JPH08119437A - Substrate carrier - Google Patents

Abstract

PURPOSE: To provide a substrate carrier which can deliver a substrate smoothly from a first conveyor to a second conveyor, in the substrate carrier installed in the process of mounting electronic parts on the substrate. CONSTITUTION: A roller, which abuts on a first conveyor 1 and rotates by the frictional force, a small roller, which rotates by sliding on this roller, and a sub roller, which rotates integrally with this small roller, are provided between a first conveyor 1 and a second conveyor 3. The substrate 8 carried by the first conveyor 1 shifts to ride on the sub roller, and is carried by the sub roller rotating, and is delivered to the second conveyor 3, being carried by the sub roller.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board carrying device for carrying boards one by one in a mounting process of electronic parts.

[0002]

2. Description of the Related Art The process of mounting electronic components on a substrate is a bonding process for bonding the electronic components to the substrate by a bond, a curing process for curing the bond, and a wire bonding process for connecting the electrode of the electronic component and the electrode of the substrate by a wire. Etc., and a predetermined work is performed while the substrate is conveyed between the steps by a conveyor.

As a conveyer for transferring the substrate,
In general, endless conveyors such as belt conveyors and chain conveyors are often used, and substrates are transferred from upstream to downstream while transferring substrates between the conveyors. Hereinafter, a conventional substrate transfer structure between conveyors will be described.

FIG. 4 is a side view of a substrate transfer section of a conventional substrate transfer device. 1 is the first conveyor,
Banded on the pulley 2. Reference numeral 3 is a second conveyor, which is banded on the pulley 4. Reference numeral 5 is a mounting frame for the pulley 4. A plate 6 is fixed to the mounting frame 5. The rear end of the plate 6 has a sharp edge 7 and is located on the first conveyor 1. 8 is a substrate,
Reference numeral 9 is an electronic component bonded to the substrate 8. Therefore, as the pulleys 2 and 4 rotate in the directions of the arrows, the substrate 8 is transferred from the first conveyor 1 onto the plate 6 and then transferred from the plate 6 onto the second conveyor 3 so that the second conveyor It is conveyed to the next process by 3.

[0005]

However, in the above-mentioned conventional configuration, when the substrate 8 is transferred onto the plate 6, the substrate 8 is difficult to transfer smoothly because it is caught by the edge 7 and the plate 6 has a substrate transfer capability. Since it does not have it, it is difficult to transfer the substrate 8 from the plate 6 to the second conveyor 3, so that there is a problem that the transfer of the substrate 8 from the first conveyor 1 to the second conveyor 3 tends to fail.

In particular, for example, when the first conveyor 1 is a cure furnace conveyor for hardening the bond for bonding the electronic component 9 to the substrate 8, the diameter of the pulley 2 is generally much larger than the diameter of the pulley 4. On the other hand, when the length of the substrate 8 is relatively short, the above-mentioned delivery failure is likely to occur frequently.

[0007] Therefore, the present invention, from the first conveyor to the second
It is an object of the present invention to provide a substrate transfer device that can smoothly transfer a substrate to a conveyor.

[0008]

To this end, according to the present invention, a substrate transfer section is provided between the first conveyor and the second conveyor, and the transfer section is brought into sliding contact with the first conveyor. From a roller that rotates in the direction opposite to the conveying direction of the first conveyor and the second conveyor, and a sub-roller that rotates in the same direction as the conveying direction of the first conveyor and the second conveyor due to the frictional frictional force with this roller. It is configured such that the substrate conveyed by the first conveyor is delivered to the second conveyor via the sub roller.

[0009]

According to the above construction, since the sub-roller rotates in the substrate carrying direction by the rotation of the first conveyor, the substrate carried by the first conveyor is carried by the sub-roller and then by the second roller. Smoothly delivered to the conveyor.

[0010]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a side view of a mounting line for electronic components according to an embodiment of the present invention, FIG. 2 is an enlarged side view of a connecting portion between a first conveyor and a second conveyor in the mounting line for electronic components, and FIG. It is an enlarged plan view. In each figure, the same parts as those in the conventional example shown in FIG. 4 are designated by the same reference numerals.

In FIG. 1, 11 is a curing furnace. The curing furnace 11 is a heating furnace for heating and curing a bond for bonding the electronic component 9 to the substrate 8.
The cure furnace 11 is provided with a first conveyor 1 for carrying the substrate 8. Reference numeral 2 is a pulley to which the first conveyor 1 is attached. Reference numeral 3 denotes a second conveyor, which is arranged on the downstream side of the first conveyor 1. Reference numeral 4 is a pulley on which the second conveyor 3 is banded, and 5 is a mounting frame thereof. The diameter of the pulley 2 of the first conveyor 1 is
It is considerably larger than the diameter of the pulley 4 of the second conveyor 3.

A substrate transfer section 12 is provided between the first conveyor 1 and the second conveyor 3. Next, FIG.
The substrate transfer section 12 will be described with reference to FIGS. Reference numeral 13 denotes a mounting plate, which is provided on the left and right as shown in FIG. The upstream end of the mounting plate 13 is located on both sides of the first conveyor 1. The base end portion is held by the holding mechanism described later so as to be vertically movable on the end portion of the mounting frame 5 of the second conveyor 3. Mounting plate 13
A roller 14 is provided on the outer surface of the. Reference numeral 15 denotes a plate, and the roller 14 is rotatably attached to a rotary shaft 16 at the rear end of the plate 15. The tip of the plate 15 is rotatably attached to the mounting plate 13 by a pin 17.

