JP3294023B2 - Substrate processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention forms a processing chamber in a dust-proof room controlled to a predetermined cleanliness level, and performs processing on substrates such as semiconductor substrates and glass substrates for liquid crystal display devices in the processing chamber. More particularly, the present invention relates to a substrate processing apparatus such as a spin coater, a developer, and a scrubber.

[0002]

2. Description of the Related Art Generally, in a substrate processing apparatus such as a spin coater, a developer, or a scrubber, a drain cup 11 is disposed in a dustproof room (clean room) 1 controlled to a predetermined cleanliness level or lower as shown in FIG. A semiconductor substrate 3 is accommodated in the processing chamber and held by the rotating device 2. Then, various processing liquids 4 such as a photoresist solution, a developing solution, and ultrapure water are discharged onto the semiconductor substrate 3 in the processing chamber, and the semiconductor substrate 3 is rotated by the rotating device 2.
To perform various processes such as coating, developing, and washing. Here, the substrate processing procedure including processing conditions such as the number of rotations of the substrate at the time of discharging the processing liquid, the type of the processing liquid to be used, and the discharge time of the processing liquid (the processing liquid discharge amount) is stored in a predetermined storage device 5 in advance. Is done. Then, when the substrate processing procedure stored in the storage device 5 is specified when starting the rotation processing of the semiconductor substrate 3, the control driving unit 6 based on the processing conditions in the specified substrate processing procedure when discharging the processing liquid.
The opening and closing valve 8 that opens and closes the processing liquid supply pipe (piping system) 7 is opened and closed by the control drive of the processing liquid discharge nozzle 9 to discharge the processing liquid toward the semiconductor substrate 3. In FIG. 8, reference numeral 10 denotes a processing liquid supply tank, 11 denotes a drain cup,
2 is a drain pipe.

In general, for example, when the operation of a substrate processing apparatus is restarted after being stopped for a long time, at the start of daily substrate processing at the start of operation, or at the start of substrate processing after a change in the substrate processing procedure, etc. It is necessary to confirm whether or not the processing liquid is properly discharged from the beginning of the substrate processing (hereinafter, referred to as initial flow rate confirmation). For this reason, conventionally, a test substrate (pilot wafer) is flowed into a processing line, a processing liquid is actually discharged onto the test substrate, and the discharge amount of the processing liquid is visually checked by an operator. The processing of the semiconductor substrate 3 to be processed has been performed.

[0004]

In the conventional method for confirming the initial flow rate of the processing liquid discharge amount, an accurate measurement result could not be obtained because the measurement accuracy of the discharge amount depended only on the skill of the operator. In addition, since the worker had to enter the dust-proof room 1 to perform the checking work, it took a lot of trouble to wear the dust-proof clothing and the dust-proof mask, etc., which not only deteriorated the work efficiency but also caused the human body. There is a possibility that the cleanliness level in the dustproof chamber 1 may be reduced due to dust and the like. Further, since the cost of the substrate material and the processing time are increased by the use of the test substrate, a method for confirming the initial flow rate without using the test substrate has been desired.

SUMMARY OF THE INVENTION In view of the above problems, the present invention can accurately measure a liquid material discharge amount, improve work efficiency and the cleanliness level of a dust-proof room, and can confirm an initial flow rate without using a test substrate. It is an object to provide a substrate processing apparatus.

[0006]

Means for Solving the Problems According to a first aspect of the present invention, a processing chamber is formed in a dust-proof room controlled to a predetermined cleanliness level, and processing is performed on a substrate in the processing chamber. A liquid material discharging means for discharging a liquid material into the processing chamber, a liquid material supplying means for supplying the liquid material to the liquid material discharging means, a piping system connecting the liquid material discharging means and the liquid material supplying means, Input means for inputting an appropriate flow level of the liquid agent at least in the piping system, storage means for storing an appropriate flow level input by the input means, and a predetermined timing in the piping system. A flow rate detecting means for detecting a flow rate of the liquid medicine; a comparing means for comparing an appropriate flow rate level stored in the storage means with the flow rate detected by the flow rate detecting means; and a predetermined value based on a comparison result by the comparing means. A determining means for flow of the liquid within the pipe system determines that not proper if it meets the matter,
Warning means for issuing a warning based on a result of the determination by the determination means.

