JPH08162740A - Method and system for transferring wiring pattern - Google Patents

Abstract

PURPOSE: To form a highly precise waring pattern by a plating pattern transfer method. CONSTITUTION: In a method for transferring a wiring pattern from a transfer plate to a work, a plate 1 is mounted on a table 3 being driven in XYθ directions and the table 3 is adjusted to align the plate 1 with a fixed position at all times. The table 3 is then shifted by a predetermined distance and the plate 1 and a work W are pressed by means of a transfer drive roller 6 and a transfer press roller 7 thus transferring a wiring pattern from the plate 1 to the work W. Since the aligning system for the plate 1 is independent from the transfer system, high precise processing can be carried out respectively.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technical field of forming a wiring pattern of a printed wiring board or the like by a transfer method,
More particularly, it relates to a method for transferring a wiring pattern and a transfer device used for the method.

[0002]

2. Description of the Related Art In recent years, in the field of semiconductors, due to technological breakthroughs, miniaturization of semiconductor packages, increase in the number of pins,
Fine pitch and miniaturization of electronic parts are rapidly advancing, and we are entering the age of so-called high-density mounting. Along with this, printed wiring boards are also being changed from single-sided wiring to double-sided wiring, and further, are being multilayered and thinned.

At present, a subtractive method and an additive method are mainly used for forming a copper pattern on a printed wiring board. The subtractive method is a method in which a hole is made in a copper-clad laminate, copper is plated inside and on the surface of the hole, and a pattern is formed by photoetching. However, it is difficult to form a fine pattern due to restrictions such as the thickness of the copper foil. On the other hand, the additive method is a method of forming a circuit pattern by electroless copper plating by forming a resist on a portion other than the pattern of a laminated plate containing a plating catalyst, and it is possible to form a fine pattern. There are difficulties in terms of sex.

In the case of a multi-layer substrate, a single-sided or double-sided printed wiring board produced by the above method or the like is pressure-laminated together with a semi-cured prepreg obtained by impregnating glass cloth with an epoxy resin. The layers are connected by forming through holes and applying electroless copper plating or the like inside.
Also, due to the progress of high-density packaging, thin and lightweight multi-layer boards and high wiring capacity per unit area are required, and board thinning per layer, interlayer connection, component mounting method, etc. The device is elaborate.

In recent years, in order to meet such requirements, a build-up type multi-layer wiring board has been developed which is manufactured by sequentially laminating a conductor pattern layer and an insulating layer on a base material. Since this multilayer wiring board is manufactured by alternately performing photoetching of the copper plating layer and patterning of the photosensitive resin, high-definition wiring and interlayer connection at arbitrary positions are possible. However, in this method, copper plating and photoetching are alternately performed a plurality of times, so the process becomes complicated,
Also, because of the serial process of stacking one layer on the substrate,
When trouble occurs in the intermediate process, it becomes difficult to recycle the product, which hinders reduction of manufacturing cost.

In contrast to these wiring board manufacturing methods, a method of forming a conductor wiring pattern by a transfer method using an electroforming method has been proposed, and it is attracting attention as a simple and highly accurate method. In this method, a metal pattern is selectively formed in advance by a plating method only on a conductive portion of a transfer plate (that is, a portion corresponding to a wiring pattern after transfer) formed of a conductive portion and an insulating portion, and this plating pattern is formed. This is a method of forming a metal wiring pattern by transferring to a transferred work. Specifically, an adhesive or sticky electrodeposition type insulating resin layer is formed only on the plating pattern on the transfer plate by the electrodeposition method, and then the plate is pressure-bonded to the transferred work to insulate it. Although only the two-layer structure pattern portion of the resin layer and the plating is transferred, the present plating pattern transfer method has an advantage that the metal wiring pattern can be formed by a simple method similar to the printing method. In addition, it is possible to continuously transfer and form a wiring pattern in multiple layers on the exposed wiring pattern. In this case, since the insulating resin layer always exists immediately below the wiring pattern of each layer, the insulation of each layer is maintained. It

[0007]

Since the plating pattern transfer method described in the prior art does not include a photolithography step at the time of forming a wiring pattern on a work, it is extremely cost-effective and process-simplifying. Can be said to be an effective method. However, there is nothing that can transfer the wiring pattern with high accuracy by this method,
This has been the biggest problem in forming highly accurate single-layer or multilayer wiring patterns.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a wiring pattern transfer method and a wiring pattern transfer method capable of forming a highly accurate wiring pattern by a plating pattern transfer method. It is to provide a wiring pattern transfer device used for this.

