JPH08148464A - Substrate processing device and processing tank provided thereto - Google Patents

Abstract

PURPOSE: To obtain a substrate processing device which is small in size and low in cost by a method wherein a portable tank where injection pipes of liquid chemicals, pure water and the like are provided in one piece is used, and the substrate is subjected to a chemical process, a cleaning process, and a drying process in a chamber which is capable of being reduced in pressure. CONSTITUTION: A portable processing tank 21 is equipped with two injection pipes 25 which are used for pouring liquid chemicals or purer water into the processing tank and located at the lateral base sides of the outer wall of a case 22. A transfer robot 31 holds the portable processing tank 21, moves it to a pad 41, and puts it on the pad 41. Liquid chemicals or pure water fed to the injection pipes 25 through an inlet opening 44 provided to the pad 41 is buffered once through an inner pipe 26 and then spouted out of slits. A dam groove 47 is provided around the pad 41 to stop liquid chemicals or pure water which overflows the processing tank 21 from flowing away, and liquid chemicals or pure water stopped by the dam groove 47 is discharged outside of a reduced-pressure chamber 40 through the intermediary of a waste line 71. When a drying process is carried out, a valve 79 connected to the bottom of the reduced-pressure chamber 40 is opened, and the vacuum chamber is evacuated by an exhaust device.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus and a processing bath used for the same, and more specifically, in a semiconductor device manufacturing process, a liquid crystal display manufacturing process, an electronic component-related manufacturing process, etc., a silicon wafer, a glass, etc. The present invention relates to an apparatus for performing a predetermined treatment (chemical treatment, cleaning treatment, drying treatment, etc.) on various substrates such as substrates and electronic components, and a treatment tank used for the same.

[0002]

2. Description of the Related Art For example, in a semiconductor device manufacturing process, various wet processes (processes using a liquid) are indispensable in an etching process, a resist film peeling process and the like. The wet treatment includes a chemical treatment for dipping a semiconductor substrate such as a silicon wafer in a predetermined chemical, a washing treatment for washing away the chemicals and various particles adhering on the semiconductor substrate with pure water, and a drying treatment for drying the semiconductor substrate. .

Conventionally, various substrate processing apparatuses for performing the above-mentioned wet processing have been proposed and put into practical use. FIG. 10 is a schematic cross-sectional view of a wet etching apparatus which is an example of a conventional substrate processing apparatus.
The one disclosed in Japanese Patent No. 72129 is shown. Further, FIG. 11 is a cross-sectional view of the wet etching apparatus of FIG. 10 in which a holder is placed in the first outer tank. 12 is a partially cutaway perspective view of the holder and the first holder pedestal in the wet etching apparatus of FIG. Hereinafter, a conventional substrate processing apparatus will be described with reference to FIGS. 10 to 12.

In FIG. 10, the wet etching apparatus has a box-shaped holder 2 for setting a wafer 1, which has an open top surface and a bottom surface composed of a perforated plate 7, and an etching section 4 for the holder 2. And an automatic transfer section 3 for transferring to the water washing section 5 and the drying section 6, a first outer tank 8A constituting the etching section 4, and a chemical solution supply pipe 11 provided on the bottom surface of the first outer tank 8A. First holder base 10A connected to
A second outer tank 8B constituting the water washing section 5, a second holder holder 10B provided on the bottom surface of the second outer tank 8B and connected to a pure water supply pipe 12; And an O-ring 14 provided around the second holder pedestal to seal the gap between the holder pedestal and the holder 2 placed thereon.
It is mainly composed of

The automatic transfer section 3 includes a chuck, a cylinder,
The holder 2 is composed of a belt or the like, holds the holder 2 on which the wafer 1 is set, and moves the holder 2 vertically and horizontally to convey the holder 2 to the etching unit 5 and the like, and places it on the holder cradle.

As shown in FIGS. 11 and 12, the holder 2 placed on the first holder base 10A of the etching section 4 is moved by the clamp 9 fixed on the first outer tank 8A. The holder base 10A of No. 1 is pressed and fixed. The gap between the holder base 2 and the first holder base 10A is sealed with an O-ring 14. In this way, the etching tank is constituted by the holder 2 and the first holder base 10A.

Next, the valve 13A is opened and the chemical solution 15 is supplied into the wafer holder 2. After flowing the chemical liquid 15 for a certain period of time, the valve 13A is closed and the chemical liquid supply is stopped. Then, after the clamp 9 is released next, the automatic transport unit 3 grips the holder 2 again and carries it to the next water washing unit 5. After the same operation as in the etching unit 4 is performed in the water washing unit 5, it is carried to the next drying unit 6 and the wafer 1 is dried by a centrifugal dryer or the like to complete a series of processes.

[0008]

As described above, in the conventional substrate processing apparatus, the chemical solution treatment, the water washing treatment, and the drying treatment are performed in different places, that is, in different outer tanks. Therefore, the configuration of the entire apparatus becomes large and the price becomes high. In particular, since such a substrate processing apparatus is installed in a clean room, if the occupied area increases, the equipment cost of the clean room also increases.

