JPH081659A - Jig for preventing falling of cut piece of single crystal ingot - Google Patents

Abstract

PURPOSE:To obtain a jig for preventing fall of a cut piece of a single crystal ingot, in which when a block or wafer of an arbitrary thickness is cut from a single crystal ingot using a band saw cutting machine, a defect that a cut piece falls off a conveyor and is chipped can be avoided. CONSTITUTION:In a jig for preventing fall of a cut piece of a single crystal ingot, rubber suction pads 1, 2 are respectively baked on metallic bottom plates 1a, 2a to be shaped into a bowl form, and the pads are connected back to back using a screw shaft 3 and fixed by a double nut 4. After a dummy block 5 having approximately the same diameter as a single crystal ingot 6 is sucked by the suction pad 1, the suction pad 2 is pressed against the end face of the single crystal ingot 6 to suck it before cutting. A cut piece is transported on a conveyor together with the dummy block 5 in a stable state and never falls off the conveyor.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for preventing a cut piece of a single crystal ingot, and more particularly to a jig for preventing a cut piece of a single crystal ingot used when the single crystal ingot is divided into relatively thin blocks. .

[0002]

2. Description of the Related Art A single crystal ingot grown by a CZ method, an FZ method or the like is divided into several blocks while being divided into several blocks so as to meet the standards of impurities such as oxygen concentration or dopant concentration. The end face is inspected, and a wafer that meets a predetermined standard is cut in a cutting process to obtain a wafer. When the single crystal ingot is divided into several blocks, or when the crystal inspection wafer is cut out from the divided blocks, the ingot 20 is cut using the band saw cutting machine 30 shown in FIG. The band saw cutting machine 30 includes a thin steel strip blade 31.
And a V-shaped support 32 for supporting the ingot 20,
An extruding device 33 for extruding the ingot 20 to a predetermined position for cutting, a control device 34 for setting a dimension for extruding the ingot 20 to a predetermined position for cutting, and the ingot 20.
A pressing tool 35 for fixing the ingot 20 to the support table 32, a receiving table 37 for receiving the cut ingot 20 and swinging to discharge the cut ingot 20 to the conveyor 36, and an ingot 20 from the receiving table 37. The conveyor 36 that conveys the ingot 20 to the position, a sensor 38 such as a laser beam that is attached to the conveyor 36 and detects that the ingot 20 is cut, and a signal from the sensor 38 determines the ingot 20 to perform the next cutting. And the control device 34 for setting the position. The control device 34 releases the signal to the support base 32 that supports the ingot 20 for performing the next cutting, the signal that pushes the ingot 20 to the predetermined position by the pushing device 33 after the release, and the ingot 20 moves to the predetermined position. When pushed out, the ingot 20 is supported on the support base 32, and after the support, the blade 31 is operated to output a signal for cutting. The band saw cutting machine 30 is one in which an endless blade 31 having diamond abrasive grains glued to one end in the width direction of a thin steel strip is wound around two pulleys (not shown). The ingot 20 fixed between the pulleys is cut while moving in the direction. The cut ingot block 21 or wafer (hereinafter referred to as block 21) is conveyed to a predetermined place by the conveyor 36. When cutting out a wafer having a preset thickness, for example, a thickness of about 1.5 mm, the end face of the ingot 20, that is,
The end face of the wafer to be cut is adsorbed in advance and then cut.

[0003]

According to the above-mentioned conventional structure, the block having the axial length H of the block of 50 mm or less is separated unless it is cut while the end face is adsorbed to the vacuum chuck in advance. It may fall down on the rear conveyor and roll, and may fall on the floor and chip. Alternatively, the guide plate installed on the side surface of the conveyor may collide and be damaged. The length H of the block to be cut out by using the band saw cutting machine is not constant because the position of the surface to be inspected is set so as to be within the standard. For example, the position from which the crystal inspection wafer is sampled again according to the inspection result of the inspection wafer sampled from the end face of a certain block, that is, the length from the end face of a certain block to the next cutting position (the axial direction of the block 21) The length H) varies depending on the inspection result obtained from the end surface of a certain block. For this reason, the vacuum chuck installed at a fixed position cannot always be used. Further, this vacuum chuck may be changed so as to be moved to a predetermined position, but there is a problem that the structure and control become complicated and the cost of equipment is high. further,
At this time, if the block has a relatively large thickness, there is a problem that it is difficult to adsorb with the vacuum chuck.

