JPH08145300A - Substrate processing device - Google Patents

Abstract

PURPOSE: To accurately confirm abnormality without using a test substrate in a substrate processing device such as a spin coater for applying processing to a semiconductor substrate in a processing room by generating an alarm based on a discrimination result between a stored appropriate flow rate level and a flow rate detected by a flow rate detecting means. CONSTITUTION: In a substrate processing line A provided with a spin coater 1 for applying a coating process and a spin developer for applying a developing process and installed in a dust-proof room, an appropriate flow rate level of processing liquid in a processing liquid feeding pipeline 37 is inputted from an input panel 51 to be stored in a storage device 35. The flow rate of the processing liquid in the processing liquid feeding pipeline 37 is detected by a flow rate sensor 52 to be compared with the appropriate flow rate level stored in the storage device 35 by means of a comparing means 53. Based on the comparing result, when the flow rate of the processing liquid in the feeding pipeline 37 is discriminated from the appropriate value by a discriminating means 54, an alarm unit 55 is operated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention forms a processing chamber in a dustproof chamber controlled to a predetermined cleanliness level, and processes substrates such as semiconductor substrates and glass substrates for liquid crystal display devices in the processing chamber. More specifically, the present invention relates to a substrate processing apparatus such as a spin coater, a developer, or a scrubber.

[0002]

2. Description of the Related Art Generally, in a substrate processing apparatus such as a spin coater, a developer or a scrubber, as shown in FIG. 8, a drain cup 11 is arranged in a dust-proof room (clean room) 1 controlled to a predetermined cleanliness level or lower. The inside of the chamber is used as a processing chamber, and the semiconductor substrate 3 is housed in the processing chamber and held by the rotating device 2. Then, various processing solutions 4 such as a photoresist solution, a developing solution, and ultrapure water are discharged onto the semiconductor substrate 3 in the processing chamber, and the semiconductor substrate 3 is rotated by the rotating device 2
Rotate at to perform various treatments such as coating, development and cleaning. Here, the substrate processing procedure including the substrate rotation speed at the time of discharging the processing liquid, the type of the processing liquid used, the processing liquid discharge time (processing liquid discharge amount), and the like are stored in advance in a predetermined storage device 5. To be done. Then, when the rotation processing of the semiconductor substrate 3 is started, when the substrate processing procedure stored in the storage device 5 is specified, the control drive unit 6 based on the processing condition in the specified substrate processing procedure when discharging the processing liquid.
The control drive of (1) opens and closes the opening / closing valve 8 that opens and closes the processing liquid supply pipe (pipe system) 7, and discharges the processing liquid from the processing liquid discharge nozzle 9 toward the semiconductor substrate 3. In FIG. 8, 10 is a processing liquid supply tank, 11 is a drain cup, and 1
2 is a drain pipe.

By the way, generally, for example, when the operation of the substrate processing apparatus is restarted after the operation is stopped, when the substrate processing is started at the beginning of daily work, or when the substrate processing is started after the substrate processing procedure is changed, It is necessary to confirm whether or not the treatment liquid is properly discharged from the beginning of the substrate treatment (hereinafter, referred to as initial flow rate confirmation). Therefore, conventionally, the test substrate (pilot wafer) is flown to the processing line, the processing liquid is actually discharged onto the test substrate, and the discharge amount of the processing liquid is visually checked by the operator, and then The semiconductor substrate 3 to be processed was processed.

[0004]

However, in the conventional confirmation of the initial flow rate of the discharge amount of the processing liquid, the measurement accuracy of the discharge amount depends only on the skill of the operator, so that an accurate measurement result cannot be obtained. Moreover, since it is necessary for the worker to enter the dustproof chamber 1 and perform the confirmation work, not only does it take a great deal of time to wear dustproof clothing and a dust mask, but the work efficiency is deteriorated, and it is generated from the human body. There is a possibility that the cleanliness level in the dust-proof chamber 1 may be lowered due to the generated dust and the like. Further, since the cost of the substrate material and the processing time are increased by using the test substrate, there has been a demand for a method of checking the initial flow rate without using the test substrate.

In view of the above problems, the present invention can accurately measure the discharge amount of the liquid agent, improve the working efficiency and the cleanliness level of the dustproof chamber, and further confirm the initial flow rate without using the test substrate. It is an object to provide a substrate processing apparatus.

