JPH08162600A - Conductive trace shape and method for formation of conductive trace - Google Patents

Abstract

PURPOSE: To make the average distance between traces correspond to the intervals between conductive pads by widening a conductive wire at parts near its connecting regions to traces, arranging those widened regions alternately, and narrowing the neiboring regions of adjoining traces in the regions of the widened trace parts. CONSTITUTION: In regions where conductive wires 12 are connected with conductive traces 15, 17, 18, the conductive traces have extended widths 28', 28" necessary for connection. Adjoining traces 29', 29" are narrowed near the width- extended trace parts, and those are arranged alternately, and the distances between traces are maintained, and the trace regions 15, 17, 18 to which the conductive wires 12 are connected are caused to approach conductive pads 11. Consequently, it becomes possible to perform mechanical and electric connection allowable maintaining the distance between adjoining traces, and to have high-density coupling with pads 11.

Description

Detailed Description of the Invention

[0001]

This invention relates generally to semiconductor components,
More specifically, it relates to coupling integrated semiconductor components to external conductive vias called coupling fingers or conductive traces. Coupling fingers and conductive traces are typically collectively referred to as the leadframe.

[0002]

BACKGROUND OF THE INVENTION As the density of active devices in integrated circuit semiconductor components has increased, the number of electrical pathways required to couple each component to its associated electrical circuit has correspondingly increased. For an integrated circuit component having a given physical size, as the number of (integrated) units that make up the integrated circuit component increases, more and more parts must be coupled to the outer portion of the electrically coupled circuit. It is typical that the conductive pads of the above are required. The type of electrical pad is commonly specified for semiconductor components.

Integrated semiconductor components are typically coupled to circuits that are coupled by conductive wires. Generally, conductive wires are electrically and mechanically bonded at one end to conductive pads of integrated semiconductor components. The second end of the conductive wire is then bonded to the conductive strip or trace. This conductive strip or trace is sometimes referred to as a coupling finger. Conductive traces carry electrical signals between the components of the circuit.

FIG. 1 shows a package design for an 8 mil wide conductive trace 18 file and a 7 mil wide conductive trace 17 file. Trace 15 is a conductive path for powering integrated circuit components. Conductive pad 11 provides a path for electrical signals and power to be exchanged between conductive traces 15, 17, 18 and the constituent units of the integrated circuit component. Conductive traces 15, 17, 1
8 is bonded to the conductive pad 11 by the conductive wire 12. Conductive wire 12 and conductive traces 15, 17, 18
Certain restrictions are placed on the size of the conductive traces to ensure that the correct electrical and mechanical connections between them are achieved. In particular, the generally accepted set of packaging rules used in component package design requires that the width of the conductive traces to which the conductive wires are connected be 9 mils or greater. Under this code of practice, some 8 mil wide conductive traces are acceptable, but conductive traces 7 mils or less wide are not. As can be seen from the upper portion of FIG. 1 where the conductive traces are 8 mils wide, there is little possibility of achieving the required 9 mils wide traces in the form illustrated here. The component package design can be further complicated by the minimum conductive trace width and the minimum inter-trace spacing.

Conductive wires connecting the conductive pads of semiconductor components to conductive traces can be connected to conductive traces that typically have a minimum width (ie, 9 mil width) specified at the connection point. There is a need for a technology to do this. This technique should allow the use of higher density conductive pads while maintaining the required minimum conductive trace width dimensions as well as the minimum inter-trace spacing.

[0006]

SUMMARY OF THE INVENTION In the present invention, these and other features are achieved by providing a conductive trace that is widened near the area where the conductive wire is connected to the trace. The widened areas can be staggered, and adjacent traces in the area of the widened traces will have a narrower approaching area of adjacent conductive traces, resulting in an average distance between the traces that is commensurate with the spacing between the conductive pads. Can have

The above and other features of the present invention will be apparent from the following description of the drawings.

[0008]

DETAILED DESCRIPTION FIG. 1 has been described in connection with the prior art.

