JPH08160542A - Aligner - Google Patents

Abstract

PURPOSE: To match a mask and a material to be exposed in a state where the yield of the material to be exposed is improved. CONSTITUTION: Plural 1st index marks 17u are formed near an upper or lower edge line at equal intervals so as to match with the pitch of exposure and plural 2nd index marks 17l positioned in the same exposure area as the 1st index mark 17u in the case it is combined with one of the plural 1st index marks 17l are formed near the upper or the lower edge line at the equal intervals on the material to be exposed M. Then, 1st and 2nd mask side marks 18u and 18l respectively corresponding to a pair of 1st and 2nd index marks 17u and 17l are at least formed on the mask 4. By moving the mask 4 so that the superimposed state of the 1st superimposed image obtained by superimposing the images of the 1st index mark 17u and the 1st mask side mark 18u may be equal to the superimposed state of the 2nd superimposed image obtained by superimposing the images of the 2nd index mark 17l and the 2nd mask side mark 18l, matching the mask 4 with the material to be exposed M is controlled in every exposure.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus, and more particularly to an exposure apparatus which sequentially exposes a mask pattern while feeding a sheet-shaped material to be exposed wound in a hoop shape to an exposure unit by a predetermined amount.

[0002]

2. Description of the Related Art Conventionally, as an exposure apparatus for mass-producing high-definition television shadow masks, IC lead frames, etc., a sheet-shaped exposed material wound in a hoop shape is delivered to an exposure unit by a predetermined amount. However, there is known an exposure apparatus that sequentially exposes a mask pattern. Further, in this type of exposure apparatus, a double-sided exposure apparatus that exposes both sides of a material to be exposed has also been realized.

FIG. 10 is a perspective view of a stand-alone type double-sided exposure apparatus provided with only one double-sided exposure section, and an unwinding section O and a winding section I are arranged on both sides of the double-sided exposure section E. There is. The unwinding section O includes a unwinding mechanism including an unwinding spindle 101, an unwinding bobbin 102, a tension brake 103, a tension roller 104, a nipper roller 105, and the like. And the unwinding spindle 10
When the unwinding bobbin 102 rotates in association with the rotation of 1,
The exposed material M wound around the unwinding bobbin 102 in a hoop shape is unwound toward the winding section I while being sandwiched between the tension roller 104 and the nipper roller 105.

The winding section I has a winding mechanism including a winding spindle 106, a winding bobbin 107, a drive motor 108, and a tension roller 109. Then, the winding spindle 106 and the winding bobbin 107 are rotated / stopped in association with the rotation / stop of the drive motor 108, so that the material M to be exposed is transferred to the winding bobbin 107 via the tension roller 109 and the like. The material to be exposed M is wound or positioned with respect to the double-sided exposed portion E.

The double-sided exposed portion E is provided with two exposed portions EF and EB on the front and back sides with the material M to be exposed therebetween, and these exposed portions EF and EB on the front and back sides have exactly the same structure. There is. That is, the exposure units EF and EB respectively include the light source device 110, the mask 111, and the alignment sensor 112.
Of the exposed material M, the front and back light sources 110 irradiate light from behind the front and back masks 111 in a state where the front and back masks 111 are in close contact with each other. The wiring pattern and the like on the front and back masks 111 are resist-exposed on both sides.

When such resist exposure is performed, at least the relative positions of the masks 111 on the front and back sides need to be aligned. Therefore, predetermined alignment marks are formed on the masks 111 on the front and back sides, and these alignment marks are formed on the front and back sides. By optically reading with the alignment sensor 112, the relative positions of the front and back masks 111 are aligned.

Alignment of the front and back masks
Is performed each time exposure is performed, but each exposure is performed without considering the alignment result of the front and back masks in the previous exposure and the alignment of the mask and the material M to be exposed. You.