[0007] The means for solving the problem according to claim 2 of the present invention is:
The predetermined timing detected by the flow rate detecting means includes at least a rising time of a discharge operation, and the predetermined condition by the determining means is a proper condition stored in the storage means in the comparison by the comparing means. The state in which the proper flow rate level differs from the flow rate detected by the flow rate detecting means continues for a predetermined number of times or more or for a predetermined time or more.

[0008] The problem solving means according to claim 3 of the present invention is:
The information processing apparatus further includes timing means for generating a timing signal at a predetermined time interval or a predetermined time, and the predetermined timing detected by the flow rate detecting means includes at least a timing of receiving a timing signal from the timing means.

[0009]

In the substrate processing apparatus according to the first aspect of the present invention, an appropriate flow rate level of the liquid material is previously input by the input means, and this is stored in the storage means. Then, at the time of starting inspection and the like, the liquid material is discharged by the liquid material discharging means in the dustproof room. At this time, the flow rate of the liquid material is detected by the flow rate detecting means, the flow rate detected by the comparing means is compared with an appropriate flow rate level, and an alarm is issued when the determining means determines that the flow rate of the liquid material is not proper. An alarm is issued by means. Then, the operator can check the abnormality while being outside the dustproof room and without using the test substrate.

In the substrate processing apparatus according to claim 2 of the present invention,
The alarm operation by the alarm means is executed only when the state in which the appropriate flow rate level differs from the actual flow rate continues for a predetermined number of times or more. Then, for example, when the operation is restarted after the operation of the substrate processing apparatus has been stopped for a long time, at the start of daily substrate processing at the start of operation, at the start of substrate processing after changing the substrate processing procedure, and the like (that is, when the liquid material discharge operation starts up). 2), it is possible to detect whether or not an abnormal state has occurred after a predetermined operation start-up time has passed, and it is possible to prevent erroneous recognition of an abnormal state before the start-up is completed.

In the substrate processing apparatus according to claim 3 of the present invention,
In the case where the operation start time cannot be specified, such as in the case of overnight operation, at a predetermined time interval or at a predetermined time every day, the clock means generates a clock signal, and the flow rate detection means periodically determines the timing of receiving the clock signal from the clock means. To detect the flow rate.

[0012]

【Example】

<< First Embodiment >><Structure> FIG. 1 is an external perspective view showing an outline of a substrate processing apparatus according to a first embodiment of the present invention. In the substrate processing apparatus of the present embodiment, the entire mechanical configuration shown in FIG. 1 is provided in a dustproof room controlled to a predetermined cleanliness level or less, and the semiconductor substrate 2
1 shows a series of processes (in this embodiment, a coating process, a developing process,
A spin coater SC, which is a substrate processing unit for performing a coating process, and a spin developer SD, which is a substrate processing unit for performing a development process, are arranged on the front side. A substrate processing row A is formed.

At a position on the rear side facing the substrate processing row A, an adhesion strengthening unit AH, a hot plate HP, and a cooling plate CP, which are substrate processing units for performing various heat treatments, are three-dimensionally arranged. The processing area B is formed.

Further, the apparatus is provided with a transfer area C sandwiched between the substrate processing row A and the substrate processing area B and extending along the substrate processing row A. In this transfer area C, a transfer robot 22 is provided. It is arranged movably. The transfer robot 22 includes a moving body 24 having a support member 23 including a pair of arms for supporting the semiconductor substrate 21.
The pair of upper and lower arms constituting the support member 23 can be independently advanced and retracted toward the substrate processing row A and the substrate processing area B by an arm driving mechanism (not shown). One of the arms receives the processed substrate with one of the processing units constituting the substrate processing area B, and the other arm loads the substrate transported from the previous substrate processing unit or the like on the processing unit. Thus, the semiconductor substrate 21 can be replaced.

Although not shown, a three-dimensional drive mechanism is connected to the moving body 24 of the transfer robot 22. By controlling the driving mechanism, the moving body 2 is moved.
The semiconductor substrate 21 can be transferred by moving the semiconductor substrate 4 before each substrate processing unit. In addition, reference numeral 27 in FIG. 1 denotes a nozzle mechanism (a liquid material discharging unit) having three processing liquid discharge nozzles 39 and discharging the processing liquid to the semiconductor substrate 21. The nozzle mechanism 27 is driven and controlled by a driving device (not shown) so as to be able to move up and down and turn in the direction of arrow G in FIG.