[0009]

In order to achieve the above object, the present invention provides a wiring pattern transfer method for transferring a wiring pattern formed on a transfer plate onto a transferred work, on a table capable of XYθ driving. The plate before transfer is placed on the plate, and the plate is aligned so that it is always in the same position by adjusting the table. Then, after moving the table by a certain distance, the plate and the transferred work are Is pressed by a transfer driving roller and a transfer press roller to transfer the wiring pattern on the plate onto the transferred work. The position of the plate placed on the table can be accurately adjusted by driving the table while observing the alignment marks provided on the plate with an observation system.

The wiring pattern transfer device used in this transfer method is a wiring pattern transfer device for transferring a wiring pattern formed on a transfer plate to a transferred work, and is an XY
A plate before transfer is placed on a table that can be driven by θ, and the table is moved by a certain distance with an aligning section that aligns the plate so that it is always in the same position by adjusting the table. It is provided with a moving unit, and a transfer unit for transferring the wiring pattern on the plate to the transferred work by pressing the moved plate and the transferred work with a transfer driving roller and a transfer press roller. Then, in order to accurately align the plate placed on the table, an observation system for observing an alignment mark provided on the plate is provided in the alignment section, and the table is observed by observing the observation system. It is good to drive.

[0011]

According to the present invention having the above-described structure, the pre-transfer plate placed on the table is aligned at the aligning portion so that it is always in the same position, and the table on which the aligned plate is placed is fixed as it is. By moving a distance and transferring the wiring pattern on the plate to the transferred work at the transfer portion, particularly in the case of multilayer transfer, the wiring pattern can be transferred in a consistent state over all layers. Further, since the matching unit and the transfer unit are operated separately, high-precision processing can be performed in an independent system.

[0012]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic view showing an example of the structure of a transfer device for carrying out the transfer method according to the present invention, and FIG. 2 is a process flow diagram of the transfer method.

In the figure, reference numeral 1 denotes a transfer plate, on which a wiring pattern 2 to be transferred and an alignment mark (not shown) for alignment are formed in advance. Although there are various configurations of the wiring pattern 2, for example, the entire surface is plated on at least the surface on which an electrically conductive electroplatable base material is provided with an insulating pattern that is the reverse pattern of the wiring pattern. It is possible to effectively apply to the present transfer system a structure in which an insulating adhesive layer is formed only on the upper part of the wiring pattern by applying the above-mentioned . Of course, it may have a multi-layered conductive layer structure in which different metals are continuously plated.

First, the transfer plate 1 is placed on a table 3 and fixed by a clamp as shown on the left side of FIG. 2 (a), and is aligned at the aligning portion A so that it is always at the same position. That is, the table 3 is adjustable in the XYθ directions, and the alignment unit A is provided with an observation system 4 using a camera or a microscope for observing the alignment mark of the plate 1 above the table 3. Then, a reference point in the observation system 4, for example, an eyepiece cross line, an electronic line on the camera monitor, or a method of manually adjusting the center of gravity by image processing is used. It is possible to adjust the orientation of the table 3 while observing the alignment marks on the plate 1 by an appropriate means such that the alignment marks on the plate 1 are always in the same position.

The plate 1 for which the alignment has been completed is shown in FIG.
As shown in, the moving means 5 moves to the next transfer portion B while it remains on the table 3. As the moving means 5, a high-precision linear guide or the like having rigidity is used, and the movement is limited to one axis so as to improve the accuracy of repeatability. This is especially important for multi-layer transfer.

