JPH08134346A - Polypheylene ether resin composition - Google Patents

Abstract

PURPOSE: To obtain a polyphenylene ether resin composition, having heat resistance of >=70 deg.C heat distortion temperature and satisfying the flame retardance rating V-0 in a UL94 vertical burning test. CONSTITUTION: This polyphenylene ether resin composition contains the following (a), (b) and (c): (a) 100 pts.wt. polyphenylene ether resin having >0.4 and <=0.7dl/g intrinsic viscosity in chloroform solvent at 30 deg.C, (b) 1-30 pts.wt. block copolymer comprising an A-B diblock copolymer, an A-B-A' triblock copolymer or a mixture thereof (A and A' denote each a vinyl aromatic compound; B denotes a conjugated diene) and (c) 1-60 pts.wt. organic phosphoric ester.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a polyphenylene ether resin composition. More specifically, the present invention relates to a polyphenylene ether resin composition that has heat resistance and does not drip during combustion in a UL94 vertical flammability test.

[0002]

2. Description of the Related Art In recent years, attention has been paid to the safety of thermoplastic resins used in real life. Of these, the flame retardant performance of resin is one of the most important safety performances. The importance of the flame retardant performance of resins is well known, but in recent years there is concern about the impact of halogen-based flame retardants on the environment, and expectations for flame-retardant resin compositions using non-halogen flame retardants have increased. ing.

For example, in British Patent No. 1591137, a composition (I) comprising (a) 60 to 99% by weight of polyphenylene ether and (b) 40 to 1% by weight of a hydrogenated ABA 'type block copolymer. 60 to 99% by weight,
(II) A flame-retardant resin composition containing 1 to 40% by weight of a phosphorus-based flame retardant is disclosed. In EP124916, (a) 50 to 70 parts by weight of polyphenylene ether, (b) 25 to 45 parts by weight of hydrogenated block copolymer,
A resin composition comprising (c) 10 to 20 parts by weight of a phosphate compound and (d) 2 to 10 parts by weight of mineral oil is disclosed.

In US Pat. No. 4,879,330,
(A) 30 to 40% by weight of polyphenylene ether,
A cable including a sheath formed of a composition comprising (b) 30 to 40% by weight of a block copolymer and (c) 20 to 35% by weight of a phosphoric ester is disclosed. Further, U.S. Pat. No. 4,154,712 discloses (a) a low molecular weight polyphenylene ether having an intrinsic viscosity at 30 ° C. in a chloroform solution of less than about 0.4, (b) an ABA 'type block copolymer and (c). A resin composition containing a plasticizer and having good impact resistance is disclosed.

Further, US Pat. No. 5,206,276 discloses that (a) 100 parts by weight of polyphenylene ether, (b) 65 to 100 parts by weight of a flame-retardant aromatic phosphate, and (c) an ABA 'type block. Polymer 10-10
A resin composition consisting of 0 parts by weight is disclosed.

By the way, generally, the UL-94 vertical combustion test method is widely used as a method for evaluating the flame retardancy of a resin composition. In order to pass V-0 in this flame retardant test,
After igniting the test piece, it is important that the combustion time from the removal of the ignition source to the extinction of the test piece and that the test piece does not drip when burned. When making the polyphenylene ether resin flame-retardant with a flame retardant, the combustion time can be easily shortened by adding the flame retardant. However, with respect to another requirement, that is, no dripping at the time of combustion, it is often very difficult to achieve it. As a specific example, this problem remarkably occurs when the thickness of the molded product is reduced.

[0007]

However, the above-mentioned resin composition has a practically preferable heat resistance, that is, 18.
A thin-walled molded product (for example, a thickness of 0.5 m, which has a heat distortion temperature of 70 ° C. or more under a fiber stress of 6 kg / cm ² and satisfies flame retardancy V-0 in a UL94 vertical combustion test.
It was difficult to produce m).