In FIG. 2, two small rollers 18 are in contact with the roller 14, the roller 14 rotates in the N2 direction, and due to the frictional force with the roller 14, the small roller 18 is moved to the first conveyor 1. It rotates in the same direction N3 as the rotation direction N1. Reference numeral 20 is a pin-shaped sub roller on which the small roller 18 is mounted. The sub-roller 20 penetrates the mounting plate 13 and projects onto the conveyance path of the substrate 8 (see FIG. 3). The sub roller 20 is integral with the small roller 18, and therefore rotates in the same direction N3 as the sub roller 18. Reference numeral 21 denotes an auxiliary roller, which is rotatably attached to the mounting plate 13 at the same level as the sub roller 20 on the downstream side of the sub roller 20.

Next, a holding mechanism for holding the transfer section 12 so as to be vertically movable will be described. Reference numeral 22 is a bracket, on the inner surface of which a slider 23 is mounted. The slider 23 is vertically slidably mounted on a vertical guide rail 24 provided on the outer surface of the end of the mounting frame 5. The mounting plate 13 is fixed to the bracket 22 with screws 25. Reference numeral 26 is a spring whose upper end is attached to a pin 27 which is erected on the bracket 22 and whose lower end is attached to a pin 28 which is erected on the attachment frame, and urges the transfer portion 12 downward.
Therefore, the roller 14 is biased to the upper surface of the first conveyor 1 by its own weight of the transfer portion 12 and the force of the spring 26, and is pressed from above by the two small rollers 18. Therefore, when the first conveyor 1 rotates in the direction of the arrow N1, the roller 14 rotates counterclockwise due to the frictional force generated between the first conveyor 1 and the roller 14, and the roller 14 and the small roller 18 move. The small roller rotates clockwise due to the frictional force generated between them. In this way, by holding the transfer unit 12 in the mounting frame 5 of the second conveyor 3 in a vertically movable manner by the holding mechanism, the weight of the transfer unit 12 and the biasing force of the spring 26 can be surely applied to the roller 14. it can. The transfer unit 12
If sufficient frictional force can be obtained only by the weight of the spring,
May be removed. In FIG. 2, the level of the upper surface of the sub roller 20 is set to be substantially the same as the level of the upper surface of the first conveyor 1.

The substrate transfer device is constructed as described above, and its operation will be described below. 2 and 3, the substrate 8 conveyed by the first conveyor 1
Moves onto the sub roller 20 (arrow N11). At this time, the roller 14 slidably contacts the first conveyor 1 and the arrow N
It rotates in two directions, and the sub roller 20 rotates in the direction of arrow N3. The direction of the arrow N3 is the transport direction of the substrate 8, and therefore the substrate 8 transferred onto the sub roller 20
Is conveyed to the right by the sub-roller 20 (arrow N1
2), it is delivered to the second conveyor 3 and conveyed to the next step (arrow N13). In this way, this transfer unit 1
The substrate 2 can smoothly transfer the substrate 8 from the first conveyor 1 to the second conveyor 3 by rotating the sub-roller 20 using the rotational force of the first conveyor 1.

Although the above embodiment has been described by taking the first conveyor 1 provided in the curing furnace 11 as an example, the substrate transfer apparatus of the present invention can be applied to other electronic component mounting processes. It is a thing.

[0017]

As described above, according to the present invention, the sub-roller that rotates by utilizing the rotational force of the first conveyor is provided in the transfer section provided between the first conveyor and the second conveyor. Therefore, the substrate conveyed by the first conveyor can be smoothly transferred to the second conveyor by the conveying force of the sub roller.

[Brief description of drawings]

FIG. 1 is a side view of a mounting line for electronic components according to an embodiment of the present invention.

FIG. 2 is an enlarged side view of a connecting portion between a first conveyor and a second conveyor in an electronic component mounting line according to an embodiment of the present invention.

FIG. 3 is an enlarged plan view of a connecting portion between a first conveyor and a second conveyor in an electronic component mounting line according to an embodiment of the present invention.

FIG. 4 is a side view of a substrate transfer section of a conventional substrate transfer device.

[Explanation of symbols]

 1 First Conveyor 3 Second Conveyor 8 Substrate 9 Electronic Component 12 Transfer Part 14 Roller 20 Sub-roller

Claims (1)

[Claims] 1. A first conveyor for transporting a substrate, a second conveyor to which the substrate is fed from the first conveyor, and a substrate disposed between the first conveyor and the second conveyor. A delivery unit, wherein the delivery unit is the first
Roller that rotates in a direction opposite to the conveying direction of the first conveyor and the second conveyor by slidingly contacting the first conveyor and the first conveyor due to the sliding contact frictional force with the roller.
And a sub-roller that rotates in the same direction as the conveying direction of the second conveyor, and transfers the substrate conveyed by the first conveyor to the second conveyor through the sub-roller. Substrate transfer device.