FIG. 2 shows a conductive trace format for implementing the coupling scheme of FIG. Conductive traces 17 starting as 7 mil wide traces in the lower trace file portion of FIG. 2 have regions 28 'and regions 28', where the trace width has been enlarged for selected portions of the associated conductive traces. The trace width dimension is shown in FIG. 2. Two enlarged regions 28 'and 28 "are shown for two adjacent traces.
Are staggered to prevent contact between adjacent enlarged traces. In fact, as shown in FIG. 2, adjacent traces are narrowed near the enlarged area 28 ″ of the adjacent trace to maintain the minimum distance between the conductive traces. The connection of the wires 15 is 8 in the selected example of the rules of practice.
It can be done on traces with a width of the mil.
As you can see from the trace format dimensions, some traces have a width of 8 mils in the area where the conductive wires are bonded,
This is an acceptable size for a small number of conductive traces. The conductive traces in the upper trace file of Figure 2 start with a dimension of 8 mils. The traces are enlarged to form a 9 mil area where the conductive wires are joined. The areas of adjacent traces are narrowed near the expanded trace areas to maintain a minimum distance between adjacent conductive traces. Again, some trace areas to which the conductive leads are attached can be 8 mils wide.

Referring to FIG. 3, the trace format shown in FIG. 2 is used in the electrical coupling system shown in FIG. As you can see, this time the conductive wire 12
It can be electrically and mechanically coupled to the conductive pads 15, 17, 18 but its shape is such that they both allow a conductive wire to have an acceptable width within each trace while maintaining a minimum inter-trace spacing. It is possible to connect to the area with.

[0011]

Operation of the Preferred Embodiment When the conductive pads associated with an integrated circuit having conductive traces are bonded by conductive wires to form a working circuit, the conductive wires are bonded to the traces at least in regions having a specified width. There must be. Circuit types having a high density of electrical coupling paths cannot be realized without violating at least one condition specified as being necessary to satisfactorily manufacture a circuit including integrated components. . Since the conductive wire is bonded to the trace area having the specified width, the trace can be widened in the bonding area, while narrowing the trace width in the area adjacent to the adjacent trace. Thus, it is possible to provide a region that is wide enough to allow acceptable mechanical and electrical connection of the conductive wires to the associated conductive traces while maintaining the distance between adjacent traces. As will be appreciated by those skilled in the art, narrowing conductive traces as a make-up for wider trace areas
It does not have to be an adjacent conductive trace.

The above description is intended to illustrate the operation of the preferred embodiment and is not intended to limit the scope of the invention in any way. The scope of the invention is limited only by the claims. From the above description, various modifications will occur to those skilled in the art without departing from the scope of the present invention. Further, the following items will be disclosed.

(1) having a conductive wire extending from a conductive pad of an integrated circuit connected thereto, said conductive wire requiring a certain minimum width of said trace to connect said conductive wire to said conductive trace. As a form design requirement, in a conductive trace form having a plurality of generally parallel traces requiring at least a predetermined distance between adjacent traces, a conductive wire may be connected thereto. At least one trace having an enlarged width region at least equal to said minimum width and an adjacent trace having a narrowed region close to said enlarged width region, said narrowed region being Conductive trace type adapted to cause a distance between an adjacent trace and the at least one trace to be greater than the predetermined distance formula.

(2) In the conductive trace type described in the paragraph (1), the adjacent trace has a region having an enlarged width, and the at least one trace is close to the enlarged region of the adjacent trace. Conductive trace type having an area with a narrowed width such that the narrowed area of the one area causes the distance between the one area and the adjacent trace to be greater than the predetermined distance.

(3) A conductive trace format as defined in paragraph (1) wherein the minimum width is 8 mils.

(4) In the conductive trace form of paragraph (2), the group of alternating conductive traces has a widened area at a first position along each member of the group of alternating traces. The other traces of the group of alternating traces have a widened area at a second location along the traces.
Conductive trace format described.