Further, a multi-connection type double-sided exposure apparatus has been realized in which a plurality of double-sided exposure sections are continuously arranged and a pair of unwinding section and winding section are arranged on both sides of the plurality of double-sided exposure sections. There is. In this multi-connection type double-sided exposure device, the front and back masks are individually aligned in each double-sided exposure unit, but each double-sided exposure unit is aligned with the masking results of the front and back masks in other double-sided exposure units. The alignment is performed without considering the alignment of the exposed material M.

[0009]

For this reason, as shown in FIG. 11, defective portions where adjacent exposure patterns overlap each other and adjacent exposure patterns are extremely separated from each other, resulting in waste of the exposed material. Since a portion is generated, the yield of the exposed material is reduced. It should be noted that the same problem also occurs in a stand-alone type or multi-connection type single-sided exposure apparatus when the material to be exposed is sent while meandering.

The present invention has been made under such a background, and an object thereof is to provide an exposure apparatus capable of aligning a mask and an exposed material in a form in which the yield of the exposed material is improved. is there.

[0011]

In order to achieve the above object, the present invention provides an unwinding part for unwinding a material to be exposed wound in a hoop shape, and the exposed material unwound from the unwinding part. Winding parts for winding the material are arranged on both sides of the exposing part, and at least one surface of the exposing material while feeding the exposed material to the exposing part by a predetermined amount by the unwinding part and the winding part. An exposure apparatus for exposing a pattern of a mask to at least one image sensor arranged in the exposure section, and a mask position for adjusting the position of the mask in a plane parallel to the exposure surface of the exposed material. In an exposure apparatus provided with a mask alignment mechanism having an adjusting means, the mask has at least 1
Forming one index mark, the image sensor is arranged at a position to capture an alignment reference portion set on the exposed material in the visual field of the image sensor when the exposed material is sent out by the predetermined amount, Further, the index mark is formed at a position where it can overlap the alignment reference portion in the visual field, and the index mark and the alignment reference portion have a predetermined positional relationship in the visual field before exposure is performed by the exposure portion. Alignment control means for controlling the mask alignment mechanism is provided so as to be superposed on each other.

[0012]

The image sensor is arranged at a position where the alignment reference portion set on the exposed material is caught within the field of view of the image sensor when the exposed material is sent out by the predetermined amount, and the index is provided. The mark is formed at a position where the alignment reference portion and the visual field can be overlapped with each other, and the alignment control means sets the index mark and the alignment reference portion within a predetermined visual field within the visual field before exposure is performed by the exposure portion. Since the mask alignment mechanism is controlled so as to be superposed in a positional relationship, a defective portion where adjacent exposure patterns overlap with each other and a portion where adjacent exposure patterns are extremely separated from each other and the exposed material is wasted are generated. Therefore, the yield of the exposed material is improved.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. Note that this embodiment is applied to a multi-connection type double-sided exposure apparatus, but its overall configuration is such that a plurality of double-sided exposure sections described in the conventional example are continuously arranged, and It has a structure in which a pair of unwinding part and winding part are arranged on both sides, and since the description of the overall structure has been given in the section of the conventional example, the characteristic points of the present invention will be mainly described below.

[First Embodiment] FIG. 1 is a perspective view showing an example of a mask alignment mechanism of an exposure apparatus according to an embodiment of the present invention. Only one of the mask alignment mechanisms is shown, and in one double-sided exposure section, the mask alignment mechanism of FIG. 1 is arranged so as to face the front side and the back side of the material M to be exposed (see FIG. 2). The mask alignment mechanism is not limited to the configuration of this embodiment as long as it can adjust the position and inclination of the glass mask in a plane parallel to the exposed surface of the exposed material.