[0006]

According to a first aspect of the present invention, a processing chamber is formed in a dustproof chamber controlled to a predetermined cleanliness level, and a substrate is processed in the processing chamber. A liquid agent discharging means for discharging a liquid agent into the processing chamber, a liquid agent supplying means for supplying the liquid agent to the liquid agent discharging means, and a pipe system connecting the liquid agent discharging means and the liquid agent supplying means, At least input means for inputting an appropriate flow rate level of the liquid agent in the piping system, storage means for storing an appropriate flow rate level input by the input means, and the storage means for storing the appropriate flow rate level in the piping system at a predetermined timing. A flow rate detecting means for detecting the flow rate of the liquid agent, a comparing means for comparing an appropriate flow rate level stored in the storage means with a flow rate detected by the flow rate detecting means, and a predetermined result from the comparison result by the comparing means. A determining means for flow of the liquid within the pipe system determines that not proper if it meets the matter,
An alarm unit is provided for issuing an alarm based on the determination result of the determination unit.

The problem solving means according to claim 2 of the present invention is
The predetermined timing detected by the flow rate detecting means includes at least the rise time of the ejection operation, and the predetermined condition in the determining means is the proper value stored in the storage means in the comparison by the comparing means. It is assumed that a state in which the flow rate level differs from the flow rate detected by the flow rate detecting means continues for a predetermined number of times of detection or for a predetermined time or more.

The problem solving means according to claim 3 of the present invention is
The device further includes a time measuring unit that generates a time measuring signal at a predetermined time interval or a predetermined time, and the predetermined timing detected by the flow rate detecting unit includes at least a reception timing of the time measuring signal from the time measuring unit.

[0009]

In the substrate processing apparatus according to the first aspect of the present invention, the proper flow rate level of the liquid agent is input in advance by the input means and stored in the storage means. Then, at the time of start-up inspection and the like, the liquid agent is discharged by the liquid agent discharging means in the dustproof chamber. At this time, the flow rate detecting means detects the flow rate of the liquid agent, compares the flow rate detected by the comparing means with an appropriate flow rate level, and gives an alarm when the determining means determines that the flow rate of the liquid agent is not proper. A warning is issued by means. Then, the worker can confirm the abnormality while being outside the dustproof chamber and without using the test substrate.

In the substrate processing apparatus according to claim 2 of the present invention,
The alarm operation by the alarm means is executed only when the state in which the proper flow rate level and the actual flow rate are different from each other continues for a predetermined number of times or more. Then, for example, when restarting the operation after the operation of the substrate processing apparatus is stopped for a long time, when starting the daily substrate processing at the start of work, when starting the substrate processing after changing the substrate processing procedure, etc. At the time), it is possible to detect whether or not there is an abnormal state after a predetermined operation rising time has passed, and prevent erroneous recognition as an abnormal state before completion of rising.

In the substrate processing apparatus according to claim 3 of the present invention,
When the operation start time cannot be specified, such as in the case of overnight operation, the timekeeping means generates a timekeeping signal at a predetermined time interval or a predetermined time every day, and the flow rate detecting means periodically receives the timing signal from the timekeeping means. To detect the flow rate.

[0012]

【Example】

{First Embodiment} <Structure> FIG. 1 is an external perspective view showing an outline of a substrate processing apparatus according to a first embodiment of the present invention. In the substrate processing apparatus of this embodiment, the entire mechanical structure shown in FIG. 1 is provided in a dustproof chamber controlled to a predetermined cleanliness level or lower, and the semiconductor substrate 2
1 to a series of treatments (in this embodiment, coating treatment, developing treatment,
Adhesion strengthening treatment, heat treatment, cooling treatment), a spin coater SC that is a substrate processing unit that performs a coating process, and a spin developer SD that is a substrate processing unit that performs a development process are arranged on the front side. A substrate processing row A is formed.

Further, at a position on the rear side facing the substrate processing row A, an adhesion strengthening unit AH which is a substrate processing unit for performing various heat treatments, a hot plate HP and a cooling plate CP are three-dimensionally arranged, A processing area B is formed.

Further, this apparatus is provided with a transfer area C sandwiched between the substrate processing row A and the substrate processing area B and extending along the substrate processing row A. In the transfer area C, the transfer robot 22 is provided. It is movably arranged. The transfer robot 22 includes a moving body 24 having a support member 23 including a pair of arms for supporting the semiconductor substrate 21.
The pair of upper and lower arms forming the support member 23 can be independently moved forward and backward toward the substrate processing row A and the substrate processing area B by an arm driving mechanism (not shown). One arm receives a processed substrate from one of the processing units constituting the substrate processing area B, and the other arm places the substrate transferred from the previous substrate processing unit on the processing unit. Thus, the semiconductor substrate 21 can be replaced.