At one end (left side in the drawing) of the substrate processing row A, the substrate processing area B and the transfer area C, the semiconductor substrate 21 is unloaded from the cassette 25 and loaded into the cassette 25. Is provided. The transfer robot 26 provided in the indexer IND transfers the semiconductor substrate 21 from the cassette 25.
And transfer the semiconductor substrate 21 subjected to a series of processes to the transfer robot 22.
And returns to the cassette 25.
Although not shown in FIG. 1, the semiconductor substrate 21 is connected to another substrate processing apparatus at the other end (right side in the drawing) of the substrate processing row A, the substrate processing area B, and the transfer area C. Interface buffer (IF-
B) is provided, and the transfer processing of the semiconductor substrate 21 is performed in cooperation with the transfer robot and the transfer robot 22 provided in the interface buffer.

FIG. 2 is a schematic diagram showing the semiconductor substrate 21 and the processing liquid supply mechanism 30 in the spin coater SC in the substrate processing row A of the present embodiment. In FIG. 2, the electric wiring system is shown by a thin line, and the processing liquid supply pipe (pipe system) 37 is shown by a thick line. The portion below the one-dot chain line in FIG. 2 is the mechanical configuration of the spin coater SC shown in FIG. 1, and is a dustproof room (clean room) 31 controlled to a predetermined cleanliness level or less.
Provided within. On the other hand, the portion above the dashed line in FIG. 2 is the configuration of the control unit of the spin coater SC, and is provided outside the dustproof room 31. In the spin coater SC, a drain cup 41 is disposed, a processing chamber is formed therein, and a rotating device 3 provided in the drain cup 41 is provided.
2 is rotationally driven by a motor (not shown). Then, the semiconductor substrate 21 held by the rotating device 32 in the processing chamber
A predetermined photoresist liquid 34 (hereinafter simply referred to as a processing liquid 3)
4) is discharged as a liquid agent, and the coating process is performed by rotating the semiconductor substrate 21. Here, a substrate processing procedure including processing conditions such as the number of rotations of the substrate at the time of discharging the processing liquid, the type of the processing liquid to be used, and the discharge time of the processing liquid (the processing liquid discharge amount: an appropriate flow rate level) is determined in advance by a predetermined It is stored in the storage device 35 (storage means). Then, when starting the rotation processing of the semiconductor substrate 21, the substrate processing procedure stored in the storage device 35 is specified. When discharging the processing liquid,
The control drive of the control drive unit 36 based on the processing conditions in the specified substrate processing procedure opens and closes an opening / closing valve 38 (electromagnetic valve) provided in a processing liquid supply pipe (pipe system) 37,
The processing liquid is discharged from the processing liquid discharge nozzle (liquid material discharge means) 39 toward the semiconductor substrate 21. In addition,
2 is a pressurized tank (liquid supply means) having a capacity of 20 to 30 liters for supplying a processing liquid to the processing liquid discharge nozzle 39 through the processing liquid supply pipe 37, a drain cup 41, and a drain 42. Tube. On the side of the drain cup 41, a standby pot 43 containing the same processing liquid 34 supplied from the pressurized tank 40 or a predetermined solvent contained therein is provided. The tip of the processing liquid discharge nozzle 39 is swung up and down in the direction of arrow G in FIG. 1 to move between the upper part of the semiconductor substrate 21 on the rotating device 32 indicated by the solid line in FIG. To move. When not in use, the processing liquid discharge nozzle 39 is placed in a standby pot 43 filled with a predetermined solvent atmosphere, and the tip of the processing liquid discharge nozzle 39 is prevented from drying. The processing liquid supply pipe 37
Actually has a filter arranged for the purpose of removing particles, a manifold for adjusting the flow path, and the like, but these are omitted in FIG. 2 for convenience.

The substrate processing apparatus according to the present embodiment has an input panel (input means) for inputting an appropriate flow level of the processing liquid in the processing liquid supply pipe 37 and storing it in the storage device 35. ) 51, a flow rate sensor (flow rate detecting means) 52 for detecting a flow rate of the processing liquid in the processing liquid supply pipe 37 at a predetermined timing, and an appropriate flow rate level stored in the storage device 35. Comparing means 53 for comparing the flow rate detected by the flow rate sensor 52 with the flow rate of the processing liquid in the processing liquid supply pipe 37 when a predetermined condition is satisfied based on the result of comparison by the comparing means 53; And a warning device (warning device) 55 for issuing a warning based on the result of the determination by the determining device.

The input panel 51 is provided with a changeover switch for inputting a flow rate level, various data input keys including the flow rate level, and the like. The input panel 51 is installed outside the dustproof room 31 and allows a worker to input a numerical value at any time. , An appropriate flow rate level of the processing liquid is freely set. The input panel 51
Is stored in the storage device 35,
Next, the input value is held until input is performed again from the input panel 51.