When a block having an axial length H of 50 mm or less falls from the conveyor to the floor after being cut, the sensor monitoring the conveyor cannot detect a cut piece, so it is judged to be abnormal and the extruder is pushed out. Alternatively, lower the drive hydraulic pressure of the presser or the like. When the hydraulic pressure is lowered, the control program must be reset and the cutting must be restarted from the beginning, which causes a loss of the inspection sample and increases the number of cutting steps. Therefore, when cutting the block having the axial length H of 50 mm or less, the operator monitors the cutting state and holds it by hand before the block collides with the guide plate or drops from the conveyor. Stop rolling or remove block from conveyor. This is unsafe work and is not desirable.

The present invention has been made in view of the above-mentioned conventional problems. When a block or wafer having an arbitrary thickness is cut out from a single crystal ingot by using a band saw cutting machine, the cut pieces roll off from the conveyor. It is an object of the present invention to provide a jig for preventing a cut piece of a single crystal ingot from falling, which is capable of avoiding a defect of colliding with a guide plate and being damaged.

[0006]

To achieve the above object, a jig for preventing a cut piece of a single crystal ingot according to the first aspect of the present invention cuts a single crystal ingot to form a block having an arbitrary predetermined length. In this case, the suction pad to be adsorbed to the end face of the single crystal ingot to be cut and the suction pad to be adsorbed to the dummy block having substantially the same diameter as the single crystal ingot are attached back to back. . A fall prevention jig for a cut piece of a single crystal ingot according to a second aspect of the present invention, when a single crystal ingot is cut into a block having an arbitrary predetermined length dimension, a dummy having substantially the same diameter as the single crystal ingot to be cut. It is characterized in that a suction pad for adsorbing to the end face of the single crystal ingot is attached to the block via a mounting member. In the third aspect of the present invention, at least one of the outer circumferences of the dummy blocks is
The feature is that a flat surface is provided at the location.

[0007]

According to the above construction, the cut block or wafer rolls out from the conveyor because it is thin and lightweight. For this purpose, two suction pads, which are respectively attached to the end face of the single crystal ingot to be cut and the dummy block having substantially the same diameter as this single crystal ingot, are attached back-to-back with each other to form a fall prevention jig. , By connecting the block separated from the single crystal ingot to be cut and the dummy block with the fall prevention jig, the cut piece rolls on the conveyor and collides with the guide plate, or falls on the floor surface. Without carrying out, it is conveyed on the conveyor in a stable state together with the dummy block. In addition, since the suction pad is attached to the dummy block via the mounting bracket to form a fall prevention jig, the suction pad is stabilized just by adsorbing it to the end face of the single crystal ingot to be cut. It can be conveyed on the conveyor in the state. Furthermore, since the flat surface is provided at least at one location on the outer circumference of the dummy block, the rolling of the dummy block on the conveyor is suppressed. Therefore, it is possible to prevent damage or loss of the cut pieces of the single crystal ingot.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of a fall prevention jig for a cut piece of a single crystal ingot according to the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of a cut piece drop prevention jig in a first embodiment of the present invention, and FIG. 2 is a perspective view of a dummy block. In FIG. 1, the cut piece drop prevention jig 10 is composed of two rubber suction pads 1 and 2 and a dummy block 5 to be sucked by one suction pad 1. Two
The rubber suction pads 1 and 2 are formed into a bowl shape by being baked on the metal bottom plates 1a and 2a, respectively.
A screw hole into which the screw shaft 3 is screwed is provided at the center of each of a and 2a. These suction pads 1 and 2 are connected to the screw shaft 3
They are connected back to back by and are fastened using a double nut 4. In the case of this embodiment, the suction pads 1 and 2
Has an outer diameter D of 82 mm and a total length L of 90 mm. Also,
The diameter of the dummy block 5 to be adsorbed to the adsorption pad 1 on one side is almost the same as the diameter of the single crystal ingot 6 to be cut, and as shown in FIG. 2, a flat surface for preventing rolling on the conveyor at one location on the outer periphery. 5a is formed. The dummy block 5 has an axial length of about 50 mm. The suction pad is not limited to rubber, but may be a deformable soft polymer material, synthetic resin, or the like.