Although not shown, a three-dimensional drive mechanism is connected to the moving body 24 of the transfer robot 22, and the moving body 2 is controlled by controlling this driving mechanism.
4 is moved to the front of each substrate processing unit to enable delivery of the semiconductor substrate 21. Further, 27 in FIG. 1 is a nozzle mechanism (liquid agent discharging means) having three processing liquid discharging nozzles 39 and discharging the processing liquid to the semiconductor substrate 21. The nozzle mechanism 27 is drive-controlled by a drive device (not shown) so as to be vertically movable and rotatable in the direction of arrow G in FIG.

At one end (left side in the drawing) of the substrate processing row A, the substrate processing area B and the transfer area C, the semiconductor substrate 21 is unloaded from the cassette 25 and the semiconductor substrate 21 is loaded into the cassette 25. An indexer IND that does The transfer robot 26 provided in this indexer IND is provided with the semiconductor substrate 21 from the cassette 25.
Of the semiconductor substrate 21 that has been subjected to a series of processes.
It is designed to be received from and returned to the cassette 25.
Although not shown in FIG. 1, the semiconductor substrate 21 is connected to another substrate processing apparatus at the other end (right side in the drawing) of the substrate processing row A, the substrate processing area B, and the transfer area C. Interface buffer (IF-
B) is provided, and the transfer processing of the semiconductor substrate 21 is performed by the cooperation of the transfer robot and the transfer robot 22 provided in the interface buffer.

FIG. 2 is a schematic diagram showing the semiconductor substrate 21 and the processing liquid supply mechanism 30 in the spin coater SC in the substrate processing array A of this embodiment. In FIG. 2, the electric wiring system is shown by a thin line, and the processing liquid supply pipeline (piping system) 37 is shown by a thick line. The portion below the dashed-dotted line in FIG. 2 is the mechanical structure of the spin coater SC shown in FIG. 1, and is a dust-proof chamber (clean room) 31 controlled to a predetermined cleanliness level or lower.
It is provided inside. On the other hand, the portion above the one-dot chain line in FIG. 2 is the configuration of the control unit of the spin coater SC and is provided outside the dustproof chamber 31. The spin coater SC is provided with a drain cup 41, a processing chamber is formed therein, and a rotating device 3 provided in the drain cup 41.
2 is rotationally driven by a motor (not shown). Then, the semiconductor substrate 21 held by the rotating device 32 in the processing chamber
A predetermined photoresist liquid 34 (hereinafter referred to simply as processing liquid 3
4) is discharged as a liquid agent, and the semiconductor substrate 21 is rotated to perform the coating process. Here, the substrate processing procedure including the substrate rotation speed at the time of discharging the processing liquid, the type of the processing liquid to be used, the processing liquid discharge time (processing liquid discharge amount: an appropriate flow rate level), and the like are specified in advance. It is stored in the storage device 35 (storage means). Then, when starting the rotation processing of the semiconductor substrate 21, the substrate processing procedure stored in the storage device 35 is specified. When discharging the processing liquid,
By the control drive of the control drive unit 36 based on the processing conditions in the specified substrate processing procedure, the opening / closing valve 38 (electromagnetic valve) provided in the processing liquid supply pipeline (piping system) 37 is opened / closed,
The processing liquid ejection nozzle (liquid agent ejection means) 39 is configured to eject the processing liquid toward the semiconductor substrate 21. In addition,
In FIG. 2, 40 is a pressure tank (liquid agent supplying means) having a capacity of 20 to 30 liters for supplying the processing liquid to the processing liquid discharge nozzle 39 through the processing liquid supply pipe 37, 41 is a drain cup, and 42 is a drain. It is a tube. A standby pot 43 containing the same treatment liquid 34 as that supplied from the pressure tank 40 or a predetermined solvent contained therein is provided beside the drain cup 41. The tip of the processing liquid discharge nozzle 39 is swung in the direction of arrow G in FIG. 1 and moved up and down so as to be located between the upper portion of the semiconductor substrate 21 on the rotating device 32 shown by the solid line in FIG. To move. When not in use, the treatment liquid discharge nozzle 39 is placed in the standby pot 43 filled with a predetermined solvent atmosphere, and its tip is prevented from drying. Incidentally, the processing liquid supply line 37
In practice, a filter arranged for the purpose of removing particles, a manifold for adjusting the flow path, and the like are actually provided, but these are omitted in FIG. 2 for convenience.

In the substrate processing apparatus of this embodiment, an input panel (input means) for inputting an appropriate flow rate level of the processing liquid in the processing liquid supply conduit 37 and storing it in the storage device 35. ) 51, a flow rate sensor (flow rate detection means) 52 for detecting the flow rate of the processing liquid in the processing liquid supply pipe 37 at a predetermined timing, an appropriate flow rate level stored in the storage device 35, and The comparison means 53 for comparing the flow rate detected by the flow rate sensor 52, and the flow rate of the treatment liquid in the treatment liquid supply conduit 37 are appropriate when a predetermined condition is satisfied from the comparison result by the comparison means 53. It is provided with a discriminating means 54 for discriminating that it is not, and an alarm device (warning means) 55 for issuing an alarm based on the discrimination result by the discriminating means.