As the flow sensor 52, for example, a float type sensor as shown in FIG. 3 is used. 60A in FIG.
Is a processing liquid inlet, 60B is a processing liquid outlet, 61 is a main body, 62
Is a taper tube, 63 is a float loosely fitted in the taper tube 62 so as to be able to move up and down, 64 is a plurality of transmission type photo interrupters for detecting the tip position of the float 63, 65 is a needle for adjusting the diameter of the flow path, and 66 is a needle. The knob of the needle 65, 67 is a nut, 68 is a case, and 69 is packing. The flow sensor 52 utilizes the fact that the position of the tip of the float 63 is determined from the balance between the urging force of the processing liquid rising from below in the tapered tube 62 and the gravity of the float 63 as shown in FIG. Then, the flow rate of the processing liquid in the processing liquid supply pipe 37 is detected, and the position of the tip of the float 63 is detected by the plurality of transmission type photo interrupters 64. Each of the transmissive photo-interrupters 64 includes one light-emitting element 71 such as an LED and one light-receiving element 72 such as a photodiode disposed opposite to the light-emitting element 71.
Each transmission type photo interrupter 64 is configured as a set.
Are arranged at equal intervals in the vertical direction. Since the rising distance of the tip of the float 63 from the lowermost position is linearly proportional to the flow rate in the tapered tube 62, the presence or absence of optical coupling of the set of transmission photointerrupters 64 arranged at equal intervals is determined. By detecting, the flow rate can be obtained by a very simple calculation. The light emitting element 71 of the flow sensor 52 is provided with a discharge operation start switch 7 for starting the processing liquid discharge operation of the processing liquid discharge nozzle 39 of the spin coater SC.
6A and a certain time after the start of the ejection operation (for example, 3 to
The control drive unit 36 receives a signal from the timekeeping unit 76B that measures the regular timing set every five seconds), and is driven and controlled via the drive circuit 73 in FIG.

The storage device 35, the control drive unit 36,
The comparing means 53 and the determining means 54 are a CPU,
Microcomputer MC with ROM and RAM
Is used, and corresponds to each functional block realized by the CPU according to the program stored in the ROM or the RAM. The comparing means 53 adds a predetermined allowable error range (± σ) determined by experience to the appropriate flow rate level (FL) stored in the storage device 35, and calculates the following equation (1). When the condition is satisfied, the stationary signal (Lo
w signal), and if not satisfied, an inverted signal (Hig)
h signal). Note that D in the expression (1) is the value of the flow rate detected by the flow rate sensor 52.

FL-σ ≦ D ≦ FL + σ (1) As shown in FIG. 2, when the inversion signal (High signal) from the comparison means 53 is continuous as shown in FIG. And an alarm device 55 that outputs an alarm signal when the count value of the counter 74 becomes equal to or more than a predetermined plurality of values (for example, “3”).
And a signal output unit 75 for outputting the result. The counter 74 is configured to reset once a steady signal (Low signal) is input, and to hold the count value “0” until the next inversion signal (High signal) is input.

The alarm 55 includes various types of alarms such as a buzzer for generating a predetermined electric sound when receiving an alarm signal from the determination means 54 and a red lamp for generating red light. Equipment is used.

Although FIG. 2 shows only the processing liquid supply line 37 corresponding to one processing liquid discharge nozzle 39, the microcomputer MC actually has three processing liquid discharge nozzles 39. And the flow rate sensor 52 and the driving circuit 7 associated therewith.
3 are connected in parallel. Further, in addition to the functions shown in FIG. 6, the microcomputer MC also provides the timing and the number of rotations of the motor for driving the rotating device 32 during the coating process, which processing liquid discharge nozzle 39 to use, and the processing liquid discharge nozzle 39 There is also a storage device (not shown) for storing various operation data such as the timing of turning and ascending and descending for discharge of 39, the opening operation timing and opening operation time of the opening / closing valve 38, and a function of controlling them based on the storage. are doing. Note that each of the adhesion strengthening unit AH, the hot plate HP, and the cooling plate CP has a general configuration, and a detailed description thereof will be omitted.

