JPH08138914A - High voltage variable resistor - Google Patents

Abstract

PURPOSE: To provide a highly reliable high voltage variable resistor, having less deterioration in characteristics, at low cost by a method wherein the stress applied to an insulated substrate, with which a high voltage fixed resistor is constituted, is alleviated and the heat shock resisting property is improved. CONSTITUTION: A film resistor 12 is formed on one main surface of an insulated substrate 11 which constitutes a high voltage fixed resistor 10, lead terminals 14 and 14 are soldered to the terminal electrodes 13 and 13 formed on both ends of the film resistor 12, and resin films 15a and 15b are formed by printing on both main surfaces of the insulated substrate 11. The high voltage fixed resistor, on which resin films 15a and 15b are formed, is housed in and fixed to a resistor housing part of the case of the high voltage variable resistor.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high voltage variable resistor used in a TV receiver, a CRT display, etc., and more particularly to a high voltage fixed resistor housed in a case of the high voltage variable resistor.

[0002]

2. Description of the Related Art Conventionally, a high voltage variable resistor of this type is constructed as shown in FIGS. 4 and 5, for example. FIG.
Is a rear view of the high-voltage variable resistor, and FIG.
It is a principal part sectional view of an X-ray.

As shown in FIGS. 4 and 5, this high-voltage variable resistor is provided in a case 1 made of synthetic resin having an opening on one side.
Variable resistor component housing 2 and high voltage fixed resistor housing 3
Is provided, and a partition wall 4 is provided between these storage units 2 and 3.
Are formed. A substrate 5 on which a coated resistor including an arcuate variable resistance portion is formed on a surface facing the bottom surface of the case 1 is adhesively fixed to a support step portion formed on an inner wall surface of the variable resistor component storage portion 2. A resin 6 (not shown in FIG. 4) is filled in the opening surface side of the variable resistor component storage portion 2. A required number of lead terminals 7, 7, 7, 7 are attached to the substrate 5 so as to project from the resin 6. A high voltage fixed resistor 10 is housed in the high voltage fixed resistor housing portion 3 via a synthetic resin holder 8 attached to the partition wall 4.

As shown in FIGS. 6A and 6B, the high voltage fixed resistor 10 has a corrugated film resistor 12 formed on one main surface of an insulating substrate 11 made of alumina or the like, and the film resistor 12 is formed. The terminal electrodes 13 and 13 are formed on both ends of the lead electrode 14, and the lead terminals 14 and 14 are soldered and attached to the terminal electrodes 13 and 13. The surface of the insulating substrate 11 on which the film resistor 12 is formed is printed. Resin coating such as epoxy resin 1
5 is formed.

Prior to this conventional high-voltage variable resistor, a so-called dip type, in which the entire surface of the high-voltage fixed resistor was coated with resin by dipping, was used, but in this conventional high-voltage variable resistor, ,
In order to reduce the cost, a resin coated by printing is used.

One of the lead terminals 14 is connected to one lead terminal 7 of the substrate 5 and is connected in series with a film resistor formed on the substrate 5, and a flyback transformer (hereinafter
A high voltage output from a high voltage generator such as FBT) is input to the other lead terminal 14.

Although not shown, a rotary shaft equipped with a slider is attached to the bottom of the variable resistor component housing 2, and the slider is mounted on the variable resistor of the film resistor of the substrate 5. Is designed to slide. Further, a lead wire for grounding or output is connected to the other lead terminals 7, 7, 7 of the substrate 5.

The high-voltage variable resistor thus constructed is incorporated in the FBT, and the hard resin filled in the FBT is filled in the entire opening side of the case 1 including the high-voltage fixed resistor housing 3. It will be.

[0009]

However, the high-voltage fixed resistor 10 used in the above-mentioned conventional high-voltage variable resistor is used.
In, the insulating substrate 1 that constitutes the high-voltage fixed resistor 10
Since the resin coating film 15 is formed only on one side surface of No. 1, that is, the surface on which the coating film resistor 12 is formed, when the heat shock test is performed in the state of being integrated with the FBT, the insulating substrate 11 is cracked, or the coating film resistor is formed. There was a problem that the heat shock resistance such as peeling of 12 was poor.

