JPH08153742A - Resin molding method for electronic parts - Google Patents

Abstract

PURPOSE: To avoid defects by voids blocking the flow of a charged molten thermosetting resin by a protrudent shape of electronic parts, resulting in undesired shape, by pressure-injecting the resin through a transfer mechanism composed of, at least, two pots and plungers per each of electronic parts. CONSTITUTION: From a plurality of pots their respective passages communicate with lead guard cavity parts of a cavity through gates. Lead guard cavity parts not communicated with the pots communicate with air vents to suck internal air from the cavity by opening to the atmospheric air or using a vacuum pump, etc. Thereby, even for products having protrudent parts such as electronic parts packages with lead guards, desired shape is obtained, without defects with voids. For general electronic parts such as QFP type or big multi- pin DIP type parts, the charging time is reduced by charging a resin from plural pots.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding method for electronic parts.

[0002]

2. Description of the Related Art FIG.
A multi-pin LSI having a fine lead shape as shown in FIG. 1 has appeared, and a package provided with a lead guard portion 9 in order to protect the lead 8 having weak mechanical strength is required. Plastic package electronic parts are cylindrical tablets made by compressing and hardening thermosetting epoxy resin powder.
Put in the pot of the mold die heated to a predetermined temperature,
A plunger that slidably engages with the pot is formed by pressure-injecting into the cavity of the molding die through the flow path and after a predetermined heat curing time. However, in the conventional molding die, it is general to inject by pressure from one pot into at least one or more cavities. There is a problem that a curable resin cannot enter and a non-filling failure occurs in which a desired shape cannot be obtained.

[0003]

The problem to be solved is that in the conventional electronic component resin molding method, in the case of a package having a projecting shape such as a package with a lead guard, molten resin is not formed in the projecting shape. This is because unfilling failure occurs in which a desired shape cannot be obtained because it cannot enter.

[0004]

In order to solve the above problems, in the present invention, a thermosetting property for one electronic component is provided by a transfer mechanism including at least two sets of pots and plungers. A resin molding method for an electronic component is used, which is characterized in that the resin is injected under pressure.

[0005]

Embodiment 1 FIG. 2 is a plan view of an electronic component resin molding die according to the present invention. The flow paths 2 communicate from the plurality of pots 1 to the lead guard cavity portion 4 of the cavity portion 3 through the gates 5, respectively. The lead guard cavity portion 6, which does not communicate with the pot 1, communicates with the air vent 7, which bleeds air from the cavity, and releases the atmosphere.
Alternatively, the internal air is sucked by a vacuum pump or the like. FIG.
FIG. 4 is a flow chart showing a process in which the molten resin 10 fills each cavity from the pot. In addition, in the present embodiment, the description has been given by taking the package with the lead guard having the special shape as an example. However, a general electronic component such as a QF is used.
Also in the P type or the large-sized multi-pin DIP type, the filling time was shortened by filling the resin from a plurality of places.

[0015]

EFFECT OF THE INVENTION By using the resin molding method for electronic parts according to the present invention, a desired shape can be obtained without defective filling even for products having protruding parts such as electronic parts packages with lead guards. Further, even in a general electronic component such as a QFP type or a large-sized multi-pin DIP type, the filling time is shortened by filling the resin from a plurality of locations.

[Brief description of drawings]

[Figure 1] Electronic component with lead guard

FIG. 2 is a plan view of an electronic component resin mold die according to the present invention.

[Figure 3] Flow chart

[Description of sign]

 1, pot 2, flow path 3, cavity portion 4, lead guard cavity portion 5, gate 6, lead guard cavity portion 7, air vent 8, lead 9, lead guard portion 10, molten resin

Claims (1)

[Claims] 1. At least 2 for one electronic component.
A resin molding method for electronic parts, characterized in that a thermosetting resin is pressure-fed and injected by a transfer mechanism composed of more than one set of pots and plungers.