JP4111817B2 - Semiconductor device mounting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor element mounting apparatus for mounting a die via solder on each heat sink intermittently fed to a plurality of work stations while sliding on a transport path formed in a heater block by each feed claw of the intermittent transport apparatus. .
[0002]
[Prior art]
In this semiconductor element mounting apparatus, it is known that the lower surface of the work is vacuum-sucked in order to perform work by positioning the work at each work station (for example, JP-A-11-72929). Furthermore, when the heat sink is intermittently fed while sliding on the conveyance path by the feed claw of the intermittent conveyance device, it is necessary to prevent overrun when conveying the heat sink on the conveyance path. Adsorb.
[0003]
[Patent Literature]
JP-A-11-72929 [0004]
[Problems to be solved by the invention]
However, the frictional force generated between the heat sink and the transport path is further applied with a vacuum adsorption force due to the friction coefficient between the heat sink and the transport path, and therefore an excessive friction force is generated. As a result, scratches occur on the contact surface, which induces oxidation of the heat sink surface and adversely affects subsequent processes.
[0005]
Therefore, the present invention reliably prevents overrun when transporting the heat sink on the transport path, and prevents the occurrence of scratches by making the necessary minimum adsorption force to prevent oxidation of the heat sink surface as much as possible. Objective.
[0006]
[Means for Solving the Problems]
For this reason, the first invention is a semiconductor device in which a die is mounted via solder on each heat sink intermittently fed to a plurality of work stations while sliding on a conveyance path formed in a heater block by each feed claw of the intermittent conveyance device. In order to prevent overrun when the heat sink is conveyed by the feed claw, a suction path for vacuum-sucking the lower surface of the heat sink is formed in the heater block at each work station and each suction is performed. The path is connected to a vacuum source via each vacuum regulator for setting the suction force.
[0007]
According to a second aspect of the present invention, in the semiconductor element mounting apparatus according to the first aspect, a solder application station for applying solder onto the heat sink, a mounting station for mounting a die on the heat sink via solder, and the heat sink A transfer station for transferring a work with a die mounted thereon is provided, and the suction force at each station is set strongly by the vacuum regulator in the order of the mounting station, the solder application station, and the transfer station.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 and 2, reference numeral 1 denotes a semiconductor element mounting device, which is intermittently fed while heating a heat sink 3 sequentially supplied onto a heater block 2 in which a heater (not shown) is embedded from the upstream side of the mounting device 1. While intermittently feeding by the device 4, the solder 5 is sequentially applied onto the heat sink 3, and the workpiece 7 having the die 6 bonded to the heat sink 3 through the solder 5 is transferred by the transfer device 8 to the carrier jig 9. A plurality, for example two, are transferred and stored.
[0009]
In order to make it more compact due to the installation space of each device of the semiconductor element mounting apparatus 1, the transport direction of the heater block 2 and the transport direction of the carrier jig 9 are orthogonal to each other. Each pitch is moved by a drive source (not shown).
[0010]
The intermittent feeding device 4 has a transfer 10 provided along the transfer direction of the heat sink 3 and a predetermined interval between the transfer 10 so as to be moved while being slid on the transfer path by being engaged with each heat sink 3 on the transfer path. A plurality of feed claws 11 provided for each, a reciprocating drive source (not shown) that reciprocates the transfer 10 by one pitch of a predetermined length, and the transfer 10 is moved by a one-pitch forward operation by the reciprocating drive source. Further, a swing drive source (not shown) that swings upward with the rear end as a fulcrum to release the engagement between the heat sink 3 and the feed claw 11 is provided.
[0011]
In each work station in which the heat sink 3 is intermittently fed by the intermittent feeding device 4, suction holes 12 penetrating vertically are formed in the heater block 2, and each suction hole 12 having the same inner diameter serves as a suction path. The vacuum source 15 is connected in parallel via the suction tube 13 and each vacuum regulator 14. During the operation of the semiconductor element mounting apparatus 1, a suction operation is always performed by the vacuum source 15.
