CN100363796C - Equipment with crystal seat assembly - Google Patents
Equipment with crystal seat assembly Download PDFInfo
- Publication number
- CN100363796C CN100363796C CNB031005241A CN03100524A CN100363796C CN 100363796 C CN100363796 C CN 100363796C CN B031005241 A CNB031005241 A CN B031005241A CN 03100524 A CN03100524 A CN 03100524A CN 100363796 C CN100363796 C CN 100363796C
- Authority
- CN
- China
- Prior art keywords
- support member
- pedestal
- rotating shaft
- room
- liquid crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Abstract
The present invention relates to an equipment with crystal seat assembly, which comprises a chamber; first and second susceptor shafts which pass through a bottom surface of a chamber; a plate type lid susceptor is installed to connect one ends of the first and second susceptor shafts; first and second supporter shafts pass through the bottom surface of the chamber and surround the first and second susceptor shafts separately; plate type first and second supporter plates are combined with one ends of the first and second supporter shafts.
Description
Technical field
The present invention relates to a kind of manufacturing equipment of semiconductor device, relate in particular to the base assembly of the manufacturing equipment of liquid crystal indicator.
Background technology
Recently, light and handy and plane low power consuming shows that (FPD) device has become the emphasis of following information age development.In various FPD devices because the characteristics such as high resolving power, colour display functions and high image quality of LCD device, by high level of development and be widely used in mobile computer and desktop PC (PC) in.
Generally speaking, the LCD device comprises upper substrate and infrabasal plate, and upper and lower substrate then has liquid crystal molecule toward each other and therebetween.The inside surface of each substrate all has electrode.When applying voltages to each electrode, promptly produce electric field, with the driving liquid crystal molecule, and according to penetrating the light transmittance of liquid crystal molecule and demonstrating image.
In order to make the LCD device, carry out follow-up deposition and the film on the substrate is carried out patterned process, and these manufacture processes are all carried out in containing the equipment of room.
Fig. 1 is the transverse section sketch map of the room in the manufacturing equipment of LCD device of correlation technique.As shown in Figure 1, room 20 is airtight reaction chamber, and wherein, the substrate 1 of deposit film on the internal-response zone by the chemical reaction that gas material took place that injects is maybe with the film of deposition patterning in addition.Room 20 comprises the inlet 22 and the outlet 24 of controlling the processing pressure in the room 20 by the residual gas material of discharging inside that are connected to the outside and make the gas material of substrate in order to supply.In addition, room 20 is provided with the pedestal 30 in order to bearing substrate 1.Generally speaking, pedestal 30 has is enough to heat the well heater of the substrate 1 that is carried (not shown).
By pedestal 30 bearing substrates 1, and with room 20 airtight in addition after, the well heater in the pedestal 30 is heated substrates 1 immediately.Simultaneously, the internal pressure of room 20 is maintained below the predetermined value, and pass through inlet 22 and the injecting gas material, substrate 1 is handled by chemical reaction by exporting 24.
The injector 26 of end that is arranged in the inlet 22 of room 20 is disseminated to whole room 20 with the gas material that injects, and so that the chemical reaction of the gas material that injects carry out smoothly.
Fig. 2 is the three-dimensional exploded view of the pedestal in the manufacturing equipment of LCD device of correlation technique of Fig. 1.As shown in Figure 2, pedestal comprises all by the upside that graphite constituted attached lid pedestal 30a and downside pedestal rotating shaft 30b.In a horizontal manner tabular and its upper surface attached lid pedestal 30a in order to bearing substrate 1 is configured in the room 20, and attached lid pedestal 30a combines with the bottom surface of the room 20 that penetrates Fig. 1 and the top of pedestal rotating shaft 30b in a tubular form.
In addition, have stupalith or aluminium oxide (Al
2O
3) the support member flat part 42 that is constituted and the base support of support member rotating shaft 44 40 drive pedestals 30 and it is moved up and down.Because pedestal rotating shaft 30b penetrates support member flat part 42, so back side of the attached lid pedestal 30a of flat support member flat part 42 contacts, support member rotating shaft 44 then penetrates the bottom surface of room 20, pedestal rotating shaft 30b can be contained in wherein and combine with the back side of support member flat part 42.
Especially, the flexible capsule 50 of Fig. 1 is positioned at the lower rear of room 20 and around around the support member rotating shaft 44, preventing that introduced contaminants from entering in the room 20 via the bottom surface of room 20 in the conversion process of support member rotating shaft 44.The area of support member flat part 42 equals the area of attached lid pedestal 30a in fact, and the centre junction at support member rotating shaft 44 and the back side of support member flat part 42 lumps together, so can keep pedestal 30 and the flatness of the substrate 1 that carried.
