JPH08162766A - Multilayer printed wiring board and production thereof - Google Patents
Multilayer printed wiring board and production thereofInfo
- Publication number
- JPH08162766A JPH08162766A JP32168094A JP32168094A JPH08162766A JP H08162766 A JPH08162766 A JP H08162766A JP 32168094 A JP32168094 A JP 32168094A JP 32168094 A JP32168094 A JP 32168094A JP H08162766 A JPH08162766 A JP H08162766A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- layer
- conductor
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は印刷配線板及びその製造
方法に関し、特に表面実装に用いられる非貫通スルーホ
ールを有する印刷配線板及びその製造方法に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board and a method of manufacturing the same, and more particularly to a printed wiring board having a non-penetrating through hole used for surface mounting and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】従来の非貫通スルーホールを有する印刷
配線板の製造方法は、特願平５−１６６１３７号に開示
されている。以下に従来の技術の特願平５−１６６１３
７号について図８〜図１１で説明する。図８に従来の技
術による構造を示す斜視図で、多層銅張り積層板に、非
貫通スルーホール（６）、スルーホール（４）、表面実
装用パッド（９ａ）、外層回路（９ｂ）、およびソルダ
ーレジスト（１０）が形成された非貫通スルーホールを
有する印刷配線板が示されており、これは実装面側の任
意の実装用パッドまたはランドから非貫通スルーホール
により任意の内装部と接続することができる。2. Description of the Related Art A conventional method for manufacturing a printed wiring board having non-penetrating through holes is disclosed in Japanese Patent Application No. 5-166137. Japanese Patent Application No. Hei 5-16613 of the prior art is described below.
No. 7 will be described with reference to FIGS. FIG. 8 is a perspective view showing a structure according to a conventional technique, in which a non-penetrating through hole (6), a through hole (4), a surface mounting pad (9a), an outer layer circuit (9b), and A printed wiring board having a non-penetrating through hole formed with a solder resist (10) is shown, which is connected from a mounting pad or land on the mounting surface side to any interior part by the non-penetrating through hole. be able to.
【０００３】図９、図１０及び図１１を用い、従来の技
術によるプリント配線板の製造方法を工程順に示した断
面図で説明する。まず、図９（ａ）に示すように、個別
に形成した内装材を接着剤層を介し加熱圧着することに
より多層銅張り積層板（１ｂ）を形成する。次に、図９
（ｂ）に示すように、表裏導通用と共に非貫通スルーホ
ール用の多層貫通穴（２ａ）を例えばφ０．４ｍｍで穴
明けする。次に、図９（ｃ）に示すように、外層貫通穴
を含む全面に１次外層めっき（３ａ）約２５μｍを施
し、スルーホール（４）を形成する。A conventional method for manufacturing a printed wiring board will be described with reference to FIGS. 9, 10 and 11 with sectional views showing the order of steps. First, as shown in FIG. 9 (a), the individually formed interior materials are thermocompression bonded via an adhesive layer to form a multilayer copper-clad laminate (1b). Next, FIG.
As shown in (b), a multilayer through hole (2a) for front and back conduction as well as a non-through through hole is formed with a diameter of 0.4 mm, for example. Next, as shown in FIG. 9C, primary outer layer plating (3a) of about 25 μm is applied to the entire surface including the outer layer through holes to form through holes (4).
【０００４】次に、図１０（ｄ）に示すように、非貫通
スルーホール用のスルーホール（４）の裏面側より外層
貫通穴（２ａ）よりやや大径、この場合φ０．５ｍｍで
非貫通スルーホール接続内装より浅い位置まで非貫通穴
（５）を明ける。例えば６層板において１〜５層間を非
貫通スルーホール（６）で接続する場合、非貫通穴
（５）は６層面側より穴明けし、ほぼ５層近傍まで穴明
けする。これにより非貫通スルーホール（６）を形成す
る。次に、図１０（ｅ）に示すように、外層貫通穴（２
ａ）及び非貫通スルーホール（６）内に、例えばフェラ
ー入りエポキシレジン等の絶縁樹脂（７）を充填する。Next, as shown in FIG. 10 (d), the diameter of the through hole (4) for non-penetrating through holes is slightly larger than that of the outer layer penetrating hole (2a) from the back surface side, in this case, φ0.5 mm is non-penetrating. Through hole connection Open a non-through hole (5) to a position shallower than the interior. For example, in the case of connecting the 1st to 5th layers in the 6-layer plate with the non-through holes (6), the non-through holes (5) are drilled from the side of the 6th layer surface, and are drilled to the vicinity of the 5th layer. This forms a non-penetrating through hole (6). Next, as shown in FIG. 10E, the outer layer through hole (2
Insulating resin (7) such as epoxy resin containing a ferr is filled in a) and the non-penetrating through hole (6).
【０００５】次に、図１０（ｆ）に示すように、全面に
２次外層めっき（３ｂ）約２５μｍを施す。次に、図１
１（ｇ）に示すように、非貫通スルーホール（６）上及
びスルーホール（４）上に表面実装パッド（９ａ）を形
成すると共に外層回路（９ｂ）を形成する。最後に図１
１（ｈ）に示すように、ソルダーレジスト（１０）を塗
布し所望のプリント配線板を得る。Next, as shown in FIG. 10 (f), a secondary outer layer plating (3b) of about 25 μm is applied to the entire surface. Next, FIG.
As shown in FIG. 1 (g), the surface mount pad (9a) is formed on the non-penetrating through hole (6) and the through hole (4), and the outer layer circuit (9b) is formed. Finally Figure 1
As shown in 1 (h), a solder resist (10) is applied to obtain a desired printed wiring board.
