JPH08172029A - Thick film printed capacitor and its capacity adjusting method - Google Patents

Thick film printed capacitor and its capacity adjusting method

Info

Publication number
JPH08172029A
JPH08172029A JP6316606A JP31660694A JPH08172029A JP H08172029 A JPH08172029 A JP H08172029A JP 6316606 A JP6316606 A JP 6316606A JP 31660694 A JP31660694 A JP 31660694A JP H08172029 A JPH08172029 A JP H08172029A
Authority
JP
Japan
Prior art keywords
thick film
capacitor
film printed
comb
printed capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6316606A
Other languages
Japanese (ja)
Inventor
Hiroshi Ochi
博 越智
Yasuyuki Baba
康行 馬場
Shigetoshi Segawa
茂俊 瀬川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6316606A priority Critical patent/JPH08172029A/en
Publication of JPH08172029A publication Critical patent/JPH08172029A/en
Pending legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

PURPOSE: To provide a thick film printed capacitor which is simple, reliable and with precision and its capacity being adjustable by improving the shape of an electrode constituting a capacitor. CONSTITUTION: By printing a conductor paste on a ceramics substrate 1, facing comb-like electrodes 2 are formed, and on the comb-like electrodes 2, a dielectric paste 3 is printed/applied so that a dielectric layer 3 is formed. The teeth part of the thick film print capacitor thus formed is selectively cut with laser light, etc., so that capacity is adjusted.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、厚膜印刷コンデンサの
電極形状及び厚膜印刷コンデンサの容量調整方法に関す
るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode shape of a thick film printed capacitor and a capacitance adjusting method for the thick film printed capacitor.

【0002】[0002]

【従来の技術】従来、厚膜印刷コンデンサは、誘電体層
を平面電極で挟み込む形で形成していたため、厚膜印刷
コンデンサの容量調整方法においては、セラミック基板
上、あるいはセラミック基板に内蔵されたコンデンサ
を、繰り返し焼成やレーザ光を照射して加熱することに
より、誘電体層を劣化させて容量調整を行ってきた。
2. Description of the Related Art Conventionally, a thick film printed capacitor has been formed by sandwiching a dielectric layer between plane electrodes. Therefore, in the method of adjusting the capacitance of the thick film printed capacitor, the thick film printed capacitor is mounted on or in a ceramic substrate. By repeatedly firing a capacitor and heating it by irradiating it with laser light, the dielectric layer is deteriorated to adjust the capacitance.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、上記従
来の厚膜印刷コンデンサは、電極導体ペースト,誘電体
ペースト,電極導体ペーストの多層構造を採っており、
誘電体層のピンホールによる電極間のショートや、誘電
体のエッジ部分での電極導体の断線等が起こっていた。
また容量調整時の熱処理は誘電体の特性を劣化させ、ま
た他の部品への影響が大きいという問題があった。
However, the above-mentioned conventional thick film printed capacitor has a multilayer structure of an electrode conductor paste, a dielectric paste, and an electrode conductor paste.
Short-circuiting between electrodes due to pinholes in the dielectric layer, disconnection of electrode conductors at the edges of the dielectric, and the like have occurred.
Further, there is a problem that the heat treatment at the time of adjusting the capacity deteriorates the characteristics of the dielectric and has a great influence on other parts.

【0004】本発明は、上記従来技術の問題点を解決し
ようとするもので、コンデンサを構成する電極形状を改
善することにより、高精度及び高信頼性の厚膜印刷コン
デンサを提供するとともに、容量を容易かつ高精度に調
整することのできる容量調整方法を提供することを目的
とする。
The present invention is intended to solve the above-mentioned problems of the prior art. By improving the shape of the electrodes forming the capacitor, the present invention provides a thick film printed capacitor with high accuracy and high reliability, and at the same time, the capacitance is improved. It is an object of the present invention to provide a capacity adjusting method capable of easily and highly accurately adjusting.