In the transfer section B, a film, which is the transferred work W, is partially wound around the transfer driving roller 6 supported by a fixed shaft, and the work W is abutted on the plate 1 to form the plate. The pressure is applied by the transfer press roller 7 from the back surface of the sheet 1. Then, as shown in FIG. 2B, after the plate 1 and the transferred work W are nipped by both rollers 6 and 7, the plate 1 is removed from the clamp of the table 3 and shown in FIG. As described above, the transfer driving roller 6 and the transfer press roller 7 are sent out in the traveling direction by the pressure and the rotating force, and the wiring pattern 2 on the plate 1 is transferred to the transferred work W accordingly. Thus, during transfer, the transfer drive roller 6 and the transfer press roller 7
Since the transfer accuracy is determined only by the parallel and rotational accuracy of, the defect factor at the time of transfer can be minimized.

The wiring pattern 2 to the transferred work W is also provided.
In order to enable not only pressure transfer but also thermal transfer, the rollers 6 and 7 have a heating system. As the insulating adhesive layer that requires heating, for example, a thermoplastic polyimide resin, an epoxy resin, or the like can be considered.

The film, which is the work W to be transferred, is partially wound around the transfer driving roller 6. Further, the transfer effective portion will be described in detail. Clamps 8 and 9 are provided at both ends of the transfer effective portion of the film. The structure is held by. This is to ensure that the rotation of the transfer driving roller 6 and the film as the transferred work W are sufficiently synchronized during transfer. Furthermore, dancer rolls 10 and 11 are arranged at the intermediate points of the film path so as to absorb the expansion and contraction of the film due to the rotation of the transfer driving roller 6 during transfer.

In the case of multi-layer transfer, the transfer driving roller 6 that has finished the transfer of the first layer continues to transfer the second layer, so that the film on which the first layer has been transferred is clamped and initially rotated. Return to position. After that, the second and subsequent layers are transferred by repeating the same process to achieve the target multilayer transfer. After the completion of the multi-layer transfer, the clamps 8 and 9 are removed, the film is fed by the take-up rolls 12 and 13 and a fixed length is fed by the winding operation, and is held again by the clamps 8 and 9 at the next transfer portion. To be done. By repeating this, a highly accurate multilayer wiring pattern can be formed on the film which is the transferred work W.

[0021]

As described above, according to the present invention,
Since the matching part that aligns the pre-transfer plate and the transfer part that follows it are operated separately, it is possible to perform high-precision processing in an independent system, and thus a wiring pattern that was previously difficult It is possible to perform high-precision transfer of. Then, it can be suitably used, for example, in the case of manufacturing a wiring board having a multilayer structure.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing a configuration example of a transfer device for carrying out a transfer method according to the present invention.

FIG. 2 is a process flow diagram of a transfer method according to the present invention.

[Explanation of symbols]

 1 plate 2 wiring pattern 3 table 4 observation system 5 moving means 6 transfer drive roller 7 transfer press roller A alignment section B transfer section

Claims (5)

[Claims] 1. A wiring pattern transfer method for transferring a wiring pattern formed on a transfer plate to a transferred work, wherein a pre-transfer plate is placed on a table capable of XYθ driving, and the table is adjusted. By aligning the plate so that the plate is always in the same position, and then moving the table by a certain distance, the plate and the transferred work are pressure-bonded by a transfer driving roller and a transfer press roller, and A wiring pattern transfer method characterized by transferring a wiring pattern on a plate onto a transferred work. 2. The wiring pattern forming method according to claim 1, wherein the alignment of the plate is performed by driving the table while observing an alignment mark provided on the plate with an observation system. 3. A film is used as a transfer target work, the transfer target work is wound around a transfer drive roller over an appropriate circumference, and the plate and the transfer target work are placed between the transfer drive roller and the transfer press roller. 3. The wiring pattern transfer method according to claim 1, wherein after the sandwiching, the plate is released from the table and transferred. 4. A wiring pattern transfer device for transferring a wiring pattern formed on a transfer plate to a transferred work, wherein the pre-transfer plate is placed on a table capable of XYθ driving. An aligning portion for aligning the plate so that the plate is always in the same position by adjusting, a moving means for moving the table by a certain distance, a plate and a transferred work after the transfer, a transfer driving roller, and a transfer press. And a transfer unit for transferring the wiring pattern on the plate onto the transferred work by pressure bonding with a roller for printing. 5. The observation system for observing an alignment mark provided on the plate is provided in the alignment section, and the table is driven by observation of the observation system. Wiring pattern transfer device.