【０００６】[0006]
【発明が解決しようとする課題】上述した従来のプリン
ト配線板の構造では以下のような欠点を有していた。
１．従来の技術の場合、表層と任意の層の内層を非貫通
スルーホールを介して接続できるのは実装面側からだけ
に限られるため、両面実装用のプリント板には効果が半
減してしまうという問題点があった。２．従来の技術の
場合、非貫通スルーホールを用いて接続したパッドの裏
面同一格子上に電気的に独立した回路を形成することは
できるが、依然として同一格子上では１種類の内層接続
しか取ることができないという問題点があった。The structure of the conventional printed wiring board described above has the following drawbacks.
1. In the case of the conventional technology, the surface layer and the inner layer of any layer can be connected to each other only through the non-penetrating through hole from the mounting surface side. There was a problem. 2. In the case of the conventional technique, it is possible to form an electrically independent circuit on the same lattice on the back surface of the pad connected using the non-through hole, but still only one kind of inner layer connection can be made on the same lattice. There was a problem that it could not be done.
【０００７】[0007]
【課題を解決するための手段】本発明の目的はかかる従
来の欠点を除去した構造を有する多層プリント板および
その製造方法を提供するものにある。本発明は、複数の
導体層および貫通穴を有する多層プリント配線板におい
て、貫通穴の任意の導体層までを導体膜で被覆し表層か
ら該導体層までを電気的に接続し、貫通穴内に絶縁体を
充填し、貫通穴の裏面側は通常の非スルーホール部の設
計ルールにより配線されることを特徴とする多層プリン
ト配線板である。また本発明は、上記の多層プリント配
線板において、貫通穴の任意の導体層までを導体膜で被
覆し表層から任意の該導体層までを電気的に接続した非
貫通スルーホールの裏面側に、サーフェイスビアホール
を形成していることを特徴とする多層プリント配線板で
ある。SUMMARY OF THE INVENTION It is an object of the present invention to provide a multilayer printed board having a structure in which the conventional drawbacks are eliminated and a method for manufacturing the same. The present invention, in a multilayer printed wiring board having a plurality of conductor layers and a through hole, covers up to any conductor layer of the through hole with a conductor film, electrically connects the surface layer to the conductor layer, and insulates the inside of the through hole. The multilayer printed wiring board is characterized in that the body is filled and the back surface side of the through hole is wired according to the normal design rule of the non-through hole portion. Further, the present invention, in the above-mentioned multilayer printed wiring board, on the back surface side of a non-penetrating through hole in which any conductor layer of the through hole is covered with a conductor film and electrically connected from the surface layer to any conductor layer, A multilayer printed wiring board having surface via holes formed therein.
【０００８】また本発明は、複数の導体層および貫通穴
を有する多層プリント配線板を製造する方法において、
貫通穴を施す工程と、貫通穴内にめっきを施す工程と、
裏面側から該貫通穴より大きい径で接続導体層手前まで
穴明けし、めっき被膜を選択的に除去する工程と、貫通
穴内すべてに絶縁体を充填する工程と、さらに裏面側よ
り同一格子上に絶縁層を残し非貫通穴および貫通穴を形
成する工程と、表面研磨の後、全面にめっきする工程
と、その後、回路形成することを特徴とする多層プリン
ト配線板の製造方法である。The present invention also provides a method for manufacturing a multilayer printed wiring board having a plurality of conductor layers and through holes,
A step of forming a through hole, a step of plating the inside of the through hole,
A step of forming a hole from the back surface side to a front side of the connecting conductor layer with a diameter larger than the through hole, selectively removing the plating film, a step of filling all the through holes with an insulator, and a back surface side on the same grid. A method for manufacturing a multilayer printed wiring board, which comprises forming a non-through hole and a through hole while leaving an insulating layer, a step of plating the entire surface after surface polishing, and then forming a circuit.
【０００９】[0009]
【作用】本発明においては、貫通穴の任意の導体層まで
を導体膜で被覆し、表層から該導体層まで電気的に接続
する等の構成を有することにより、ストリップライン構
造の信号層と最外層間を接続する非貫通スルーホールは
形成できない等の層構成の制約を受けることなく、ま
た、所定の工程で製造するものであるからアスペクト比
を高くとることができるので、高密度化をすることもで
きるという作用をするものである。また、表裏から任意
の層へ接続できることにより、同一格子上に異なる２種
類の内装接続を取ることが可能であり、さらに高密度化
を促進することができるものである。According to the present invention, the signal layer of the stripline structure and the signal layer of the stripline structure are optimally formed by covering the through hole up to an arbitrary conductor layer with a conductor film and electrically connecting the surface layer to the conductor layer. Non-penetrating through-holes that connect the outer layers cannot be formed, and there is no restriction on the layer structure, and since it is manufactured in a predetermined process, the aspect ratio can be made high, so high density is achieved. It also has the function of being able to do so. Further, by connecting from the front and back to an arbitrary layer, it is possible to make two different types of internal connections on the same grid, and it is possible to further promote high density.
【００１０】[0010]
【実施例】本発明の実施例について図面を参照して説明
する。 ［実施例１］図１は、本発明によるプリント配線板の実
施例を示す斜視図である。図１に示すように、複数の導
体層および貫通穴を有する多層プリント配線板におい
て、多層銅張り積層板に、非貫通スルーホール（６）、
スルーホール（４）、表面実装用パッド（９ａ）、外層
回路（９ｂ）、およびソルダーレジスト（１０）および
サーフェイスビアホール（８）が設けられ、これにより
非貫通スルーホール（６）の裏側最外層とその直下層を
接続しているものである。Embodiments of the present invention will be described with reference to the drawings. [Embodiment 1] FIG. 1 is a perspective view showing an embodiment of a printed wiring board according to the present invention. As shown in FIG. 1, in a multilayer printed wiring board having a plurality of conductor layers and through holes, a non-through through hole (6),
A through hole (4), a surface mounting pad (9a), an outer layer circuit (9b), and a solder resist (10) and a surface via hole (8) are provided, thereby forming a back outermost layer of the non-penetrating through hole (6). It connects the layers directly below it.
