JPH08111436A - Mesh pattern ribbon for wiring - Google Patents
Mesh pattern ribbon for wiringInfo
- Publication number
- JPH08111436A JPH08111436A JP6268233A JP26823394A JPH08111436A JP H08111436 A JPH08111436 A JP H08111436A JP 6268233 A JP6268233 A JP 6268233A JP 26823394 A JP26823394 A JP 26823394A JP H08111436 A JPH08111436 A JP H08111436A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- mesh
- pattern
- ribbon
- mesh pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/37001—Core members of the connector
- H01L2224/3701—Shape
- H01L2224/37011—Shape comprising apertures or cavities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子機器の実装に使用
するベアチップＩＣと配線基板との間の配線に用いる配
線用メッシュ状パターンリボンに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring mesh pattern ribbon used for wiring between a bare chip IC used for mounting electronic equipment and a wiring board.
【０００２】[0002]
【従来の技術】電子機器に用いられるプリント配線基板
等への部品搭載を行うための実装技術において、図４に
示すように、ベアチップＩＣ４と、配線基板５上のパタ
ーン７との間の配線材として、メッシュリボン３を用い
て実装する方法がある。この従来技術の方法によれば、
インダクタンス成分を低く抑えることにより、ＣＯＢ
（Ｃｈｉｐ Ｏｎ Ｂｏｎｄｉｎｇ）技術であってもボ
ンディングワイヤ一本で実装する方法に比較して、超高
周波数帯域での周波数特性を、より高周波数まで伸ばす
ことができて良好な特性が得られることが知られてい
る。2. Description of the Related Art In a mounting technique for mounting components on a printed wiring board or the like used in electronic equipment, as shown in FIG. 4, wiring material between a bare chip IC 4 and a pattern 7 on a wiring board 5 is used. There is a method of mounting using the mesh ribbon 3. According to this prior art method,
By keeping the inductance component low, COB
Even with the (Chip On Bonding) technology, it is possible to extend the frequency characteristics in the ultrahigh frequency band to higher frequencies and obtain good characteristics, as compared with the method of mounting with only one bonding wire. Are known.
【０００３】このメッシュリボン３は、Ａｕ又はＡｌ等
の極細線（２０〜３０μｍφ）を用いてメッシュ状に編
んで個片に形成したものである。そのために、極細線
で構成されているので、全体が柔らかく、メッシュリボ
ン３がお互いに接触すると張り付いて絡んでしまうなど
取り扱いが難しい、従ってメッシュリボン３をハンド
リングして、ベアチップＩＣ４及び配線基板５の上にあ
るボンディングパッド６と位置合わせをするのに時間を
要してしまうので効率が悪い、その上、メッシュリボ
ン３を変形させてメッシュ状態を保っていないようにな
ると周波数特性が低下してしまう、などの欠点を有して
いた。The mesh ribbon 3 is formed by knitting into a mesh shape using an ultrafine wire (20 to 30 μmφ) such as Au or Al to form an individual piece. Therefore, since it is made up of ultrafine wires, it is difficult to handle because the whole is soft and the mesh ribbons 3 stick to each other and get entangled when they come into contact with each other. Since it takes time to align with the bonding pad 6 on the upper side, it is inefficient. Moreover, when the mesh ribbon 3 is deformed and the mesh state is not maintained, the frequency characteristic deteriorates. It had the drawback of being lost.
【０００４】[0004]
【発明が解決しようとする課題】本発明が解決しようと
する課題は、部品搭載を行う実装技術において、実装を
行うための配線材として用いられる配線用メッシュリボ
ンが持つ超高周波数帯域での良好な周波数特性が損なわ
れないようにするために、（イ）取り扱いが容易で変形
せず、（ロ）ボンディング作業も効率的にできる構成の
配線用メッシュリボンを得ることである。The problem to be solved by the present invention is, in the mounting technology for mounting components, good in a super high frequency band possessed by a wiring mesh ribbon used as a wiring material for mounting. In order to prevent the frequency characteristics from being impaired, (a) to obtain a wiring mesh ribbon having a configuration that is easy to handle and does not deform, and (b) that is capable of efficient bonding work.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決するため
に、本発明による配線用メッシュリボンの構成において
は、機械的性質では屈曲性があり、電気的性質では絶縁
性があるフィルムの一方の面上に、導電性のある材料を
用いたメッシュ状の配線用パターンを形成して構成した
配線用メッシュ状パターンリボンを実現した。In order to solve the above-mentioned problems, in the structure of the mesh ribbon for wiring according to the present invention, one of films having flexibility in mechanical properties and insulating properties in electrical properties is used. A mesh-shaped pattern ribbon for wiring is realized by forming a mesh-shaped wiring pattern using a conductive material on the surface.