Recently, in order to increase output, so the substrate of LCD device is bigger and heavier.For example, usable floor area greater than 1 * 1m
2Substrate.And attached lid pedestal 30a and support member flat part 42 will become bigger because of large substrate.Yet this will produce following problem.
When becoming big in order to the attached lid pedestal 30a that supports large substrate with support member flat part 42, attached lid pedestal 30a and support member flat part 42 certainly will become weight.For example, the general assembly (TW) of base assembly can reach 0.1 ton.Yet when the environment of hundreds of degree high temperature was handled, these base assemblies very big and weight were incited somebody to action very easily temperature distortion and then are broken.
In addition, though that the support member flat part 42 of low thermal coefficient of expansion zone beyond it is bonded to the zone of support member rotating shaft 44 still can be kept is smooth, attached lid pedestal 30a is with distortion protruding upward significantly.Therefore, substrate will be out of shape thereupon, and the distortion of attached lid pedestal 30a will worsen because of moving up and down more of base assembly.
Summary of the invention
In order to solve the above-mentioned shortcoming of correlation technique, the object of the present invention is to provide a kind of equipment that comprises base assembly, and this base assembly supports substrate reliably in high-temperature process.
Other purpose of the present invention and advantage by subsequently detailed description and the claim of enclosing when can be clearer.
In order to reach above-mentioned advantage of the present invention and purpose, shown in following examples, provide a kind of manufacturing equipment of liquid crystal indicator, comprise: room; First and second pedestal rotating shaft runs through the bottom surface of room; Attached lid pedestal is connected to the end of first and second pedestal rotating shaft; First and second support member rotating shaft, be looped around respectively first and second pedestal rotating shaft around, and run through the bottom surface of room; And first and second support member flat part, be first and second support member rotating shaft end separately.
In another example, a kind of base assembly of manufacturing equipment of liquid crystal indicator then is provided, comprise: first and second pedestal rotating shaft, run through the bottom surface of the room of manufacturing equipment; Attached lid pedestal is connected to the end of first and second pedestal rotating shaft; First and second support member rotating shaft, be looped around respectively first and second pedestal rotating shaft around, and run through the bottom surface of room; And first and second support member flat part, be first and second support member rotating shaft end separately.
Description of drawings
Fig. 1 is the transverse section sketch map of the room in the manufacturing equipment of LCD device of correlation technique.
Fig. 2 is the three-dimensional exploded view of the pedestal in the manufacturing equipment of LCD device of correlation technique of Fig. 1.
Fig. 3 is the transverse section sketch map of the room in the manufacturing equipment of LCD device of one embodiment of the present of invention.
Fig. 4 is the three-dimensional exploded view of the pedestal in the manufacturing equipment of LCD device of one embodiment of the present of invention.
Symbol description among the figure
1 substrate
120,20 rooms
122,22 inlets
124,24 outlets
126,26 injectors
130,30 pedestals
The attached lid pedestal of 130a, 30a
130b, 130c, the rotating shaft of 30b pedestal
132 grooves
140a, 140b, 40 base support
142a, 142b, 42 support member flat parts
144a, 144b, 44 support member rotating shafts
150a, 150b, 50 flexible capsules
The K distance
Embodiment
Following conjunction with figs. describes embodiments of the invention in detail.
Fig. 3 is the transverse section sketch map of room of manufacturing equipment of the LCD device of one embodiment of the present of invention, and Fig. 4 is the three-dimensional exploded view of pedestal of manufacturing equipment of the LCD device of one embodiment of the present of invention.As shown in Figures 3 and 4, room 120 is airtight reaction chamber, and wherein, the substrate 1 of deposit film on the internal-response zone by the chemical reaction that gas material took place that injects is maybe with the film of deposition patterning in addition.Room 120 comprises that one is connected to the outside and makes the inlet 122 of the gas material of substrate in order to supply, and one is controlled the outlet 124 of the processing pressure among the room 120 by discharging inner residual gas material.In addition, room 120 is provided with the pedestal 130 in order to bearing substrate 1.Generally speaking, pedestal 130 has is enough to heat the well heater of the substrate 1 that is carried (not shown).
By pedestal 130 bearing substrates 1, and with room 120 airtight in addition after, the well heater in the pedestal 130 is heated substrates 1 immediately.Simultaneously, the internal pressure of room 120 is maintained below the predetermined value, and pass through inlet 122 and the injecting gas material, substrate 1 is handled by chemical reaction by exporting 124.