The alignment stage 1 is locked on the alignment base 3 via five drive joints 2a, 2b, 2c, 2d and 2e, and the alignment stage 1
A glass mask 4 is attached to. That is, as shown in FIG. 3, a hole 8 is formed in the alignment base 3, and at the position of this hole 8, the drive joint 2a,
2b, 2c, 2d, 2e and the alignment stage 1 are screwed with a bolt 10 via a connecting member 9 with the alignment base 3 sandwiched therebetween. Further, a low friction material is provided on at least one sliding surface between the drive joints 2a, 2b, 2c, 2d, 2e and the alignment base 3 and at least one sliding surface between the alignment stage 1 and the alignment base 3. A sheet (for example, Teflon) is attached or coated. Further, the alignment base 3 has three drive motors 5
a, 5b, 5c are fixed, drive motors 5a, 5b, 5
The screws 6a, 6b, 6c connected to the rotation shaft of c are loosely fitted to the drive joints 2a, 2b, 2c, respectively, in a state where movement in the screw axis direction within the joints and rotation around the central axis are prohibited. The nuts 7a, 7b, 7c provided are screwed together (see FIG. 2).

Therefore, when the drive motors 5a, 5b and 5c rotate, the drive joints 2a, 2b and 2c are screwed into the screws 6a and 6c.
Driven by the action of b, 6c and nuts 7a, 7b, 7c, the glass mask 4 is linearly or rotationally driven together with the alignment stage 1 in conjunction with it.

The drive motors 5a, 5b and 5c are motors of the same standard. Therefore, when the glass mask 4 is moved in the vertical direction, the drive motors 5a and 5b are controlled to have the same rotation speed, and when the glass mask 4 is rotated, only one of the drive motors 5a and 5b is rotated. Alternatively, or when the glass mask 4 is moved in the horizontal direction by controlling the rotation speeds of the drive motors 5a and 5b to be different from each other, only the drive motor 5c needs to be rotated.

As shown in FIG. 1, the alignment base 3 has a preload cylinder 1 for preloading the drive joint 2c.
2 is attached to prevent a decrease in positioning accuracy due to a gap between the screw 6c and the nut 7c when the glass mask 4 is positioned. In addition, the alignment base 3 is provided with one-dimensional image sensors 13u and 13l for detecting mask alignment marks formed on the upper and lower portions of the front and back glass masks 4 in order to align them. Adjustment stage 14 for adjusting the focus of an image obtained from the sensor
It is provided through. The one-dimensional image sensors 13u and 13l are provided on either the front or back of each double-sided exposure unit. Various one-dimensional image sensors such as CCD (charge coupled device) can be used.

As shown in FIG. 4, relatively wide L-shaped front mask alignment marks 15u and 15l having a light-transmitting property are formed above and below the front glass mask 4, and at least the periphery thereof is not formed. It is a translucent part. Further, on the upper and lower sides of the glass mask 4 on the back side, at a position corresponding to the front mask alignment marks 15u and 15l, an opaque L-shaped back mask alignment mark 16u which is narrower than the front mask alignment marks 15u and 15l. , 1
6l is formed, and at least the periphery thereof is a translucent portion.

Further, the upper and lower one-dimensional image sensors 13
Each of u and 13l is composed of two sensors. That is, as shown in FIG. 4, the upper one-dimensional image sensor 13u is configured by the horizontal and vertical one-dimensional image sensors 13ux and 13uy, and the lower one-dimensional image sensor 13l is One-dimensional image sensor 13l arranged horizontally and vertically
x, 13ly.

The upper one-dimensional image sensor 13ux and the lower one-dimensional image sensor 13lx respectively include portions of the front mask alignment marks 15u and 15l and the back mask alignment marks 16u and 16l which are orthogonal to the moving direction of the material M to be exposed. Read, upper one-dimensional image sensor 1
The 3 ui, lower one-dimensional image sensor 13 ly reads the portions of the front mask alignment marks 15 u and 15 l and the back mask alignment marks 16 u and 16 l parallel to the moving direction of the material M to be exposed.

Further, in the present embodiment according to the present invention, FIG.
As shown in FIG. 3, circular material reference holes 17u and 17l as alignment reference portions for aligning with the glass mask 4 are opened near the upper and lower edges of the exposed material M. The material reference holes 17u and 17l are shown in FIG.
As shown in FIG. 7, index marks corresponding to a plurality of double-sided exposure units of the multi-sided double-sided exposure apparatus are provided at equal intervals according to the pitch between exposures and above the material M to be exposed.
A plurality of openings are formed on a line parallel to the lower edge line. Further, as shown in FIG. 4, on one of the front side and the back side of the glass mask 4, as shown in FIG. 4, the alignment marks 18u for material alignment are arranged at the same intervals as the intervals of the upper and lower material reference holes 17u and 17l of the material M to be exposed. , 18 l are formed.