[0008]

In view of such circumstances, the inventors of the present invention have diligently studied the heat and flame resistance of the polyphenylene ether resin composition, and as a result, a specific polyphenylene ether resin, a specific block copolymer and The present invention has been completed by finding that a resin composition prepared by mixing a specific amount of each organic phosphate ester has excellent heat resistance and flame retardancy.

That is, the present invention provides the following (a) and (b):
And a polyphenylene ether-based resin composition containing (c). (A) Chloroform solvent, intrinsic viscosity at 30 ° C. is 0.4
100 parts by weight of polyphenylene ether-based resin of greater than dl / g and less than or equal to 0.7 dl / g (b) AB diblock copolymer, ABA 'triblock copolymer or block copolymer composed of a mixture thereof Polymer 1 to 30 parts by weight (wherein A and A'represent a vinyl aromatic compound, B represents a conjugated diene, respectively). (C) Organic phosphate 1 to 60 parts by weight

Hereinafter, the present invention will be described in detail. The present invention is a polyphenylene ether-based resin obtained by blending three components described below, namely (a) a specific polyphenylene ether-based resin (b) a specific block copolymer and (c) an organic phosphate ester in a specific ratio. The composition is 1
A heat distortion temperature of 70 or more under a fiber stress of 8.6 kg / cm ² and a UL94 vertical burning test of V-0 are achieved.

In the present invention, the melt viscosity (200 ° C.) of the resin composition is one of the conditions for further satisfying the flame retardancy.
Preferably from 5000 to 30000 poise, more preferably from 5000 to 25000 poise, most preferably 5
It is 000 to 20,000 poise. The measurement of melt viscosity is
It was carried out under the following conditions using a high and low melt flow tester. Measuring conditions: Measuring temperature range 170 ° C to 250 ° C Measuring load 200kg Temperature rising rate 5 ° C / min Orifice used L / D = 10/1

In the present invention, the flame retardancy is further improved by defining not only the melt viscosity of the resin composition but also the decrease rate of the melt viscosity. The rate of decrease in melt viscosity is preferably 25% or less, more preferably 20% or less, and most preferably 15% or less. The decrease rate of melt viscosity can be measured by
The measurement was carried out under the following condition (2) using a capillary rheometer. Condition (2) Measurement temperature: 300 ° C. Measurement shear rate region: 60 sec ⁻¹ Under these measurement conditions, the melt viscosity of the sample after melting for 5 minutes and 15
The melt viscosities of the samples retained for a minute are compared, and the decrease rate of the melt viscosity of the retained samples is calculated based on the following formula. Reduction rate of melt viscosity = [(melt viscosity of sample after melting for 5 minutes) − (melt viscosity of sample retained for 15 minutes)] ÷ (5
Melt viscosity of sample after melting for 1 minute) × 100

The (a) polyphenylene ether resin used in the present invention means the following general formula (in the formula, R ¹ , R ² and R
³ , R ⁴ and R ⁵ are each selected from a hydrogen atom, a halogen atom, a hydrocarbon group or a substituted hydrocarbon group, and one of them is always a hydrogen atom. ) Is a (co) polymer obtained by oxidatively polymerizing one or more of the phenolic compounds represented by the formula (1) or two or more using an oxidative coupling catalyst with oxygen or an oxygen-containing gas, in a chloroform solvent at a temperature of 30 ° C. Intrinsic viscosity 0.4dl /
It is a polyphenylene ether-based resin of more than 0.7 g and 0.7 dl / g or less.

[0014]

R ¹ , R ² , R ³ , R in the above general formula
Specific examples of ⁴ and R ⁵ are hydrogen, chlorine, bromine, fluorine, iodine, methyl, ethyl, n- or iso-propyl, pri-, sec- or t-butyl, chloroethyl, hydroxyethyl, phenylethyl, benzyl. , Hydroxymethyl, carboxyethyl, methoxycarbonylethyl, cyanoethyl, phenyl, chlorophenyl, methylphenyl, dimethylphenyl, ethylphenyl, allyl and the like.