(5) To create a conductive trace format for a plurality of parallel traces, the design parameters for the conductive trace format include a portion of the first conductive trace having at least a minimum distance in the width direction and are adjacent to each other. Conductive traces for a plurality of parallel traces when the spacing between the traces is at least a predetermined distance and the width of the parallel traces is less than the minimum distance. A width of a portion of the first trace is at least the minimum distance and a close portion of an adjacent trace is narrowed to provide at least a distance between the first trace and the adjacent trace. A method comprising the step of maintaining the predetermined distance.

(6) In the method described in paragraph (5), the width of a portion of the adjacent traces is widened to be at least the minimum distance, and the adjacent portion of the first trace is narrowed to reduce the width of the first trace. A method comprising maintaining at least the predetermined distance between one trace and the adjacent trace.

(7) The method of claim (6), including the step of providing an alternating member of the group of traces with a widened portion at the first trace location. Has a width of at least the minimum distance, and the remaining members of the group of traces have a second dimension on the traces.
A method in which a widened portion is provided at the position, and the widened second trace portion has a width of at least the minimum distance.

(8) The conductive trace type design parameters include at least a preselected distance between the traces, such that the width of a portion of the trace for connecting to the conductive wires must be at least a minimum distance. In a conductive trace format, a plurality of parallel traces have a width less than the minimum distance and have at least the preselected distance between the traces, with at least one of the traces widened. A region, the widened region having a width of at least the minimum distance, the adjacent trace having a narrowed region close to the widened region, the narrowed region having the narrowed region between the one trace and the adjacent trace. Conductive trace format that keeps a preselected distance.

(9) In the conductive trace type described in the item (8), there is a second adjacent trace adjacent to the first trace, and the second adjacent trace is close to the widened area. A conductive trace format having a narrowed area to maintain the preselected distance between the first trace and the second adjacent trace.

(10) In the conductive trace form according to the item (8), the conductive trace type has a group of traces, and the first set of alternating traces have a width at a first position and at least the minimum distance. A second region along the first set of traces, and a second region along the first set of traces, with a narrowed region at a second location along the first set of traces. A widened region having a width at least at the minimum distance at a position and a narrowed region at a first position along the second set of traces, the widened region and the narrowed region between the adjacent traces. A conductive trace format having a preselected distance to the.

(11) In an electronic circuit to which an integrated circuit is coupled, the circuit component and a plurality of conductive traces coupled to the circuit component are provided, and at least one trace is a conductive wire. A first end of the conductive wire is coupled, and the conductive wire is coupled to a portion of the trace having a width at least equal to the minimum distance, The two ends are coupled to preselected integrated circuit tabs and the inter-trace distance between the traces is designed to be greater than the preselected distance, the one trace having at least the minimum width. Less than the distance, one conductive wire is coupled to the first trace at the widened portion of the first trace, the widened portion having a width of at least the minimum distance, and at least one of the second traces. An electronic circuit wherein the traces have a narrowed region close to the widened portion of the first trace to maintain the preselected inter-trace distance.

(12) In the electronic circuit as set forth in (11), the widened portions of the adjacent traces are arranged at alternate positions along the adjacent traces, and each widened portion has at least the width. An electronic circuit with a minimum distance.

(13) In the electronic circuit according to item (11), there is provided an electronic component, and a conductive wire is coupled to the widened portion of the plurality of traces, the electric component and the circuit component. An electronic circuit that electrically couples.

(14) In the design condition, the minimum coupling width is specified for a portion of the traces mechanically and electrically coupled to the conductive wire, and the design condition specifies the minimum trace width between the adjacent traces. In the method of densifying generally parallel conductive traces, wherein the first traces are defined by the first traces and the traces have a width that is less than the minimum distance. The first trace when there is a sufficient inter-trace distance between the first trace and the adjacent trace to allow a minimum bond width trace portion while maintaining the minimum distance between the first trace and the adjacent trace. And forming a minimum combined trace portion for the first trace while maintaining the minimum trace distance between the adjacent traces, and the first trace defines the minimum trace distance. For at least one trace proximate to the first trace when there is insufficient inter-trace distance to allow a minimum bond width portion between the first trace and an adjacent trace while maintaining a separation, Providing a narrowed trace portion to create a minimum combined trace portion for said first trace while maintaining a minimum inter-trace distance for adjacent traces.