Alignment marks 18u, 1 for material alignment
8l is read by an image sensor described later,
In order to distinguish it from the image signals of the material reference holes 17u and 17l which become the H level image signal, the light non-transmissive portion is formed so as to become the L level image signal, and the periphery thereof is the light transmitting portion. . Further, in order to avoid interference between the image signals from the material reference holes 17u and 17l and the image signals from the material alignment alignment marks 18u and 18l, and to reliably distinguish the two signals, the material alignment alignment marks 18u and 18l can be distinguished.
The diameter of 1 is considerably smaller than the diameter of the material reference holes 17u and 17l.

Alignment marks 18u, 1 for material alignment
As shown in FIG. 4, the mask alignment mechanism on the front side or the back side having the glass mask 4 on which 8l is formed has a material reference hole 17u and a material alignment alignment mark 18u, and a material reference hole 17l and a material alignment alignment, as shown in FIG. Two-dimensional image sensors 19u and 19l for simultaneously reading the marks 18l are provided. In this embodiment, 2
Although the two-dimensional image sensors 19u and 19l are provided on the alignment base 3 on the side where the one-dimensional image sensors 13u and 13l are not provided, they may be provided on the same side as long as there is no problem in space such as interference. Then, the center of gravity of the images of the material reference hole 17u simultaneously read by the two-dimensional image sensor 19u and the alignment mark 18u for material matching coincides, and the material reference hole 17l simultaneously read by the two-dimensional image sensor 19l is used for material matching. The glass mask 4 and the exposed material M are aligned by slightly moving the glass mask 4 so that the centers of gravity of the images of the alignment marks 18l coincide with each other. As the two-dimensional image sensor, various ones such as CCD can be used.

The alignment control for performing the automatic alignment operation is performed by the alignment control section provided in each alignment mechanism. FIG. 6 shows one of the alignment control units 20. In the example of this figure, an alignment control unit for aligning one glass mask 4 (of the mask alignment mechanism corresponding to this control unit) with the exposed material is shown. The alignment control unit 20 includes a two-dimensional image sensor 19u, 1
Multiplexer 21 to which the image signal from 9l is input
And a microcomputer 22 to which the mark image signal selected by the multiplexer 21 is input, and on the side having the glass mask provided with the alignment marks 18u and 18l based on the drive signal output from the microcomputer 22. By driving and controlling the drive motors 5a, 5b, 5c corresponding to the mask alignment mechanism, the glass mask 4 is slightly moved to move the glass mask 4
And a motor drive circuit 23a for matching the exposed material M,
It has 23b and 23c.

The microcomputer 22 has an interface circuit 24, a CPU 25, and a memory 26, and the image signal selected by the multiplexer 21 is input to the CPU 25 via the interface circuit 24. The CPU 25 outputs a selection signal to the multiplexer 21 via the interface circuit 24 and outputs a control signal for controlling the image reading operation to the interface circuit 2
It outputs to the two-dimensional image sensors 19u and 19l via the line 4. Further, the CPU 25 outputs the drive signal generated based on the input mark image signal to the motor drive circuit 23a,
It outputs to 23b and 23c. The alignment control unit (not shown) corresponding to the other mask alignment mechanism is
In FIG. 6, instead of the two-dimensional image sensors 19u and 19l, the one-dimensional image sensors 13ux, 13uy and 13l.
The configuration is the same as that of FIG. 6 except that x and 13ly are connected. This is for aligning the other glass mask 4 with the glass mask 4 of the alignment mechanism of FIG.

The alignment control by the CPU 25 is performed as follows. That is, first, the CPU 2 of FIG.
5 uses the image signals from the two-dimensional image sensors 19u and 19l to perform alignment between the glass mask 4 and the exposed material M, and then the CPU of the other alignment control unit 20.
25 is a one-dimensional image sensor 13ux, 13uy, 13
Using the image signals from 1x and 13ly, the front and back glass masks 4 are matched with each other.