This means that the hard resin filled around the high-voltage fixed resistor is well compatible with the resin film 15 on the surface of the film resistor 12 and is not well compatible with the material of the insulating substrate 11, so that the insulating resin is insulated. This is because the adhesive force on both sides of the substrate 11 is different, and therefore the stress of contraction or expansion due to the temperature change of the hard resin is applied with different strength on both sides of the insulating substrate 11.

Therefore, an object of the present invention is to solve the above-described problems of the conventional high voltage variable resistor and to print-coat resin coatings on both sides of the insulating substrate constituting the high voltage fixed resistor. , The stress caused by the temperature change of the hard resin filled around the high voltage fixed resistor due to the temperature change is relaxed, and the heat shock resistance of the high voltage fixed resistor is improved. An object of the present invention is to provide a variable resistor for high voltage that is inexpensive and has high reliability with little deterioration in characteristics.

[0012]

In order to achieve the above object, the present invention provides a high voltage variable resistor comprising a case and a variable resistor constituting member and a high voltage fixed resistor housed in the case. The invention is characterized in that resin coatings are formed by printing on both surfaces of an insulating substrate that constitutes a high voltage fixed resistor.

[0013]

According to the above construction, the resin coating is formed on both surfaces of the insulating substrate which constitutes the high voltage fixed resistor used in the high voltage variable resistor. The stress of shrinkage and expansion due to temperature change of the hard resin filled around the high-voltage fixed resistor is evenly applied to both surfaces of the insulating substrate, and the stress due to shrinkage and expansion of the hard resin due to temperature change is reduced. can do. Also, since the resin coating is formed by printing,
It is possible to reduce the cost for forming the resin film.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings showing the embodiments thereof. In the figure, the same or corresponding parts and those having the same functions as those in the conventional example are designated by the same reference numerals.

FIG. 1 shows the structure of a high-voltage fixed resistor used in the high-voltage variable resistor according to one embodiment of the present invention, and FIGS. 2 and 3 show the structure of the high-voltage variable resistor. 1A is a front view of the high-voltage fixed resistor, FIG. 1B is a back view, and FIG. 1C is a side view. 2 is a rear view of the high-voltage variable resistor, and FIG. 3 is a cross-sectional view of the main part taken along line XX of FIG.

As shown in FIG. 1, in the high voltage fixed resistor 10 used in the high voltage variable resistor of the present embodiment, the resin film 15 is formed on the surface of the insulating substrate 11 on which the film resistor 12 is formed.
On the surface where a is not formed, a resin coating 15b is formed by printing an epoxy resin or the like. The resin coatings 15a and 15b are formed by forming the coating resistor 12 and the terminal electrodes 13 and 13 on the surface of the insulating substrate 11 and then printing and applying by screen printing or the like and curing. Insulating substrate 1
After forming the resin coatings 15a and 15b on both main surfaces of 1, the lead terminals 14 and 14 are soldered to the terminal electrodes 13 and 13. Glass coating may be applied before forming the resin coatings 15a and 15b.

The resin coatings 15a and 15b have a thickness of several tens of μm, and on the surface where the coating film resistor 12 is formed, as shown in FIG.
As shown in (a), the resin coating 15a has the terminal electrode 13,
13 is formed so as to cover the film resistor 12 in a region other than the formation region and the peripheral portion of the insulating substrate 11, and on the other main surface, as shown in FIG. 1B, the resin film 15b is almost the same as the resin film 15a. It is formed in the same pattern.