[0012]
The first work station is a work thickness detection station for measuring the thickness of the heat sink 3 supplied onto the heater block 2 by a thickness measuring sensor 20 comprising a laser displacement meter, and the suction hole 12 connected to the vacuum source 15. The length from the heater block 2 that is the reference surface of the heat sink 3 in the state of being sucked through the heat sink, that is, the thickness of the heat sink 3 is measured. Based on the thickness information from the thickness measurement sensor 20, the descending amount of the mounting nozzle 22 at a mounting station, which will be described later, is calculated by a control device including a microcomputer (not shown). Then, the vacuum regulator 14 communicating with the suction hole 12 of the workpiece thickness detection station is set so that the degree of vacuum becomes a predetermined value, and the suction force is set to “weak”.
[0013]
The next work station is a solder application station in which an application nozzle 21 that can move the solder 5 on the heat sink 3 on the heater block 2 by a driving source (not shown) can be moved in the plane direction and the vertical direction, and is connected to the vacuum source 15. The solder 5 is applied on the heat sink 3 in a state of being sucked through the suction hole 12. The vacuum regulator 14 communicating with the suction hole 12 of the solder application station is set so that the degree of vacuum becomes a predetermined value, and the suction force is set to “medium”.
[0014]
The next work station is a mounting station in which a mounting nozzle 22 is mounted on the heat sink 3 on the heater block 2 via a solder 5 and can be moved in a plane direction and a vertical direction by a driving source (not shown). The die 6 is mounted while melting the solder 5 on the heat sink 3 in a state of being sucked through the suction hole 12 connected to the heat sink 15. Then, the vacuum regulator 14 communicating with the suction hole 12 of the mounting station is set so that the degree of vacuum becomes a predetermined value, and the suction force is set to “strong”.
[0015]
In the next next work station and the next work station, two works 7 on the heater block 2 in which the die 6 is bonded on the heat sink 3 via the solder 5 are transferred to the carrier jig 9 by the transfer device 8. The transfer station is a transfer station for transferring the workpieces 7, and the workpiece 7 sucked through the suction holes 12 connected to the vacuum source 15 is picked up and transferred to the carrier jig 9. Then, the vacuum regulator 14 communicating with the suction holes 12 of these transfer stations is set so that the degree of vacuum becomes a predetermined value, and the suction force is set to “weak”.
[0016]
Here, since it is necessary to prevent overrun when transporting the heat sink 3 on the transport path (not shown) formed in the heater block 2 by the feed claw 11, the lower surface of the heat sink 3 is vacuum-sucked. The frictional force generated between 3 and the transport path is further applied with a vacuum suction force due to the coefficient of friction between the heat sink 3 and the transport path, so that an excessive frictional force is generated. As a result, scratches occur on the contact surface, which induces oxidation of the surface of the work 7 and adversely affects the subsequent processes. “Low” is set for a work station that may be used, “medium” is set for a work station for which overrun is surely eliminated, and “high” is set for a work station that is assumed to be subjected to external force after transfer.
[0017]
Next, the transfer device 8 will be described with reference to FIGS. Reference numeral 25 denotes a drive cylinder which is a drive source for the transfer operation, and a rod of the cylinder 25 is connected to a connecting shaft 28 which is rotatable with respect to the apparatus main body 26 via a bearing 27.
[0018]
The apparatus main body 26 includes a first transfer nozzle 31 that is restricted by a Boolean spline nut 30 provided in the first cylinder 29 and can be moved up and down by a drive source (not shown) but cannot be rotated. A second transfer nozzle 34 that is restricted by a boules spline nut 33 provided in the two cylinders 32 and can be moved up and down by a drive source (not shown) but cannot be rotated is provided. Further, bearings 35 and 36 are provided between the intermediate portion of the first cylindrical body 29 and the second cylindrical body 32 and the apparatus main body 26, respectively. In addition, pulleys 37 and 38 are provided around the first cylinder 29 and the second cylinder 32, and a timing belt 39 having the same number of teeth as the pulleys 37 and 38 is stretched over the pulleys 37 and 38. It is built. Reference numeral 40 denotes a tension roller for applying a tension to the timing belt 39.