【０００６】[0006]
（１）本発明による配線用メッシュ状パターンリボン
は、メッシュ状パターンが形成されている面上のボンデ
ィング位置と、ベアチップＩＣ及び配線基板上の配線パ
ターンのボンディングパッドとを向き合わせ、フィルム
のもう一方の面上から圧着して使用する。 （２）メッシュ状パターンが形成された基板であるフィ
ルムは、物理的には耐熱性の高いもので構成されかつ、
極めて薄い（数μｍ〜数１０μｍ）ので、熱を加えての
圧着や超音波を加えての圧着によって起こる熱変化量は
吸収することができるので配線品質を損なうことがな
い。 （３）メッシュ状パターンが形成されるのは、フィルム
上なので取り扱いが容易であるために、位置合わせが容
易に精度良く効率的に可能である。(1) In the wiring mesh-shaped pattern ribbon according to the present invention, the bonding position on the surface on which the mesh-shaped pattern is formed and the bonding pad of the wiring pattern on the bare chip IC and the wiring substrate are made to face each other, Use by crimping from above. (2) The film, which is the substrate on which the mesh-shaped pattern is formed, is physically composed of a material having high heat resistance, and
Since it is extremely thin (several .mu.m to several tens .mu.m), the amount of heat change caused by pressure bonding by applying heat or pressure bonding by applying ultrasonic waves can be absorbed, so that wiring quality is not impaired. (3) Since the mesh-shaped pattern is formed on the film, it is easy to handle, so that the alignment can be performed easily, accurately and efficiently.
【０００７】[0007]
【実施例】図１は本発明の実施例による配線用メッシュ
状パターンリボンの概念を示す平面図及びその断面図で
ある。図２は、他の実施例の配線用メッシュ状パターン
リボンであり複数で、かつ回路配線のための配線パター
ンが形成される概念を示す平面図である。図３は、同じ
く他の実施例による配線用メッシュ状パターンリボンの
概念を示す平面図及びその断面図であり、ボンディング
エリア８の位置にフィルム２を排除した穴９を設けたも
のである。FIG. 1 is a plan view and a sectional view showing the concept of a mesh pattern ribbon for wiring according to an embodiment of the present invention. FIG. 2 is a plan view showing a concept of forming a plurality of wiring mesh pattern ribbons for wiring according to another embodiment and forming a wiring pattern for circuit wiring. 3A and 3B are a plan view and a sectional view showing the concept of a mesh pattern ribbon for wiring according to another embodiment, in which a hole 9 for removing the film 2 is provided at the position of the bonding area 8.
【０００８】（１）図１は、本発明の配線用メッシュ状
パターンリボン１１である。構成としては、物理的性質
から見れば、機械的な屈曲性があり、電気的な絶縁性が
あり、かつ熱的に耐熱性のあるフィルム２、例えばポリ
イミドフィルムの一方の面上に導電性がある良導体例え
ばＡｕ、Ａｌ等を用いてメッシュ状パターン１を形成す
る。メッシュ状パターン１の形成には、例えばフォトエ
ッチング法や選択メッキ法が用いられる。従って、本発
明の配線用メッシュ状パターンリボン１１は、同一の外
形形状、パターン形状及び均一なフィルム厚さ、メッシ
ュ状パターン厚さが得易くなった。(1) FIG. 1 shows a wiring mesh pattern ribbon 11 of the present invention. As a constitution, in view of physical properties, a film 2 having mechanical flexibility, electrical insulation, and heat resistance to heat, such as a polyimide film, has conductivity on one side. The mesh-shaped pattern 1 is formed by using a good conductor such as Au or Al. To form the mesh pattern 1, for example, a photo etching method or a selective plating method is used. Therefore, in the wiring mesh pattern ribbon 11 of the present invention, it is easy to obtain the same outer shape, pattern shape, uniform film thickness, and mesh pattern thickness.