In this case, the alignment control between the glass mask 4 and the material M to be exposed is performed by the alignment marks 18u, 1 for material alignment.
The CPU 25 in the alignment control unit 20 on the front side or the back side having the glass mask 4 on which 8l is formed is performed.
On the other hand, the alignment control between the front and back glass masks 4 is performed while maintaining the alignment state once established with the exposed material M,
To align the glass masks 4 on the front and back sides, the CPU 25 in the alignment control unit 20 on the back side or the front side having the glass masks 4 on which the material alignment alignment marks 18u and 18l are not formed is performed.

The interface circuit 24 and the CPU 2
5, a microcomputer 22 including a memory 26, or a multiplexer 21, a motor driving circuit 2
The configuration may be such that the alignment control unit 20 including 3a to 23c is shared and one unit controls the front and back sides.

The CPU 25 performs the above processing according to the processing program preset in the memory 26. The memory 26 stores various calculation results calculated by the CPU 25 and is also used as a work area for performing various calculations.

When the glass mask 4 and the material M to be exposed are aligned, the CPU 25 in the alignment control section 20 on the front side or the back side having the glass mask 4 on which the material alignment marks 18u and 18l are formed first. The image signal of the material reference hole 17u and the image signal of the material alignment mark 18u are distinguished from each other based on the image signal in which the images of the material reference hole 17u and the material alignment mark 18u from the two-dimensional image sensor 19u are superimposed. To do. This distinction is made as described above, in which the image signal of the material reference hole 17u is at the H level and the material alignment mark 18 is used.
The image signal of u becomes L-bell, and the interference of both image signals is avoided, so that the image signal of u is reliably performed. Then, based on the distinguished image signals, the center of gravity of the image of the material reference hole 17u and the center of gravity of the image of the material alignment mark 18u are obtained.

Next, the material reference hole 17l from the two-dimensional image sensor 19l and the material alignment mark 18 are aligned.
The image signal of the material reference hole 17l and the image signal of the material alignment mark 18l are distinguished based on the mark image signal on which the image of 1 is superimposed, and based on the distinguished image signal, the material reference hole 17l The center of gravity of the image and the center of gravity of the image of the alignment mark 18l for material matching are obtained.

Then, the center of gravity of the image of the material reference hole 17u and the center of gravity of the image of the material alignment mark 18u match, and the center of gravity of the image of the material reference hole 17l and the center of gravity of the image of the material alignment mark 18l also match. Drive signals to calculate the motor drive circuits 23a, 23
b, 23c. As a result, the glass mask 4 and the material M to be exposed are in a matched state.

As shown in FIG. 7, for example, the material reference holes 17u and 17l and the material alignment mark 1 are aligned.
When 8l and 18l are largely deviated to some extent, the center of gravity cannot be accurately obtained and the glass mask 4 and the exposed material cannot be aligned.
The alignment mark 18l for material alignment,
The alignment control between the glass mask 4 and the material M to be exposed must be performed after the image of 18l is completely included in the images of the material reference holes 17u and 17l. However, in this embodiment, the material alignment alignment marks 18l, 18
This problem is solved by making the diameter of 1 sufficiently smaller than the diameter of the material reference holes 17u and 17l.

After the glass mask 4 and the material M to be exposed are aligned in this way, the alignment mark 1 for material alignment is formed.
CP in the alignment control unit 20 on the back side or the front side having the glass mask 4 on which 8u and 18l are not formed
U25 aligns the front and back glass masks 4 with each other as follows.

That is, in the alignment control unit 20 of the other alignment mechanism, an image signal in which the images of the front mask alignment mark 15u and the back mask alignment mark 16u from the one-dimensional image sensors 13ux and 13uy are superimposed, and the one-dimensional image sensor. 13lx,
Based on the image signal on which the images of the front mask alignment mark 15l and the back mask alignment mark 16l from 13ly are superimposed, the material alignment mark 1
Alignment mark 1 for material alignment with respect to the front side or back side glass mask 4 on which 8u and 18l are formed
8u and 18l are not formed on the back side or the front side of the glass mask 4, and the amount of displacement is obtained, and the alignment marks 18u and 18 for material alignment are set so that the amount of displacement is "0".
1 is driven by a motor so that the glass mask 4 on the back side or the front side on which the l is not formed is moved relative to the glass mask 4 on the front side or the back side on which the alignment marks 18u, 18l for material alignment are formed. Circuit 23
drive motors 5a, 5b, 5 via a, 23b, 23c
Control c.

The above control is performed for each one-shot exposure in each double-sided exposure section of the multi-sided double-sided exposure apparatus.
As a result, as shown in FIG.
Not only the alignment between the two, but also the alignment between the glass mask 4 on the front and back and the exposed material M, as shown in FIG.
It is possible to prevent the occurrence of defective portions in which the exposure patterns obtained in the respective double-sided exposure portions overlap with each other, and portions in which the material M to be exposed is wasted due to an extremely large distance between the exposure patterns. Can be minimized and the yield of the exposed material M can be improved.

For example, in the case of the multiple type as in this embodiment,
The interval between adjacent exposure patterns by one-shot exposure is set to be approximately equal to the pattern width, and after one-shot exposure, it is wound by the center-to-center distance between the exposure apparatuses, and further one-shot exposure is performed for the previously exposed portion. Even in the case where the material is wasted as little as possible by performing the exposure of the unexposed portion between them, it is possible to prevent a problem such as the overlapping of the adjacent exposure patterns after the two exposures.

[Second Embodiment] In the second embodiment, the upper and lower edge lines of the material M to be exposed are used as alignment reference portions without forming material reference holes in the material M to be exposed. In this second embodiment, as shown in FIG. 9, the circular mask reference marks 27u and 27l are formed on the front or back side of the glass mask 4 so as to have the same distance between the upper and lower edge lines of the material M to be exposed. It is formed in a direction perpendicular to the moving direction of the material M to be exposed with a space between the centers. The mask reference marks 27u and 27l are translucent marks, and at least the peripheral portions thereof are opaque portions.

In this embodiment, the two-dimensional image sensor 19
u and 19l are arranged at positions facing the mask reference marks 27u and 27l, and as shown in FIG. 9, the area of the image of the mask reference marks 27u and 27l obtained from the two-dimensional image sensors 19u and 19l is The upper and lower edge lines of the exposed material M are controlled to be halved (or the upper and lower mask reference marks 27u and 27l projected from the upper and lower edge lines have the same area). As a result, the same result as that of the first embodiment as shown in FIG. 8 is obtained. In this embodiment, since it is not necessary to form the material reference hole in the exposed material,
The cost required for exposure can be reduced as compared with the embodiment, and a high-definition television shadow mask, an IC lead frame and the like can be produced at low cost. The mask reference mark 2
Instead of 71, the mask reference mark 28u shown in FIG. 9 may be provided, and the area of the image of the mask reference marks 27u and 28u may be controlled to be halved by the upper edge line of the material M to be exposed. Alternatively, three mask reference marks 27u, 27l, 28u may be used.

The present invention is not limited to the above-described embodiment, but can be applied to, for example, a stand-alone type double-sided exposure apparatus, a stand-alone type or a multi-connection type single-sided exposure apparatus. Further, the shape of the material reference hole may be a shape other than a circle such as a quadrangle. Also, the first and second
It is not always necessary to obtain the center of gravity if control is performed so that the superimposed states of the superimposed images of are matched.

Further, there is only one material reference hole opened in a line parallel to the edge line of the material M to be exposed in accordance with the pitch between exposures in one exposure area overlapping with the mask. The other material reference holes may be, for example, the exposure pattern P such as the positions indicated by X or Δ in FIG.
It can be formed at an arbitrary position as long as it does not interfere with.