[0019]
With the above configuration, the operation will be described below. First, the heat sink 3 is sequentially supplied to the semiconductor element mounting device 1 from the upstream device (not shown) one by one on the heater block 2. Then, the transfer 10 is moved forward by one pitch of a predetermined length by a reciprocating drive source (not shown) to be engaged with each heat sink 3 on the transport path by each feed claw 11 and moved. (Not shown), the transfer 10 is swung upward with the rear end as a fulcrum to release the engagement between the heat sink 3 and the feed claw 11, and is further moved backward by the reciprocating drive source to return one pitch, Repeatedly swinging the transfer 10 downward by using the swing drive source with the rear end as a fulcrum, during which each work is performed at each work station as described later.
[0020]
In the first workpiece thickness detection station, the thickness measurement sensor 20 measures the thickness of the heat sink 3 in a state where the suction force is “weak” through the suction hole 12 connected to the vacuum source 15. In this case, the length from the heater block 2, which is the reference surface of the heat sink 3, that is, the thickness t of the heat sink 3, is detected. Based on the thickness information from the thickness measurement sensor 20, the descending amount of the mounting nozzle 22 is determined. Calculated by the control device.
[0021]
At the next solder application station, the solder 5 is applied onto the heat sink 3 in a state where the suction force is “medium” through the suction hole 12 and the application nozzle 21 moved in the plane direction is lowered.
[0022]
At the next mounting station, the mounting nozzle 22 moved in the planar direction via the solder 5 is lowered onto the heat sink 3 in a state where the suction force is “strong” through the suction hole 12 and the die 6 is mounted. In this case, since the descending amount of the mounting nozzle 22 is calculated by the control device, that is, the standard thickness (thickness reference value) of the heat sink 3 stored in the RAM (storage device) of the control device configured by a microcomputer. ) Is set to T, and the thickness of the solder 5 after mounting is set to 100 μm, the descending amount of the mounting nozzle 22 is reduced from the lower surface of the die 6 adsorbed and held by the mounting nozzle 22 at the standby position. It is a value obtained by subtracting 100 μm from the distance Z to the upper surface, but is constant by lowering it taking into account the difference between the standard thickness T and the thickness t of the heat sink 3 obtained by the thickness measurement sensor 20. The solder thickness (100 μm) can be obtained. Accordingly, it is possible to secure the solder thickness after bonding that covers the thickness variation in manufacturing the heat sink 3. In this case, a so-called scrubbing operation is performed.
[0023]
In the next transfer station and the next transfer station, a work in which the die 6 is mounted via the solder 5 on the heat sink 3 in which the suction force is “weak” and is sucked through the suction hole 12. 7 is transferred to the carrier jig 9 by the transfer device 8 two by two.
[0024]
Hereinafter, the operation of the transfer device 8 will be described in detail. First, when a drive source (not shown) is driven, the first transfer nozzle 31 and the second transfer nozzle 34 are lowered while being guided by the nuts 30 and 33, and each workpiece 7 is vacuum-sucked to be on the heater block 2. Take out from.
[0025]
Then, when the drive cylinder 25 is driven, the rod extends, and the apparatus main body 26 rotates 90 degrees counterclockwise with the first transfer nozzle 31 as a fulcrum while the connecting shaft 28 draws an arc-shaped locus indicated by a one-dot chain line. The state shown in FIGS. 2 and 3 is changed to the state shown in FIGS.