Specific examples of the above general formula include phenol, o-, m- or p-cresol, 2,6-, 2,
5-, 2,4- or 3,5-dimethylphenol, 2
-Methyl-6-phenylphenol, 2,6-diphenylphenol, 2,6-diethylphenol, 2-methyl-6-ethylphenol, 2,3,5-, 2,3,6
-Or 2,4,6-trimethylphenol, 3-methyl-6-t-butylphenol, thymol, 2-methyl-6-allylphenol and the like. Further, a phenol compound other than the above general formula, for example, a polyvalent hydroxyaromatic compound such as bisphenol-A, tetrabromobisphenol-A, resorcin, hydroquinone, and novolac resin is used together with a phenol compound represented by the above general formula. It may be used as a raw material of the polymer. Among these compounds, 2,6-dimethylphenol, 2,6-
Diphenylphenol, 3-methyl-6-t-butylphenol and 2,3,6-trimethylphenol are preferred.

The oxidative coupling catalyst used in the oxidative polymerization of the phenol compound is not particularly limited, and any catalyst having a polymerization ability can be used.

A method for producing such a polyphenylene ether resin is described in, for example, US Pat. Nos. 3,306,874 and 33.
06875 and 3257357, as well as Japanese Examined Patent Publication No. 52-17880 and Japanese Patent Laid-Open No. 50-51197.
And Japanese Patent Application Laid-Open No. 1-304119.

Specific examples of the (A) polyphenylene ether resin in the present invention include poly (2,6-dimethyl-1,4-phenylene ether) and poly (2,6-diethyl-1,4-phenylene ether). , Poly (2-methyl-6-ethyl-1,4-phenylene ether), poly (2-methyl-6-propyl-1,4-phenylene ether), poly (2,6-dipropyl-1,4-phenylene) Ether), poly (2-ethyl-6-propyl-1,
4-phenylene ether), poly (2,6-butyl-
1,4-phenylene ether), poly (2,6-dipropenyl-1,4-phenylene ether), poly (2,6)
-Dilauryl-1,4-phenylene ether), poly (2,6-diphenyl-1,4-phenylene ether), poly (2,6-dimethoxy-1,4-phenylene ether), poly (2,6-diethoxy) -1,4-phenylene ether), poly (2-methoxy-6-ethoxy-1,4-phenylene ether), poly (2-ethyl-)
6-stearyloxy-1,4-phenylene ether), poly (2-methyl-6-phenyl-1,4-phenylene ether), poly (2-methyl-1,4-phenylene ether), poly (2-ethoxy) -1,4-phenylene ether), poly (2-chloro-1,4-phenylene ether), poly (3-methyl-6-t-butyl-
1,4-phenylene ether), poly (2,6-dichloro-1,4-phenylene ether), poly (2,5-dibromo-1,4-phenylene ether), poly (2,6
-Dibenzyl-1,4-phenylene ether) and various copolymers containing plural kinds of repeating units constituting these polymers. Some of the copolymers are 2,3,6-trimethylphenol, 2,3,5,6-
Polysubstituted phenol such as tetramethylphenol and 2,6
-Including a copolymer with dimethylphenol.

Of these polyphenylene ether resins, the preferred one is poly (2,6-dimethyl-1,4-).
(Phenylene ether) and a copolymer of 2,6-dimethylphenol and 2,3,6-trimethylphenol.

The polyphenylene ether resin usable in the present invention has an intrinsic viscosity measured in chloroform at 30 ° C. of more than 0.4 dl / g and more than 0.7 dl / g.
Or less, preferably 0.42 dl / g or more and 0.6 dl / g
Or less, more preferably 0.42 dl / g or more and 0.5 dl
/ G or less. When the intrinsic viscosity is 0.4 dl / g or less, it is difficult to achieve no dropping during combustion, which is not preferable, and when it exceeds 0.7 dl / g, moldability is deteriorated, which is not preferable.

The polyphenylene ether resin used in the present invention is styrene or α-based on the above-mentioned polymers and copolymers.
It may be a copolymer modified by grafting a styrene compound such as methylstyrene, p-methylstyrene, vinyltoluene and chlorostyrene.