The input panel 51 is provided with a changeover switch for inputting a flow rate level, various data input keys including the flow rate level, etc., and is installed outside the dust-proof chamber 31 to input numerical values at any time by an operator. To freely set an appropriate flow rate level of the processing liquid. The input panel 51
Since the input numerical value from is stored in the storage device 35,
The input value is held until it is input again from the input panel 51.

As the flow rate sensor 52, for example, a float type sensor as shown in FIG. 3 is used. 60A in FIG.
Is a processing liquid inlet, 60B is a processing liquid outlet, 61 is a main body, 62
Is a tapered tube, 63 is a float that is loosely fitted in the tapered tube 62, 64 is a plurality of transmissive photointerrupters for detecting the tip position of the float 63, 65 is a needle for adjusting the flow path diameter, and 66 is The needle 65 is a knob, 67 is a nut, 68 is a case, and 69 is a packing. As shown in FIG. 4, the flow rate sensor 52 utilizes that the position of the tip of the float 63 is determined from the balance between the biasing force of the processing liquid rising from below in the taper tube 62 and the gravity of the float 63. Then, the flow rate of the processing liquid in the processing liquid supply conduit 37 is detected, and the position of the tip of the float 63 is detected by the plurality of transmission type photo interrupters 64. In each of the transmissive photo interrupters 64, one light emitting element 71 such as an LED and one light receiving element 72 such as a photodiode arranged facing the light emitting element 71 are integrated.
Each transmissive photo interrupter 64 is configured as a set.
Sets are arranged at equal intervals in the vertical direction. Since the rising distance from the lowermost position of the tip of the float 63 is linearly proportional to the flow rate in the taper tube 62, the presence or absence of optical coupling between the sets of transmissive photointerrupters 64 arranged at equal intervals is determined. By detecting, the flow rate can be obtained by extremely simple calculation. Then, the light emitting element 71 of the flow rate sensor 52 has the discharge operation start switch 7 when the processing liquid discharge operation of the processing liquid discharge nozzle 39 of the spin coater SC starts.
6A and a fixed time (for example, 3 to
The control drive unit 36 receives a signal from the time measuring means 76B that measures the periodic timing set every 5 seconds, and the drive is controlled via the drive circuit 73 in FIG.

The storage device 35, the control drive unit 36,
The comparison means 53 and the determination means 54 are a CPU,
Microcomputer MC provided with ROM and RAM
Is used and corresponds to each functional block realized by the CPU according to the program stored in the ROM or the RAM. Of these, the comparison means 53 adds a predetermined allowable error range (± σ) determined by experience to the proper flow rate level (FL) stored in the storage device 35, and the following equation (1) is obtained. If the condition is satisfied, the steady signal (Lo
w signal) is output, and when it is not satisfied, an inverted signal (High signal)
h signal) is output. It should be noted that D in the equation (1) is the value of the flow rate detected by the flow rate sensor 52.

FL-σ≤D≤FL + σ (1) The discriminating means 54 counts the number of times the inverted signal is inputted when the inverted signal (High signal) from the comparing means 53 is continuous as shown in FIG. Counter 74, and an alarm device 55 that outputs an alarm signal when the count value of the counter 74 exceeds a predetermined plurality of values (for example, "3").
And a signal output unit 75 for outputting the signal. The counter 74 is configured to reset once a steady signal (Low signal) is input, and hold the count value "0" until an inverted signal (High signal) is input next.

The alarm device 55 is a buzzer for generating a predetermined electric sound when receiving an alarm signal from the discriminating means 54, a red lamp for emitting red light, or the like for notifying an operator of an abnormal state. Equipment is used.

Although only the processing liquid supply conduit 37 corresponding to one processing liquid discharge nozzle 39 is shown in FIG. 2, in practice, the microcomputer MC has three processing liquid discharge nozzles 39. Of the processing liquid supply pipes 37 corresponding to the above, the flow rate sensors 52 associated therewith, and the drive circuit 7
3 and the like are connected in parallel. Further, in addition to the functions shown in FIG. 6, the microcomputer MC has the timing and speed of rotation of the motor that drives the rotating device 32 during coating processing, which processing liquid ejection nozzle 39 to use, and which processing liquid ejection nozzle. It also has a storage device (not shown) that holds various operation data such as swivel and up / down timing for discharging 39, opening / closing valve 38 opening operation timing and opening operation time, and a function of controlling them based on the storage. are doing. Since the adhesion strengthening unit AH, the hot plate HP, and the cooling plate CP each have a general configuration, detailed description thereof will be omitted.