【００１１】図２（ａ）〜（ｃ）図３（ｄ）〜（ｆ）及
び図４（ｇ）〜（ｉ）は第１の実施例の製造方法を説明
するための工程順に示した断面図である。多層銅張り積
層板として、図２（ａ）に示すように、１層面導体（２
１）、２層面導体（２２）、３層面導体（２３）、４層
面導体（２４）、５層面導体（２５）、６層面導体（２
６）の６層板を例に説明する。そして具体的には、ここ
では板厚１．６ｍｍ、１層面導体厚０．０５ｍｍ、１−
２層間０．１５ｍｍ、２層面導体厚０．０４ｍｍ、２−
３層間０．２５ｍｍ、３層面導体厚０．０７ｍｍ、３−
４層間０．５ｍｍ、４層面導体厚０．０７ｍｍ、４−５
層間０．２５ｍｍ、５層面導体厚０．０４ｍｍ、５−６
層間０．１５ｍｍ、６層面導体厚０．０５ｍｍの６層板
を例に説明する。2 (a) to 2 (c), 3 (d) to 3 (f), and 4 (g) to 4 (i) are cross-sectional views in the order of steps for explaining the manufacturing method of the first embodiment. It is a figure. As a multilayer copper clad laminate, as shown in FIG.
1) 2 layer surface conductor (22), 3 layer surface conductor (23), 4 layer surface conductor (24), 5 layer surface conductor (25), 6 layer surface conductor (2
The 6-layer plate of 6) will be described as an example. And specifically, here, the plate thickness is 1.6 mm, the one-layer surface conductor thickness is 0.05 mm, 1-
2-layer 0.15 mm, 2-layer conductor thickness 0.04 mm, 2-
3-layer 0.25 mm, 3-layer conductor thickness 0.07 mm, 3-
4 layers 0.5 mm, 4 layers conductor thickness 0.07 mm, 4-5
Layer 0.25 mm, 5 layer conductor thickness 0.04 mm, 5-6
A six-layer plate having an interlayer thickness of 0.15 mm and a six-layer surface conductor thickness of 0.05 mm will be described as an example.
【００１２】まず、図２（ａ）に示すように、テンティ
ング工法にて個別に内層材を形成し、得られた内装材を
接着剤層を介し加熱圧着することにより多層銅張り積層
板（１）を形成する。次に、図２（ｂ）に示すように、
表裏導通用と共に非貫通スルーホール用の貫通穴（２）
を例えばφ０．４ｍｍで穴明けする。次に、図２（ｃ）
に示すように、貫通穴（２）を含む全面に化学銅めっき
を施し、例えば硫酸銅めっき液を用いたパネルめっき工
法により１次外層めっき（３）を約２５μｍ施し、スル
ーホール（４）を形成する。First, as shown in FIG. 2A, an inner layer material is individually formed by a tenting method, and the obtained interior material is heat-pressed via an adhesive layer to form a multilayer copper clad laminate ( 1) is formed. Next, as shown in FIG.
Through hole for front and back conduction as well as non-through through hole (2)
Is drilled with, for example, φ0.4 mm. Next, FIG. 2 (c)
As shown in FIG. 3, the entire surface including the through hole (2) is subjected to chemical copper plating, and for example, the primary outer layer plating (3) is applied to about 25 μm by a panel plating method using a copper sulfate plating solution to form the through hole (4). Form.
【００１３】次に、図３（ｄ）に示すように、非貫通ス
ルーホール用のスルーホール（４）の裏面側より外層貫
通穴（２）よりやや大径、この場合φ０．５ｍｍで６層
面側より少なくとも５層面の導体が露出し、４層面の導
体が露出しない深さまで、この場合、約０．４４ｍｍの
深さまで１次非貫通穴（５ａ）を明ける。穴あけ機の位
置決め精度は通常±５０μｍであるため１次非貫通穴
（５ａ）形成においては完全にスルーホール（４）内の
銅を除去するためスルーホール（４）を形成したドリル
径に対し＋１００μｍのドリル径を用いる。これにより
非貫通スルーホール（６）を形成する。Next, as shown in FIG. 3 (d), the diameter of the through hole (4) for non-penetrating through holes is slightly larger than that of the outer layer through holes (2) from the back surface side, in this case φ0.5 mm, and the six layer surface is formed. The primary non-penetrating hole (5a) is opened to a depth where at least the conductor of the fifth layer surface is exposed from the side and the conductor of the fourth layer surface is not exposed, in this case, to a depth of about 0.44 mm. Since the positioning accuracy of the drilling machine is usually ± 50 μm, in the formation of the primary non-through hole (5a), in order to completely remove the copper in the through hole (4), it is +100 μm with respect to the drill diameter in which the through hole (4) was formed. Use the drill diameter of. This forms a non-penetrating through hole (6).