(15) In the method described in paragraph (14), the design condition requires that each trace width is larger than the minimum trace width, and further, the width of the narrowed trace portion is A method comprising keeping above the minimum trace width.

(16) The method of claim (14), including the step of providing the narrowed trace portions in at least two adjacent conductive traces as an offset of the widened trace portions.

(17) As a design condition, it is required that the coupling region where the conductive wire is electrically and mechanically coupled to the trace has a minimum coupling width and the minimum inter-trace distance is maintained. A method of making a plurality of generally parallel conductive traces that may have trace widths less than the distance, wherein the minimum distance on each trace is maintained while maintaining the minimum distance between adjacent traces. A region having a minimum bond width, and the distance between adjacent traces is insufficient to allow the region having the minimum bond width while maintaining the minimum inter-trace distance. Forming a narrowed region in the at least one trace close to, thus maintaining said minimum inter-trace distance.

(18) In the method described in paragraph (17), the step of forming the narrowed region forms the narrowed region in at least one trace adjacent to a trace having a minimum bond width region. A method including steps.

(19) In the method described in paragraph (17), the step of forming the regions includes forming the regions having the minimum bond width at staggered positions along adjacent traces of a certain length. A method comprising forming.

(20) Conductive pad 11 and conductive traces 15, 17 of an integrated circuit, when the usual rules for defining the width of traces to which conductive wires can be bonded cannot be directly applied due to the density of the conductive pads. The conductive traces are provided with regions 28 ', 28 "of increased width to provide the conductive wires 12 for coupling the eighteen. Adjacent traces 29', 29" are narrowed near the expanded trace width, Keep the distance between traces. The enlarged and narrowed trace areas are staggered so that the trace areas to which the conductive wires are bonded approach the conductive pads. The conductive traces are constrained to have a distance greater than the selected inter-trace distance and a width greater than the preselected conductive trace width.

[Brief description of drawings]

FIG. 1 is a plan view of an electrical connection between a series of conductive pads and a series of conductive traces using conductive wires according to the prior art.

FIG. 2 is a plan view of a conductive wire and trace format coupled to a conductive trace such that the conductive trace has an acceptable trace width in accordance with the present invention.

3 is a plan view of the coupling structure of FIG. 1 implemented using the trace format of FIG.

[Explanation of symbols]

 11 conductive pads 12 conductive wires 17, 18 conductive traces 28'28 "areas of increased width

Claims (2)

[Claims] 1. A conductive wire extending from a conductive pad of an integrated circuit connected thereto, the conductive wire requiring a certain minimum width of said trace to connect said conductive wire to said conductive trace type. The design requirement is that in a conductive trace format with a plurality of generally parallel traces requiring at least a planned distance between adjacent traces, a conductive wire can be connected thereto, At least one trace having an enlarged width region at least equal to said minimum width and an adjacent trace having a narrowed region close to said enlarged width region, said narrowed region being said adjacent A conductive trace format adapted to cause a distance between a trace and the at least one trace to be greater than the predetermined distance. 2. A conductive trace type for a plurality of parallel traces, wherein design parameters for the conductive trace type include a portion of a first conductive trace having at least a minimum distance in a width direction and are adjacent to each other. A conductive trace format for a plurality of parallel traces is provided when the spacing between the traces is at least a predetermined distance and the width of the parallel traces is less than the minimum distance. In a method of making, the width of a portion of the first trace is widened to at least the minimum distance and the adjacent portions of adjacent traces are narrowed to provide at least the portion between the first trace and the adjacent trace. A method comprising the step of maintaining a scheduled distance.