The block copolymer (b) used in the present invention is an AB diblock copolymer, an ABA 'triblock copolymer or a block copolymer composed of a mixture thereof. In the formula, A and A'represent a vinyl aromatic compound, and B represents a conjugated diene. Examples of the vinyl aromatic compound of A and A ′ include polymers derived from styrene, α-methylstyrene, vinyltoluene, vinylxylene and vinylnaphthalene.
Examples of the conjugated diene of B include a polymer derived from butadiene, isoprene and 1,3-pentadiene. Examples of the block copolymer include diblock copolymers such as styrene-butadiene diblock copolymers and triblock copolymers such as styrene-butadiene-styrene triblock copolymers. Among these, a styrene-butadiene-styrene triblock copolymer composed of a B central block made of polybutadiene and terminal A and A'blocks made of polystyrene is preferable.

Many methods have been proposed as a method for producing the above block copolymer, and a typical method is, for example, the method described in JP-B-40-2798, which is a lithium catalyst or Ziegler. A block copolymer of a vinyl aromatic compound (block A) and a conjugated diene (block B) can be obtained by performing block polymerization in an inert solvent using a type catalyst. This block copolymer is, for example, CARIFLE from Shell Chemical Co.
It is commercially available under the trade name of X [registered trademark] TR1101.

The block copolymer (b) has a number average molecular weight of 10,000 to 1,000,000, preferably 20,000 to 300,000. The block A or A ′ in the block copolymer has a number average molecular weight of 1,0.
00-200,000, preferably 2,000-10
And the number average molecular weight of block B is 1,0
00-200,000, preferably 2,000-10
10,000 and block A and block B, or
The weight ratio of the blocks A and A'to the block B is 2 / 98-
60/40, preferably 10/90 to 40/60.

The organophosphate ester (c) used in the present invention is not particularly limited, but an aromatic phosphate ester represented by the following general formula is preferred.

[0027] (In the formula, R ¹¹ , R ¹² and R ¹³ are each an alkyl group,
The same or different groups selected from a cycloalkyl group, an aryl group, an aryl-substituted alkyl group and a combination thereof, and at least one of R ¹¹ , R ¹² and R ¹³ represents an aryl group. )

Specific compounds thereof include phenylbisdodecyl phosphate, phenylbisneopentyl phosphate, phenylbis (3,5,5'-trimethylhexyl) phosphate, ethyldiphenyl phosphate, 2-ethylhexyl phosphate ( p-tolyl), tritolyl phosphate, bis (2-ethylhexyl) phenyl phosphate, tri (nonylphenyl) phosphate, triphenyl phosphate, dibutylphenyl phosphate, p-tolylbis phosphate (2,5,5′-). Trimethylhexyl), 2-ethylhexyl diphenyl phosphate and the like. Among these, organic phosphoric acid esters in which R ¹¹ , R ¹² and R ¹³ are each an aryl group are preferable. For example, triphenyl phosphate, diphenyl cresyl phosphate, etc. are mentioned. Among these, particularly preferred organic phosphate ester is triphenyl phosphate, which may be unsubstituted or substituted (eg, isopropylated triphenyl phosphate). May be

The organic phosphate ester used in the present invention may be a difunctional or polyfunctional compound represented by the following general formula, a polymer, or a mixture thereof.

[0030](In the formula, R^{twenty one}, R^{twenty three}, R^{twenty five}Are selected independently of each other
Hydrogen radical, R^{twenty two}, R^{twenty four}, R ²⁶, R²⁷Are chosen independently of each other
Hydrocarbon group or hydrocarbon oxy group, X¹, X ², X
³Are halogen atoms independently selected from each other, m and r are 0 to
4 is an integer of 4 and n and p are integers of 1 to 30) Examples of the specific compound include resorcinol and
Doloquinone, bisphenol A bis (diphenyl phosphate
) Esters and their polymeric counterparts.