【００１４】次に、図３（ｅ）に示すように、外層貫通
穴（２）及び非貫通スルーホール（６）内に例えばガラ
ス等のフィラー入りエポキシレジン等の絶縁樹脂（７）
を充填する。フィラーにより２次非貫通穴（５ｂ）穴あ
け時の樹脂クラックを防止できる。絶縁樹脂（７）は、
例えばスクリーン印刷法により充填し、加熱硬化後、ベ
ルト研磨にて平滑化する。次に、図３（ｆ）に示すよう
に、非貫通スルーホール用のスルーホール（４）の裏面
側より１次非貫通穴（５ａ）よりやや大径、この場合φ
０．６ｍｍで６層面側より少なくとも５層面の導体が露
出し、４層面の導体が露出しない深さで且つ絶縁樹脂層
が確保できる深さ、この場合、約０．２９ｍｍの深さま
で２次非貫通穴（５ｂ）を明ける。Next, as shown in FIG. 3 (e), an insulating resin (7) such as epoxy resin containing a filler such as glass in the outer layer through hole (2) and non-through hole (6).
To fill. The filler can prevent resin cracks during drilling of the secondary non-through hole (5b). Insulating resin (7)
For example, it is filled by a screen printing method, heated and cured, and then smoothed by belt polishing. Next, as shown in FIG. 3 (f), the diameter is slightly larger than the primary non-through hole (5a) from the back surface side of the through hole (4) for the non-through hole, in this case φ.
At a depth of 0.6 mm, the conductors on at least the 5th layer surface are exposed from the 6th layer surface side, the conductors on the 4th layer surface are not exposed, and the insulating resin layer can be secured. Open the through hole (5b).
【００１５】次に、図４（ｇ）に示すように、全面に１
次外層めっきと同様の工法により２次外層めっき（３
ｂ）を約２５μｍ施す。これによりサーフェイスビアホ
ール（８）を形成する。サーフェイスビアホール（８）
により非貫通スルーホール（６）の裏側最外層とその直
下層、この場合６層と５層を接続する。次に、図４
（ｈ）に示すように、通常回路形成により非貫通スルー
ホール（６）上及びスルーホール（４）上に表面実装用
パッド（９ａ）を形成すると共に外層回路（９ｂ）を形
成する。最後に、図４（ｉ）に示すように、ソルダーレ
ジスト（１０）を塗布し所望のプリント配線板（１１）
を得る。Next, as shown in FIG.
Secondary outer layer plating (3
Apply b) to about 25 μm. Thereby, the surface via hole (8) is formed. Surface beer hall (8)
The outermost layer on the back side of the non-penetrating through hole (6) and the layer immediately thereunder, in this case, the sixth layer and the fifth layer are connected. Next, FIG.
As shown in (h), the surface mounting pads (9a) are formed on the non-penetrating through holes (6) and the through holes (4) and the outer layer circuit (9b) is formed by normal circuit formation. Finally, as shown in FIG. 4 (i), a solder resist (10) is applied to the desired printed wiring board (11).
Get.
【００１６】［実施例２］図５（ａ）〜（ｃ）図６
（ｄ）〜（ｆ）及び図７（ｇ）〜（ｉ）は、第２実施例
の製造方法を説明するための工程順に示した断面図であ
る。多層銅張り積層板として、図５（ａ）に示すよう
に、１層面導体（２１）、２層面導体（２２）、３層面
導体（２３）、４層面導体（２４）、５層面導体（２
５）、６層面導体（２６）の６層板を例に説明する。こ
こでも板厚１．６ｍｍ、１層面導体厚０．０５ｍｍ、１
−２層間０．１５ｍｍ、２層面導体厚０．０４ｍｍ、２
−３層間０．２５ｍｍ、３層面導体厚０．０７ｍｍ、３
−４層間０．５ｍｍ、４層面導体厚０．０７ｍｍ、４−
５層間０．２５ｍｍ、５層面導体厚０．０４ｍｍ、５−
６層間０．１５ｍｍ、６層面導体厚０．０５ｍｍの６層
板を例に説明する。[Embodiment 2] FIGS. 5A to 5C.
(D)-(f) and FIGS. 7 (g)-(i) are cross-sectional views showing the order of steps for explaining the manufacturing method of the second example. As a multilayer copper-clad laminate, as shown in FIG. 5A, a one-layer surface conductor (21), a two-layer surface conductor (22), a three-layer surface conductor (23), a four-layer surface conductor (24), and a five-layer surface conductor (2
5), a 6-layer plate of the 6-layer surface conductor (26) will be described as an example. Again, the plate thickness is 1.6 mm, the one-layer surface conductor thickness is 0.05 mm, and 1
-2 layers 0.15 mm, 2 layers conductor thickness 0.04 mm, 2
-3 layer 0.25 mm, 3 layer surface conductor thickness 0.07 mm, 3
-4 layers 0.5 mm, 4 layers conductor thickness 0.07 mm, 4-
5 layers 0.25 mm, 5 layers conductor thickness 0.04 mm, 5-
An explanation will be given by taking a 6-layer plate having 0.15 mm of 6 layers and a conductor thickness of 0.05 mm of 6 layers as an example.
【００１７】まず、図５（ａ）に示すように、実施例１
と同様の工法にて内層材を形成、積層し多層銅張り積層
板（１）を形成する。次に、図５（ｂ）に示すように、
非貫通スルーホール用の外層貫通穴（２）を例えばφ
０．４ｍｍで穴明けする。次に、図５（ｃ）に示すよう
に、外層貫通穴（２）含む全面に化学銅めっきを施し、
例えば硫酸銅めっき液を用いたパネルめっき工法により
１次外層めっき（３）を約２５μｍ施し、スルーホール
（４）を形成する。First of all, as shown in FIG.
An inner layer material is formed and laminated by the same construction method as above to form a multilayer copper clad laminate (1). Next, as shown in FIG.
The outer layer through hole (2) for the non-through hole is, for example, φ
Make a hole at 0.4 mm. Next, as shown in FIG. 5C, the entire surface including the outer layer through hole (2) is subjected to chemical copper plating,
For example, a primary outer layer plating (3) is applied to about 25 μm by a panel plating method using a copper sulfate plating solution to form a through hole (4).