<Operation in General Processing> In general coating and developing processing using a photoresist solution, the substrate processing apparatus having the above-described configuration uses the transfer robot 22 in the transfer area C to transfer the semiconductor substrate 21 to various substrates. Processing unit (spin coater SC, spin developer SD, adhesion strengthening unit A
H, hot plate HP, and cooling plate C
P, etc.), a series of processing steps are carried out by taking in and out of these processing sections while carrying in a predetermined carrying order. At this time, in the spin coater SC, under the control of the microcomputer MC, the motor for driving the rotary device 32, the swiveling and lifting of the processing liquid discharge nozzle 39, and the opening / closing valve 3
The operation of 8 is controlled, and a coating process of a photoresist liquid is performed.

<Operation at Confirmation of Initial Flow Rate> In order to perform the above-described general processing, the spin coater SC used to start the stopped substrate processing apparatus.
The operation and operation will be described in detail below with reference to the flowchart of FIG. First, the operator uses the input panel 51 to input various operation data in the coating process to be performed to the microcomputer MC (step S1). At this time, the input various operation data is stored as operation data in a storage device (not shown), and among the operation data, the processing liquid discharge nozzle 39 to be used and the opening operation time (T) of the opening / closing valve 38 corresponding thereto are used. (For example, 0.5
Second), and data (F of an appropriate flow rate per unit time of the processing liquid to flow through the processing liquid supply pipe 37 at that time).
L) is stored in the storage device 35 as data for initial flow rate confirmation (step S2). Then, it is determined whether or not the input of all data has been completed (step S3). This determination is made based on whether or not the ejection operation start switch 76A has been pressed. When the input of all data is completed, the operator presses the discharge operation start switch 76A.

When the discharge operation start switch 76A is pressed, it is confirmed in the nozzle mechanism 27 that the tip of the processing liquid discharge nozzle 39 is placed in the standby pot 43 (step S4). At this time, if the processing liquid discharge nozzle 3
9 is not in the standby pot 43, the nozzle mechanism 2
7 is driven to position the tip of the processing liquid discharge nozzle 39 in the standby pot 43.

Then, based on the data for confirming the initial flow rate stored in the storage device 35, the opening / closing valve 38 corresponding to the processing liquid discharge nozzle 39 to be used is opened for the opening operation time (T), and the pressurized tank 40 is opened. Is discharged from the processing liquid discharge nozzle 39 (step S5). During the opening operation time (T), the flow rate (D) of the processing liquid is detected by the flow rate sensor 52 disposed in the processing liquid supply pipe 37 (step S).
6). More specifically, during this opening operation time (T), all the light emitting elements 71 in FIG. By confirming the position of the disposed light receiving element, the tip of the float 63 detects the position, and by detecting the fluid pressure in the tapered tube 62, the flow rate in the processing liquid supply pipe 37 is detected.

At this time, the comparing means 53 stores in the storage device 35
A predetermined permissible error range (± σ) determined by experience is added to the appropriate flow rate level (FL) stored in the memory and compared with the flow rate (D) of the processing liquid detected by the flow rate sensor 52 ( Step S7). Then, when the above-described equation (1) is satisfied, a stationary signal (Low signal) is output, and when it is not satisfied, an inverted signal (High signal) is output.

When a steady signal (Low signal) is output, that is, when the detected flow rate (D) is an appropriate flow rate (FL)
If it has reached, the operation of checking the initial flow rate is completed normally, and a predetermined operation by the operator is waited.
Executes the coating process data input in. Conversely, when the inverted signal (High signal) is output, the determination unit 5
4 counter 74 outputs the inverted signal (H
) is counted (step S8). The count value of the counter 74 increases to 1, 2, and 3 each time step S8 is executed. If the inverted signal (High signal) is output as a result of the first ejection, that is, if the detected flow rate (D) has not reached the appropriate flow rate (FL), the count value is 1, It is determined NO in step S9, and an instruction for re-discharge is waited (step S1).
0). This re-discharge instruction is made by sending a periodic timing signal, which is output at regular intervals after the timer 76B receives a signal for operating the discharge operation start switch 76A, to the control drive unit 36. When the periodic timing signal is input from the timer 76B, the process returns to step S5,
The ejection is performed again based on the data for confirming the initial flow rate stored in the storage device 35, and the flow rate is detected.

If the detected flow rate (D) does not reach the appropriate flow rate (FL) even though the discharge has been performed three times, the count value becomes 3 as a result of step S8, and YES in step S9. Is determined. This means that some device abnormality such as a decrease in the pressure of the pressurized tank 40 or clogging of the processing liquid supply line 37 did not reach an appropriate flow level even after a certain rise time. At this point, the signal output unit 75 outputs an alarm signal. Then, the alarm 55 emits a predetermined electric sound or red light to notify the worker of the abnormal state (step S11).