<Operation in General Processing> In general coating and developing processing using a photoresist solution, the substrate processing apparatus having the above-mentioned configuration causes the transfer robot 22 in the transfer area C to transfer the semiconductor substrate 21 to various substrates. Processing unit (spin coater SC, spin developer SD, adhesion strengthening unit A
H, hot plate HP, and cooling plate C
(P, etc.), a series of processing steps are carried out by carrying them in and out of the processing sections while carrying them in a predetermined carrying order. At this time, in the spin coater SC, under the control of the microcomputer MC, the motor that drives the rotating device 32, the swirling and raising / lowering of the processing liquid discharge nozzle 39, and the opening / closing valve 3 are controlled.
The operation of 8 is controlled, and the coating process of the photoresist liquid is performed.

<Operation at Confirming Initial Flow Rate> The spin coater SC when starting the substrate processing apparatus which has been stopped in order to perform the general processing as described above.
The operation and the operation will be described in detail below with reference to the flowchart of FIG. First, the operator uses the input panel 51 to input various operation data in the coating process to be performed into the microcomputer MC (step S1). At this time, various input operation data are stored as operation data in a storage device (not shown), and the opening time (T) of the processing liquid discharge nozzle 39 to be used and the opening / closing valve 38 corresponding thereto is included in the operation data. (Eg 0.5
Second), and the data (F) of the proper flow rate per unit time of the processing liquid that should flow through the processing liquid supply line 37 at that time.
L) is stored in the storage device 35 as data for confirming the initial flow rate (step S2). Then, it is determined whether or not all the data have been input (step S3). This determination is made based on whether or not the discharge operation start switch 76A has been pressed. The operator presses the discharge operation start switch 76A when input of all data is completed.

When the discharge operation start switch 76A is pressed, it is confirmed in the nozzle mechanism 27 that the tip of the processing liquid discharge nozzle 39 is in the standby pot 43 (step S4). At this time, if the processing liquid discharge nozzle 3
If the tip of 9 is not in the standby pot 43, the nozzle mechanism 2
7 is driven to position the tip of the processing liquid discharge nozzle 39 in the standby pot 43.

Then, based on the data for confirming the initial flow rate stored in the storage device 35, the opening / closing valve 38 corresponding to the processing liquid discharge nozzle 39 to be used is opened for the opening operation time (T), and the pressure tank 40 is opened. The processing liquid which is pressurized and sent from is discharged from the processing liquid discharge nozzle 39 (step S5). Then, during this opening operation time (T), the flow rate (D) of the processing liquid is detected by the flow rate sensor 52 arranged in the processing liquid supply conduit 37 (step S).
6). Specifically, during the opening operation time (T), all the light emitting elements 71 in FIG. By confirming the position of the arranged light receiving element, the tip of the float 63 detects the position, and by detecting the fluid pressure in the taper tube 62, the flow rate in the treatment liquid supply conduit 37 is detected.

At this time, the comparison means 53 causes the storage device 35 to operate.
A predetermined permissible error range (± σ) determined by experience is added to the appropriate flow rate level (FL) stored in, and compared with the flow rate (D) of the processing liquid detected by the flow rate sensor 52 ( Step S7). Then, the steady signal (Low signal) is output when the above formula (1) is satisfied, and the inverted signal (High signal) is output when the formula (1) is not satisfied.

When a steady signal (Low signal) is output, that is, the detected flow rate (D) is an appropriate flow rate (FL)
If it has reached, the operation of confirming the initial flow rate is normally completed, and the predetermined operation by the operator is awaited.
Execute the coating process for which the data has been input. On the contrary, when the inverted signal (High signal) is output, the determination unit 5
The counter 74 of No. 4 has an inverted signal (H
The "high signal" is added and counted (step S8). The count value of the counter 74 increases to 1, 2, 3 every time step S8 is executed. As a result of the first discharge, when the inversion signal (High signal) is output, that is, when the detected flow rate (D) has not reached the appropriate flow rate (FL), the count value is 1, When NO is determined in step S9, the re-ejection instruction is awaited (step S1).
0). The instruction for re-ejection is made by sending to the control drive unit 36 a regular timing signal that is output at regular time intervals after the timing means 76B receives a signal for operating the ejection operation start switch 76A. When the regular timing signal is input from the clock means 76B, the process returns to step S5,
Re-ejection and flow rate detection are performed based on the data for confirming the initial flow rate stored in the storage device 35.

