JPH08152435A - Probe device and its manufacture - Google Patents

Abstract

PURPOSE: To obtain a probe device in which irregularity in the contact resistance of respective probe needles is eliminated and which can perform a precise measurement by a method wherein derivation positions from an insulating member of the probe needles are arranged in a zigzag shape. CONSTITUTION: Many fine probe needles 10a to 10c for a probe needle 10 are isolated from each other, and they are fixed to an insulating member 11. Free end parts of the needles 10a to 10c which have been derived from the member 11 are bent in the same direction, and their edges are brought into elastic contact with an electrode 3b for an object to be measured in a zigzag shape so as to be connected electrically. At this time, derivation positions from the member 11 of the needles 10a to 10c are arranged in a zigzag shape so as to correspond to the zigzag arrangement of the free end parts of the probe 10. In addition, the derivation face from the probe 10 of the member 11 is tilted in such a way that distances up to base parts from the free end parts of the needles 10a to 10c become equal. Thereby, lengths of the needles 10a to 10c are resembles closely. When the needle 10 is pressed to the electrode 3b down to a prescribed depth so as to come into contact surely, deformation amounts of the needles 10a to 10c are resembled closely, and also contact pressures are resembled closely. Consequently, it is possible to avoid a measuring defect based on irregularity in a contact resistance, and a precise measurement can be performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is applied to each electrode when manufacturing an electronic component having a large number of fine and closely arranged electrodes such as a TAB type semiconductor integrated circuit device used for driving a liquid crystal display device. The present invention relates to a probe device used for connecting a power source, a measuring instrument, and the like, and a manufacturing method thereof.

[0002]

2. Description of the Related Art The structure in the manufacturing process of a semiconductor integrated circuit device for driving a multi-electrode electronic component such as a liquid crystal display device is shown in FIG.
And it demonstrates from FIG. In the figure, 1 is a long TAB
With tape, conductive foils are laminated on the insulating film 2 in which feed holes 2a and 2a are formed on both sides and through holes 2b are formed in the middle at predetermined intervals in the longitudinal direction, and the conductive foils are etched, A conductive pattern 3 including an inner lead 3a extending in the through hole 2b and an outer lead 3b externally connected is formed.

This conductive pattern is usually a copper foil, the surface of which is gold-plated, and then a metal such as tin is plated. In a semiconductor device for a liquid crystal display device, there are about 30 conductive patterns on the input side and 200 conductive patterns on the output side.
Since this number is required, the inner lead on the input side must be a through hole 2.
On one side of b, the inner leads on the output side are located on the other three sides, and the respective outer leads are located on both sides of the insulating tape 2. Thus, the ratio of the number of input / output leads is 6
However, due to the dimensional restrictions of the semiconductor device, the distance between the output side conductive patterns is set to be higher than the distance between the input side conductive patterns. 4 is a through hole 2 of the TAB tape 1
The electrode 4 formed on the surface of the semiconductor pellet arranged in b.
a is polymerized with the inner lead 3a and electrically connected to TA
The intermediate structure of the B type semiconductor device is formed.

This intermediate structure is connected to a power source or a measuring device through a measuring terminal to the outer lead 3b to make an electrical measurement to determine whether it is good or bad. Only a good product is wound on a spool to be moved and stored, and TAB is further provided. Unnecessary portions of the tape 1 are cut and removed to be separated into individual semiconductor devices and mounted on a liquid crystal display device or the like. Here, FIG. 8 shows an example of a probe apparatus used for the inspection of the intermediate structure. In the figure,
Reference numeral 5 is a substrate having a window 5a formed in the central portion, 6 and 7 are insulating members arranged on the insulating substrate 5 with a through hole 5a interposed therebetween, 8 and 9.
Is a large number of probe needles arranged in parallel, and the middle part is fixed to the insulating members 6 and 7. Probe needles 8 and 9
Is made of a hard and elastic metal such as tungsten, has a tip diameter of about 60 μm, and is processed into a needle-like shape with a diameter of a base portion led out from the insulating members 6 and 7 of about 300 μm,
The exposed portions of the insulating members 6 and 7 are bent in a substantially V shape, and the length from the free end to the bent portion is set to about 1 mm, and the length from the bent portion to the base portion is set to about 5 mm. .

The adjacent space between the probe needles 8 and 9 is set to the space between the outer leads 3b. In the outer lead on the output side where the lead space is close, the space is, for example, 200 μm, which is narrower than the base diameter 300 μm of the probe needle 9. When set to 1, the probe needles 9 cannot be arranged in the same plane at equal intervals. Therefore, the insulating member 7 of the probe needle 9
As shown in FIG. 9, the derivation part from is set in a zigzag pattern with the horizontal interval set to 200 μm, which is equal to the outer lead interval, and the vertical interval set to 300 μm or more,
The distance between the adjacent probe needles 9, 9 is set to be sufficiently large. On the other hand, the free end diameter of the probe needle 9 is 6
Although it is about 0 μm, which is sufficiently smaller than the arrangement pitch of the outer leads, as shown in FIG. 10, the free ends of the probe needles 9 are also staggered by being offset by about 500 μm in the axial direction of the probe needles 9.