As described above, the flow rate sensor 52 is provided in the processing liquid supply pipe 37, and an abnormal state is detected by comparing the flow rate level with a preset appropriate flow rate level. Since there is no need to use a test substrate as in the conventional example, material costs can be reduced accordingly.

Further, since the above abnormal state can be recognized even if the worker is outside the dustproof room 31, the dustproof room 31 is compared with the conventional example in which the worker visually confirms the inside of the dustproof room 31. Inside can be maintained at a desired level, and cleanliness management can be easily performed. In addition, since there is no need to wear a dust-proof garment, a dust-proof mask, and the like, work efficiency can be improved. Furthermore, the measurement accuracy of the discharge amount is visually checked by the operator,
Compared with the conventional example that relies only on skill, accurate measurement results can be obtained in a very short time without skill.

Further, the alarm operation of the alarm 55 is performed in accordance with the appropriate flow level stored in the storage device 35 and the flow sensor 52.
Is executed only when the state in which the flow rate is different from the flow rate detected in the above is continued for a predetermined number of times (three times), for example, when the operation is restarted after the operation of the substrate processing apparatus is stopped for a long time. In addition, at the start of daily substrate processing at the start of business, at the start of substrate processing after changing the substrate processing procedure, etc. (ie, at the start of the processing liquid discharge operation), an abnormal state immediately occurs due to insufficient flow rate at the first discharge. There is no judgment. Therefore, it is possible to detect whether or not an abnormal state has occurred after a predetermined operation rise time, and to erroneously recognize a temporary unstable state of the apparatus only before the start-up is completed as an abnormal state of the apparatus. Can be prevented.

As a result, it is possible to obtain an apparatus having a short operation time and a high operation rate as a whole.

Second Embodiment <Structure> FIG. 6 is a view showing a substrate processing apparatus according to a second embodiment of the present invention. In FIG. 6, the components having the same functions as those described in the first embodiment are denoted by the same reference numerals. The substrate processing apparatus of the present embodiment is configured to always check for an abnormality at a certain time of the day because the operation start time of the substrate processing apparatus cannot be specified during continuous overnight operation. That is, as shown in FIG.
The substrate processing apparatus of the present embodiment measures the discharge operation start switch 76A similar to that described in the first embodiment and the time span of the predetermined regular timing as the elements for determining the detection timing of the flow sensor 52. Timekeeping means 76
In addition to B, a timer means (timer) 76 for generating a clock signal at a predetermined time every day, for example, at 0:00, 8:00 and 16:00.
C is provided. That is, in this embodiment, the initial flow rate checking operation is performed in which the processing liquid is discharged and the flow rate is checked also at the timing of receiving the timing signal from the timing means 76C, in addition to the start of the processing liquid discharging operation of the substrate processing apparatus. It is configured to do. The other configuration is the same as that of the first embodiment shown in FIGS.

<Operation> The operation of the above-structured substrate processing apparatus at the above-described predetermined time will be described with reference to FIG. Here, the description will be made on the assumption that the data of the appropriate flow rate level is stored in the storage device 35 in advance.
First, while the substrate processing apparatus performs a normal operation, the spin coater SC is also performing a normal coating processing operation.
When a predetermined time has come (step S12), the time counting means 7
6C emits a timing signal. If the operator wants to check the flow rate arbitrarily, for example, when the operator interrupts the operation, the operator presses the discharge operation start switch 76A,
An instruction to confirm the flow rate is issued (step S13). Step S
If any of steps S12 and S13 is YES, the operation of discharging the processing liquid from the processing liquid discharge nozzle 39 and checking the flow rate is performed as in step S6 and subsequent steps. Step S
The operations after 6 are the same as those in the above-described embodiment, and the corresponding steps are denoted by the same reference numerals and description thereof will be omitted.

As described above, according to the present embodiment, the clocking means 7
6C emits a timing signal at predetermined time intervals (every 8 hours),
At a predetermined time interval, the flow rate of the processing solution can be checked at a predetermined time every day, and the flow rate can be automatically checked in consideration of the operation time of the factory, etc., while maintaining the reliability of the apparatus. Driving automation can be further promoted. In addition,
The timer means 76C is not limited to one that emits a signal at the same time every day, but simply emits a signal at predetermined time intervals.
It may be one that emits a signal at a different time every day according to a predetermined program. Other effects are similar to those of the first embodiment.

