JPH08167795A - Mounting equipment for electronic part - Google Patents

Abstract

PURPOSE: To obtain a higher speed for mounting parts by arranging at least two rotating heads around a substrate carrying table and by mounting the parts to the substrate by using these rotating heads together. CONSTITUTION: A second rotating head H, a second parts supplying machine F, a table T2 and a rail R2 are symmetrically arranged by sandwiching a table T2 and a rail R2. Moreover, the rotating head H and its intermittent rotating mechanism are supported by a slide base or the like, and the facing interval Pd of the rotating heads is made variable. Each rotating head H rotates at the preadjusted position, and the rotating heads H perform parts mounting action simultaneously and respectively by mounting device J came to the position B after receiving parts come to the position A by the mounting device J. As stated above, two rotating heads H can be used together for parts mounting to the substrate K so that the parts mounting can be performed at a capacity twice larger compared to the conventional equipment and therefore a higher speed can be obtained in parts mounting.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting device for mounting electronic parts on a substrate on a table.

[0002]

4 and 5 are a perspective view and a top view of a conventional mounting device, respectively. In the figure, H
Is a rotary head, J is a mounting tool, T1 is a substrate transport table, F is a component feeder, and T2 is a component feeder transport table.

The rotary head H has a cylindrical outer shape, and its central axis Ha is connected to an intermittent rotation mechanism (not shown). The mounting fixtures J are composed of cylinders Ja and suction nozzles Jb connected to the cylinder rods, and a total of eight mounting fixtures J are arranged on the circumferential surface of the rotary head H at intervals of 45 degrees. This mounting device J
Makes it possible to move the suction nozzle Jb up and down and to pick up and release parts by the nozzle Jb.

The substrate transfer table T1 is an X table T1a.
And a Y table T1b, and an X table T1a.
Is arranged on the straight rail R1 so as to be movable in the X direction, and Y
The table T1b is arranged on the X table T1a so as to be movable in the Y direction. The board K on which the components are mounted is supported on the Y table T1b of the board transport table T1.

The component feeder F is constructed by arranging a plurality of feeders Fa on which various components are mounted in parallel on a table T2. The feeder Fa is a well-known one using a component tape, and the component taped by the pressing operation accompanying the lowering of the suction nozzle Jb is exposed and can be sequentially fed to the tip position. In addition, a plurality of feeders Fa
The table T2 supporting the (component feeder F) is arranged so as to be movable in the X direction on a linear rail R2 arranged in parallel with the rail R1.

The rotary head H rotates at a fixed position, and the mounting tool J at the position A in FIG. 5 receives the component and the mounting tool J at the position B simultaneously mounts the component.

Specifically, when the mounting head J is moved to the A position by the rotation of the rotary head H, the table T2 is simultaneously moved in the X direction and the predetermined feeder Fa in the component feeder F is moved to the A position. Then, the suction force is applied to the suction nozzle Jb of the mounting tool J at the position A to lower the suction force, and the nozzle Jb receives the component from the feeder Fa. After receiving the components, the suction nozzle Jb is raised and returned.

When the mounting tool J holding the component is moved to the B position by the rotation of the rotary head H, at the same time, the table T1 is moved in the XY directions to align the substrate K and the mounting tool J, and Mounting device J at position B
Then, the suction nozzle Jb is lowered to release the suction force, and the component is mounted on the substrate K at a predetermined position. Suction nozzle Jb after component mounting
Rise back up.

The above-mentioned component reception and component mounting are sequentially carried out every time each mounting tool J of the rotary drum H reaches position A and position B, whereby various components are mounted on the substrate K on the table T1. .

[0010]

In order to shorten the time required to complete the mounting in the above-described conventional mounting device, there are only limited measures such as the addition of mounting equipment J and the speed of head rotation and nozzle elevation. . However, in any case, there is a limit in terms of size and accuracy such as suction failure and mounting failure, and thus there is a limit to the speedup. In addition, since the necessary components are mounted on the substrate one by one using one rotary head H, when components are mounted on a plurality of substrates, the time required to complete the mounting depends on the number of mounted substrates. There is a problem of doubling.

The present invention has been made in view of the above problems, and an object of the present invention is to provide an electronic component mounting apparatus capable of speeding up component mounting.

[0012]

In order to achieve the above-mentioned object, the invention of claim 1 is a rotary head having a plurality of mounting fixtures capable of receiving and mounting components in the circumferential direction,
In a mounting device for an electronic component, which is equipped with a component feeder that supplies various components to the mounting device that has arrived at the component receiving position and a substrate transport table that aligns the mounting device that has reached the component mounting position with the substrate, At least two rotary heads are arranged around the table, and these rotary heads are used together to mount components on the substrate.

According to a second aspect of the present invention, in the mounting apparatus according to the first aspect, at least a pair of rotary heads are arranged to face each other with the substrate transfer table interposed therebetween, and the facing distance between the rotary heads can be varied. I am trying.

[0014]

According to the first aspect of the invention, it is possible to mount components on the substrate on the table by using a plurality of rotary heads together. That is, it is possible to alternately mount the components from the rotary heads to the substrate for one set of substrates, and to mount the components on the substrate for multiple sets by making the rotary heads correspond to each region. It can be carried out.

According to the second aspect of the present invention, by varying the facing interval of the rotary heads, it is possible to adjust the mounting position when simultaneously mounting the substrates on a plurality of substrates. Other functions are similar to those of the invention of claim 1.