The amount of each component constituting the resin composition of the present invention is 1 to 30 parts by weight, preferably 1 to 30 parts by weight of the (b) block copolymer with respect to 100 parts by weight of the (a) polyphenylene ether resin. 25 parts by weight, more preferably 1-2
0 parts by weight, 1 to 60 parts by weight of (c) the organic phosphate ester, preferably 1 to 50 parts by weight, more preferably 1 to 4 parts by weight.
0 parts by weight. (B) The compounding amount of the block copolymer is 1
If the amount is less than 30 parts by weight, dripping may occur during combustion, resulting in poor flame retardancy. If the amount exceeds 30 parts by weight, heat resistance may be deteriorated. When the compounding amount of the organic phosphate (c) is less than 1 part by weight, the flame retardancy is poor, and when it exceeds 60 parts by weight, dripping occurs during combustion and the flame retardancy is poor, which is not preferable.

The polyphenylene ether resin composition of the present invention may contain other polymer compounds and auxiliary agents. Other polymer compounds include, for example, polystyrene,
Styrene polymers such as high-impact polystyrene, polypropylene, high density polyethylene, low density polyethylene, linear low density polyethylene, propylene-ethylene copolymer, ethylene-butene-1 copolymer, ethylene-
Pentene copolymers, ethylene-hexene copolymers, olefin polymers such as poly-4-methylpentene-1, olefins and vinyl monomers copolymerizable therewith (eg,
Acrylic acid esters, methacrylic acid esters, vinyl acetate, styrene, acrylonitrile, glycidyl (meth) acrylate copolymers, etc., polyvinyl chloride,
Polymers such as polymethyl methacrylate, polyvinyl acetate, polyvinyl pyridine, polyvinyl carbazole, polyacrylamide, polyacrylonitrile, polycarbonate, polysulfone, polyether sulfone, polyethylene terephthalate, polybutylene terephthalate,
Polyarylene ester (for example U of Unitika Ltd.)
Polymer), polyphenylene sulfide, polyamide such as 6-nylon, 6,6-nylon and 12-nylon, condensation type polymer compound such as polyacetal, and further silicone resin, fluororesin, polyimide, polyamideimide, phenol resin Various thermosetting resins such as alkyd resin, unsaturated polyester resin and dabon resin are also included. The blending amount of the polymer compound is usually 0 to 2 with respect to 100 parts by weight of the polyphenylene ether resin.
0 parts by weight.

The polyphenylene ether-based resin composition of the present invention may contain a filler for the purpose of strengthening, imparting functions and the like. Examples of the filler include glass fibers, carbon fibers, aramid fibers, reinforcing fibers such as aluminum and stainless steel, and metal whiskers, silica, alumina, calcium carbonate, talc, mica, clay, kaolin, magnesium sulfate, carbon black, TiO ₂ , ZnO
And inorganic fillers such as Sb ₂ O ₃ can be used.

The polyphenylene ether resin composition of the present invention may contain a flame retardant or a flame retardant aid such as a halogen compound, if necessary. Further, the polyphenylene resin composition of the present invention may also contain a dye, a pigment, an antistatic agent, an antioxidant, a weather resistance imparting agent and the like.

The method for producing the polyphenylene ether resin composition of the present invention is not particularly limited, and examples thereof include various methods such as a solution blending method and a melt kneading method. Of these, the melt kneading method is preferable. Upon kneading, the melting temperature is usually 150 to 350 ° C., preferably 2
The range of 00 to 300 ° C. is selected.

When carrying out by the melt kneading method, the order of compounding and kneading the respective components is not particularly limited, and, for example, when the components are melt kneaded using an extruder or the like, the components (a) and (b) are mixed.
And (c) are added all at once, and melt kneading is performed at the same time,
A method in which the components (a) and (b) are melt-kneaded in advance, and then the component (c) is additionally added to perform melt-kneading, the components (a) and (c) are melt-kneaded in advance, and then the component (b) is added. Method of melt-kneading with additional addition, components (b) and (c)
May be pre-kneaded in advance, and then the component (a) may be additionally added and melt-kneaded.