[Modifications] (1) In each of the above embodiments, an example in which the present invention is applied to a spin coater as a substrate processing apparatus has been described. However, other than this, a spin developer, a spin scrubber, or an HM may be used.
The present invention may be applied to any apparatus such as DS, which performs a desired process on the semiconductor substrate 21 in a dustproof room controlled to a predetermined cleanliness level or less. In addition, the processing liquid (pure water etc.) when applied to the spin scrubber is usually supplied from the original tank (pressurized tank 40) of the factory line.

(2) In each of the above embodiments, the semiconductor substrate 21
In the above description, only the processing liquid for performing the treatment is used as an example of the liquid agent. However, for example, a spin coater provided with a device for discharging a solvent to the drain cup in order to wash the drain cup may be used. In other words, the present invention can be applied to confirming the initial flow rate by treating such a solvent as a liquid material. In short, the present invention can be applied to a device that discharges a liquid material into a processing chamber. In the above embodiment,
Although a standby pot filled with a predetermined solvent atmosphere is provided to keep the processing liquid discharge nozzle on standby when not in use to prevent drying of its tip, such a structure is not always necessary. Further, in the above embodiment, the processing liquid is discharged in the standby pot for checking the initial flow rate. However, the discharge may be performed not only in the standby pot but also in a drain cup, for example.

(3) In the first embodiment, the flow rate sensor 5
2, a float-type optical sensor that optically detects the position of the float as shown in FIG. 3 was used, but a float-type magnetic sensor that detects the position of the float by a magnetic force method may be used. An ultrasonic flow sensor utilizing the Doppler effect or a Karman vortex flow sensor which detects the frequency of a partially generated vortex may be used. Further, the flow rate sensor 52 may be a sensor that detects a flow rate by detecting a change in the amount of the processing liquid (waste liquid) in the drain cup 41.

(4) In the above embodiment, when the predetermined condition in the discriminating means is compared with the comparing means, the proper flow rate level stored in the storage means differs from the flow rate detected by the flow detecting means. Although the state is assumed to continue for a predetermined number of times or more, the state in which the appropriate flow level stored in the storage means differs from the flow rate detected by the flow detecting means may be continued for a predetermined time or more. In this case, it is needless to say that the same effect as in the above embodiment can be obtained.

(5) In each of the above embodiments, FIGS.
As described above, the flow sensor 52 is disposed between the pressurized tank 40 and the opening / closing valve 38, but the flow sensor 52 may be disposed between the opening / closing valve 38 and the processing liquid discharge nozzle 39.

[0044]

According to the first aspect of the present invention, a liquid material discharging means, a liquid material supplying means for supplying a liquid material to the liquid material discharging means,
A piping system connecting them, an input means for inputting an appropriate flow rate level of the liquid material, a storage means for storing an appropriate flow rate level, a flow rate detecting means for detecting a flow rate of the liquid material, a detected flow rate and an appropriate flow rate A comparison means for comparing the level with the determination means, a determination means for determining that the flow rate of the liquid agent is not appropriate based on the comparison result, and an alarm means for issuing an alarm based on the determination result by the determination means. An abnormal state is detected by comparing the appropriate flow rate level set by the input means with the actual flow rate, and the operator can be notified of such an abnormal state by the alarm means. Therefore, an abnormal state can be detected extremely easily without using a test substrate as in the conventional example, while freely setting an appropriate flow rate level. Thus, the material cost can be reduced as much as the test substrate can be omitted as compared with the conventional example. In addition, since the abnormal state can be recognized even when the worker is outside the dustproof room, the cleanliness in the dustproof room is set to a desired level as compared with the conventional example in which the worker visually checks in the dustproof room. Can be maintained and cleanliness management can be easily performed. In addition, since there is no need to wear a dust-proof garment, a dust-proof mask, and the like, work efficiency can be improved. further,
Compared with the conventional example in which the measurement accuracy of the discharge amount depends only on the skill of the operator, there is an effect that an accurate measurement result can be obtained in a very short time without skill, and the stop time of the apparatus is reduced. A device that is short and has high availability is obtained.

According to the second aspect of the present invention, the alarm operation by the alarm means is executed only when the state in which the appropriate flow rate level differs from the actual flow rate continues for a predetermined number of times or more. For example, when the operation of the substrate processing apparatus is restarted after being stopped for a long time, at the start of daily substrate processing at the start of business, at the start of substrate processing after changing the substrate processing procedure, etc. At the time of start-up), it is possible to detect whether or not an abnormal state has occurred after a predetermined operation start-up time has passed, and it is possible to prevent an erroneous recognition of an abnormal state before completion of start-up.