If the detected flow rate (D) does not reach the proper flow rate (FL) even though the ejection has been performed three times, the count value becomes 3 as a result of step S8, and YES is obtained in step S9. Is judged. This means that some kind of apparatus abnormality such as a decrease in the pressure applied to the pressurizing tank 40 or a clogging of the processing liquid supply conduit 37 did not reach an appropriate flow rate level even after a certain rise time. Therefore, at this time, the signal output unit 75 outputs an alarm signal. Then, the alarm device 55 generates a predetermined electric sound or red light to notify the operator of the abnormal state (step S11).

As described above, the flow rate sensor 52 is provided in the processing liquid supply pipe 37, an abnormal state is detected by comparing with a preset proper flow rate level, and the operator is notified of the state by the alarm 55. Since it is not necessary to use a test substrate as in the conventional example, the material cost can be reduced accordingly.

Further, since the abnormal state can be recognized even when the worker is outside the dustproof chamber 31, the dustproof chamber 31 can be compared with the conventional example in which the worker visually confirms in the dustproof chamber 31. The cleanliness inside can be maintained at a desired level, and the cleanliness can be easily controlled. Moreover, it is not necessary to wear dustproof clothing and a dust mask, so that work efficiency can be improved. In addition, the measurement accuracy of the discharge amount is
As compared with the conventional example which depends only on skill, accurate measurement results can be obtained in an extremely short time without requiring skill.

Further, the alarm operation of the alarm device 55 is controlled by the appropriate flow rate level and flow rate sensor 52 stored in the storage device 35.
Since it is executed only when the state in which the flow rate detected in step 3 differs from the predetermined number of detections (3 times) continues, for example, when restarting the operation after the operation of the substrate processing apparatus is stopped for a long time. Also, at the start of daily substrate processing at the start of work, at the time of starting substrate processing after changing the substrate processing procedure (that is, at the start of the processing liquid discharge operation), an insufficient flow rate at the first discharge immediately causes an abnormal condition. There is no judgment. Therefore, it is possible to detect whether or not there is an abnormal state after a predetermined operation rise time, and erroneously misrecognize the temporary unstable state of the device that is seen only before the completion of the rise as the abnormal state of the device. Can be prevented.

As a result, it is possible to obtain a device having a short operating time and a high operating rate as a whole.

{Second Embodiment} <Structure> FIG. 6 is a diagram showing a substrate processing apparatus according to a second embodiment of the present invention. Regarding each element in FIG. 6, elements having the same functions as those described in the first embodiment are designated by the same reference numerals. The substrate processing apparatus of the present embodiment is configured to always confirm an abnormality at a certain time of the day because the operation start time of the substrate processing apparatus cannot be specified during continuous overnight operation. That is, as shown in FIG.
The substrate processing apparatus of the present embodiment measures the discharge operation start switch 76A similar to that described in the first embodiment and the time span of a predetermined regular timing as the elements that determine the detection timing of the flow rate sensor 52. Timing means 76
In addition to B, a time measuring means (timer) 76 for generating a time measuring signal at a predetermined time every day, for example, 0 o'clock, 8 o'clock, 16 o'clock
Equipped with C. That is, in the present embodiment, the initial flow rate confirmation operation of discharging the processing liquid and confirming the flow rate not only at the time of the rising of the processing liquid discharge operation of the substrate processing apparatus but also at the reception timing of the timing signal from the timing means 76C. Is configured to The other structure is similar to that of the first embodiment shown in FIGS. 1 to 4, and the description thereof is omitted.

<Operation> The operation of the substrate processing apparatus having the above configuration at the above-mentioned predetermined time will be described with reference to FIG. Note that, here, the description will be made assuming that the data of the proper flow rate level is previously stored in the storage device 35.
First, when the spin coater SC is also performing a normal coating process operation while the substrate processing apparatus is performing a normal operation,
When the predetermined time has come (step S12), the clock means 7
6C emits a timing signal. In addition, when the operator wants to arbitrarily check the flow rate when the operation is interrupted, the operator presses the discharge operation start switch 76A,
A flow rate confirmation instruction is given (step S13). Step S
If either of S12 and S13 is YES, the operation of discharging the processing liquid from the processing liquid discharge nozzle 39 and confirming the flow rate thereof is performed as in step S6 and the subsequent steps. Step S
Since the operation after 6 is the same as that of the above-described embodiment, the same reference numerals are given to the corresponding steps and the description thereof will be omitted.

