JPH081659A - 単結晶インゴット切断片の落下防止治具 - Google Patents

単結晶インゴット切断片の落下防止治具

Info

Publication number
JPH081659A
JPH081659A JP16742094A JP16742094A JPH081659A JP H081659 A JPH081659 A JP H081659A JP 16742094 A JP16742094 A JP 16742094A JP 16742094 A JP16742094 A JP 16742094A JP H081659 A JPH081659 A JP H081659A
Authority
JP
Japan
Prior art keywords
single crystal
crystal ingot
cut
cut piece
jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16742094A
Other languages
English (en)
Japanese (ja)
Inventor
Shinji Ando
慎治 安藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumco Techxiv Corp
Original Assignee
Komatsu Electronic Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Electronic Metals Co Ltd filed Critical Komatsu Electronic Metals Co Ltd
Priority to JP16742094A priority Critical patent/JPH081659A/ja
Priority to TW84112413A priority patent/TW277011B/zh
Publication of JPH081659A publication Critical patent/JPH081659A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP16742094A 1994-06-27 1994-06-27 単結晶インゴット切断片の落下防止治具 Pending JPH081659A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP16742094A JPH081659A (ja) 1994-06-27 1994-06-27 単結晶インゴット切断片の落下防止治具
TW84112413A TW277011B (fr) 1994-06-27 1995-11-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16742094A JPH081659A (ja) 1994-06-27 1994-06-27 単結晶インゴット切断片の落下防止治具

Publications (1)

Publication Number Publication Date
JPH081659A true JPH081659A (ja) 1996-01-09

Family

ID=15849373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16742094A Pending JPH081659A (ja) 1994-06-27 1994-06-27 単結晶インゴット切断片の落下防止治具

Country Status (2)

Country Link
JP (1) JPH081659A (fr)
TW (1) TW277011B (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5993810A (ja) * 1982-11-17 1984-05-30 Kawasaki Steel Corp 溶融スラグ薄層固化装置
WO2009087723A1 (fr) * 2008-01-08 2009-07-16 Shin-Etsu Handotai Co., Ltd. Appareil et procédé de coupe de lingot
CN104440162A (zh) * 2014-11-18 2015-03-25 无锡恒富科技有限公司 支托式工件装夹机构
JP2015109378A (ja) * 2013-12-05 2015-06-11 信越半導体株式会社 切断治具及びワークの切断方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5993810A (ja) * 1982-11-17 1984-05-30 Kawasaki Steel Corp 溶融スラグ薄層固化装置
WO2009087723A1 (fr) * 2008-01-08 2009-07-16 Shin-Etsu Handotai Co., Ltd. Appareil et procédé de coupe de lingot
JP2009160825A (ja) * 2008-01-08 2009-07-23 Shin Etsu Handotai Co Ltd インゴット切断装置および切断方法
JP2015109378A (ja) * 2013-12-05 2015-06-11 信越半導体株式会社 切断治具及びワークの切断方法
CN104440162A (zh) * 2014-11-18 2015-03-25 无锡恒富科技有限公司 支托式工件装夹机构

Also Published As

Publication number Publication date
TW277011B (fr) 1996-06-01

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