As a result, the probe needles 9 on the output side are separated substantially parallel to each other in a plan view and a side view. In this probe device, the free ends of the probe needles 8 and 9 and the outer lead 3b of the intermediate structure are superposed and positioned, and the probe needles 8 and 9 are positioned.
And the intermediate structure relatively close to each other, and the outer lead 3b
The free ends of the probe needles 8 and 9 are brought into contact with each other, and the probe needles 8 and 9 are elastically applied to each other by further approaching each other by about 100 μm from this contact position to ensure the connection, thereby ensuring the connection and the semiconductor intermediate structure. And are electrically connected. Here, when the intermediate structure and the probe device are brought close to each other in order to ensure the electrical connection between the outer lead 3b and the probe needles 8 and 9, the probe needles 8 and 9 tend to rotate around their bases and their free ends. However, the tip of the probe needles 8 and 9 bites into the plating layer of the outer lead 3b and is prevented from moving.

[0007]

By the way, since the probe needles 8 in contact with the input-side conductive pattern of the probe device can have a sufficiently large interval, they do not need to be arranged in a staggered pattern, and the lengths of the adjacent probe needles are not required. Are almost the same, while the probe needle 9 that contacts the output side conductive pattern
Are arranged in a zigzag pattern and in parallel with each other, the lengths of the probe needles are different, and as a result, the deformation amount when the probe needles 9 are pressed to a predetermined depth to ensure electrical connection. However, there is a problem in that the elastic force of the probe needle 9 with respect to the conductive pattern also varies, the connection state becomes non-uniform, and the contact resistance varies, resulting in variations in measurement and inspection results.

Further, although the probe needles 8 and 9 elastically contact the plating layer of the conductive pattern, the plating metal or foreign matter may adhere to the free end by repeated use and damage the electrical connection. To remove foreign matter. By this polishing, the length from the free end to the bent portion of the probe needle 9 is shortened. However, with a short probe needle, the rate of shortening the length by polishing is large, and the change in the length of each probe needle 9 causes a gap between the probe needles 9. There is also a possibility that the elastic forces of the two differ greatly and the contact pressure becomes non-uniform, resulting in variations in measurement. Further, the work of fixing the probe needles 9 to the insulating member 7 in a zigzag manner is complicated, and it is difficult to manufacture the probe device.

[0009]

SUMMARY OF THE INVENTION The present invention has been proposed for the purpose of solving the above-mentioned problems, in which the intermediate portions of a large number of fine probe needles are separated from each other and fixed by an insulating member,
In the probe device in which the free end portion of the probe needle led out from the insulating member is bent in the same direction, and the end surface is elastically contacted in a staggered manner on the electrode of the object to be measured to electrically connect, Provided is a probe device characterized in that the lead-out positions from the insulating member are arranged in a staggered manner corresponding to the staggered arrangement of the probe needle free ends, and the probe needle lead-out surface of the insulating member is inclined. In this device, the length from the free end of the adjacent probe needle to the insulating member can be made substantially constant. In addition, it is comparatively easy by fixing the intermediate part of many probe needles arranged in parallel on the same plane with an insulating member and integrating them, and stacking a plurality of these insulating members while shifting them in the pull-out direction of the probe needle. The probe device can be manufactured.

[0010]

With the above means for solving the problems, even if the probe needles are arranged in a zigzag manner in accordance with the arrangement pitch of the conductive patterns, the length of each probe needle can be made substantially constant. This pressure can be made constant, and there is no variation in contact resistance, which enables accurate measurement. Further, even if the probe needles are polished during the periodic inspection, the shortening rate of the probe needles is almost constant, and the contact pressure among the probe needles is small in variation and stable measurement can be performed for a long period of time.

[0011]

Embodiments of the present invention will be described below with reference to FIGS. 1 and 2. In the figure, the same reference numerals as those in FIGS. 6 to 8 indicate the same things, and duplicate explanations are omitted. The probe device according to the present invention is characterized by the probe needles 10 that are connected to the output side conductive pattern having a dense array pitch. That is, the intermediate portions of a large number of fine probe needles 10a, 10b, 10c are separated from each other and fixed by the insulating member 11,
By bending the free ends of the probe needles 10a, 10b, and 10c derived from the same in the same direction, the end faces are measured.
Probe needles 10a, 10
b, 10c are arranged in zigzag corresponding to the staggered arrangement of the free ends of the probe needles 10, and the surface 11 from which the probe needles 10 of the insulating member 11 are drawn out.
It is characterized in that a is inclined.