Axial length of 50 m from single crystal ingot
When cutting out blocks or wafers of m or less, follow the procedure below. (1) The single crystal ingot 6 is placed on the support 32 of the band saw cutting machine 30. (2) After inputting a required program for the cutting position to the control device 34, the automatic operation button 34a is pressed. (3) The pushing device 33 pushes the single crystal ingot 6 to a designated position, and the pressing tool 35 is used to push the single crystal ingot 6
Clamp. At this time, the jig 10 for dropping the cut piece of the single crystal ingot in which the pad 1 on one side is attracted to the dummy block 5 is placed on the pedestal 37 that discharges to the conveyor 36, and the pushing device 33 pushes the single crystal ingot 6 into place. When pushed out to the designated position, the pad 2 on the other side is pushed against the end face of the single crystal ingot 6 to be adsorbed. (4) Cutting of the single crystal ingot 6 is started. (5) When the cutting of the single crystal ingot 6 is completed, the cut piece, that is, the block 21 is conveyed by the conveyor 36 while being attracted to the fall prevention jig 10. (6) Remove the block 21 from the fall prevention jig. (7) For the next cutting, the drop prevention jig 10 for the cut piece of the single crystal ingot is placed on the pedestal 37 discharged to the conveyor 36. Next, the process returns to step (3), and the process is repeated.

FIG. 3 is a sectional view of a fall prevention jig 11 for a cut piece of a single crystal ingot according to the second embodiment of the present invention. The structure of this cutting piece drop prevention jig 11 is almost the same as that of the first embodiment, but since the length of the screw shaft 3 connecting the two suction pads 1 and 2 is shortened, the total length is shortened to 40 mm. ing. Axial length is 50mm using this jig
The procedure for cutting out the following blocks or wafers is the same as in the case of the first embodiment. Regarding which of the jigs shown in FIGS. 1 and 3 is to be used,
It may be arbitrarily selected. Although the screw shaft is used in the above configuration, the suction pads 1 and 2 may be integrally formed.

FIG. 4 is a sectional view of a cut piece drop prevention jig 12 according to a third embodiment of the present invention. One suction pad 1 is attached to the tip of a screw shaft 3 attached to a dummy block 5. It is a thing. A flat surface is provided on the outer periphery of the dummy block 5, and the diameter of the dummy block 5 is the same as the diameter of the single crystal ingot 6 to be cut. In the case of this jig, since the dummy block 5 and the suction pad 1 are integrally formed, it suffices to press the suction pad 1 against the end face of the single crystal ingot 6 to suck the single crystal ingot 6, but for an ingot of a specific diameter. It will be a dedicated jig. In addition, the first
Cutting piece drop prevention jig 12 of the embodiment and the second embodiment
Needless to say, can be adapted to a wide range of diameters by adjusting the diameter of the dummy block 5 to the single crystal ingot 6 for cutting.

[0012]

As described above, according to the present invention, since the jig for preventing the cut piece of the single crystal ingot provided with the suction pad has a simple structure, it can be obtained by cutting the single crystal ingot. The lightweight cutting piece is stably conveyed on the conveyor together with the dummy block, and it is possible to reliably prevent damage and loss of the cutting piece that has been conventionally generated. Therefore, loss of cut pieces due to the damage and loss,
As a result, the number of cutting steps is not increased and unsafe work is eliminated.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a cut piece drop prevention jig according to a first embodiment of the present invention.

FIG. 2 is a perspective view of a dummy block.

FIG. 3 is a sectional view of a cut piece drop prevention jig according to a second embodiment of the present invention.

FIG. 4 is a sectional view of a cut piece drop prevention jig according to a third embodiment of the present invention.

FIG. 5 is a diagram illustrating a cutting device.

[Explanation of symbols]

 1, 2 Adsorption pad 3 Screw shaft 5 Dummy block 5a Flat surface 6 Single crystal ingot

Claims (3)

[Claims] 1. When a single crystal ingot is cut into a block having an arbitrary predetermined length, a suction pad to be adsorbed to an end face of the single crystal ingot to be cut, and a dummy block having a diameter substantially the same as that of the single crystal ingot. A jig for preventing falling of a single crystal ingot cut piece, which comprises a suction pad and a suction pad attached to each other. 2. When a single crystal ingot is cut into a block having an arbitrary predetermined length, an end surface of the single crystal ingot is attached to a dummy block having a diameter substantially the same as that of the single crystal ingot to be cut through a fitting. A jig for preventing a cut piece of a single crystal ingot from dropping, which is equipped with a suction pad to be sucked onto. 3. A jig for preventing falling of a single crystal ingot cut piece according to claim 1 or 2, wherein a flat surface is provided on at least one location on the outer periphery of the dummy block.