【００１８】次に、図６（ｄ）に示すように、非貫通ス
ルーホール（６）用のスルーホールの裏面側より外層貫
通穴（２）よりやや大径、この場合φ０．５ｍｍで６層
面側より少なくとも５層面の導体が露出し、４層面の導
体が露出しない深さまで、この場合、約０．４４ｍｍの
深さまで１次非貫通穴（５ａ）を明ける。例えば６層板
において１〜４層間を非貫通スルーホール（６）で接続
する場合、１次非貫通穴（５ａ）は６層面側より穴明け
し、ほぼ４層近傍まで穴明けする。これにより非貫通ス
ルーホール（６）を形成する。Next, as shown in FIG. 6D, the diameter of the through hole for the non-penetrating through hole (6) is slightly larger than that of the outer layer through hole (2) from the rear surface side. The primary non-penetrating hole (5a) is opened to a depth where at least the conductor of the fifth layer surface is exposed from the side and the conductor of the fourth layer surface is not exposed, in this case, to a depth of about 0.44 mm. For example, when connecting 1st-4th layers in a 6-layer board with a non-through hole (6), the primary non-through hole (5a) is drilled from the 6th layer surface side, and is drilled to the vicinity of 4th layer. This forms a non-penetrating through hole (6).
【００１９】次に、図６（ｅ）に示すように、非貫通ス
ルーホール（６）内に例えばガラス等のフィラー入りエ
ポキシレジン等の絶縁樹脂（７）を充填する。フィラー
により２次非貫通穴（５ｂ）穴あけ時の樹脂クラックを
防止できる。絶縁樹脂（７）は例えばスクリーン印刷法
により充填し、加熱硬化後、ベルト研磨にて平滑化す
る。次に、図６（ｆ）に示すように、非貫通スルーホー
ル用のスルーホール（４）の裏面側より外層貫通穴（５
ａ）よりやや大径、この場合φ０．６ｍｍで６層面側よ
り少なくとも５層面の導体が露出し、４層面の導体が露
出しない深さで且つ絶縁樹脂層が確保できる深さ、この
場合、約０．２９ｍｍの深さまで２次非貫通穴（５ｂ）
を明ける。同時に、部品実装用外層貫通穴（２）を例え
ばφ０．７ｍｍで穴明けする。Next, as shown in FIG. 6 (e), the non-penetrating through hole (6) is filled with an insulating resin (7) such as epoxy resin containing filler such as glass. The filler can prevent resin cracks during drilling of the secondary non-through hole (5b). The insulating resin (7) is filled by, for example, a screen printing method, heated and cured, and smoothed by belt polishing. Next, as shown in FIG. 6F, the outer layer through hole (5) is formed from the back surface side of the through hole (4) for the non-through through hole.
a) The diameter is slightly larger than that of a), in this case φ0.6 mm, the depth of the conductor layer of at least 5 layers is exposed from the side of 6 layers, the conductor of 4 layers is not exposed, and the depth at which the insulating resin layer can be secured, in this case, about Secondary non-through hole (5b) up to a depth of 0.29mm
Open up. At the same time, the component mounting outer layer through hole (2) is drilled with a diameter of 0.7 mm, for example.
【００２０】次に、図７（ｇ）に示すように、外層貫通
穴（２ａ）含む全面に１次外層めっきと同様の工法で２
次外層めっき（３ｂ）を約２５μｍ施しサーフェイスビ
アホール（８）及びスルーホール（４）を形成する。サ
ーフェイスビアホール（８）により非貫通スルーホール
（６）の裏側最外層とその直下層、この場合６層と５層
を接続する。図７（ｈ）に示すように、通常回路形成に
より非貫通スルーホール（６）上に表面実装用パッド
（９ａ）を形成すると共に外層回路（９ｂ）を形成す
る。最後に、図７（ｉ）に示すように、ソルダーレジス
ト（１０）を塗布し所望のプリント配線板（１１）を得
る。Next, as shown in FIG. 7 (g), the entire surface including the outer layer through hole (2a) is plated by the same method as the primary outer layer plating.
Next outer layer plating (3b) is applied to about 25 μm to form a surface via hole (8) and a through hole (4). The surface via hole (8) connects the outermost layer on the back side of the non-penetrating through hole (6) and the layer immediately thereunder, in this case, the sixth layer and the fifth layer. As shown in FIG. 7H, a surface mounting pad (9a) is formed on the non-penetrating through hole (6) and an outer layer circuit (9b) is formed by normal circuit formation. Finally, as shown in FIG. 7 (i), a solder resist (10) is applied to obtain a desired printed wiring board (11).
【００２１】[0021]
【発明の効果】以上説明したように本発明は、高アスペ
クトの非貫通スルーホールを有するため以下のような効
果を有する。 １．表層と非貫通スルーホールを介して接続すべき内層
は特に表層直下の層に限定されず任意の層と接続可能で
ある。よって、最外層直下の層に電源、グランド層を配
置したマイクロストリップライン構造の場合でも非貫通
スルーホールを介し表層と接続できる。 ２．高アスペクトの非貫通スルーホールが形成可能なた
め、深層に位置する内層導体と表層を接続する場合で
も、非貫通スルーホール径に小径を使えるため高密度化
対応が可能である。 ３．非貫通スルーホールを用いて接続したパッドの裏面
同一格子上にサーフェイスビアホールを形成することが
できるため、両面実装等にも適し、更なる高密度化を図
ることができる。As described above, the present invention has the following effects because it has a high aspect non-penetrating through hole. 1. The inner layer to be connected to the surface layer via the non-penetrating through hole is not particularly limited to the layer immediately below the surface layer and can be connected to any layer. Therefore, even in the case of the microstrip line structure in which the power source and the ground layer are arranged in the layer immediately below the outermost layer, it is possible to connect to the surface layer through the non-through holes. 2. Since high-aspect non-penetrating through-holes can be formed, even when connecting the inner conductor located in the deep layer and the surface layer, a small diameter can be used for the non-penetrating through-holes, which enables high density. 3. Since the surface via holes can be formed on the same lattice on the back surface of the pads connected by using the non-through holes, it is suitable for double-sided mounting and the like, and further high density can be achieved.