According to a third aspect of the present invention, there is provided a timing means for generating a timing signal at a predetermined time interval or at a predetermined time, and the flow rate is detected at the timing of receiving the timing signal from the timing means. Therefore, when the operation start time cannot be specified, such as in the case of overnight operation, an abnormal state can be periodically detected at a predetermined time interval or a predetermined time, and an abnormality can be confirmed according to the working hours of a factory or the like. effective.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an outline of a substrate processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a conceptual diagram illustrating a semiconductor substrate and a processing liquid supply mechanism in the substrate processing apparatus according to the first embodiment of the present invention.

FIG. 3 is a sectional view showing a flow rate detecting means of the substrate processing apparatus according to the first embodiment of the present invention.

FIG. 4 is a view showing a flow rate detecting operation of a flow rate detecting means of the substrate processing apparatus according to the first embodiment of the present invention.

FIG. 5 is a flowchart showing an operation of the substrate processing apparatus according to the first embodiment of the present invention.

FIG. 6 is a conceptual diagram showing a semiconductor substrate and a processing liquid supply mechanism in a substrate processing apparatus according to a second embodiment of the present invention.

FIG. 7 is a flowchart illustrating an operation of the substrate processing apparatus according to the second embodiment of the present invention.

FIG. 8 is a conceptual diagram showing a semiconductor substrate and a processing liquid supply mechanism in a conventional substrate processing apparatus.

[Explanation of symbols]

 Reference Signs List 21 semiconductor substrate 27 nozzle mechanism 30 processing liquid supply mechanism 31 dustproof chamber 32 rotating device 34 processing liquid 35 storage device 36 control drive unit 37 processing liquid supply pipeline 38 open / close valve 39 processing liquid discharge nozzle 40 pressurized tank 41 drain cup 51 Input panel 52 Flow rate sensor 53 Comparison means 54 Determination means 55 Alarm 61 Main body 62 Tapered tube 63 Float 64 Transmission type photo interrupter 65 Needle 71 Light emitting element 72 Light receiving element 73 Drive circuit 74 Counter 75 Signal output section 76A Discharge operation start switch 76B Means 76C Timing means A Substrate processing line AH Adhesion strengthening unit B Substrate processing area SC Spin coater SD Spin developer

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-58-26131 (JP, A) JP-A-3-233797 (JP, A) JP-A-52-33118 (JP, A) JP-A-1- 283500 (JP, A) JP-A-58-221414 (JP, A) JP-A-54-67875 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) F17D 3/01 B05C 11 / 08 G02F 1/13 G02F 1/1333 H01L 21/027

Claims (3)

(57) [Claims] 1. A liquid material discharging means for forming a processing chamber in a dustproof chamber controlled to a predetermined cleanliness level and performing processing on a substrate in the processing chamber, wherein a liquid material is discharged into the processing chamber. Liquid material supply means for supplying the liquid material to the liquid material discharge means; a piping system connecting the liquid material discharge means and the liquid material supply means; and inputting an appropriate flow rate level of the liquid material in at least the piping system. Input means, storage means for storing an appropriate flow level input by the input means, flow rate detection means for detecting the flow rate of the liquid agent in the piping system at a predetermined timing, and stored in the storage means Comparing means for comparing the appropriate flow rate level with the flow rate detected by the flow rate detecting means, and a flow rate of the liquid agent in the piping system when a predetermined condition is satisfied from a result of the comparison by the comparing means. A substrate processing apparatus comprising: a determining means for determining that not proper, and a warning means for issuing an alarm based on the result of the discrimination at the discrimination means. 2. The method according to claim 1, wherein the predetermined timing detected by the flow rate detection means includes at least a rising time of a discharge operation, and the predetermined condition in the determination means is determined by the comparison means in the comparison means. 2. The substrate processing apparatus according to claim 1, wherein the state in which the appropriate flow rate level stored in the flow rate is different from the flow rate detected by the flow rate detection means is continued for a predetermined number of times or more for a predetermined time or more. 3. The apparatus according to claim 1, further comprising: a timer for generating a clock signal at a predetermined time interval or a predetermined time, wherein the predetermined timing detected by the flow rate detecting means is at least a timing of receiving the clock signal from the clock means. The substrate processing apparatus according to claim 1, comprising: