material comes into contact with the inner surface of the heat radiation hole of the plate member. Therefore,
The heat of the chip component is transferred to the plate material having excellent heat conductivity through the heat conductive material, so that the heat dissipation of the chip component is improved.

In this case, since the heat dissipation hole is processed at the same time when the mounting board is manufactured, the cost does not increase.

When the heat dissipation hole is a through hole that vertically penetrates the plate material, the contact area of the heat conductive material with the plate material is large, so that the heat dissipation from the heat conductive material to the plate material is improved. Will be done.

When the heat dissipation hole is a half-drilled hole that extends downward from the upper surface of the plate member to the middle, for example, at the time of mounting, there is no possibility that the heat conductive material may drop downward from the heat dissipation hole. To be done.

When the heat conductive material is solder, the heat conductive material may be filled in the heat dissipation holes, for example, in a solder dipping step in mounting a chip component.

When the heat conductive material is a heat conductive adhesive, the heat conductive material is filled into the heat dissipation holes by a work of pouring the heat conductive adhesive.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail below with reference to FIGS. In addition, since the Examples described below are preferred specific examples of the present invention, various technically preferable limitations are given. However, the scope of the present invention particularly limits the present invention in the following description. The embodiment is not limited to these embodiments unless otherwise stated.

1 and 2 show a first embodiment of a chip component mounting board to which the present invention is applied. In these figures, the chip component mounting substrate 10 has a plate material 11, an insulating layer 12 formed on the surface of the plate material 11, and a conductive pattern (not shown) formed on the insulating layer 12. are doing. The chip component 13 is mounted at the chip component mounting position of this conductive pattern.

The plate member 11 is made of a conductive material such as iron. As a result, the plate material 11 also has relatively high thermal conductivity.

The insulating layer 12 is formed on the surface of the plate member 11 by
For example, it is formed by various methods such as vapor deposition and coating, and on its surface, a conductive pattern that forms a predetermined circuit together with various components including a chip component to be mounted is formed. This conductive pattern is made of, for example, copper foil.

In this case, the chip component 13 is a chip component such as a semiconductor chip of a motor driving IC or a power IC that generates a relatively large amount of heat, and has a plurality of lead terminals 13a.
It has. In the illustrated case, the chip component 13 is configured to have a plurality of lead terminals 13a on both sides thereof, but the configuration is not limited to this, and the chip component 13 may have a plurality of lead terminals on the four sides of a square package, for example. May be a package.

Further, the mounting board 10 has a heat dissipation hole 14 which extends through the insulating layer 12 into the plate material 11 directly below the chip component 13, and a heat conductive material filled in the heat dissipation hole 14. And 15 are provided.

As shown in FIG. 2, the heat radiation hole 14 completely penetrates the plate material 11 and the insulating layer 12 vertically. The heat dissipation holes 14 are formed at the same time when the mounting board including the plate material 11 and the insulating layer 12 is manufactured. Therefore, the heat dissipation hole 14
The heat dissipation hole 1 can be formed without particularly providing a process for forming
4 is formed at the same time when the mounting substrate is manufactured.

The heat conductive material 15 is, for example, solder,
A heat conductive adhesive is used. In the case of solder, the heat radiation holes 14 are simultaneously filled with solder in a solder dipping process for mounting the chip component 13. This allows
The heat conductive material 15 can dissipate the heat radiation holes 1 without increasing the number of steps.
4 will be filled. In the case of a heat conductive adhesive, the heat conductive adhesive is injected into the heat dissipation hole 14 so that its surface slightly rises from the surface of the insulating layer 12, and then the chip component 13 is used. Should be placed at the mounting position.

In this way, the heat conductive material 15 comes into contact with the lower surface of the chip component 13 and the inner surface of the heat dissipation hole 14 of the plate member 11.

Chip component mounting substrate 10 according to the present embodiment
Is configured as described above, and the chip component 13 mounted on the chip component mounting board 10 has its lead terminal 1
3a is mechanically fixed and electrically connected by being soldered to the conductive pattern formed on the surface of the insulating layer 12.

Further, the lower surface of the chip part 13 is in contact with the heat conductive material 15 filled in the heat radiation hole 14, and the heat conductive material 15 is placed in the heat radiation hole 14 to cover the plate material 11. It contacts the inner surface of the heat dissipation hole 14. Therefore, the heat generated from the chip component 13 is transferred from its lower surface to the heat conductive material 15, and further, from this heat conductive material 15,
The heat is transmitted to the plate material 11 on the inner surface of the heat dissipation hole 14. Thus, the heat of the chip component 13 is radiated to the plate material 11 via the heat conductive material 15. In this case, since the heat conductive material 15 is in direct contact with the plate material 11 inside the heat dissipation hole 14, good heat dissipation performance can be obtained.