【図１】 本発明の実施例を示す斜視図。FIG. 1 is a perspective view showing an embodiment of the present invention.
【図２】 本発明の第１の実施例の製造方法を説明する
ための工程順に示した断面図。2A to 2D are sectional views showing the manufacturing method of the first embodiment of the present invention in the order of steps for explaining the manufacturing method.
【図３】 本発明の第１の実施例の製造方法を説明する
ための工程順に示した断面図。3A to 3D are sectional views showing the manufacturing method according to the first embodiment of the present invention in the order of steps for explaining the manufacturing method.
【図４】 本発明の第１の実施例の製造方法を説明する
ための工程順に示した断面図。4A to 4C are sectional views showing the manufacturing method of the first embodiment of the present invention in the order of steps for explaining the manufacturing method.
【図５】 本発明の第２の実施例の製造方法を説明する
ための工程順に示した断面図。5A to 5C are sectional views showing the manufacturing method according to the second embodiment of the present invention in the order of steps for explaining the manufacturing method.
【図６】 本発明の第２の実施例の製造方法を説明する
ための工程順に示した断面図。6A to 6C are sectional views showing the manufacturing method of the second embodiment of the present invention in the order of steps for explaining the manufacturing method.
【図７】 本発明の第２の実施例の製造方法を説明する
ための工程順に示した断面図。7A to 7C are sectional views showing the manufacturing method of the second embodiment of the present invention in the order of steps for explaining the manufacturing method.
【図８】 従来のプリント配線板の構造を示す斜視図。FIG. 8 is a perspective view showing a structure of a conventional printed wiring board.
【図９】 従来のプリント配線板の製造方法の工程順に
示した断面図。FIG. 9 is a sectional view showing the order of steps in a conventional method for manufacturing a printed wiring board.
【図１０】 従来のプリント配線板の製造方法の工程順
に示した断面図。FIG. 10 is a cross-sectional view showing the order of steps in a conventional method for manufacturing a printed wiring board.
【図１１】 従来のプリント配線板の製造方法の工程順
に示した断面図。FIG. 11 is a cross-sectional view showing the order of steps in a conventional method for manufacturing a printed wiring board.
１．多層銅張り積層板 １ｂ．銅張り積層板 ２ａ．外層貫通穴 ２ｂ．内層貫通穴 ３．３ａ．１次外層めっき ３ｂ．２次外層めっき ４．スルーホール ５．非貫通穴 ６．非貫通スルーホール ７．絶縁樹脂 ８．サーフェイスビアホール ９ａ．表面実装用パッド ９ｂ．外層回路 １０．ソルダーレジスト １１．プリント配線板 ２１．１層面導体 ２２．２層面導体 ２３．３層面導体 ２４．４層面導体 ２５．５層面導体 ２６．６層面導体 1. Multi-layer copper-clad laminate 1b. Copper clad laminate 2a. Outer layer through hole 2b. Inner layer through hole 3.3a. Primary outer layer plating 3b. Secondary outer layer plating 4. Through hole 5. Non-through hole 6. Non-through hole 7. Insulating resin 8. Surface beer hole 9a. Surface mount pad 9b. Outer layer circuit 10. Solder resist 11. Printed wiring board 21.1 Layer surface conductor 22.2 Layer surface conductor 23.3 Layer surface conductor 24.4 Layer surface conductor 25.5 Layer surface conductor 26.6 Layer surface conductor
【手続補正書】[Procedure amendment]
【提出日】平成７年３月１０日[Submission date] March 10, 1995
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００２[Name of item to be corrected] 0002
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００２】[0002]
【従来の技術】従来の非貫通スルーホールを有する印刷
配線板の製造方法は、特願平５−１６６１３７号に開示
されている。以下に従来の技術の特願平５−１６６１３
７号について図８〜図１１で説明する。図８に従来の技
術による構造を示す斜視図で、多層銅張り積層板に、非
貫通スルーホール（６）、スルーホール（４）、表面実
装用パッド（９ａ）、外層回路（９ｂ）、およびソルダ
ーレジスト（１０）が形成された非貫通スルーホールを
有する印刷配線板が示されており、これは実装面側の任
意の実装用パッドまたはランドから非貫通スルーホール
により任意の内層部と接続することができる。2. Description of the Related Art A conventional method for manufacturing a printed wiring board having non-penetrating through holes is disclosed in Japanese Patent Application No. 5-166137. Japanese Patent Application No. Hei 5-16613 of the prior art is described below.
No. 7 will be described with reference to FIGS. FIG. 8 is a perspective view showing a structure according to a conventional technique, in which a non-penetrating through hole (6), a through hole (4), a surface mounting pad (9a), an outer layer circuit (9b), and A printed wiring board having a non-penetrating through hole formed with a solder resist (10) is shown, which is connected to an arbitrary inner layer portion by a non-penetrating through hole from any mounting pad or land on the mounting surface side. be able to.