Therefore, an object of the present invention is to provide a small-sized and inexpensive substrate processing apparatus and a processing bath used for the same.

[0010]

The invention according to claim 1 is
An apparatus for performing a predetermined process on a plurality of substrates in a closed space, which has a box shape with an upper surface and a lower surface opened, and stores a plurality of substrates inside thereof. Further, in the vicinity of its bottom, a portable processing tank integrally provided with an injection pipe for injecting a chemical solution and / or pure water,
A chamber having a lid that can be opened and closed on its upper surface, the interior of which is closed when the lid is closed, a transport means for transporting a processing bath containing a substrate and storing it in the chamber, and an inner bottom portion of the chamber. A pedestal that is provided and holds the bottom of the processing tank in a sealed state, a supply unit that is provided in association with the chamber and that supplies a chemical liquid and / or pure water from the outside to the injection pipe, and a chamber related to the chamber. And a discharge means for discharging the chemical solution and / or pure water discharged from the processing tank to the outside, and a chamber, which is vacuum-exhausted to reduce the pressure to dry the substrate. It is characterized in that the substrate is provided with a reduced pressure drying means, and the substrate is subjected to chemical solution treatment, cleaning treatment and drying treatment.

According to a second aspect of the present invention, in the first aspect of the invention, the injection pipe has a double pipe structure including an inner pipe and an outer pipe communicating with the inner pipe. And / or pure water is supplied to the inner tube.

According to a third aspect of the present invention, in the second aspect of the invention, the outer pipe is provided with one or a plurality of jet ports on the surface exposed in the processing tank, and the inner pipe is provided with a jet port. One or a plurality of jet ports are formed at a position facing approximately 180 ° with respect to the jet port.

According to a fourth aspect of the invention, in the invention of the third aspect, the outer tube is formed with a plurality of slits as ejection ports, and each slit is formed on each substrate arranged in the processing tank. It is arranged at a position corresponding to the space.

According to a fifth aspect of the present invention, in any one of the first to fourth aspects of the invention, the central portion of the pedestal is formed so as to extend along the arrangement direction of the substrates in the processing tank, and projects upward. Further provided is a rectifying convex portion.

According to a sixth aspect of the present invention, in the first aspect of the present invention, the inside of the treatment tank is provided by being provided in association with the chamber, and pushing up the bottom portion of the treatment tank to separate the treatment tank and the pedestal. The device further includes a push-up device for rapidly discharging the drug solution and / or pure water stored in.

According to a seventh aspect of the present invention, in the invention of the sixth aspect, a plurality of positioning grooves are formed in the bottom of the processing tank, and the processing tank is placed on the upper surface of the pedestal. A plurality of positioning protrusions that fit into the positioning groove are formed, and the push-up device is characterized in that the bottom of the processing tank is lifted by lifting each positioning protrusion.

The invention according to claim 8 is a portable type, which is a processing tank housed in a chamber when a predetermined processing is performed on a plurality of substrates housed therein. A housing having an upper surface and a lower surface opened, a plurality of substrate guides integrally formed on the inner wall of the housing, and a plurality of grooves for regularly holding a substrate, respectively, are regularly provided, and along the outer circumference of the lower surface of the housing. And a frame-shaped frame whose bottom is formed in a plane, and is integrally provided in the vicinity of the bottom of the housing,
An injection pipe for injecting a chemical liquid and / or pure water is provided inside the housing.

[0018]

In the invention according to claim 1, the processing tank containing a plurality of substrates is transferred by the transfer device and is stored in the chamber. At this time, the pedestal in the chamber is
Hold the bottom of the treatment tank sealed. Next, a chemical solution and / or pure water is supplied from the outside of the chamber to an injection pipe provided in the processing tank. Therefore, the chemical liquid and / or pure water is injected into the processing tank. Further, the chemical liquid and / or pure water discharged from the processing tank is discharged to the outside of the chamber by the discharging means. Through a series of these operations, the chemical solution treatment and the cleaning treatment of the substrate are performed in the chamber. Next, the inside of the chamber is depressurized by the depressurizing means, and the substrate is dried. As described above, since the chemical liquid treatment, the cleaning treatment, and the drying treatment of the substrate can be performed in one chamber, a compact and inexpensive substrate processing apparatus can be obtained.

According to the second aspect of the invention, the chemical liquid and / or pure water from the outside is first supplied to the inner pipe of the injection pipe. Then, the chemical liquid and / or pure water flows out from the inner pipe to the outer pipe and is jetted from the outer pipe to the processing tank. As described above, since the chemical solution and / or pure water supplied from the outside is temporarily buffered in the inner tube, the flow rate of the chemical solution and / or pure water ejected from the outer tube to the processing tank is the total length in the longitudinal direction of the injection tube. Is homogenized over.

