JPH08172162A - Semiconductor integrated circuit - Google Patents

Abstract

PURPOSE: To easily form an input processing circuit, an output circuit and a power supply circuit without complicated wiring, by constituting the bulk layout of an input block, an output block, a power supply block and an element arrangement block, and containing various kinds of elements in the input block, the output block and the power supply block. CONSTITUTION: In a semiconductor integrated circuit 10, an IC substrate is divided into an input block 11, an output block 12, a power supply block 13, an element arrangement block 14, etc. Each of the input block 11, the output block 12 and the power supply block 13 contains various kinds of elements capable of constituting circuits for realizing the function of each block. For example, the input block 11 contains a pad 15, ESD protective diodes D1 , D2 . and further a transistor Q1 and a resistor R3 which constitute a clamp circuit 20 for surge protection. Thereby the clamp circuit 20 for surge protection wherein it is necessary to drive a large current can be arranged in the vicinity of the pad 15.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention has a common region (bulk) in which elements such as transistors and resistors are formed, and by changing contacts and wiring, the resistance value and circuit connection can be changed to provide a user. The present invention relates to a semiconductor integrated circuit capable of producing a dedicated IC having desired functions and characteristics, and mainly to a semiconductor integrated circuit used as an automobile IC.

[0002]

2. Description of the Related Art This type of semiconductor integrated circuit has a common bulk, which is a region in which transistors, resistors, etc. are formed,
ICs with various functions can be created simply by changing contacts and wirings. By increasing the total number of common bulks used, ICs can be created.
It is possible to reduce the development and manufacturing costs of. For this reason, the bulk, which is a common part, is laid out so that it is as versatile as possible and can contain as many elements as possible in a limited chip size.

FIG. 4 shows an example of a bulk layout in a conventional semiconductor integrated circuit. A plurality of pads 61 are arranged on the outer peripheral portion of the semiconductor integrated circuit 60.
A large current NPN transistor arrangement block 65 and a PN in which a large current NPN transistor is built in the center of 0
A PNP transistor arrangement block 64 in which P transistors are built is arranged, and a large current NPN transistor arrangement block 65 and a PNP transistor arrangement block 6 are arranged.
An NPN transistor arrangement block 63 in which a small current NPN transistor is built is arranged with 4 in between,
On both sides of the PN transistor arrangement block 63, resistor arrangement blocks 62 having resistors built therein are arranged.

In the case of the bulk layout in the conventional semiconductor integrated circuit 60 shown in FIG. 4, large current NPN transistor arrangement blocks 65 are arranged in a line at the center of the chip.

[0005]

By the way, ICs for automobiles
In this case, it is necessary to cope with serge noise from the outside such as ignition noise, and a surge protection clamp circuit is arranged at the input terminal, power supply terminal, etc.
The circuit configuration is different from that of C. In the case of the conventional semiconductor integrated circuit, as shown in FIG. 4, the bulk layout, which is a common part, emphasizes element matching and area efficiency. If an IC is to be constructed, there arise problems that the use efficiency of the element is deteriorated and wiring is difficult.

In the case of a surge protection clamp circuit used in an automobile IC, it is necessary to drive a large current.
It is desirable to place it near the pad for the input terminal.
However, it is impossible to arrange the surge protection circuit near the input terminal in the conventional semiconductor integrated circuit described above. Also,
Since the number of input terminals is large and the number of pads may be about half of the total number of pads, if a serge protection clamp circuit is constructed with a conventional semiconductor integrated circuit having the bulk layout shown in FIG. Becomes difficult.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a semiconductor integrated circuit having a bulk layout suitable for use as various input processing ICs, particularly as automobile ICs.

[0008]

In order to achieve the above object, a semiconductor integrated circuit (1) according to the present invention comprises a pad and an ES.
An input block including a D protection element and at least various elements capable of forming a clamp circuit for surge protection, and various elements for forming an output circuit including a pad and an ESD protection element A bulk is laid out by an output block including a power supply block including various elements for configuring a reference voltage circuit, and an element placement block including elements such as resistors and transistors for configuring other circuits. It is characterized by

A semiconductor integrated circuit (2) according to the present invention
In the semiconductor integrated circuit (1), the input block is arranged along one side of the IC chip, and the output block is arranged along the opposite side of the one side of the IC chip.

[0010]

[Action]

Semiconductor integrated circuit (1) In the semiconductor integrated circuit (1), the bulk layout is composed of an input block, an output block, a power supply block, and an element arrangement block, and each of the input block, the output block, and the power supply block has a block layout. Since various elements for realizing the function are built-in, the input processing circuit, the output circuit, and the power supply circuit can be easily formed without complicated wiring. In particular, since the input block includes a pad, an ESD protection element, and various elements that can form at least a clamp circuit for surge protection, it is necessary to drive a large current near the input terminal (pad). It is possible to easily form a certain clamp circuit for surge protection. That is, when the semiconductor integrated circuit (1) having the above configuration is used, various kinds of input processing are performed as compared with the case of using the conventional semiconductor integrated circuit in which the bulk layout is configured for each element as shown in FIG. It becomes possible to form an IC having a function, especially an IC for a vehicle, which must cope with a surge noise such as an ignition noise, much easier.

Semiconductor integrated circuit (2) In the semiconductor integrated circuit (2) according to the above configuration, the input block is arranged along one side of the IC chip, and the output block is arranged on the opposite side of the one side of the IC chip. Since the input terminal and the output terminal are separated along the line, interference between the input and the output is prevented, and the reliability is further enhanced.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a semiconductor integrated circuit according to the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram schematically showing the bulk layout of the semiconductor integrated circuit 10 according to the embodiment.

A total of eight input blocks, four input blocks 11a and four input blocks 11b, are arranged along one side 10a of the semiconductor integrated circuit 10.
A total of eight output blocks, that is, four output blocks 12a and four output blocks 12b, are arranged along the opposite side 10b of 0. Each input block 11a, 11b is a pad 1
5, each output block 12a, 12b includes a pad 16
It is configured to include. Also, the input block 11
The layout of the elements contained in a (or the output block 12a) and the layout of the elements contained in the input block 11b (or the output block 12b) are symmetrical.

Input block 11b and output block 12b
A power supply block 13 is arranged between the input blocks 11a, 11b and the output blocks 12a, 12b, and element arrangement blocks 14a-14d and element arrangement blocks 14e-14h are arranged between them. In each of the element placement blocks 14a to 14d and 14e to 14h,
Elements such as a resistor R, a PNP transistor, and an NPN transistor are built in and arranged in consideration of element matching.

The input block 11 includes the following elements. By connecting the following elements with contacts and wiring, various clamp circuits for surge protection can be configured. There is. That is, the input block 11 is a large current PNP transistor and a large current NPN transistor that can handle a surge current of 10 mA to 20 mA.
It contains one transistor each, several small current transistors, several resistors and two ESD protection diodes.

FIG. 2 shows an example of a clamp circuit constructed by using each of the above elements. The pad 15 is connected to the connection point A, the ESD protection diode D ₁ is interposed between the connection point A and the power supply Vcc, and the ESD protection diode D is connected between the connection point A and the ground GND. ₂ is interposed. Further, the connection point A is connected to a connection point B serving as an output terminal to the internal circuit via the resistor R ₁ , and the connection point B and the power source Vc are connected.
An NPN transistor Q ₁ is interposed between the connection point B and the ground GND, and a PNP transistor Q ₁ is connected between the connection point B and the ground GND.
₂ is interposed. A resistor R ₃ and an NPN transistor Q ₃ are provided between the connection point B and the power source Vcc,
A resistor R ₄ and PN are provided between the connection point B and the ground GND.
A P-transistor Q ₄ is provided. The emitter of the NPN transistor Q ₃ is connected to the base of the NPN transistor Q ₁ , and the emitter of the PNP transistor Q ₄ is P
The base of the NP transistor Q ₂ is connected. A resistor R ₅ and a resistor R are provided between the power supply Vcc and the ground GND.
₆ is interposed, and the connection point V _R between the resistor R ₅ and the resistor R ₆ is N
It is connected to the base of PN transistor Q ₃ and P
It is connected to the base of the NP transistor Q ₄ . The NPN transistor Q ₁ is for a large current, and the PNP
The transistor Q _{2 is} also for high current.

The operation of the clamp circuit 20 configured as described above will be briefly described. A voltage V _ref, which is a voltage obtained by dividing the power source Vcc by the resistors R ₅ and R ₆ , is applied to the connection point V _R. When a positive surge voltage is applied to the pad 15, the PNP transistor Q ₄ and the PNP transistor Q ₂ are turned on, and the potential at the connection point B is (V _ref + 2V _EB ).
Fixed to. On the other hand, when a negative surge voltage is applied to the pad 15, the NPN transistor Q ₃ and the NPN transistor Q ₁ are turned on, and the potential at the connection point B becomes (V _ref -2V
_BE ) fixed. As described above, in the clamp circuit 20 shown in FIG. 2, the voltage applied from the connection point B to the internal circuit is always set in the range of (V _ref -2V _BE ) to (V _ref + 2V _EB ). And the potential at the connection point B becomes Vc
The value of the voltage V _ref is set so that the voltage value does not exceed c or does not become the voltage value equal to or lower than the ground GND.

Next, a configuration example of the output block 12 will be briefly described. The output block 12 is an element for forming various output circuits, one large current NPN transistor capable of driving a current of 10 mA to 20 mA, several small current transistors, several resistors, and an ESD. It is configured to include two protection diodes.

FIG. 3 shows an example of an output circuit composed of contacts and wirings using the above elements. The output circuit 30 is used, for example, in an automobile IC when the signals from various sensors are processed by an internal circuit and then output to a microcomputer or the like.

The output of the internal circuit is input to the base of the NPN transistor Q _8.
The collector of the transistor Q ₈ is connected to the power source V via the resistor R _9.
The emitter is connected to the ground GND via the resistor R ₁₀ and is also connected to the base of the NPN transistor Q ₉ . The emitter of the NPN transistor Q ₉ is connected to the ground GND, and the collector is the resistor R.
Is connected to the power supply Vcc via ₁₁ and pad 16
It is connected to the. An electrostatic protection diode D ₅ is provided between the collector of the NPN transistor Q ₉ and the power supply Vcc, and an electrostatic protection diode D ₅ is connected between the collector and the ground GND.
₆ is interposed. The NPN transistor Q ₉ is for a large current.

The operation of the output circuit 30 configured as described above will be briefly described. When a high level is input to the base of the NPN transistor Q ₈ from the internal circuit, the NPN transistor Q ₈ and the NPN transistor Q ₉ are turned on, and the ground level (low level) is output from the pad 16. On the other hand, base of NPN transistor Q ₈ - scan in Russia - when the level is input, the NPN transistor Q ₈ and NPN
The transistor Q ₉ is turned off, and the pad 16 outputs the Vcc power supply (high level).

In the power supply block 13, several tens of reference points can be constructed so that a high precision reference voltage circuit using a bandgap voltage (bandgap reference) of a diode formed between the base and the emitter can be constructed. The number of transistors, dozens of resistors, and phase correction capacitors are arranged in consideration of element matching, and the output voltage can be set freely by changing the contacts and wiring. It has become. The power supply block 13 is preferably arranged near the ground terminal.

As described above, in the semiconductor integrated circuit 10 according to the embodiment, the IC substrate is the input block 11,
Each block of the input block 11, the output block 12, and the power supply block 13 is divided into an output block 12, a power supply block 13, an element arrangement block 14, and the like, and various elements that can configure a circuit for realizing the function of each block. Since it has a built-in IC, wiring can be done in each block, and the input processing circuit (cage circuit for surge protection) is much easier than the conventional semiconductor integrated circuit in which the bulk is laid out for each element. Etc.), each circuit of the output circuit and the power supply circuit can be formed.

The input block 11 includes, for example, a pad 15 and ESD protection diodes D ₁ and D ₂ , and at least various elements (NPN transistor Q ₁ and NPN transistor Q ₁ , which can form a clamp circuit 20 for surge protection. Resistance R ₃
Etc.), a clamp circuit for surge protection can be arranged near the input terminal (pad 15). Therefore, when the semiconductor integrated circuit 10 according to the embodiment is used, compared with the case where the conventional semiconductor integrated circuit is used,
Input processing ICs, especially automotive ICs that require protection of internal circuits from surge noises such as ignition noises
Can be formed much easier without the difficulty of wiring.

Generally, in ICs for automobiles, in many cases, minute input signals from various sensors are amplified by an amplifier or waveform-shaped by a comparator and output, so that the input terminal and the output terminal are adjacent to each other. If so, a problem may occur due to interference between terminals. However, the semiconductor integrated circuit 1
In the bulk layout of 0, the input block 11 is arranged along one side 10a of the semiconductor integrated circuit 10 and the output block 12 is arranged on the opposite side 10 of the semiconductor integrated circuit 10.
Since the input terminal (pad 15) and the output terminal (pad 16) are arranged along b, the interference between the input and output can be prevented and the reliability can be improved.

[0026]

As described above in detail, by using the semiconductor integrated circuit (1) according to the present invention, even if complicated wiring is not required,
The input processing circuit, the output circuit, and the power supply circuit can be easily formed. The input block is a pad and an E
Since it includes SD protection elements and at least various elements that can form a surge protection clamp circuit, it is necessary to drive a large current near the input terminal (pad) for surge protection. A clamp circuit can be arranged.

In the semiconductor integrated circuit (2) according to the present invention, the input block is arranged along one side of the IC chip, and the output block is arranged along the opposite side of the IC chip. Since the input terminal and the output terminal are separated, interference between the input and output can be prevented.

Therefore, the semiconductor integrated circuit (1) according to the present invention
By using the semiconductor integrated circuit (2) and / or the semiconductor integrated circuit (2), various highly reliable input processing ICs, particularly automobile ICs, can be easily realized.

[Brief description of drawings]

FIG. 1 is a block diagram schematically showing a bulk layout of a semiconductor integrated circuit according to an embodiment of the present invention.

FIG. 2 is a configuration example (clamp circuit) of an input block configuring a bulk layout of a semiconductor integrated circuit according to an embodiment.
It is the circuit diagram which showed.

FIG. 3 is a circuit diagram showing a configuration example of an output block configuring a bulk layout of a semiconductor integrated circuit according to an example.

FIG. 4 is a block diagram schematically showing an example of a bulk layout in a conventional semiconductor integrated circuit.

[Explanation of symbols]

10 Semiconductor Integrated Circuit 10a One Side 10b Opposite Side 11 Input Block 12 Output Block 13 Power Supply Block 14 Element Arrangement Block 15, 16 Pad 20 Clamp Circuit 30 Output Circuit D ₁ , D ₂ ESD Protection Diode (ESD Protection Element)

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location H01L 21/8222 27/06 H03K 17/00 A 9184-5K H01L 27/04 A 27/06 101 D

Claims (2)

[Claims] 1. A pad and an ESD (Electro Static Disch)
arge) an input block including a protective element and at least various elements capable of forming a clamp circuit for surge protection, a pad and an ESD protective element, and various types for forming an output circuit. Bulk layout with output block including elements, power supply block including various elements to configure the reference voltage circuit, and element placement block including elements such as resistors and transistors to configure other circuits A semiconductor integrated circuit characterized by being provided. 2. The semiconductor integrated circuit according to claim 1, wherein the input block is arranged along one side of an IC chip, and the output block is arranged along a side opposite to the one side of the IC chip. .