Examples of the use of the polyphenylene ether resin composition of the present invention include general injection molding applications such as OA equipment, electric and electronic equipment, extrusion molding applications, and film applications. In particular, thin-walled molded products can be sufficiently applied to applications requiring flame retardancy.

[0038]

The present invention will be described in more detail based on the following examples, but the invention is not intended to be limited to these examples.

The meanings of the abbreviations used in Examples and Comparative Examples are shown below. (1) Polyphenylene ether-based resin Poly (2,6-dimethyl-1,4-) having an intrinsic viscosity of 0.40 dl / g measured at 30 ° C. in a chloroform solvent.
(Phenylene ether) (PPE1) Poly (2,6-dimethyl-1,4-) having an intrinsic viscosity of 0.42 dl / g measured at 30 ° C. in a chloroform solvent.
(Phenylene ether) (PPE2) Poly (2,6-dimethyl-1,4-) having an intrinsic viscosity of 0.48 dl / g measured at 30 ° C. in a chloroform solvent.
(Phenylene ether) (PPE3) (2) Rubber modified polystyrene (HIPS-1) Weight average molecular weight 20.5 × 10 ⁴ Rubber amount 7.3% by weight Rubber particle size (weight average) 0.7 μm MI measurement result (measurement condition: 200 ° C., 5 kg load) 3.5 g / 10 minutes (3) Block copolymer Styrene-butadiene-styrene triblock copolymer (SBS-1) CARIFLEX TR1101 manufactured by Shell Chemical Co. (4) Organophosphate triphosphate Phenyl (TPP)

Next, methods for evaluating the physical properties of the resin composition will be described. (1) Melt flow rate (MFR) The melt flow rate (MFR) was measured at 280 ° C. under a load of 10 kg according to JIS K7210. (2) Heat distortion temperature (HDT) Measured under a fiber stress of 18.6 kg / cm ² according to ASTM D648.

(3) Melt viscosity The value of melt viscosity at 200 ° C. under the following conditions was used. Measuring device: High-lower melt flow tester Measuring condition: Measuring temperature range 170 ° C to 250 ° C Measuring load 200kg Temperature rising rate 5 ° C / min Orifice used L / D = 10/1 (4) Melt viscosity decrease rate The following measuring conditions And the melt viscosity of the sample after melting for 5 minutes and 15
The melt viscosities of the samples retained for a minute were compared, and the decrease rate of the melt viscosity of the retained samples was calculated based on the following calculation formula. Measuring device: Capillary rheometer Orifice used: L / D = 40/1 Measuring temperature: 300 ° C. Measuring shear rate region: 60 (sec ⁻¹ ) Melt viscosity decrease rate = [(Melting viscosity of sample after melting for 5 minutes) -(Melt viscosity of sample retained for 15 minutes)] / (5
Melt viscosity of sample after melting for 1 minute) × 100

(5) Combustion test UL94 was prepared by molding a 0.8 mm-thick test piece by injection molding a polyphenylene ether resin composition.
A vertical flammability test was performed. Similarly, a test piece having a thickness of 0.5 mm was molded and a UL94 vertical flammability test was conducted. V-0: Burning time was 10 seconds or less, and no ignition by dropping.
In addition, in this evaluation, the non-dripping was set to V-0. V-1: Burning time was 30 seconds or less and no ignition by dropping. V-2: Burning time was 30 seconds or less and ignition was caused by dropping.

Example 1 From a hopper of a continuous twin-screw kneader (TEX-44 type made by Japan Steel Co., Ltd.) in which each component (composition 1) having a mixing ratio shown in Table 1 was set at a cylinder temperature of 260 ° C. and a screw rotation speed of 330 rpm. It was charged, melt-kneaded and pelletized. The pellets are injection molded at a cylinder temperature of 260 ° C and 0.8mm
A thickness test piece was prepared. Table 2 shows the evaluation results.