Further, since the plate material 11 is made of iron, it has good thermal conductivity, and heat is sequentially radiated to the iron plate material via the heat conductive material 15 such as solder. Furthermore, this mounting board 10
Since an iron plate is used as the plate material, is cheaper and more durable than a glass epoxy substrate which is a normal printed circuit board. Therefore, according to the chip component mounting board 10 of the present embodiment, it is possible to provide a board which has excellent heat dissipation, is inexpensive, and has high strength.

FIG. 3 shows a second embodiment of the chip component mounting board according to the present invention. In FIG. 3, the chip component mounting board 20 includes a plate member 21, an insulating layer 22 formed on the surface of the plate member 21, a conductive pattern (not shown) formed on the insulating layer 22, and the conductive layer. The chip component 23 mounted at the chip component mounting position of the pattern, the heat radiation hole 24 penetrating the insulating layer 22 immediately below the chip component 23 and extending into the plate material 21, and the heat radiation hole 24 are filled. The heat conductive material 25 is included, and these configurations are the same as those in the first embodiment.

As shown in FIG. 3, the heat dissipation hole 24 completely penetrates the insulating layer 22 in the vertical direction, and also the plate member 21.
It is a so-called half-drilled hole that extends downward from the upper surface to about half the thickness. This heat dissipation hole 24 is formed by the plate member 21.
It is formed by half blanking at the same time when the mounting board including the insulating layer 22 and the insulating layer 22 is manufactured. Therefore, the heat dissipation hole 24 can be formed without providing a process for forming the heat dissipation hole 24.
Will be formed at the same time when the mounting substrate is manufactured.

The heat conductive material 25 is, for example, solder,
A heat conductive adhesive is used. In the case of solder, the heat radiation holes 24 are simultaneously filled with solder in the solder dipping process for mounting the chip component 23. This allows
The heat conductive material 25 is used for the heat dissipation hole 2 without increasing the number of steps.
4 will be filled. In the case of a heat conductive adhesive, the heat conductive adhesive is injected into the heat dissipation hole 24 so that the surface thereof is slightly raised from the surface of the insulating layer 22, and thereafter, the chip component 23. May be placed at the mounting position and the heat conductive adhesive may be cured. Therefore, the second embodiment has the same effect as that of the first embodiment, and further, in this case, since the heat dissipation hole 24 is a semi-drilled hole, solder before curing, a heat conductive adhesive, etc. The thermally conductive material 25 does not fall downward from the heat dissipation hole 24.

As described above, in the above-described embodiment, the heat of the chip component is transferred to the plate material through the heat conductive material filled in the heat dissipation holes, so that the heat dissipation of the chip component is improved and It is durable because it uses a material with excellent conductivity as the base plate. Therefore, the improvement of the heat dissipation of the chip parts greatly reduces the risk of thermal runaway. Further, by improving the heat dissipation of the chip component, the package of the chip component can be made more compact and high density, and sufficient strength can be obtained, so that various devices can be miniaturized. In this case, since the heat dissipation holes are processed at the same time when the mounting board is manufactured, the cost does not increase and the cost can be reduced.

In the above embodiment, the plate material 1
Although the case where iron is used as the material of Nos. 1 and 21 has been described, the present invention is not limited to this, and a material having high heat conductivity and high strength, such as a copper plate or an aluminum plate, may be used.

[0034]

As described above, according to the present invention, the heat dissipation of the mounted chip parts is improved.
A chip component mounting board will be obtained.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of a first embodiment of a chip component mounting board according to the present invention.

FIG. 2 is a schematic cross-sectional view of the chip component mounting board of FIG.

FIG. 3 is a schematic sectional view of a second embodiment of a chip component mounting board according to the present invention.

[Explanation of symbols]

 10 Chip Component Mounting Board 11 Plate Material 12 Insulating Layer 13 Chip Component 14 Radiating Hole 15 Thermal Conductive Material 20 Chip Component Mounting Board 21 Plate Material 22 Insulating Layer 23 Chip Component 24 Radiating Hole 25 Thermal Conductive Material

Claims (5)

[Claims] 1. A base material having excellent thermal conductivity, an insulating layer formed on the surface of the plate material, a conductive pattern formed on the insulating layer, and a component provided on the conductive pattern. A mounting position and a heat dissipation hole that penetrates through the insulating layer and extends into the plate material immediately below the mounting position of the chip component, and fills the heat dissipation hole to contact the lower surface of the chip component and the inner surface of the heat dissipation hole of the plate member. A chip component mounting board comprising a heat conductive material. 2. The chip component mounting board according to claim 1, wherein the plate member is an iron plate, and the heat dissipation hole is a through hole that vertically penetrates the plate member. 3. The chip component mounting according to claim 1, wherein the plate member is an iron plate, and the heat dissipation hole is a half-drilled hole that extends partway downward from the upper surface of the plate member. Mounting board. 4. The chip component mounting board according to claim 1, wherein the thermally conductive material is solder. 5. The chip component mounting board according to claim 1, wherein the heat conductive material is a heat conductive adhesive.