The injector 126 of end that is arranged in the inlet 122 of room 120 is disseminated to the gas material that injects among the whole room 120, and so that the chemical reaction of the gas material that injects carry out smoothly.
The base assembly of the substrate 1 in support and the heating room 120 is made of with first and second base support 140a and the 140b that support pedestal 130 pedestal 130.130 of the pedestals that graphite constituted comprise attached lid pedestal 130a and first and second pedestal rotating shaft 130b and 130c.In a horizontal manner flat attached lid pedestal 130a is configured among the room 120, can pass through attached lid pedestal 130a bearing substrate 1.First and second pedestal rotating shaft 130b of tubulose and 130c protrude in outside the back side of attached lid pedestal 130a and run through the bottom surface of room 120.Pedestal 130 has an attached lid pedestal 130a who flatly is configured in the room 120, and has the bottom surface that penetrates room 120 and first and second pedestal rotating shaft 130b and 130c of combining with the back side of attached lid pedestal 130a.First and second base support 140a that pedestal 130 combines via the back side with pedestal 130a and the drive of 140b and move up and down.
The first base support 140a is made of the first support member rotating shaft 144a and the first support member flat part 142a, and the second base support 140b then is made of the second support member rotating shaft 144b and the second support member flat part 142b.First and second support member rotating shaft 144a of tubulose and 144b be looped around respectively first and second pedestal rotating shaft 130b and 130c around, and first and second support member rotating shaft 144a and 144b run through the bottom surface of room 120.First and second support member flat part 142a and 142b then combine with first and second support member rotating shaft 144a and 144b respectively, and first and second support member flat part 142a and 142b are together with first and second pedestal rotating shaft 130b and the 130c back side that touches attached lid pedestal 130a that penetrate respectively wherein.
First and second base support 140a and 140b comprise each other first and second support member flat part 142a and 142b that separate at the back side that makes attached lid pedestal 130a side by side, and comprise the bottom surface of running through room 120 and first and second support member rotating shaft 144a and the 144b that supports first and second support member flat part 142a and 142b respectively.First and second support member rotating shaft 144a and both inside of 144b have first and second pedestal rotating shaft 130b and the 130c that drive unit drove by motor " M " respectively.
Therefore, first and second support member flat part 142a and 142b will be driven and be moved up and down by first and second support member rotating shaft 144a and 144b, and attached lid pedestal 130a and also moving up and down with its first and second pedestal rotating shaft 130b and 130c that combines.
Base assembly comprises and penetrates room 120 and in a tubular form first and second pedestal rotating shaft 130b and 130c, and comprise with room 120 among first and second pedestal rotating shaft 130b and 130c combine and be flat attached lid pedestal 130a, base assembly 130a, 130b and 130c then constitute pedestal 130.Make the end of each first and second pedestal rotating shaft 130b and 130c be arranged in room 120, attached lid pedestal 130a is bearing substrate 1 then.In addition, base assembly also comprises and penetrates room 120 and in a tubular form first and second support member rotating shaft 144a and 144b, and comprise and combine with first and second support member rotating shaft 144a and 144b respectively and be flat first and second support member flat part 142a and 142b that base assembly 142a and 144a and 142b and 144b then constitute first and second base support 140a and 140b respectively.An end position that makes each first and second support member rotating shaft 144a and 144b is in room 120, and the inside of first and second support member rotating shaft 144a and 144b then has first and second pedestal rotating shaft 130b and 130c respectively.First and second pedestal rotating shaft 130b and 130c penetrate first and second support member flat part 142a and 142b respectively, and first and second support member flat part 142a and 142b then support the back side of attached lid pedestal 130a.
First and second support member flat part 142a and 142b and first and second support member rotating shaft 144a and 144b are by low heat conductivity and have the aluminium oxide (Al of low thermal coefficient of expansion
2O
3) and stupalith one of them constitute.Because first and second support member flat part 142a and 142b are supported by first and second support member rotating shaft 144a and 144b respectively, so when the size of substrate and weight increase, the problem of temperature distortion can't take place substrate.Therefore, the manufacturing of film will be finished reliably.
When the heater heats among the attached lid pedestal 130a reached high temperature, first and second support member flat part 142a and 142b incited somebody to action thereby expanded by heating.Yet, because first and second support member flat part 142a and 142b separate each other and reach several mm distance K, so even first and second support member flat part 142a and 142b expanded by heating, but still can touch attached lid pedestal 130a and supported.The back side of attached lid pedestal 130a has the groove 132 corresponding to distance K, can prevent the heat conduction from well heater.