【０００９】（２）上記のような構成方法なので、本発
明の配線用のメッシュ状パターン１の形状は、パターン
設計によって自由に変更できるので特性のバラツキの少
ないものが得られる。 （３）ベアチップＩＣ４や配線基板５上のパターン７上
のボンディングパッド６に合わせてボンディングエリア
８を設けることも必要に応じてできるのでより確実なボ
ンディング作業が実現できた。 （４）また、メッシュ状パターン１の中のボンディング
される位置又はボンディングエリア８の位置にフィルム
２を排除した穴９を設けることで、メッシュ状パターン
１の上から圧着することができるので、パッシベーショ
ン（絶縁処理）のないベアチップＩＣ４の配線が可能と
なった。 （５）更に、本発明の配線用メッシュ状パターンリボン
１１の構成によれば、１個だけではなく複数個形成する
ことが容易に可能で、配線パターン１０を形成すること
もできるので配線用回路を構成することも可能となっ
た。(2) With the above construction method, the shape of the mesh pattern 1 for wiring according to the present invention can be freely changed by pattern design, so that the variation in characteristics can be obtained. (3) Since the bonding area 8 can be provided in accordance with the bonding pad 6 on the bare chip IC 4 or the pattern 7 on the wiring substrate 5, more reliable bonding work can be realized. (4) Further, by providing the holes 9 excluding the film 2 at the positions to be bonded or the positions of the bonding areas 8 in the mesh pattern 1, the mesh pattern 1 can be pressure-bonded, so that the passivation is performed. Wiring of bare chip IC 4 without (insulation treatment) has become possible. (5) Furthermore, according to the structure of the wiring mesh pattern ribbon 11 of the present invention, not only one but a plurality can be easily formed, and the wiring pattern 10 can also be formed, so that the wiring circuit can be formed. It has become possible to configure
【００１０】（６）本発明の配線用メッシュ状パターン
リボン１１を用いてベアチップＩＣ４と配線基板５との
間の配線を行うときは、例えばメッシュ状パターン１が
形成されている面と、ベアチップＩＣ４のボンディング
面及び配線基板５上のパターン７面とを向き合わせ、ボ
ンディング位置を合わせてフィルム２の上から熱を加え
ながら圧着するか、超音波を加えながら圧着して行う。(6) When wiring between the bare chip IC 4 and the wiring substrate 5 is performed using the wiring mesh pattern ribbon 11 of the present invention, for example, the surface on which the mesh pattern 1 is formed and the bare chip IC 4 are formed. The bonding surface and the pattern 7 surface on the wiring substrate 5 are faced to each other, and the bonding positions are aligned to perform pressure bonding from the top of the film 2 while applying heat or applying ultrasonic waves.
【００１１】[0011]
【発明の効果】本発明は、以上説明したように構成され
ているので、以下に記載されるような効果を奏する。 （１）本発明の配線用メッシュ状パターンリボンは、フ
ィルム上に形成されている構成なので取り扱いやすく変
形しない。従って、メッシュ状パターンの持つ周波数特
性が全く損なわれず超高周波数帯域（数ＧＨｚ〜数１０
ＧＨｚ）での確実な適用が可能となった。 （２）本発明の配線用メッシュ状パターンリボンは、パ
ッシベーションの施されていないベアチップＩＣを実装
せねばならない場合にも適用が可能となった。 （３）また、本発明の配線用メッシュ状パターンリボン
の形成によれば、複数個での構成や配線パターンによる
回路接続もできるので、作業効率と設計自由度も向上し
た。Since the present invention is configured as described above, it has the following effects. (1) Since the wiring pattern mesh ribbon of the present invention is formed on a film, it is easy to handle and does not deform. Therefore, the frequency characteristic of the mesh pattern is not impaired at all, and the ultra-high frequency band (several GHz to several tens) is used.
It became possible to surely apply at (GHz). (2) The mesh pattern ribbon for wiring according to the present invention can be applied even when a bare chip IC that is not passivated must be mounted. (3) Further, according to the formation of the mesh-shaped patterned ribbon for wiring of the present invention, it is possible to make a circuit connection by a plurality of configurations and wiring patterns, so that the working efficiency and the degree of freedom in design are improved.
【図１】本発明の実施例の概念を示す平面図及びその断
面図である。FIG. 1 is a plan view and a cross-sectional view showing the concept of an embodiment of the present invention.
【図２】本発明の他の実施例の概念を示す平面図であ
る。FIG. 2 is a plan view showing the concept of another embodiment of the present invention.
【図３】本発明の第３の実施例の概念を示す断面図であ
る。FIG. 3 is a sectional view showing the concept of the third embodiment of the present invention.
【図４】従来技術による配線用メッシュリボンによる実
装の概念を示す平面図及び断面図である。4A and 4B are a plan view and a cross-sectional view showing the concept of mounting with a wiring mesh ribbon according to a conventional technique.
１ メッシュ状パターン ２ フィルム ３ メッシュリボン ４ ベアチップＩＣ ５ 配線基板 ６ ボンディングパッド ７ パターン ８ ボンディングエリア ９ 穴 １０ 配線パターン １１ メッシュ状パターンリボン 1 mesh pattern 2 film 3 mesh ribbon 4 bare chip IC 5 wiring board 6 bonding pad 7 pattern 8 bonding area 9 hole 10 wiring pattern 11 mesh pattern ribbon
Claims (6)
あるフィルム（２）の一方の面上に、導電性金属で配線
用のメッシュ状パターン（１）を形成する、ことを特徴
とする配線用メッシュ状パターンリボン。1. A mesh-like pattern (1) for wiring is formed of a conductive metal on one surface of a film (2) having mechanical flexibility and electrical insulation. Wire pattern mesh ribbon for wiring.
（１）の形状を任意の形状としたことを特徴とする請求
項１記載の配線用メッシュ状パターンリボン。2. The mesh-shaped pattern ribbon for wiring according to claim 1, wherein the mesh-shaped patterned ribbon for wiring has an arbitrary shape.
にボンディングエリア（８）を形成したことを特徴とす
る請求項１又は２記載の配線用メッシュ状パターンリボ
ン。3. The mesh pattern ribbon for wiring according to claim 1, wherein a bonding area (8) is formed in the mesh pattern (1) for wiring.
に形成したボンディングエリア（８）の位置にフィルム
（２）を排除した穴（９）を設けたことを特徴とする請
求項１、２又は３記載の配線用メッシュパターンリボ
ン。4. The hole (9) excluding the film (2) is provided at the position of the bonding area (8) formed in the wiring mesh pattern (1). The mesh pattern ribbon for wiring according to 2 or 3.
のメッシュ状パターン（１）を設けたことを特徴とする
請求項１、２、３、又は４記載の配線用メッシュ状パタ
ーンリボン。5. The wiring mesh pattern ribbon according to claim 1, 2, 3 or 4, wherein a plurality of wiring mesh patterns (1) are provided on the same film (2). .
ン（１）は、複数特定の上記メッシュ状パターン（１）
との間に配線パターン（１０）を設けたことを特徴とす
る配線用メッシュ状パターンリボン。6. A plurality of mesh-shaped patterns (1) according to claim 5, wherein a plurality of specific mesh-shaped patterns (1) are provided.
A mesh pattern ribbon for wiring, characterized in that a wiring pattern (10) is provided between the pattern ribbon and the wiring pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6268233A JPH08111436A (en) | 1994-10-06 | 1994-10-06 | Mesh pattern ribbon for wiring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6268233A JPH08111436A (en) | 1994-10-06 | 1994-10-06 | Mesh pattern ribbon for wiring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08111436A true JPH08111436A (en) | 1996-04-30 |
Family
ID=17455759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6268233A Withdrawn JPH08111436A (en) | 1994-10-06 | 1994-10-06 | Mesh pattern ribbon for wiring |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08111436A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007194270A (en) * | 2006-01-17 | 2007-08-02 | Ultrasonic Engineering Co Ltd | Bonding ribbon and bonding method using the same |
| WO2010119416A2 (en) * | 2009-04-17 | 2010-10-21 | Nxp B.V. | Foil and method for foil-based clip-and/or wire-bonding and resulting package |
-
1994
- 1994-10-06 JP JP6268233A patent/JPH08111436A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007194270A (en) * | 2006-01-17 | 2007-08-02 | Ultrasonic Engineering Co Ltd | Bonding ribbon and bonding method using the same |
| JP4612550B2 (en) * | 2006-01-17 | 2011-01-12 | 超音波工業株式会社 | Bonding ribbon for power device and bonding method using the same |
| WO2010119416A2 (en) * | 2009-04-17 | 2010-10-21 | Nxp B.V. | Foil and method for foil-based clip-and/or wire-bonding and resulting package |
| WO2010119416A3 (en) * | 2009-04-17 | 2011-08-25 | Nxp B.V. | Foil and method for foil-based clip-and/or wire-bonding and resulting package |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20020115 |