[0026]
At this time, the apparatus main body 26 is rotated 90 degrees counterclockwise by the bearing 35 with the first transfer nozzle 31 whose rotation is restricted by the nut 30 by the extension of the rod as a fulcrum, as shown in FIG. In addition, when the first transfer nozzle 31 is lowered as described above, the leading work 7 of the heater block 2 can be transferred to the storage portion of the carrier jig 9, as indicated by A to D in FIGS. In addition, the position of the pulley 37 can be transferred without changing the orientation of the workpiece 7.
[0027]
Further, in this way, the first cylinder 29 and the first transfer nozzle 31 do not rotate, but are provided so that the timing belt 39 straddles the pulleys 37 and 38 around the first cylinder 29 and the second cylinder 32. Therefore, when the apparatus main body 26 rotates 90 degrees, the pulley 38 rotates 90 degrees, so that the second cylinder 32 (and the second transfer nozzle 34) rotates clockwise through the bearing 36. Will be rotated 90 degrees. Therefore, as a result, as shown by E to H in FIGS. 3 and 8, the carrier jig is in a state where the orientation of the second work 7 on the heater block 2 adsorbed by the second transfer nozzle 34 is not changed. Can be transferred to 9 storage units. In addition, the first transfer nozzle 31 and the second transfer nozzle 34 simultaneously align the plurality of workpieces 7 sucked and taken out on the heater block 2 in the same direction. It can be transferred and stored in the carrier jig 9 in a state.
[0028]
After this transfer, the carrier jig 9 is transported by two pitches by a drive source (not shown) to prepare for the next transfer. As described above, two workpieces 7 can be sequentially transferred from the heater block 2 to the storage portion of the carrier jig 9 in the same direction by the transfer device 8.
[0029]
In this embodiment, two transfer nozzles are provided. However, the number of transfer nozzles is not limited to two, and three or more including nozzles, pulleys, and bearings may be provided.
[0030]
Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.
[0031]
【The invention's effect】
As described above, according to the present invention, it is possible to reliably prevent overrun of each heat sink at each work station when transporting the heat sink on the transport path, and to set the vacuum regulator for each suction path to the minimum necessary. Thus, it is possible to prevent the occurrence of scratches and to prevent the heat sink surface from being oxidized as much as possible.
[Brief description of the drawings]
FIG. 1 is a partial front view of a workpiece storage device.
FIG. 2 is a partial plan view of the work storage device.
FIG. 3 is a plan view of the transfer device.
FIG. 4 is a longitudinal front view of the transfer device.
FIG. 5 is a partially longitudinal side view of the transfer device.
FIG. 6 is a partially longitudinal side view of the transfer device.
FIG. 7 is a partial plan view of the work storage device after the transfer operation.
FIG. 8 is a plan view of the transfer device after the transfer operation.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Mounting apparatus 2 Heater block 3 Heat sink 4 Intermittent feeder 7 Work 9 Carrier jig 10 Transfer 11 Feeding nail 12 Suction hole 14 Vacuum regulator 15 Vacuum source 21 Coating nozzle 22 Mounting nozzle

Claims (2)

  In the semiconductor device mounting apparatus, a die is mounted via solder on each heat sink intermittently fed to a plurality of work stations while sliding on a transport path formed in the heater block by each feed claw of the intermittent transport device. In order to prevent overrun when the heat sink is transported by the heat sink, a suction path for vacuum-sucking the lower surface of the heat sink is formed in the heater block at each work station, and suction power is set for each suction path. A semiconductor device mounting apparatus, wherein the semiconductor device is connected to a vacuum source via each vacuum regulator. The solder coating station for applying solder onto a heat sink, comprising a transfer station for transferring the mounting station and a work of mounting the die on to the heat sink mounting the die through solder on the heat sink, by the vacuum regulator 2. The semiconductor element mounting apparatus according to claim 1 , wherein the suction force at each station is set stronger in the order of the mounting station, the solder application station, and the transfer station.

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