The resin coatings 15a and 15b may have different shapes on both surfaces of the insulating substrate 11 or may be formed in a plurality of divided portions. The shape, thickness, forming position, etc. are not particularly limited. Absent. Resin coating 15a, 15b
The shape, thickness, formation position, and the like are appropriately set in accordance with the required characteristics such as heat shock resistance and the like, depending on the storage position of the high-voltage fixed resistor 10, the type of hard resin, and the like. Also,
The type of the resin coatings 15a and 15b is not limited to the epoxy type resin, but may be a silicon type resin, a phenol type resin, or the like, and those having different types and compositions on both sides can also be used.

The high-voltage variable resistor of this embodiment is constructed as shown in FIGS. 2 and 3, and the configuration other than the high-voltage fixed resistor 10 is shown in FIGS. 4 and 5 of the conventional example. The configuration is the same as that described above, and the description thereof is omitted.

In this configuration, the resin coatings 15a and 15b are formed on both surfaces of the insulating substrate 11 which constitutes the high voltage fixed resistor 10, and after the high voltage fixed resistor 10 is assembled to a high voltage generator such as an FBT. It is possible to relieve the stress applied to the insulating substrate 11 due to the contraction and expansion of the hard resin with which the temperature is changed. Therefore, the deterioration of the insulating substrate 11 due to heat shock or the like is significantly alleviated.

By increasing the thickness of the resin coatings 15a and 15b, the resin coatings 15a and 15b also have a function as a damper material, and the stress applied to the insulating substrate 11 can be further alleviated.

Further, since the resin film is formed by printing, the resin film 15 is formed as compared with the resin film formed by dipping.
The cost of forming a and 15b is reduced.

The means for accommodating and fixing the high-voltage fixed resistor is not limited to the holder of the above-mentioned embodiment, but any suitable means may be adopted. In addition to the variable resistor component and the high voltage fixed resistor, for example, a high voltage capacitor or the like may be housed inside the case.

[0024]

As described above, according to the high-voltage variable resistor of the present invention, the resin coating is formed on both surfaces of the insulating substrate that constitutes the high-voltage fixed resistor, so that a high voltage such as FBT is generated. After assembly in the device, the stress of shrinkage and expansion due to temperature change of the hard resin filled around the high-voltage fixed resistor is evenly applied to both sides of the insulating substrate, and the shrinkage and expansion due to temperature change of the hard resin is insulated. The stress applied to the substrate can be relieved, and the deterioration of the insulating substrate and the film resistor due to heat shock or the like can be remarkably reduced. Further, since the resin film is formed by printing, it is possible to reduce the cost of forming the resin film.

Therefore, according to the present invention, it is possible to improve the heat shock resistance of the high-voltage fixed resistor, and to obtain a low-voltage, high-reliability high-voltage variable resistor with little characteristic deterioration.

[Brief description of drawings]

1A is a front view of a high voltage fixed resistor according to an embodiment of the present invention, FIG. 1B is a back view, and FIG. 1C is a side view.

FIG. 2 is a rear view of a high voltage variable resistor according to an embodiment of the present invention.

3 is a cross-sectional view of a main part of the high voltage variable resistor shown in FIG. 2, taken along line XX.

FIG. 4 is a rear view of a conventional high voltage variable resistor.

5 is a cross-sectional view of the main part of the high voltage variable resistor shown in FIG. 4, taken along line XX.

FIG. 6A is a front view of a conventional high voltage fixed resistor,
(B) is a side view.

[Explanation of symbols]

 1 Case 2 Variable Resistor Component Member Storage Section 3 High Voltage Fixed Resistor Storage Section 4 Partition Wall 5 Substrate 6 Resin 7 Lead Terminal 8 Holder 10 High Voltage Fixed Resistor 11 Insulating Substrate 12 Coated Resistor 13 Terminal Electrode 14 Lead Terminal 15a, 15b Resin coating

Claims (1)

[Claims] 1. A high voltage variable resistor comprising a variable resistor constituting member and a high voltage fixed resistor housed in a case, wherein resin is formed by printing on both sides of an insulating substrate constituting the high voltage fixed resistor. A high-voltage variable resistor characterized by having a film formed thereon.