In the invention according to claim 3, the chemical liquid and / or pure water supplied to the inner pipe is ejected from the ejection port of the inner pipe to the outer pipe, and then hits the inner wall of the outer pipe to be branched in two directions. It After each branch flow proceeds along the inner wall of the outer pipe,
The merging is performed in the vicinity of the ejection port of the outer tube, and the inter-substrate flow in a fan shape is ejected from the ejection port of the outer tube into the processing tank. Such a fan-shaped inter-substrate flow widely covers the inside of the processing bath.

In the invention according to claim 4, the fan-shaped inter-substrate flow ejected from each slit of the outer tube surely flows into each substrate arranged in the processing tank.

In the fifth aspect of the invention, the fan-shaped inter-substrate flow ejected from the outer tube hits the rectifying convex portion formed in the central portion of the pedestal and is converted into an upward flow having various angles. . Therefore, a rotational flow is formed between each substrate,
New chemical solution or pure water is efficiently spread over the entire substrate.

According to the sixth aspect of the present invention, the bottom of the processing tank is pushed up by the push-up device to separate the processing tank from the pedestal. As a result, the chemical solution and / or pure water stored in the processing tank is rapidly discharged.

In the invention according to claim 7, the push-up device lifts the bottom of the processing tank by lifting each positioning protrusion.

[0025]

1 is an external perspective view showing the structure of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is similar to FIG.
FIG. 3 is a partially cutaway perspective view showing a more detailed configuration of a portable processing tank in the substrate processing apparatus of FIG. The substrate processing apparatus of the present embodiment is, as will be described later, in one decompression chamber,
A configuration capable of performing a series of wet treatments (chemical treatment, cleaning treatment, and drying treatment) on various substrates (silicon wafers for semiconductor integrated circuits, glass substrates for liquid crystal display devices, substrates for other electronic components, etc.) Has become. The configuration of the substrate processing apparatus of this embodiment will be described below with reference to FIGS. 1 and 2.

A portable processing tank (hereinafter simply referred to as a processing tank) 21 has a housing 22 whose upper and lower surfaces are open. The lower portion of the housing 22 has an R shape along the outer periphery of the substrate 20 in order to minimize the gap with the substrate 21 housed inside. The inner wall of the housing 22 has a substrate guide 23a for supporting the substrate 20.
23d are fixedly attached. Each of the substrate guides 23a to 23d is formed with a plurality of support grooves at positions corresponding to each other, and the substrate 20 is placed in the support grooves.
By supporting the plurality of substrates 2 in the processing bath 21.
Zeros are arranged in a non-contact and parallel state. Four engaging protrusions 24a to 24d are fixedly attached to the upper portion of the outer wall of the housing 22. Further, on the left and right sides of the outer wall bottom portion of the housing 22, there are two members for injecting a chemical solution or pure water into the processing tank.
A book injection tube 25 is provided. These two injection tubes 25
Has a double pipe structure composed of an inner pipe 26 and an outer pipe 27, respectively. One end of each inner pipe 26 penetrates one end of the outer pipe 27 and is bent vertically downward. The other end of each inner tube 26 is closed by an outer tube 27. Further, one end and the other end of each outer tube 27 are closed. Further, a rectangular frame-shaped frame 28 is provided on the lower surface of the housing 22 so as to surround the opening.
Is provided. The bottom surface of the frame 28 is formed to have a flatness with a predetermined accuracy in order to improve the adhesion with the pedestal 41 on the decompression chamber side. A positioning groove 29 is formed on the bottom surface of the frame 28 at the center of each side.

The transfer robot 31 has a pair of left and right chucks 32, each of which is rotatable, and the chucks 32 are provided with engaging recesses 32a to 32d. The transfer robot 31 can hold the processing tank 21 by engaging the engaging protrusions 24a to 24d of the processing tank 21 with the engaging recesses 32a to 32d. Then, the transfer robot 31 can move the grasped processing tank 21 vertically and horizontally. That is, in this embodiment, the processing tank 2
1 is also used as a carrier for carrying the substrate 20.

A pedestal 41 on which the processing bath 21 is placed is provided at the inner bottom of the decompression chamber (not shown). A plurality of positioning protrusions 42 are formed on the upper surface of the pedestal 41 at positions corresponding to the positioning grooves 29 of the frame 28. By engaging each positioning protrusion 42 with the corresponding positioning groove 29, the processing tank 21 is accurately positioned with respect to the pedestal 41. Also, the cradle 4
A plurality of suction ports 43 are formed on the upper surface of the No. 1 at positions facing the bottom surface of the frame 28. The processing tank 21 is a pedestal 41
When it is placed on, the processing tank 21 is vacuum-chucked so as not to move by sucking air from each suction port 43. Further, on the upper surface of the pedestal 41, each inner pipe 26
Two inlets 44 (only one inlet is shown in FIG. 1 due to the limitation of drawing) connected to one end of the inner pipe 26 and for supplying a chemical liquid or pure water to each inner pipe 26. It is formed. Further, a rectifying convex portion 45 extending in the longitudinal direction (that is, the arrangement direction of the substrates 20) is formed in the center of the upper surface of the pedestal 41.

FIG. 3 is a partial perspective view showing a more detailed structure of the injection pipe 25 in FIG. FIG. 4 is a sectional view of the injection pipe 25 in FIG. Hereinafter, the configuration of the injection tube 25 will be described in more detail with reference to FIGS. 3 and 4. The outer tube 27 is formed with a plurality of slits 27 a that open toward the inside of the processing tank 21. Each slit 2
7a extends along the circumferential direction of the outer tube 27, and is arranged so as to correspond to the position between the substrates 20, as shown in FIG. The inner pipe 26 has a plurality of ejection ports 26a.
Are formed. The ejection ports 26a are arranged at positions facing the slits 27a by approximately 180 °.

FIG. 6 is a partial sectional view showing a state in which the processing tank 21 is placed on the pedestal 41. Hereinafter, the reason why the injection pipe 25 has a double pipe structure will be described with reference to FIG. From the inlet 44 (see FIG. 1) of the cradle 41 to the inner pipe 26
The chemical liquid or the pure water supplied to the inner pipe 27 flows into the outer pipe 27 from each ejection port 26a. The chemical liquid or pure water that has flowed into the outer pipe 27 hits the inner wall of the outer pipe facing the respective ejection ports 26a,
Branch in two directions. After moving along the inner wall of the outer pipe 27, the respective branched flows join together in the vicinity of the slits 27a and are jetted from the slits 27a into the processing tank. At this time, a fan-shaped inter-substrate flow is ejected from each slit 27a.

As described above, the chemical liquid or pure water supplied from the inlet 44 to the inlet pipe 25 is temporarily buffered by the inner pipe 26 and then ejected from each slit 27a. Therefore, the flow velocity of the jet flow in the slit 27a is
Is almost uniformed over the entire length of. In addition, the flow velocity distribution in the longitudinal direction in each slit 27a is also made uniform. On the other hand, in the conventional substrate processing apparatus shown in FIGS. 10 to 12, the chemical liquid (or pure water) supplied from the chemical liquid supply pipe 11 (or pure water supply pipe 12) is simply not buffered. Since the structure is dispersed by the perforated plate 7,
The flow velocity of the jet flow is highest in the central portion of the perforated plate 7 where the chemical liquid supply pipe 11 (or the pure water supply pipe 12) is arranged, and the flow velocity decreases rapidly as the distance from the central portion increases. This increases the difference in the concentration of the chemical liquid in the processing tank during the chemical liquid processing. In addition, the efficiency of replacing the chemical solution with pure water becomes poor even during cleaning.

Further, in the injection pipe 25 of this embodiment, the outer pipe 2
Since each slit 27a of No. 7 is arranged at a corresponding position between the substrates 20 in the processing tank, the jet flow enters between the substrates, and the dispersion efficiency of the chemical liquid and the substitution efficiency of the chemical liquid with the pure water are conventionally improved. It is remarkably improved as compared with the above substrate processing apparatus. Further, since a fan-shaped inter-substrate flow is ejected from each slit 27a, the inter-substrate flow covers a wide range in the processing tank. Moreover, the jet flow from each slit 27a is converted into an upward flow having various angles by the straightening convex portion 45 formed in the center of the pedestal 41, so that a rotational flow is formed between each substrate and the entire substrate is formed. New chemical solution or pure water spreads over. Therefore, the chemical treatment efficiency and the cleaning treatment efficiency are improved. On the other hand, in the conventional substrate processing apparatus shown in FIGS. 10 to 12, since only a linear upward flow in the vertical direction is generated in the holder 2, adjacent holes formed in the porous plate 7 are During that time, a dead space is formed, and the circulation efficiency of the chemical liquid or pure water is deteriorated at that portion.

As shown in FIG. 7, an ultrasonic transducer 46 composed of a piezo element or the like may be provided inside the rectifying convex portion 45 of the pedestal 41. The ultrasonic oscillator 46 generates ultrasonic waves in pure water during cleaning with pure water and cleans the substrate with ultrasonic waves. In contrast,
In the conventional substrate processing apparatus shown in FIGS. 10 to 12, since the bottom of the holder 2 is closed by the porous plate 7, it is not possible to provide the ultrasonic transducer as described above.

FIG. 8 is a system flow chart showing the overall configuration of the substrate processing apparatus according to one embodiment of the present invention. In FIG. 8, the decompression chamber 40 includes a main body 401 that houses the processing tank 21, and a lid 402 that covers the upper surface of the main body 401. An O-ring 40 is provided between the body 401 and the lid 402.
It is adhered by 3 etc. A pedestal 41 for mounting the processing bath 21 is arranged on the inner bottom of the main body 401. Around the pedestal 41, a receiving groove 47 for receiving the chemical liquid or the pure water which has overflowed from the processing tank 21 is formed. A deionized water jet pipe 48 and an IPA vapor (vapor) supply pipe 49 are provided inside the decompression chamber 40.

Pure water is supplied to the pure water supply pipe 48 from an external pure water supply source via a valve 51. IPA vapor (vapor) is supplied to the IPA vapor supply pipe 49 from an external IPA supply source through the valve 52. The push-up device 53 is provided on the outer bottom of the decompression chamber 40 and below the pedestal 41.
Is provided. The push-up device 53 pushes up the positioning protrusion 42 (see FIG. 1) on the pedestal 41 at the time of a quick dump rinse described later, and separates the frame 28 and the pedestal 41. As a result, the chemical liquid or pure water in the processing tank is rapidly discharged.

In the system of this embodiment, three tanks 54 to 56 are prepared as chemical liquid supply sources. The first tank 54 stores a mixed liquid SC-1 of NH ₄ OH, H ₂ O ₂ and H ₂ 0. In the second tank 55, H
A mixed solution SC-2 of Cl, H ₂ O ₂ and H ₂ 0 is stored. HF is stored in the third tank 56.
The mixed liquid SC-1 is supplied to the inlet 44 of the pedestal 41 via the pump 57, the filter 58, and the valve 59. The mixed liquid SC-2 is supplied to the inlet 44 via the pump 60, the filter 61 and the valve 62. HF
Is a filter 63, a valve 64, a mixing valve 65
And to the inlet 44 via the valve 66.
The third tank 56 is pressurized with nitrogen gas (N ₂ ), and HF is supplied to the inlet 44 at a pressure according to this pressure. The pressure value applied to the third tank 56 is the pressure detector 67, the pressure controller 68, and the regulator 6.
It is automatically controlled by a feedback loop composed of 9 and 9. Pure water is supplied to the injection port 44 from an external pure water supply source through a mixing valve 65. Further, the valve 70 is connected to the supply hole 44. This valve 70 is used for a slow leak that slowly discharges the liquid in the processing tank.

The chemical liquid or pure water that overflows from the processing tank 21 is received by the receiving groove 47 and then discharged to the outside of the decompression chamber 40 through the drainage line 71.
Valves 71 to 73 are provided in parallel on the drainage line 71. The valve 72 is a valve for discharging the chemical liquid (HF in this embodiment) or pure water that has overflowed from the processing tank 21. A specific resistance meter 75 is provided on the discharge line from the valve 72. This resistivity meter 75
Detects the amount of particles contained in the pure water by measuring the specific resistance of the discharged pure water. The smaller the amount of impurities, that is, particles, the higher the specific resistance of pure water. The valve 73 is a valve for returning the chemical liquid overflowing from the processing tank 21 to the first tank 54 during the chemical liquid treatment with the mixed liquid SC-1. The valve 74 is for treating the liquid chemical with the mixed liquid SC-2.
The chemical liquid overflowing from the processing tank 21 is stored in the second tank 5
It is a valve for returning to 5.

A heater 75 is provided in the first tank 54.
However, a heater 76 is provided in the second tank 55, and each chemical is kept at a constant temperature that is optimum for processing.
A valve 75 is provided between the filter 58 and the first tank 54, and a valve 76 is provided between the filter 61 and the second tank 55. These valves 75 and 76 are opened when the chemical solution is not processed to circulate the chemical solution in each tank. This prevents unevenness in the temperature distribution of the chemical liquid in each tank. The valve 79 connected to the bottom of the decompression chamber 40 is a valve for evacuation. That is, the valve 79 is opened during the drying process and the inside of the decompression chamber is decompressed by the exhaust device not shown.

FIG. 9 is a flow chart showing the operation of the substrate processing apparatus shown in FIG. The operation of the substrate processing apparatus shown in FIG. 8 will be described below with reference to FIG. First, the substrate 20 transferred from the previous step is stored in the processing tank 21. Then, the transfer robot 31 (see FIG. 1) grips and transfers the processing bath 21 by the chuck 32, and places the processing bath 21 on the pedestal 41 in the decompression chamber 40 (step S1). Then, the lid 402 of the decompression chamber 40 is closed, and the air in the decompression chamber is preferably replaced with an inert gas such as nitrogen.

Next, chemical treatment is performed. Here, the chemical liquid treatment includes a circulating chemical liquid treatment performed by circulating the chemical liquid between the treatment tank and the tank, and a disposable non-circulating chemical liquid treatment not performing such circulation. In this embodiment, the mixed liquid SC
The chemical liquid treatment using -1 or SC-2 is a circulating chemical liquid treatment, and the chemical liquid treatment using HF is a non-circulating chemical liquid treatment. In step S2, it is determined whether the chemical liquid treatment to be performed is a circulating chemical liquid treatment or a non-circulating chemical liquid treatment.

As a result of the determination in step S2, when the circulating type chemical solution treatment is performed, the processing of circulating the chemical solution in the treatment tank is performed (step S3). For example, when performing the chemical liquid treatment using the mixed liquid SC-1, the valves 59 and 73 are opened. Therefore, the chemical liquid in the first tank 54 is supplied into the processing tank 21. Then, the chemical liquid overflowing from the first tank 54 is returned into the first tank via the receiving groove 47 and the valve 73. In addition, mixed solution SC-
When performing the chemical liquid treatment using 2, the valves 62 and 74
Is opened. Therefore, the chemical liquid in the second tank 55 is supplied to the processing tank interior 21. Then, the chemical liquid overflowing from the second tank 55 receives the receiving groove 47 and the valve 7.
It is returned to the second tank via 4. When the circulation of the chemical liquid as described above is performed for a predetermined period of time, each valve on the supply side is closed and the circulation of the chemical liquid is stopped (step S4).

On the other hand, in the case of performing the non-circulation type chemical solution treatment, the chemical solution is supplied into the processing tank, and the overflowed chemical solution is discharged as drainage (step S5). More specifically, valves 64, 66 and 72 are opened. As a result, the chemical liquid HF in the third tank 56 is mixed with pure water by the mixing valve 65 and then supplied into the processing tank. Further, the chemical liquid that overflows from the third tank 56 is discharged as drainage through the receiving groove 47 and the valve 72. When the chemical solution treatment as described above is performed for a predetermined time, the valve 64 is closed and the supply and discharge of the chemical solution is stopped (step S6).

When the chemical treatment is completed as described above,
This time, the cleaning process is performed. Here, the cleaning process includes a first cleaning method for rapidly discharging (draining) the chemical liquid in the processing tank and a second cleaning method for not performing such rapid discharging. In the present embodiment, the first cleaning method is adopted for the cleaning process after the chemical solution treatment using the mixed liquid SC-1 or SC-2,
The second cleaning method is used for the cleaning process after the chemical solution process using HF. In step S7, it is determined whether the cleaning process to be performed is the first cleaning process or the second cleaning process.

As a result of the determination in step S7, when the first cleaning process is performed, the chemical solution in the processing tank is rapidly discharged (step S8). More specifically, the positioning protrusions 4 on the pedestal 41 are pushed by the push-up device 53.
2 (see FIG. 1) is pushed up, and the frame 28 and the pedestal 41 are separated. As a result, the chemical liquid or pure water in the processing tank is rapidly discharged. The discharged chemical liquid is recovered in the first or second tank 54 or 55 through the valve 73 or 74 and reused. By rapidly discharging the chemical solution in this manner, the chemical solution can be replaced with pure water in a short time. Next, the push-up device 53
Lowers the positioning protrusion 42 to the initial position, and the processing tank 2
1 is set again on the pedestal 41 (step S9).
As described above, the push-up device 53 moves the positioning protrusion 42 up and down, so that when the processing tank 21 is reset, the processing tank 21 and the pedestal 41 are automatically positioned, and the displacement between them is prevented. it can. Next, the valve 66
Is opened, pure water is supplied into the processing tank, and the substrate 20 is washed with the pure water (step S10). At this time, the deionized water overflowing from the processing tank 21 is stored in the receiving groove 4
7 and the valve 72, and is discharged out of the decompression chamber. Next, the cradle 41 is pushed by the push-up device 53.
The upper positioning protrusion 42 is pushed up, and the frame 28 and the pedestal 41 are separated. As a result, the pure water in the processing tank is rapidly discharged (step S11). The discharged pure water is thrown out of the decompression chamber through the receiving groove 47 and the valve 72. At this time, the valve 51 is opened, and a shower of pure water is showered on each substrate 20 from the pure water jet pipe 48. Next, the push-up device 53 lowers the positioning protrusion 42 to the initial position, and sets the processing tank 21 on the receiving table 41 again (step S12). The processes of steps S10 to S12 are repeated 2-3 times. As described above, by rapidly discharging (quick dump rinse) the pure water in the processing tank during the cleaning, many particles detached from the substrate 20 and dissolved in the pure water are discharged all at once, and the cleaning time Can be significantly shortened.

On the other hand, when performing the above-mentioned second cleaning treatment,
Pure water is supplied into the processing bath through the valve 66, and the substrate 20 is washed with the pure water (step S1).
3). At this time, the chemical solution (HF) in the processing tank is gradually replaced with pure water. Further, the chemical liquid or pure water that overflows from the processing tank 21 is discharged to the outside of the decompression chamber via the receiving groove 47 and the valve 72. After that, when a predetermined time has elapsed, the valve 66 is closed and the supply of pure water to the processing tank 21 is stopped (step S14).

Next, it is judged whether or not another chemical liquid treatment remains, and if there is any other chemical liquid treatment, the above-mentioned operations of steps S2 to S14 are repeated. On the other hand, when all the chemical solution treatments have been completed, the final cleaning treatment is performed (step S1).
6). More specifically, the valve 66 is opened,
Pure water is supplied into the processing tank. At this time, the pure water that overflows from the processing tank 21 receives the receiving groove 47 and the valve 72.
Is discharged to the outside of the decompression chamber via. Further, the specific resistance value of the pure water discharged is measured by the specific resistance meter 75, and it is determined whether the specific resistance value is equal to or more than a preset value or less (step S17). If the specific resistance value of the pure water is less than the set value, the amount of particles remaining in the pure water is large, and thus the final cleaning process of step S16 is continued. On the other hand, when the specific resistance value of the pure water is equal to or higher than the set value, almost no particles remain in the pure water, so the valve 66 is closed and the supply of the pure water into the processing tank is stopped (step S
18). At this time, the supply of nitrogen gas to the decompression chamber 40 is also stopped.

Next, the valve 70 is opened and the pure water in the processing tank is gradually discharged through the injection pipe 25. At the same time, the valve 52 is opened and the IPA vapor is supplied into the decompression chamber (step S19). At this time, the water level in the processing tank gradually decreases and each substrate 20 is exposed to the IPA vapor. Therefore, on the surface of each substrate 20, water droplets I
Replaced with PA vapor. That is, IPA lowers the surface tension of water droplets attached to the substrate surface, and therefore the water droplets flow down from the substrate surface due to its own weight. When the water level in the processing tank drops below the bottom of the substrate 20, the valve 70
And 52 are closed, and the discharge of pure water and the supply of IPA vapor are stopped (step S20). Next, the valve 79 is opened, and the inside of the decompression chamber is evacuated and decompressed (step S21). As a result, the boiling point of the IPA vapor is lowered, the IPA replaced with pure water on the substrate surface is quickly evaporated, and the substrate surface is dried in a short time. In addition, as long as it is water-soluble and has a property of lowering the surface tension of water droplets remaining on the substrate, a vapor of another organic solvent may be used instead of the IPA vapor. Instead of such an organic solvent vapor, heated water vapor may be sprayed to dry the substrate surface. When the substrate drying process is completed, nitrogen gas is supplied into the decompression chamber and the inside thereof is returned to atmospheric pressure (step S22).

In the above embodiment, the slits 27a provided on the outer tube 27 of the injection tube 25 are arranged at the corresponding positions between the substrates 20, but they may be arranged at other positions. good. Also, instead of such a slit,
A circular hole or the like may be provided in the outer tube 27. Further, the outer tube 27 may be provided with one elongated hole extending along the axial direction thereof. Further, in the above-mentioned embodiment, the double-pipe structure injection pipe is used, but the single-structure injection pipe may be used.

[0049]

According to the first aspect of the present invention, since a chemical solution treatment, a cleaning treatment and a drying treatment of a substrate can be performed in one chamber, a compact and inexpensive substrate processing apparatus can be obtained.

According to the second aspect of the present invention, since the chemical solution and / or pure water supplied from the outside is temporarily buffered in the inner tube, the chemical solution and / or pure water ejected from the outer tube to the processing tank can be treated. The flow velocity is uniform over the entire length of the injection tube in the longitudinal direction. Therefore, each substrate can be processed uniformly.

According to the third aspect of the invention, since the fan-shaped inter-substrate flow is jetted from the jet port of the outer tube, the inside of the processing tank can be widely covered and a dead space is unlikely to be formed.

According to the invention of claim 4, since each slit of the outer tube is arranged at a position corresponding to each substrate, the fan-shaped inter-substrate flow ejected from each slit is different in each processing tank. It surely flows between the substrates arranged inside. Therefore, the processing efficiency is significantly improved.

According to the fifth aspect of the present invention, the fan-shaped inter-substrate flow ejected from the outer tube hits the straightening convex portion formed in the central portion of the pedestal and is converted into an upward flow having various angles. Therefore, a rotating flow is formed between the substrates, and the new chemical liquid or pure water is efficiently spread over the entire substrates.

According to the sixth aspect of the present invention, since the bottom of the processing tank is pushed up by the push-up device to separate the processing tank and the pedestal from each other, the chemical liquid or pure water stored in the processing tank can be rapidly discharged. Can be discharged.

According to the invention of claim 7, since the push-up device lifts the bottom of the processing tank by lifting each positioning protrusion, the processing tank automatically moves when the processing tank is lowered, that is, when the processing tank is reset. Positioned in
It is possible to prevent displacement from occurring with respect to the cradle.

According to the eighth aspect of the present invention, since the processing bath can be taken out of the chamber, the inside of the chamber can be easily cleaned. Further, since the substrate can be stored in the state of being taken out from the chamber, the storing operation is easier than the case of storing the substrate in the processing tank provided in the chamber.
Further, since the upper and lower surfaces of the processing tank are open, each substrate can be housed or taken out by vertically elevating and lowering each substrate from the lower portion of the processing tank with an elevating device or the like. Therefore, the margin in the processing tank can be reduced as compared with the conventional case where the chuck of the transfer robot is put in the processing tank to grip the substrate. As a result, the internal volume of the processing tank is reduced, and the consumption of chemicals and pure water can be reduced.

[Brief description of drawings]

FIG. 1 is a perspective view of essential parts showing a configuration of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a partially cutaway perspective view showing the processing tank 21 in FIG. 1 in more detail.

FIG. 3 is a partial perspective view showing a more detailed configuration of an injection pipe 25 in FIG.

4 is a cross-sectional view of an injection pipe 25 in FIG.

5 is a diagram showing an arrangement relationship between a substrate 20 and a slit 27a in FIG.

FIG. 6 is a diagram for explaining the flow of a chemical solution or pure water ejected from the injection pipe 25 into the processing tank in the embodiment of FIG.

FIG. 7 is a diagram showing a configuration of a pedestal provided with an ultrasonic transducer.

FIG. 8 is a system flow diagram showing an overall configuration of a substrate processing apparatus according to an embodiment of the present invention.

9 is a flowchart showing the operation of the embodiment shown in FIG.

FIG. 10 is a schematic cross-sectional view showing the configuration of a conventional substrate processing apparatus.

FIG. 11 is a cross-sectional view of the etched portion in FIG.

12 is a partially cutaway perspective view of the holder and the first holder cradle in FIG. 10. FIG.

[Explanation of symbols]

 20 ... Substrate 21 ... Processing tank 22 ... Enclosure 23a-23d ... Substrate guide 24a-24d ... Engagement projection 25 ... Injection pipe 26 ... Inner pipe 26a ... Jet port 27 ... Outer pipe 27a ... Slit 28 ... Frame 29 ... Positioning groove 31 ... Transfer robot 32 ... Chuck 40 ... Decompression chamber 41 ... Receptacle 42 ... Positioning protrusion 43 ... Adsorption port 44 ... Injection port 45 ... Rectification convex part 46 ... Ultrasonic transducer

Claims (8)

[Claims] 1. An apparatus for performing a predetermined process on a plurality of substrates in a closed space, which has a box shape with an upper surface and a lower surface opened, and wherein the plurality of substrates are provided inside thereof. Of the substrate, and a portable treatment tank integrally provided with an injection pipe for injecting a chemical solution and / or pure water near the bottom thereof, and an openable lid on the upper surface thereof, A chamber whose inside is closed when the lid is closed, a transport means for transporting the processing bath containing the substrate and storing it in the chamber, and a bottom portion of the processing bath provided at an inner bottom portion of the chamber. A pedestal for holding in a sealed state, a supply means provided in association with the chamber, for supplying a chemical liquid and / or pure water from the outside to the injection pipe, and provided in association with the chamber, The chemical liquid discharged from the treatment tank And / or a decompression means for ejecting pure water to the outside, and a decompression drying means provided in association with the chamber for drying the substrate by evacuating and decompressing the inside of the chamber. A substrate processing apparatus, wherein the substrate is subjected to a chemical solution treatment, a cleaning treatment, and a drying treatment. 2. The injection pipe has a double pipe structure composed of an inner pipe and an outer pipe communicating with the inner pipe, and a chemical solution and / or pure water from the outside is supplied to the inner pipe. The substrate processing apparatus according to claim 1, which is performed. 3. The outer pipe is formed with one or a plurality of jet ports on a surface exposed in the processing tank, and the inner pipe is provided at a position facing the jet port by approximately 180 °. The substrate processing apparatus according to claim 2, wherein one or a plurality of ejection ports are formed. 4. A plurality of slits are formed in the outer tube as the ejection ports, and each of the slits is arranged at a position corresponding to each of the substrates arranged in the processing bath. The substrate processing apparatus according to claim 3, wherein 5. The rectifying convex portion, which is formed so as to extend along the arrangement direction of the substrates in the processing tank in the central portion of the pedestal and which projects upward, is any one of claims 1 to 4. The substrate processing apparatus as described in 1. 6. A chemical solution and / or pure water stored in the processing tank, which is provided in association with the chamber and pushes up a bottom portion of the processing tank to separate the processing tank from the pedestal. The substrate processing apparatus according to claim 1, further comprising a push-up device for rapidly discharging the gas. 7. A plurality of positioning grooves are formed in the bottom of the processing tank, and when the processing tank is placed on the upper surface of the pedestal,
The substrate processing apparatus according to claim 6, wherein a plurality of positioning protrusions that fit in the positioning groove are formed, and the push-up device lifts the bottom of the processing tank by lifting each of the positioning protrusions. 8. A processing tank which is portable and is housed in a chamber when a predetermined processing is performed on a plurality of substrates housed therein, and an upper surface and a lower surface thereof are open. And a plurality of substrate guides, which are integrally formed on the inner wall of the casing, and each of which has a plurality of grooves for holding a substrate, are provided along the outer periphery of the lower surface of the casing, A processing tank comprising: a frame-shaped frame whose bottom is formed into a plane; and an injection pipe integrally provided near the bottom of the housing for injecting a chemical solution and / or pure water into the inside of the housing.