Example 2 The procedure of Example 1 was repeated, except that a pellet having a thickness of 0.5 mm was prepared using the pellet obtained in Example 1. Table 2 shows the evaluation results.

Example 3 The same procedure as in Example 2 was carried out except that each component (composition 2) in the mixing ratio shown in Table 1 was used. Table 2 shows the evaluation results.

Comparative Example 1 The procedure of Example 2 was repeated, except that the respective components (composition 3) in the compounding ratios shown in Table 1 were used. Table 2 shows the evaluation results.

Comparative Example 2 The procedure of Example 2 was repeated, except that the components (composition 4) in the compounding ratios shown in Table 1 were used. Table 2 shows the evaluation results.

Comparative Example 3 The procedure of Example 2 was repeated, except that the respective components (composition 5) in the compounding ratios shown in Table 1 were used. Table 2 shows the evaluation results.

Comparative Example 4 The procedure of Example 2 was repeated except that the components (composition 6) in the compounding ratios shown in Table 1 were used. The heat resistance was not reached, and the combustion test could not be conducted. Table 2 shows the evaluation results.

[0050]

[Table 1] ─────────────────────────────────── Composition composition ratio (parts by weight) No. PPE1 PPE2 PPE3 HIPS-1 SBS-1 TPP ─────────────────────────────────── 1 ─── 100 ── ── 14 22 2 ─── 90 ── 10 14 22 3 100 ─── ── ── 14 22 4 ─── ─── 100 ── ── 21 5 ─── ─── 100 20 ─ ─ 30 6 ─── ─── 100 ── 50 50 ────────────────────────────────────

[0051]

[Table 2] ─────────────────────────────────── Actual Example Comparison Example 1 2 3 1 2 3 4 ─────────────────────────────────── Composition No. 1 1 2 3 4 5 6 MFR ( (g / 10 min) 142 142 160 160 70 155 30 HDT (℃) 93 93 85 89 113 89 55 Viscosity (Poise) 9600 9600 7000 5000 60200 3400 ── Viscosity decrease rate (%) 10 10 14 30 10 30 8 Flame retardant V-0 V-0 V-0 V-2 V-2 V-2 ── ────────────────────────────── ──────

[0052]

As described above, according to the present invention, even a thin-walled molded product has heat resistance of 70 ° C. or more under a fiber stress of 18.6 kg / cm ² . Moreover, it is possible to provide a polyphenylene ether-based resin composition satisfying the flame retardancy V-0 in the UL94 vertical combustion test.

Claims (3)

[Claims] 1. A polyphenylene ether resin composition containing the following (a), (b) and (c): (A) Chloroform solvent, intrinsic viscosity at 30 ° C. is 0.4
100 parts by weight of polyphenylene ether-based resin of greater than dl / g and less than or equal to 0.7 dl / g (b) AB diblock copolymer, ABA 'triblock copolymer or block copolymer composed of a mixture thereof Polymer 1 to 30 parts by weight (wherein A and A'represent a vinyl aromatic compound, B represents a conjugated diene, respectively). (C) Organic phosphate 1 to 60 parts by weight 2. A melt viscosity (20) under the following condition (1):
The polyphenylene ether resin composition according to claim 1, which has a temperature of 0 ° C to 5,000 to 30,000 poise. Condition (1) Measuring device: High-lower melt flow tester Measuring condition: Measuring temperature range 170 ° C. to 250 ° C. Measuring load 200 kg Temperature rising rate 5 ° C./min Orifice used L / D = 10/1 3. The polyphenylene ether resin composition according to claim 2, wherein the rate of decrease in melt viscosity under the following condition (2) is 25% or less. Condition (2) Measuring device: Capillary rheometer Orifice used: L / D = 40/1 Measuring temperature: 300 ° C. Measuring shear rate region: 60 (sec ⁻¹ ) Decrease rate of melt viscosity = [(Sample after melting for 5 minutes Melt viscosity)-(melt viscosity of sample retained for 15 minutes)] / (5
Melt viscosity of sample after melting for 1 minute) × 100