【0005】[0005]

【課題を解決するための手段】上記目的を達成するため
に、(1) 本発明の厚膜印刷コンデンサは、セラミック基
板上あるいはセラミックグリーンシート上に、電極導体
ペーストを対向する櫛形に印刷し、その電極上に誘電体
ペーストを印刷塗布することにより、厚膜印刷コンデン
サを形成するものである。
In order to achieve the above object, (1) a thick film printed capacitor of the present invention, an electrode conductor paste is printed in a comb shape facing each other on a ceramic substrate or a ceramic green sheet, A thick film printed capacitor is formed by printing and applying a dielectric paste on the electrodes.

【0006】(2) 本発明の厚膜印刷コンデンサの容量調
整方法は、対向する櫛形に形成された電極の歯部を、レ
ーザ光などにより選択的に切断することにより容量を調
整するものである。
(2) In the method of adjusting the capacitance of the thick film printed capacitor of the present invention, the capacitance is adjusted by selectively cutting the tooth portions of the opposing comb-shaped electrodes with laser light or the like. .

【0007】[0007]

【作用】上記(1)の厚膜印刷コンデンサによれば、誘電
体を挟み込む電極を一度に同時に形成できるため、電極
形成のための印刷工程数が減り、また誘電体のピンホー
ルによる電極間ショートや、誘電体のエッジ部分での電
極導体の断線等が解消される。
According to the thick film printed capacitor of the above (1), since the electrodes sandwiching the dielectric can be formed at the same time, the number of printing steps for forming the electrode is reduced, and the short circuit between the electrodes due to the pinhole of the dielectric. Also, disconnection of the electrode conductor at the edge of the dielectric is eliminated.

【0008】また、(2)の容量調整方法によれば、コン
デンサを形成する誘電体に直接負荷を加えることなく容
量を調整することができ、またセラミック基板に内蔵さ
れたコンデンサについても、櫛形電極の歯部をビア導体
を介して最外層に配線することにより、同様に容量を調
整することができる。
Further, according to the capacitance adjusting method (2), the capacitance can be adjusted without directly applying a load to the dielectric forming the capacitor, and the capacitor incorporated in the ceramic substrate can also be used in the comb-shaped electrode. By similarly wiring the tooth portion of (1) to the outermost layer via the via conductor, the capacitance can be similarly adjusted.

【0009】[0009]

【実施例】以下、図面を参照して実施例を詳細に説明す
る。図1は本発明の一実施例における厚膜印刷コンデン
サを示したものであり、1はセラミック基板、2は導体
ペーストを印刷して焼成した互いに対向する櫛形電極、
3は櫛形電極2上に印刷塗布された誘電体層、4はレー
ザ光などにより選択的に切断された電極の歯部で、5は
その切断箇所である。
Embodiments will be described in detail below with reference to the drawings. FIG. 1 shows a thick film printed capacitor according to an embodiment of the present invention, in which 1 is a ceramic substrate, 2 is a comb-shaped electrode formed by printing and firing a conductor paste, and facing each other.
Reference numeral 3 denotes a dielectric layer printed and applied on the comb-shaped electrode 2, reference numeral 4 denotes a tooth portion of the electrode selectively cut by a laser beam or the like, and reference numeral 5 denotes a cut portion thereof.

【0010】使用する電極用導体ペーストはAg/Pd(8
5/15)粉末に有機ビヒクルを加えて混練,作製したもの
であり、また、誘電体ペーストはPb(Mg1/3,Nb2/3)
−PbO−PbTiO3粉にビヒクルを加えて作製したもの
である。
The electrode conductor paste used is Ag / Pd (8
5/15) Organic powder was added to the powder, and the mixture was kneaded and prepared. The dielectric paste was Pb (Mg1 / 3, Nb2 / 3).
Those prepared by adding vehicle -PbO-PbTiO 3 powder.

【0011】セラミック基板1上に導体ペーストを用い
て対向する櫛形電極パターンを印刷し、箱型乾燥炉にて
150℃,10分間乾燥後冷却し、続いて誘電体ペーストを
櫛形電極上に印刷塗布し、箱型乾燥炉にて150℃,10分
間乾燥した後、ベルト式焼成炉にて900℃,15分の焼成
を行った。
A comb-shaped electrode pattern is printed on the ceramic substrate 1 using a conductor paste, and the comb-shaped electrode pattern is printed in a box-type drying oven.
After drying at 150 ° C for 10 minutes and cooling, the dielectric paste is then applied by printing onto the comb-shaped electrodes, dried at 150 ° C for 10 minutes in a box-type drying oven, and then 900 ° C for 15 minutes in a belt-type firing oven. Was fired.

【0012】得られた櫛形電極2を持つ厚膜印刷コンデ
ンサの容量をLCRメーターで測定しながら、櫛歯部分
を選択的に切断していくと(切断箇所5)、その切断歯部
4と相手側歯部との間に挟まれた部分の容量が減少す
る。このようにして所定の容量値になるまで櫛歯を選択
的に切断していくことにより、容量精度の高い厚膜印刷
コンデンサが得られる。
While the capacitance of the obtained thick film printed capacitor having the comb-shaped electrode 2 was measured with an LCR meter, the comb tooth portion was selectively cut (cutting point 5), and the cutting tooth portion 4 and the mating tooth portion 4 were mated with each other. The capacity of the portion sandwiched between the side teeth is reduced. In this way, by selectively cutting the comb teeth until the predetermined capacitance value is obtained, a thick film printed capacitor with high capacitance accuracy can be obtained.

【0013】[0013]

【発明の効果】以上説明したように、本発明は、コンデ
ンサの電極を対向する櫛形に形成して厚膜印刷コンデン
サを構成したもので、電極形成の工程数を減らすことが
でき、また誘電体のピンホールによる電極間ショートや
誘電体のエッジ部分での電極導体の断線等が解消され
る。これにより、厚膜印刷コンデンサの信頼性を向上す
ることができる。
As described above, according to the present invention, the electrodes of the capacitor are formed in a comb shape so as to face each other to form the thick film printed capacitor, which can reduce the number of steps for forming the electrode, and the dielectric material. The short circuit between electrodes due to the pinhole and the disconnection of the electrode conductor at the edge portion of the dielectric are eliminated. As a result, the reliability of the thick film printed capacitor can be improved.

【0014】また、本発明は、櫛形電極の歯部を選択的
に切断して容量調整を行うので、コンデンサを形成する
誘電体、あるいは基板全体に直接負荷を加えることがな
く、そのため、回路基板においては、他の電子部品実装
後も厚膜印刷コンデンサの容量を調整することができ
る。また、セラミック基板に内蔵されたコンデンサにつ
いても、櫛形歯部の配線をビア導体を介して最外層に配
線することにより、同様に容量を調整することができ
る。このようにして容量精度の高い厚膜印刷コンデンサ
を提供することができる。
Further, according to the present invention, since the tooth portion of the comb-shaped electrode is selectively cut to adjust the capacitance, it is not necessary to directly apply a load to the dielectric material forming the capacitor or the entire substrate, and therefore the circuit board is provided. In, the capacitance of the thick film printed capacitor can be adjusted even after mounting other electronic components. Also, regarding the capacitor built in the ceramic substrate, the capacitance can be adjusted in the same manner by wiring the wiring of the comb-teeth portion to the outermost layer via the via conductor. In this way, it is possible to provide a thick film printed capacitor having high capacitance accuracy.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例のセラミック基板上に形成さ
れた厚膜印刷コンデンサを示す斜視図である。
FIG. 1 is a perspective view showing a thick film printed capacitor formed on a ceramic substrate according to an embodiment of the present invention.

【符号の説明】 1…セラミック基板、 2…櫛形電極、 3…誘電体
層、 4…切断された歯部、 5…切断箇所。
[Explanation of Codes] 1 ... Ceramic substrate, 2 ... Comb-shaped electrode, 3 ... Dielectric layer, 4 ... Cut tooth portion, 5 ... Cut portion.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 電極形状を、対向する櫛形にしたことを
特徴とする厚膜印刷コンデンサ。
1. A thick film printed capacitor, characterized in that the electrodes have a comb shape facing each other.
【請求項2】 対向する櫛形電極の歯部を選択的に切断
して容量を調整することを特徴とする厚膜印刷コンデン
サの容量調整方法。
2. A method of adjusting the capacity of a thick film printed capacitor, which comprises selectively cutting the tooth portions of the comb-shaped electrodes facing each other to adjust the capacity.
JP6316606A 1994-12-20 1994-12-20 Thick film printed capacitor and its capacity adjusting method Pending JPH08172029A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6316606A JPH08172029A (en) 1994-12-20 1994-12-20 Thick film printed capacitor and its capacity adjusting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6316606A JPH08172029A (en) 1994-12-20 1994-12-20 Thick film printed capacitor and its capacity adjusting method

Publications (1)

Publication Number Publication Date
JPH08172029A true JPH08172029A (en) 1996-07-02

Family

ID=18078947

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6316606A Pending JPH08172029A (en) 1994-12-20 1994-12-20 Thick film printed capacitor and its capacity adjusting method

Country Status (1)

Country Link
JP (1) JPH08172029A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980046814A (en) * 1996-12-13 1998-09-15 조희재 Pattern Formation Method
JP2004072034A (en) * 2002-08-09 2004-03-04 Toppan Printing Co Ltd Capacitor, interposer or printed circuit board incorporating the same
EP1517596A2 (en) * 2003-09-18 2005-03-23 E.I. du Pont de Nemours and Company High tollerance embedded capacitors
US7609526B2 (en) 2004-09-24 2009-10-27 Meiko Electronics Co., Ltd. Circuit board
KR101148126B1 (en) * 2010-08-16 2012-05-23 엘지이노텍 주식회사 Supercapacitor and manufacturing method of the same
JP2016105514A (en) * 2010-12-22 2016-06-09 アナログ ディヴァイスィズ インク Vertically integrated system
CN106876152A (en) * 2015-12-11 2017-06-20 中芯国际集成电路制造(上海)有限公司 A kind of super capacitance cell and its manufacture method
JP2021500544A (en) * 2017-10-20 2021-01-07 フォームファクター, インコーポレイテッド Direct metal guide plate

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980046814A (en) * 1996-12-13 1998-09-15 조희재 Pattern Formation Method
JP2004072034A (en) * 2002-08-09 2004-03-04 Toppan Printing Co Ltd Capacitor, interposer or printed circuit board incorporating the same
EP1517596A2 (en) * 2003-09-18 2005-03-23 E.I. du Pont de Nemours and Company High tollerance embedded capacitors
EP1517596A3 (en) * 2003-09-18 2006-11-02 E.I. du Pont de Nemours and Company High tollerance embedded capacitors
US7609526B2 (en) 2004-09-24 2009-10-27 Meiko Electronics Co., Ltd. Circuit board
KR101148126B1 (en) * 2010-08-16 2012-05-23 엘지이노텍 주식회사 Supercapacitor and manufacturing method of the same
JP2016105514A (en) * 2010-12-22 2016-06-09 アナログ ディヴァイスィズ インク Vertically integrated system
JP2017157862A (en) * 2010-12-22 2017-09-07 アナログ ディヴァイスィズ インク Vertically integrated system
JP2019080074A (en) * 2010-12-22 2019-05-23 アナログ ディヴァイスィズ インク Vertically integrated system
CN106876152A (en) * 2015-12-11 2017-06-20 中芯国际集成电路制造(上海)有限公司 A kind of super capacitance cell and its manufacture method
JP2021500544A (en) * 2017-10-20 2021-01-07 フォームファクター, インコーポレイテッド Direct metal guide plate

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