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００３[Name of item to be corrected] 0003
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００３】図９、図１０及び図１１を用い、従来の技
術によるプリント配線板の製造方法を工程順に示した断
面図で説明する。まず、図９（ａ）に示すように、個別
に形成した内層材を接着剤層を介し加熱圧着することに
より多層銅張り積層板（１ｂ）を形成する。次に、図９
（ｂ）に示すように、表裏導通用と共に非貫通スルーホ
ール用の多層貫通穴（２ａ）を例えばφ０．４ｍｍで穴
明けする。次に、図９（ｃ）に示すように、外層貫通穴
を含む全面に１次外層めっき（３ａ）約２５μｍを施
し、スルーホール（４）を形成する。A conventional method for manufacturing a printed wiring board will be described with reference to FIGS. 9, 10 and 11 with sectional views showing the order of steps. First, as shown in FIG. 9A, the individually formed inner layer materials are thermocompression bonded via an adhesive layer to form a multilayer copper-clad laminate (1b). Next, FIG.
As shown in (b), a multilayer through hole (2a) for front and back conduction as well as a non-through through hole is formed with a diameter of 0.4 mm, for example. Next, as shown in FIG. 9C, primary outer layer plating (3a) of about 25 μm is applied to the entire surface including the outer layer through holes to form through holes (4).
【手続補正３】[Procedure 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００４[Correction target item name] 0004
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００４】次に、図１０（ｄ）に示すように、非貫通
スルーホール用のスルーホール（４）の裏面側より外層
貫通穴（２ａ）よりやや大径、この場合φ０．５ｍｍで
非貫通スルーホール接続内層より浅い位置まで非貫通穴
（５）を明ける。例えば６層板において１〜５層間を非
貫通スルーホール（６）で接続する場合、非貫通穴
（５）は６層面側より穴明けし、ほぼ５層近傍まで穴明
けする。これにより非貫通スルーホール（６）を形成す
る。次に、図１０（ｅ）に示すように、外層貫通穴（２
ａ）及び非貫通スルーホール（６）内に、例えばフェラ
ー入りエポキシレジン等の絶縁樹脂（７）を充填する。Next, as shown in FIG. 10 (d), the diameter of the through hole (4) for non-penetrating through holes is slightly larger than that of the outer layer penetrating hole (2a) from the back surface side, in this case, φ0.5 mm is non-penetrating. The non-through hole (5) is opened to a position shallower than the inner layer of the through hole connection. For example, in the case of connecting the 1st to 5th layers in the 6-layer plate with the non-through holes (6), the non-through holes (5) are drilled from the side of the 6th layer surface, and are drilled to the vicinity of the 5th layer. This forms a non-penetrating through hole (6). Next, as shown in FIG. 10E, the outer layer through hole (2
Insulating resin (7) such as epoxy resin containing a ferr is filled in a) and the non-penetrating through hole (6).
【手続補正４】[Procedure amendment 4]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１２[Correction target item name] 0012
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１２】まず、図２（ａ）に示すように、テンティ
ング工法にて個別に内層材を形成し、得られた内層材を
接着剤層を介し加熱圧着することにより多層銅張り積層
板（１）を形成する。次に、図２（ｂ）に示すように、
表裏導通用と共に非貫通スルーホール用の貫通穴（２）
を例えばφ０．４ｍｍで穴明けする。次に、図２（ｃ）
に示すように、貫通穴（２）を含む全面に化学銅めっき
を施し、例えば硫酸銅めっき液を用いたパネルめっき工
法により１次外層めっき（３）を約２５μｍ施し、スル
ーホール（４）を形成する。First, as shown in FIG. 2A, an inner layer material is individually formed by a tenting method, and the obtained inner layer material is heat-pressed through an adhesive layer to form a multilayer copper clad laminate ( 1) is formed. Next, as shown in FIG.
Through hole for front and back conduction as well as non-through through hole (2)
Is drilled with, for example, φ0.4 mm. Next, FIG. 2 (c)
As shown in FIG. 3, the entire surface including the through hole (2) is subjected to chemical copper plating, and for example, the primary outer layer plating (3) is applied to about 25 μm by a panel plating method using a copper sulfate plating solution to form the through hole (4). Form.
Claims (3)
プリント配線板において、貫通穴の任意の導体層までを
導体膜で被覆し表層から該導体層までを電気的に接続
し、貫通穴内に絶縁体を充填し、貫通穴の裏面側は通常
の非スルーホール部の設計ルールにより配線されること
を特徴とする多層プリント配線板。1. In a multilayer printed wiring board having a plurality of conductor layers and a through hole, a conductor film covers up to an arbitrary conductor layer of the through hole, and the surface layer to the conductor layer are electrically connected to each other. A multilayer printed wiring board characterized by being filled with an insulating material and being wired on the back surface side of a through hole according to a normal non-through hole design rule.