In addition, columned first and second flexible capsule 150a and 150b are positioned at the lower rear of room 120 and respectively around around first and second support member rotating shaft 144a and the 144b, with can be, prevent that introduced contaminants from entering in the room 120 via the bottom surface of room 120 and first and second support member rotating shaft 144a and the formed gap of 144b the moving up and down in the process of first and second base support 140a and 140b.First and second flexible capsule 150a and 150b have crease and possess retractility.
In the present invention, first and second pedestal rotating shaft that the weight fraction that base assembly comprises is enough to the attached lid pedestal that will be carried is isolated, and comprise first and second support member rotating shaft that the weight fraction that is enough to first and second support member flat part that will be carried is isolated.Therefore, will handle film reliably.Especially, all can avoid producing distortion because support each pedestal rotating shaft and each support member rotating shaft of very big and heavy substrate, so base assembly can be used to support very big and heavy substrate effectively.In addition, owing to being slit between first and second support member flat part and first and second support member flat part, the support member plate part has several mm distance, even so in the process of pyroprocessing, will avoid taking place the problem of temperature distortion, and then keep the flatness of substrate.And, because the back side of attached lid pedestal has the groove corresponding to distance between first and second support member flat part, conduct, and then prevent the distortion that produces because of heat conduction so can reduce from the direct heat of well heater.
The above only is preferred embodiment of the present invention, and is any according to the change that the present invention did, and only otherwise break away from spirit of the present invention, all is considered as being included in the claim scope of the present invention.
Claims (14)
1. the substrate processing apparatus of a liquid crystal indicator is characterized in that, it comprises:
A room;
First and second pedestal rotating shaft runs through the bottom surface of this room;
An attached lid pedestal is arranged in this room, and the end that is connected to this first and second pedestal rotating shaft is to support this substrate;
First and second support member rotating shaft, be looped around respectively this first and second pedestal rotating shaft around, and run through the bottom surface of this room; And
First and second support member flat part is arranged in this room, also supports this attached lid pedestal in this first and second support member rotating shaft end separately.
2. the manufacturing equipment of liquid crystal indicator as claimed in claim 1 is characterized in that, this attached lid pedestal and this first and second support member flat part is configured in the inside of this room.
3. the manufacturing equipment of liquid crystal indicator as claimed in claim 2 is characterized in that, this attached lid pedestal is tabular.
4. the manufacturing equipment of liquid crystal indicator as claimed in claim 3 is characterized in that, in a horizontal manner this attached lid pedestal of configuration and this first and second support member flat part.
5. the manufacturing equipment of liquid crystal indicator as claimed in claim 1 is characterized in that, this first and second pedestal rotating shaft in a tubular form.
6. the manufacturing equipment of liquid crystal indicator as claimed in claim 5 is characterized in that, this first and second support member rotating shaft in a tubular form.
7. the manufacturing equipment of liquid crystal indicator as claimed in claim 1 is characterized in that, this first and second pedestal rotating shaft runs through this first and second support member flat part respectively.
8. the manufacturing equipment of liquid crystal indicator as claimed in claim 1 is characterized in that, this first and second support member flat part contains one of them of aluminium oxide and stupalith.
9. the manufacturing equipment of liquid crystal indicator as claimed in claim 1 is characterized in that, this attached lid pedestal contains a well heater.
10. the manufacturing equipment of liquid crystal indicator as claimed in claim 1 is characterized in that, the about 1mm to 9mm in the interval of this first and second support member flat part.
11. the manufacturing equipment of liquid crystal indicator as claimed in claim 10 is characterized in that, this attached lid pedestal has a groove between first and second support member flat part.
12. the manufacturing equipment of liquid crystal indicator as claimed in claim 11 is characterized in that, this groove is formed on the back side of this attached lid pedestal.
13. the manufacturing equipment of liquid crystal indicator as claimed in claim 1 is characterized in that, also comprises first and second the flexible capsule on every side that is looped around first and second support member rotating shaft respectively.