The inclination angle of the inclined surface 11a of the insulating member 11 is set so that the lengths of the probe needles 10a, 11b and 11c from the free end to the base portion are substantially equal. According to the present invention, the probe needle 10 lead-out surface 11a of the insulating member 11
By tilting the probe needles 10a, 10
b and 10c are similar in length, and the deformation amount of the probe needle 10 when the probe needle 10 is pressed to a predetermined depth to ensure the connection between the probe needle 10 and the conductive pattern 3 is approximate. The contact pressure can be approximated to avoid measurement failure due to variations in contact resistance. In addition, the probe needle 10 is provided to remove foreign matter adhering to the probe needle 10.
Even if the probe needle 10 is shortened by polishing the tip of the
Since the shortening rate of the length of each probe needle 10 is substantially equal, there is no variation in the contact pressure between the probe needles due to polishing. This probe device can be manufactured by the method shown in FIGS. First, as shown in FIG. 3, projecting walls 12a, 12a are formed along both sides, and recessed grooves 12b are formed on the projecting wall 12a at a pitch three times the electrode pitch, for example, at intervals of 600 μm.
A large number of straight probe needles 10a are housed in the grooves 12b and arranged in parallel on the insulating sheet 12 having a large number of formed.

Next, as shown in FIG. 4, a pair of thermoplastic insulating sheets 13 each having a plurality of projecting walls 13a provided on the sheet 12 in a direction intersecting with the grooves 12b are covered with a fluororesin surface. It is sandwiched by a heater plate (not shown) and the insulating sheets 12 <13 are welded to obtain an intermediate structure in which a large number of probe needles 10a are integrated. This intermediate structure is also created for the probe needles 10b and 10c, and each probe needle 10
Bending is performed for each a10b10c. As shown in FIG. 5, these intermediate structures are thin heat-sensitive or pressure-sensitive adhesive sheets 1
4, the probe needles 10a, 10b, 10c are displaced by the electrode arrangement pitch in the arrangement direction, and the probe needle 10
Of the probe needle molded body of the probe device. In this manufacturing method, the probe needle molded body can be formed for each layer, and the arrangement of the probe needles can be adjusted for each intermediate structure, and the probe device that is easy to manufacture and has high accuracy can be realized at low cost.

[0014]

As described above, according to the present invention, it is possible to realize a probe device that has a small variation in contact pressure between probe needles, a small change in contact pressure even after polishing, and enables stable measurement over a long period of time. it can. It is also easy to manufacture,
A probe device that enables highly accurate measurement can be realized at low cost.

[Brief description of drawings]

FIG. 1 is a side sectional view showing a probe device of the present invention.

FIG. 2 is an enlarged side view of main parts of the device shown in FIG.

FIG. 3 is a perspective view illustrating a method of manufacturing a probe device according to the present invention.

FIG. 4 is a side sectional view illustrating a method for manufacturing a probe device according to the present invention.

FIG. 5 is a side sectional view illustrating a method for manufacturing a probe device according to the present invention.

FIG. 6 is a perspective view showing an example of an intermediate structure of a TAB semiconductor device.

FIG. 7 is a side sectional view of the intermediate structure shown in FIG.

FIG. 8 is a side sectional view showing the inspection device for the semiconductor device shown in FIG.

FIG. 9 is a partial cross-sectional side view showing a lead-out portion of a probe needle from an insulating member.

FIG. 10 is a plan view of an essential part showing an arrangement state of free ends of probe needles.

[Explanation of symbols]

 1 TAB Tape 2 Insulating Film 2a Feed Hole 2b Through Hole 3 Conductive Pattern 3a Inner Lead 3b Outer Lead 4 Electronic Component Main Body (Semiconductor Pellet) 4a Electrode 5 Board 6 Insulation Member 7 Insulation Member 8 Probe Needle 9 Probe Needle

Claims (3)

[Claims] 1. A plurality of fine probe needles are separated from each other by an intermediate portion and fixed by an insulating member, and the free ends of the probe needles led out from the insulating member are bent in the same direction, and the end faces are fixed. In a probe device which is electrically connected in a staggered manner on the electrode of the object to be measured, the lead-out position of the probe needle from the insulating member is made zigzag in correspondence with the staggered arrangement of the probe needle free end. A probe device characterized in that the probe needle leading surface of the insulating member is inclined while being arranged. 2. The probe device according to claim 1, wherein the length from the free end of the adjacent probe needle to the insulating member is substantially constant. 3. A plurality of probe needles arranged in parallel on the same plane are fixed and integrated with an insulating member at an intermediate portion thereof, and a plurality of the insulating members are laminated while being shifted in a leading-out direction of the probe needle. And a method for manufacturing a probe device.