[0016]

1 is a top view of a mounting apparatus according to the present invention. This embodiment is different from the conventional example shown in FIGS. 4 and 5 in that the substrate transport table T1 and the rail R are different.
The first rotary head H and the second component feeder F with the first pinch interposed therebetween.
The table T2 and the rail R2 are arranged symmetrically, and the rotary head H and its intermittent rotation mechanism are supported by a slide stand or the like so that the facing distance Pd of the rotary head H can be varied. Since the configuration of each device is the same as that of the conventional example, the same reference numerals are used and the description thereof is omitted.

Each of the rotary heads H described above rotates at a pre-adjusted position, and each rotary head H comes to the position A for the mounting tool J.
And the mounting of the component by the mounting tool J that has come to the B position are performed simultaneously.

When components are mounted on a single substrate K, basically the components are alternately mounted on the substrates K from each rotary head H. That is, A of one rotary head H,
When component reception and component mounting are being performed at both B positions, the other rotary head H is in the middle of rotation, and the substrate K and the mounting fixture J are attached to the rotary head H on the component mounting side. Try to align. Of course, 1
Even on the substrate K of the pedestal, two components can be simultaneously mounted from both rotary heads H at a position where the pitch and the facing distance of the mounting fixture J at the position B match.

Also, a two-piece substrate K1 as shown in FIG.
On the other hand, when components are mounted, basically, components are alternately mounted from the rotary heads H to the substrate K1 as in the case of the single-piece substrate. In other words, when component reception and component mounting are being performed at both the A and B positions of one rotary head H, the other rotary head H is in the middle of rotation, and the rotary head H on the component mounting side is set. On the other hand, substrate K
The respective positions K1a and K1b of No. 1 and the mounting tool J are aligned. Of course, even in the case of the two substrates K1, if the facing distance Pd of the rotary heads H is adjusted in advance according to the component mounting distance Pk between the respective areas K1a and K1b, the rotary heads H can be moved to the respective areas K1a and K1b. On the other hand, two parts can be mounted at the same time. Also, with respect to the four-piece board K2 and the six-piece board K3 shown in FIG. 3, it is possible to simultaneously mount two components in the upper and lower portions in the drawing, as in the above.

As described above, according to the mounting apparatus of this embodiment, the two rotary heads H can be used together for mounting the component on the single-piece substrate K, so that the component mounting can be performed with twice the capacity as compared with the conventional apparatus. Therefore, it is possible to speed up the component mounting and reduce the time required to complete the component mounting. Further, if the facing distance Pd of the rotary head H is adjusted in advance, the multi-cavity substrate K1 to K3 Since components can be mounted from both rotary heads H at the same time, the time required to complete the mounting can be reduced to half that of the conventional device by converting it to a board for one unit, which can greatly improve the production capacity.

Further, even when a large electronic component with a lead, such as an integrated circuit, is mounted at low speed by one rotary head H, another component is mounted on the substrate by using the other rotary head H. It becomes possible.

In the above embodiment, the rotary heads H are symmetrically arranged with the substrate transfer table sandwiched between them. However, depending on the outer shape of the rotary head or the substrate size, two or more rotations can be made around the substrate transfer table. It is also possible to dispose the heads facing each other, and it is possible to use three or more rotary heads together to further speed up component mounting.

Although a combination of a cylinder and a suction nozzle has been illustrated as a mounting tool, various mounting tools that can receive and mount components can be used. Further, well-known devices that do not use a component tape can be widely used for the feeder that constitutes the component feeder.

[0024]

As described above in detail, according to the first aspect of the present invention, since two or more rotary heads can be used together for mounting components on the substrate, component mounting can be performed with a capacity more than twice that of the conventional device. This makes it possible to speed up component mounting and shorten the time required to complete mounting.

According to the second aspect of the present invention, if the facing intervals of the rotary heads are adjusted in advance, parts can be mounted simultaneously from the rotary heads facing each other on the plurality of substrate boards.
If converted into a board for one unit, the time required for completion of mounting can be reduced to less than half that of the conventional device, and thus the production capacity can be greatly improved. The other effects are the same as those of the invention of claim 1.

[Brief description of drawings]

FIG. 1 is a top view of a mounting device according to the present invention.

FIG. 2 is a diagram showing a two-piece substrate.

FIG. 3 is a diagram showing a four-cavity substrate and a six-cavity substrate.

FIG. 4 is a perspective view of a conventional mounting device.

FIG. 5 is a top view of a conventional mounting device.

[Explanation of symbols]

H ... rotary head, J ... mounting device, T1 ... substrate transport table, K ... substrate, F ... component feeder.

Claims (2)

[Claims] 1. A rotary head provided with a plurality of mounting devices capable of receiving and mounting components in the circumferential direction, a component supply device for supplying various components to the mounting device at a component receiving position, and a component mounting position. In a mounting device for electronic parts, which includes a mounting tool and a board transfer table for aligning the board with each other, at least two rotary heads are arranged around the board transfer table, and the rotary heads are used together to move to the board. A mounting device for electronic components, characterized in that it mounts components. 2. The mounting device for electronic parts according to claim 1, wherein at least a pair of rotary heads are arranged so as to face each other with the substrate transport table interposed therebetween, and the facing distance between the rotary heads is variable.