As described above, one mask is aligned with the exposed material, and one mask is aligned with the exposed material without aligning the masks with each other, and the other mask is exposed with the exposed material. It is also possible to match the material. In this case, the mask and the exposed material can be aligned and the masks can also be aligned without providing an alignment mark for aligning the material on the mask. In the above embodiment, the one-dimensional sensors 13ux, 13uy, 13l are used for adjusting the alignment between the masks.
x, 13ly, and marks 15u, 15l, 16u,
Although 16l was used, other methods may be used. Furthermore, two-dimensional sensors 19u and 19l may be used as sensors, and these may also be used for matching masks.

[0044]

As described above, according to the present invention,
It is possible to minimize the gap between the exposure patterns by preventing the occurrence of defective portions where the exposure patterns overlap with each other, and portions where the distance between the exposure patterns is extremely large and wastes the exposed material. Therefore, the yield of the exposed material can be improved.

[Brief description of drawings]

FIG. 1 is a schematic block diagram showing a mask alignment mechanism of an exposure apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing a state in which mask alignment mechanisms on the front and back sides of the exposure apparatus according to the embodiment of the present invention face each other.

FIG. 3 is a diagram showing a connecting portion of a drive joint, an alignment base, and an alignment stage of the exposure apparatus according to the embodiment of the present invention.

FIG. 4 is a diagram showing various marks, sensors, etc. for alignment of the exposure apparatus according to the embodiment of the present invention.

FIG. 5 is a diagram showing an arrangement state of a plurality of alignment marks (material reference holes) on an exposed material of the exposure apparatus according to the first embodiment of the present invention.

FIG. 6 is a block diagram showing an electrical control system according to an embodiment of the present invention.

FIG. 7 is a diagram for explaining a problem peculiar to the first embodiment of the present invention and a solution to the problem.

FIG. 8 is a diagram for explaining the effect of the present invention.

FIG. 9 is a diagram for explaining the first embodiment of the present invention.

FIG. 10 is a perspective view showing a conventional stand-alone type double-sided exposure apparatus.

FIG. 11 is a diagram for explaining a conventional problem.

[Explanation of symbols]

 1 ... Alignment stage 2a, 2b, 2c, 2d, 2e ... Drive joint 3 ... Alignment base 4 ... Glass mask 5a, 5b, 5c ... Drive motor 13u, 13l ... One-dimensional image sensor 15u, 15l ... Table mask alignment mark 16u, 16l ... Back mask alignment mark 17u, 17l ... Material reference hole 18u, 18l ... Material alignment alignment mark 19u, 19l ... Two-dimensional image sensor 20 ... Alignment control unit 25 ... CPU 27 ... Mask reference mark M ... Exposed material

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Michihiro Kuramochi 1-5-50 Kumeinuma Shinmei, Fujisawa-shi, Kanagawa Nippon Seiko Co., Ltd. Inside NSK Ltd. (72) Inventor Toshiyuki Aihara 1-5-50 Kumeiuma Kugenuma, Fujisawa-shi, Kanagawa Inside NSK Ltd.

Claims (1)

[Claims] 1. An unwinding part for unwinding the exposed material wound in a hoop shape, and a winding part for winding up the exposed material unwound from the unwinding part are arranged on both sides of the exposing part. An exposure device that exposes the exposed material to the exposure portion by a predetermined amount by the unwinding portion and the winding portion, and exposes a mask pattern on at least one surface of the exposed material. An exposure apparatus having a mask alignment mechanism having at least one image sensor disposed in a portion and mask position adjusting means for adjusting the position of the mask in a plane parallel to the exposure surface of the exposed material, At least one index mark is formed on the mask, and the image sensor has an alignment reference portion set on the exposed material within the visual field of the image sensor when the exposed material is delivered by the predetermined amount. To The alignment mark is formed at a position where it can be overlapped with the alignment reference part in the field of view, and the index mark and the alignment reference part are formed before exposure by the exposure part. An exposure apparatus comprising alignment control means for controlling the mask alignment mechanism so that the mask alignment mechanism is superposed in a visual field in a predetermined positional relationship.