As described above, according to this embodiment, the clock means 7
6C emits a clock signal at predetermined time intervals (every 8 hours),
It is possible to check the flow rate of the processing liquid at a predetermined time every day at a predetermined time interval, and it is possible to automatically check the flow rate in consideration of factory operation time, etc., while maintaining the reliability of the device. Driving automation can be promoted further. In addition,
The time measuring means 76C is not limited to one that emits a signal at the same time every day, but one that simply emits a signal at predetermined time intervals,
It may be one that emits a signal at a different time every day according to a predetermined program. Other effects are similar to those of the first embodiment.

{Modifications} (1) In each of the above embodiments, an example in which the present invention is applied to a spin coater as a substrate processing apparatus is shown. However, in addition to this, a spin developer, a spin scrubber or an HM.
Any material, such as DS, may be applied as long as the semiconductor substrate 21 is subjected to desired processing in a dust-proof chamber controlled to a predetermined cleanliness level or lower. The treatment liquid (pure water or the like) when applied to the spin scrubber is usually supplied from the original tank (pressurization tank 40) in the factory line.

(2) In each of the above embodiments, the semiconductor substrate 21
Although only the treatment liquid for performing the treatment is explained as an example of the liquid agent, in addition to this, for example, in a spin coater equipped with a device for discharging a solvent to the drain cup to wash the drain cup. For example, the present invention can be applied to confirm the initial flow rate by treating such a solvent as a liquid agent, that is, the present invention can be applied as long as the liquid agent is discharged into the processing chamber. Further, in the above embodiment,
Although a standby pot filled with a predetermined solvent atmosphere is provided to make the treatment liquid discharge nozzle stand by when not in use to prevent the tip of the nozzle from drying, such a structure is not always necessary. Further, in the above-described embodiment, the processing liquid is discharged in the standby pot for checking the initial flow rate, but the discharging is not limited to the standby pot and may be performed in the drain cup, for example.

(3) In the first embodiment, the flow sensor 5
2, a float type optical sensor for optically detecting the position of the float is used as shown in FIG. 3, but a float type magnetic sensor for detecting the position of the float by a magnetic force method may be used. An ultrasonic flow sensor utilizing the Doppler effect, or a Karman vortex flow sensor that detects the frequency of a partially generated vortex may be used. Further, the flow rate sensor 52 may be one that detects the flow rate by detecting the transition of the amount of the processing liquid (waste liquid) in the drain cup 41.

(4) In the above-described embodiment, the predetermined condition of the discriminating means is different from the proper flow rate level stored in the storing means and the flow rate detected by the flow rate detecting means in the comparison by the comparing means. Although the state is supposed to continue for a predetermined number of times or more, the state in which the proper flow rate level stored in the storage means and the flow rate detected by the flow rate detecting means are different may continue for a predetermined time or more. Needless to say, in this case, the same effect as that of the above embodiment can be obtained.

(5) In each of the above embodiments, FIGS.
As described above, the flow rate sensor 52 is disposed between the pressurizing tank 40 and the opening / closing valve 38, but the flow rate sensor 52 may be disposed between the opening / closing valve 38 and the processing liquid discharge nozzle 39.

[0044]

According to the first aspect of the present invention, the liquid agent discharging means, the liquid agent supplying means for supplying the liquid agent to the liquid agent discharging means,
A piping system connecting them, an input means for inputting an appropriate flow rate level of the liquid agent, a storage means for storing an appropriate flow rate level, a flow rate detecting means for detecting the flow rate of the liquid agent, a detected flow rate and an appropriate flow rate. Since a comparison means for comparing the level, a determination means for determining that the flow rate of the liquid agent is not appropriate based on the comparison result, and an alarm means for issuing an alarm based on the determination result by the determination means are provided in advance. An abnormal state can be detected by comparing the proper flow rate level set by the input means with the actual flow rate, and the operator can be notified of such a state by the alarm means. Therefore, it is possible to detect an abnormal state extremely easily without using a test substrate as in the conventional example while freely setting an appropriate flow rate level. Therefore, the material cost can be reduced by the amount that the test substrate can be omitted as compared with the conventional example. Further, since the worker can recognize the abnormal state even outside the dustproof room, the cleanliness in the dustproof room can be set to a desired level as compared with the conventional example in which the worker visually confirms in the dustproof room. It can be held and cleanliness can be easily controlled. Moreover, it is not necessary to wear dustproof clothing and a dust mask, so that work efficiency can be improved. further,
Compared with the conventional example in which the measurement accuracy of the discharge amount depends only on the skill of the operator, there is an effect that an accurate measurement result can be obtained in an extremely short time without requiring skill, and the down time of the device A device that is short and has a high operating rate can be obtained.