覆し表層から任意の該導体層までを電気的に接続した非
貫通スルーホールの裏面側に、サーフェイスビアホール
を形成していることを特徴とする請求項１に記載の多層
プリント配線板。2. A surface via hole is formed on the back surface side of a non-penetrating through hole in which an arbitrary conductor layer of the through hole is covered with a conductor film and the surface layer to the arbitrary conductor layer are electrically connected. The multilayer printed wiring board according to claim 1, wherein:
プリント配線板を製造する方法において、貫通穴を施す
工程と、貫通穴内にめっきを施す工程と、裏面側から該
貫通穴より大きい径で接続導体層手前まで穴明けし、め
っき被膜を選択的に除去する工程と、貫通穴内すべてに
絶縁体を充填する工程と、さらに裏面側より同一格子上
に絶縁層を残し非貫通穴および貫通穴を形成する工程
と、表面研磨の後、全面にめっきする工程と、その後、
回路形成することを特徴とする請求項１または２に記載
の多層プリント配線板の製造方法。3. A method for manufacturing a multilayer printed wiring board having a plurality of conductor layers and a through hole, the step of forming a through hole, the step of plating the inside of the through hole, and the diameter larger than the through hole from the back surface side. Drilling up to the front of the connecting conductor layer, selectively removing the plating film, filling the entire inside of the through-hole with an insulator, and leaving the insulating layer on the same lattice from the back side and leaving the non-through-hole and through-hole. And the step of plating the entire surface after surface polishing, and then
A method for producing a multilayer printed wiring board according to claim 1, wherein a circuit is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6321680A JP2699898B2 (en) | 1994-11-30 | 1994-11-30 | Multilayer printed wiring board and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6321680A JP2699898B2 (en) | 1994-11-30 | 1994-11-30 | Multilayer printed wiring board and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08162766A true JPH08162766A (en) | 1996-06-21 |
| JP2699898B2 JP2699898B2 (en) | 1998-01-19 |
Family
ID=18135228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6321680A Expired - Lifetime JP2699898B2 (en) | 1994-11-30 | 1994-11-30 | Multilayer printed wiring board and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2699898B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006157031A (en) * | 2006-01-10 | 2006-06-15 | Ngk Spark Plug Co Ltd | Capacitor |
| CN103582292A (en) * | 2012-08-08 | 2014-02-12 | 佳能株式会社 | Printed wiring board, printed circuit board, and printed circuit board manufacturing method |
| JP2016527725A (en) * | 2013-08-02 | 2016-09-08 | 北大方正集▲団▼有限公司Ｐｅｋｉｎｇ Ｕｎｉｖｅｒｓｉｔｙ Ｆｏｕｎｄｅｒ Ｇｒｏｕｐ Ｃｏ．， Ｌｔｄ | Method for manufacturing back drill hole on PCB substrate and PCB substrate |
| JP2019071245A (en) * | 2017-10-11 | 2019-05-09 | 国立研究開発法人理化学研究所 | Current introduction terminal, and pressure holding device and x-ray imaging apparatus equipped with the current introduction terminal |
| CN112020214A (en) * | 2020-09-01 | 2020-12-01 | 北京子兆信息技术有限公司 | Multilayer high-frequency PCB and signal via hole optimization method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62291095A (en) * | 1986-06-10 | 1987-12-17 | 日立化成工業株式会社 | Manufacture of wiring board |
| JPH04171890A (en) * | 1990-11-05 | 1992-06-19 | Nec Corp | Manufacture of multilayer printed circuit board |
| JPH05251868A (en) * | 1993-02-05 | 1993-09-28 | Ibiden Co Ltd | Multilayer printed wiring board with blind via holes |
| JPH06350256A (en) * | 1993-06-11 | 1994-12-22 | Nec Corp | Printed wiring board having non-through hole and production of thereof |
-
1994
- 1994-11-30 JP JP6321680A patent/JP2699898B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62291095A (en) * | 1986-06-10 | 1987-12-17 | 日立化成工業株式会社 | Manufacture of wiring board |
| JPH04171890A (en) * | 1990-11-05 | 1992-06-19 | Nec Corp | Manufacture of multilayer printed circuit board |
| JPH05251868A (en) * | 1993-02-05 | 1993-09-28 | Ibiden Co Ltd | Multilayer printed wiring board with blind via holes |
| JPH06350256A (en) * | 1993-06-11 | 1994-12-22 | Nec Corp | Printed wiring board having non-through hole and production of thereof |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006157031A (en) * | 2006-01-10 | 2006-06-15 | Ngk Spark Plug Co Ltd | Capacitor |
| CN103582292A (en) * | 2012-08-08 | 2014-02-12 | 佳能株式会社 | Printed wiring board, printed circuit board, and printed circuit board manufacturing method |
| US9282634B2 (en) | 2012-08-08 | 2016-03-08 | Canon Kabushiki Kaisha | Printed wiring board, printed circuit board, and printed circuit board manufacturing method |
| JP2016527725A (en) * | 2013-08-02 | 2016-09-08 | 北大方正集▲団▼有限公司Ｐｅｋｉｎｇ Ｕｎｉｖｅｒｓｉｔｙ Ｆｏｕｎｄｅｒ Ｇｒｏｕｐ Ｃｏ．， Ｌｔｄ | Method for manufacturing back drill hole on PCB substrate and PCB substrate |
| EP3030062B1 (en) * | 2013-08-02 | 2018-01-03 | Peking University Founder Group Co., Ltd. | Manufacturing method for back drilling hole in pcb and pcb |
| JP2019071245A (en) * | 2017-10-11 | 2019-05-09 | 国立研究開発法人理化学研究所 | Current introduction terminal, and pressure holding device and x-ray imaging apparatus equipped with the current introduction terminal |
| CN111201584A (en) * | 2017-10-11 | 2020-05-26 | 国立研究开发法人理化学研究所 | Current lead-in terminal, and pressure holding device and X-ray imaging device provided with same |
| US11470722B2 (en) | 2017-10-11 | 2022-10-11 | Riken | Current introduction terminal, and pressure holding apparatus and X-ray image sensing apparatus therewith |
| CN111201584B (en) * | 2017-10-11 | 2022-12-13 | 国立研究开发法人理化学研究所 | Current introduction terminal, and pressure holding device and X-ray imaging device provided with same |
| CN112020214A (en) * | 2020-09-01 | 2020-12-01 | 北京子兆信息技术有限公司 | Multilayer high-frequency PCB and signal via hole optimization method thereof |
| CN112020214B (en) * | 2020-09-01 | 2022-07-19 | 北京子兆信息技术有限公司 | Multilayer high-frequency PCB and signal via hole optimization method thereof |
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| Publication number | Publication date |
|---|---|
| JP2699898B2 (en) | 1998-01-19 |
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