14. the base assembly of the substrate processing apparatus of a liquid crystal indicator is characterized in that, it comprises:
First and second pedestal rotating shaft runs through the bottom surface of a room of this manufacturing equipment;
An attached lid pedestal is arranged in this room, is connected to the end of this first and second pedestal rotating shaft, to support this substrate;
First and second support member rotating shaft, be looped around respectively this first and second pedestal rotating shaft around, and run through the bottom surface of this room; And
First and second support member flat part is arranged in this room, in this first and second support member rotating shaft end separately, and supports this attached lid pedestal.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20022092 | 2002-01-14 | ||
| KR10-2002-0002092A KR100489189B1 (en) | 2002-01-14 | 2002-01-14 | susceptor assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1432848A CN1432848A (en) | 2003-07-30 |
| CN100363796C true CN100363796C (en) | 2008-01-23 |
Family
ID=27656308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031005241A Expired - Fee Related CN100363796C (en) | 2002-01-14 | 2003-01-14 | Equipment with crystal seat assembly |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR100489189B1 (en) |
| CN (1) | CN100363796C (en) |
| TW (1) | TWI286811B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1296878C (en) * | 2003-11-04 | 2007-01-24 | 爱德牌工程有限公司 | Flat panel display manufacturing apparatus |
| KR101311855B1 (en) * | 2006-12-08 | 2013-09-27 | 엘아이지에이디피 주식회사 | Apparatus and Method for joining of substrate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08145300A (en) * | 1994-11-17 | 1996-06-07 | Dainippon Screen Mfg Co Ltd | Substrate processing device |
| JPH0933873A (en) * | 1995-07-25 | 1997-02-07 | Hitachi Kasei Techno Plant Kk | Heat treatment device for glass substrate for liquid crystal |
| JPH1154470A (en) * | 1997-07-31 | 1999-02-26 | Shibaura Eng Works Co Ltd | Spin processing device |
| JP2000097564A (en) * | 1998-09-21 | 2000-04-04 | Hitachi Ltd | Substrate dryer and substrate dryer/cleaner |
| JP2000208458A (en) * | 1999-01-13 | 2000-07-28 | Ultra Clean Technology Kaihatsu Kenkyusho:Kk | Substrate cleaning unit |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63137427A (en) * | 1986-11-29 | 1988-06-09 | Nec Corp | Semiconductor manufacture apparatus |
| JP3070158B2 (en) * | 1991-07-04 | 2000-07-24 | 日新電機株式会社 | Susceptor rotation support structure for thin film vapor phase growth equipment |
| JPH10237653A (en) * | 1997-02-26 | 1998-09-08 | Ulvac Japan Ltd | Vacuum treating device |
| US6190113B1 (en) * | 1997-04-30 | 2001-02-20 | Applied Materials, Inc. | Quartz pin lift for single wafer chemical vapor deposition/etch process chamber |
| JP3076791B2 (en) * | 1998-10-19 | 2000-08-14 | アプライド マテリアルズ インコーポレイテッド | Semiconductor manufacturing equipment |
-
2002
- 2002-01-14 KR KR10-2002-0002092A patent/KR100489189B1/en active IP Right Grant
-
2003
- 2003-01-13 TW TW092100658A patent/TWI286811B/en not_active IP Right Cessation
- 2003-01-14 CN CNB031005241A patent/CN100363796C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08145300A (en) * | 1994-11-17 | 1996-06-07 | Dainippon Screen Mfg Co Ltd | Substrate processing device |
| JPH0933873A (en) * | 1995-07-25 | 1997-02-07 | Hitachi Kasei Techno Plant Kk | Heat treatment device for glass substrate for liquid crystal |
| JPH1154470A (en) * | 1997-07-31 | 1999-02-26 | Shibaura Eng Works Co Ltd | Spin processing device |
| JP2000097564A (en) * | 1998-09-21 | 2000-04-04 | Hitachi Ltd | Substrate dryer and substrate dryer/cleaner |
| JP2000208458A (en) * | 1999-01-13 | 2000-07-28 | Ultra Clean Technology Kaihatsu Kenkyusho:Kk | Substrate cleaning unit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1432848A (en) | 2003-07-30 |
| TW200301950A (en) | 2003-07-16 |
| KR20030061555A (en) | 2003-07-22 |
| TWI286811B (en) | 2007-09-11 |
| KR100489189B1 (en) | 2005-05-11 |
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Owner name: JIANGSU ZONGYI PHOTOVOLTAIC-PV CO., LTD. Free format text: FORMER OWNER: ZHOUXING ENGINEERING CO., LTD. Effective date: 20100617 |
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Free format text: CORRECT: ADDRESS; FROM: GYEONGGI-DO, SOUTH KOREA TO: 226376 ZONGYI DIGITAL-CENTER, XINGDONG TOWN, TONGZHOU DISTRICT, NANTONG CITY, JIANGSU PROVINCE |
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| TR01 | Transfer of patent right |
Effective date of registration: 20100617 Address after: 226376, Nantong, Jiangsu Province, Tongzhou District City, East Town, variety Digital City Patentee after: Jiangsu Zongyi Photovoltaic Co., Ltd. Address before: Gyeonggi Do, South Korea Patentee before: Chusung Engineering Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080123 Termination date: 20170114 |
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| CF01 | Termination of patent right due to non-payment of annual fee |