According to the second aspect of the present invention, the alarm operation by the alarm means is executed only when the state in which the proper flow rate level and the actual flow rate are different from each other continues for a predetermined number of times or more. Therefore, for example, when restarting the operation after stopping the operation of the substrate processing apparatus for a long time, when starting the daily substrate processing at the beginning of the work, when starting the substrate processing after changing the substrate processing procedure, etc. At the time of rising), it is possible to detect whether or not an abnormal state has occurred after a predetermined operation rising time has elapsed, and it is possible to prevent erroneously erroneously recognizing an abnormal state before the completion of rising.

According to the third aspect of the present invention, it is provided with a time measuring means for generating a time measuring signal at a predetermined time interval or a predetermined time, and the flow rate is detected at the reception timing of the time measuring signal from the time measuring means. Therefore, when it is not possible to specify the start time of the operation, such as when operating overnight, it is possible to detect an abnormal condition periodically at a predetermined time interval or at a predetermined time, and to confirm an abnormality according to the working hours of the factory. effective.

[Brief description of drawings]

FIG. 1 is a perspective view showing an outline of a substrate processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a conceptual diagram showing a semiconductor substrate and a processing liquid supply mechanism in the substrate processing apparatus of the first embodiment of the present invention.

FIG. 3 is a sectional view showing a flow rate detecting means of the substrate processing apparatus according to the first embodiment of the present invention.

FIG. 4 is a diagram showing a flow rate detecting operation of a flow rate detecting means of the substrate processing apparatus according to the first embodiment of the present invention.

FIG. 5 is a flowchart showing an operation of the substrate processing apparatus according to the first embodiment of the present invention.

FIG. 6 is a conceptual diagram showing a semiconductor substrate and a processing liquid supply mechanism in a substrate processing apparatus according to a second embodiment of the present invention.

FIG. 7 is a flowchart showing an operation of the substrate processing apparatus according to the second embodiment of the present invention.

FIG. 8 is a conceptual diagram showing a semiconductor substrate and a processing liquid supply mechanism in a conventional substrate processing apparatus.

[Explanation of symbols]

 21 Semiconductor Substrate 27 Nozzle Mechanism 30 Processing Liquid Supply Mechanism 31 Dustproof Chamber 32 Rotating Equipment 34 Processing Liquid 35 Storage Device 36 Control Driving Section 37 Processing Liquid Supply Pipeline 38 Open / Close Valve 39 Processing Liquid Discharge Nozzle 40 Pressurizing Tank 41 Drain Cup 51 Input panel 52 Flow rate sensor 53 Comparing means 54 Discriminating means 55 Alarm device 61 Main body 62 Tapered tube 63 Float 64 Transmission type photo interrupter 65 Needle 71 Light emitting element 72 Light receiving element 73 Drive circuit 74 Counter 75 Signal output section 76A Discharge operation start switch 76B Timekeeping Means 76C Timing Means A Substrate Processing Sequence AH Adhesion Strengthening Unit B Substrate Processing Area SC Spin Coater SD Spin Developer

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display location H01L 21/027 21/304 341 S

Claims (3)

[Claims] 1. A liquid agent ejecting means for forming a processing chamber in a dust-proof chamber controlled to a predetermined cleanliness level and performing a process on a substrate in the processing chamber, wherein the liquid agent is ejected into the processing chamber. And a liquid supply means for supplying the liquid to the liquid discharge means, a pipe system connecting the liquid discharge means and the liquid supply means, and at least inputting an appropriate flow rate level of the liquid in the pipe system. Input means, storage means for storing an appropriate flow rate level input by the input means, flow rate detection means for detecting a flow rate of the liquid agent in the pipe system at a predetermined timing, and storage means for storing the flow rate. Comparing means for comparing the appropriate flow rate level with the flow rate detected by the flow rate detecting means, and the flow rate of the liquid agent in the piping system when a predetermined condition is satisfied from the comparison result by the comparing means. A substrate processing apparatus comprising: a determining means for determining that not proper, and a warning means for issuing an alarm based on the result of the discrimination at the discrimination means. 2. The predetermined timing to be detected by the flow rate detecting means includes at least the rising time of the ejection operation, and the predetermined condition in the determining means is the storage means in the comparison in the comparing means. 2. The substrate processing apparatus according to claim 1, wherein a state in which the appropriate flow rate level stored in the flow rate and the flow rate detected by the flow rate detecting means are different is continued for a predetermined number of times of detection or for a predetermined time or more. 3. A time measuring means for generating a time measuring signal at a predetermined time interval or a predetermined time is further provided, and the predetermined timing detected by the flow rate detecting means is at least a reception timing of the time measuring signal from the time measuring means. The substrate processing apparatus according to claim 1, further comprising: