JPH08109242A - Epoxy resin composition for sealing of semiconductor - Google Patents

Abstract

PURPOSE: To improve the fluidity, soldering crack resistance, low hygroscopicity, and heat resistance by incorporating a particular epoxy resin, an epoxy resin curing agent, an inorganic filler, and a curing accelerator. CONSTITUTION: 20 to 90 pts.wt. 4,4'-bisphenol F epoxy resin of the formula I (wherein m is 0 to 0.5 on the average), 10 to 80 pts.wt. bisphenol epoxy resin of the formula II (wherein R is H, a 1-10C alkyl, a (substd.) phenyl, a (substd.) aralkyl, a 1-10C alkoxy, or a halogen, and n is m), an epoxy resin curing agent in an amt. of 0.5 to 2.0 mol, in terms of total amt. of groups reactive with the epoxy group, per mol of epoxy group in the whole epoxy resin component, 60 to 95wt.%, based on the whole compsn., inorg. filler, and 0.1 to 7wt.%, based on the epoxy resin, curing accelerator are mixed together.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for encapsulating a semiconductor, which gives a cured product having excellent fluidity and solder crack resistance.

[0002]

2. Description of the Related Art Epoxy resin compositions are used for adhesion, casting, encapsulation, lamination, because of their excellent cured properties and ease of handling.
It is used in a wide range of fields such as molding and painting. There are many types of epoxy resins, and the cured physical properties vary greatly depending on the selection, so they are used properly according to the field of use and purpose.

In recent years, as the use conditions of polymer materials have become severer, various characteristics required for polymer materials have become strict, and various epoxy resins generally used satisfy the required characteristics sufficiently. I can't.

For example, an epoxy resin composition is used for encapsulating a semiconductor, but the required performance is becoming strict in this field as well. That is, as the degree of integration of semiconductor devices has increased, the size of semiconductor elements has increased significantly, and the packages themselves have become smaller and thinner. In addition, the mounting of semiconductor devices is also shifting to surface mounting, and in surface mounting, semiconductor devices are directly immersed in a solder bath and exposed to high temperatures, which causes a large expansion of the entire package due to the rapid expansion of absorbed moisture. Stress is applied and the sealing material cracks. Therefore, an epoxy resin composition for a sealing material having good solder crack resistance is required to have high heat resistance (that is, high glass transition temperature), low hygroscopicity and low stress.

Further, with the miniaturization and thinning of packages, epoxy resin compositions for encapsulants are required to have high fluidity.

It is also widely practiced to improve the properties of low hygroscopicity and low stress (that is, low coefficient of thermal expansion) by highly filling an inorganic filler such as fused silica powder,
Although it has a great effect on improving the solder crack resistance, the epoxy resin for the encapsulant is also required to have a low melt viscosity because high flow of the inorganic filler impairs the flowability during molding. It was

The cresol novolac type epoxy resin which is mainly used at present has become insufficient in view of low melt viscosity.

The tetramethylbiphenol type epoxy resin is known to give a cured product excellent in solder crack resistance because it has a low melt viscosity and relatively high heat resistance (Japanese Patent Laid-Open No. 61-61). No. 47725), it cannot be said to be sufficient to meet the more severe demand for low melt viscosity in recent years.

The bisphenol A type epoxy resin and the bisphenol F type epoxy resin have a lower melt viscosity, but generally, these epoxy resins are liquid at room temperature, and the epoxy resin composition for encapsulant used as powder is used. Is difficult to use. Further, these epoxy resins also have insufficient heat resistance.

[0010]

SUMMARY OF THE INVENTION It is an object of the present invention to provide an epoxy resin composition for semiconductor encapsulation which gives a cured product having excellent fluidity and solder crack resistance.

[0011]

As a result of various studies to solve the above-mentioned problems, the present inventors have identified a specific bisphenol F type epoxy resin and a specific biphenol type epoxy resin as epoxy resins. The purpose could be achieved by using a mixture of the following ratios.

That is, the epoxy resin composition for semiconductor encapsulation of the present invention is an epoxy resin composition containing at least an epoxy resin, an epoxy resin curing agent, an inorganic filler and a curing accelerator. Of the general formula (I)

[0013]

Embedded image (In the formula, m is an average value of 0 to 0.5.) 4,4′-bisphenol F type epoxy resin 20
~ 90 parts by weight and the following general formula (II)

[0014]

[Chemical 4] (Wherein, R is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms,
A substituted or unsubstituted phenyl group, a substituted or unsubstituted aralkyl group, an alkoxy group having 1 to 10 carbon atoms, or a halogen atom, each R may be the same or different, and n is an average value. And is a number from 0 to 0.5. ) Biphenol type epoxy resin 10 represented by
The composition is characterized by using an epoxy resin whose main component is an epoxy resin consisting of -80 parts by weight.

Since a general bisphenol F type epoxy resin is a mixture of three kinds of isomers of 2,2'-form, 2,4'-form and 4,4'-form, its 2,2 ' The two isomers of the -form and the 2,4'-form hinder the crystallization of the 4,4'-form, are liquid at room temperature, and have high viscosity, and further give a cured product having low heat resistance. is there.

On the other hand, the 4,4'-bisphenol F type epoxy resin represented by the general formula (I) used in the present invention [hereinafter, referred to as "4,4'-bisphenol F"
It may be abbreviated as "type epoxy resin (I)". ] Is
Since it is composed only of 4,4′-form, it is a crystal (solid) at room temperature, and the average value of m in the general formula (I) is in the range of 0 to 0.5. It is possible to provide a cured product having a low viscosity and relatively excellent heat resistance.

Further, the above-mentioned general formula (II) used in the present invention
The biphenol-type epoxy resin represented by (hereinafter, may be abbreviated as "biphenol-type epoxy resin (II)") is a crystal (solid) at room temperature and has an average of n in the general formula (II). Since the value is in the range of 0 to 0.5, a cured product having a low melt viscosity and relatively excellent heat resistance can be provided.

The epoxy resin used in the present invention is
20 to 90 parts by weight, preferably 30 to 80 parts by weight of the specific 4,4′-bisphenol F type epoxy resin (I) and the specific biphenol type epoxy resin (I
The epoxy resin composition of the present invention is excellent in the fluidity of the composition because it is an epoxy resin whose main component is 10 to 80 parts by weight of I), preferably 20 to 70 parts by weight. At the same time, it is possible to provide a cured product having excellent heat resistance, a low moisture absorption rate, and excellent solder crack resistance. When the proportion of the 4,4′-bisphenol F type epoxy resin (I) is too large, the composition has excellent fluidity, but the heat resistance of the cured product decreases, and the biphenol type epoxy resin (II If the ratio of (1) is too large, the heat resistance of the cured product will be excellent, but the fluidity of the composition will deteriorate, so the ratio of both will be within the above range.

The 4,4'-bisphenol F type epoxy resin (I) can be produced by subjecting 4,4'-bisphenol F and epihalohydrin to a condensation reaction in the presence of an alkali.

A typical example of the method for producing the 4,4'-bisphenol F type epoxy resin (I) is described in detail below. First, 4,4'-bisphenol F is dissolved in an amount of epihalohydrin corresponding to 3 to 20 mol per mol of the phenolic hydroxyl group to form a uniform solution. Then
While stirring the solution, an alkali metal hydroxide in an amount of 1 to 2 mol per mol of the phenolic hydroxyl group is added as a solid or an aqueous solution and reacted. This reaction can be carried out under normal pressure or reduced pressure, and the reaction temperature is usually about 30 to 105 ° C. in the case of reaction under normal pressure and about 30 to 80 ° C. in the case of reaction under reduced pressure. is there. In the reaction, the reaction solution is azeotroped while maintaining a predetermined temperature if necessary, and the condensate obtained by cooling the vaporizing vapor is separated into oil and water, and the oil content excluding water is returned to the reaction system. It is dehydrated from the reaction system depending on the method. The addition of the alkali metal hydroxide is intermittently or continuously added little by little over 1 to 8 hours in order to suppress a rapid reaction. The total reaction time is usually 1 to
It is about 10 hours.

After completion of the reaction, the insoluble by-product salt is removed by filtration or washed with water, and the unreacted epihalohydrin is removed by distillation under reduced pressure to remove the desired 4,4'-bisphenol F type epoxy resin ( I) is obtained.

Epichlorohydrin or epibromohydrin is usually used as the epihalohydrin in this reaction, and NaOH or KOH is usually used as the alkali metal hydroxide.

In this reaction, quaternary ammonium salts such as tetramethylammonium chloride and tetraethylammonium bromide; tertiary amines such as benzyldimethylamine and 2,4,6- (trisdimethylaminomethyl) phenol; A catalyst such as imidazoles such as 2-ethyl-4-methylimidazole and 2-phenylimidazole; phosphonium salts such as ethyltriphenylphosphonium iodide; phosphines such as triphenylphosphine may be used.

Further, in this reaction, alcohols such as ethanol and isopropanol; acetone,
Ketones such as methyl ethyl ketone; ethers such as dioxane and ethylene glycol dimethyl ether; inert organic solvents such as aprotic polar solvents such as dimethyl sulfoxide and dimethylformamide may be used.

Furthermore, 4, obtained as described above,
When the amount of the saponifiable halogen of the 4'-bisphenol F type epoxy resin is too large, it can be reprocessed to obtain a purified epoxy resin having a sufficiently reduced amount of the saponifiable halogen. For example, the crude epoxy resin is isopropanol, methyl ethyl ketone, methyl isobutyl ketone,
It is redissolved in an inert organic solvent such as toluene, xylene, dioxane, propylene glycol monomethyl ether or dimethyl sulfoxide, and an alkali metal hydroxide is added as a solid or an aqueous solution at a temperature of about 30 to 120 ° C.
After the ring closure reaction was carried out for 5 to 8 hours, excess alkali metal hydroxide and by-product salts were removed by a method such as washing with water, and the organic solvent was distilled off under reduced pressure to give purified 4,4 A'-bisphenol F type epoxy resin is obtained.

Next, the biphenol type epoxy resin (II) can be produced by subjecting various 4,4'-biphenols and epihalohydrin to a condensation reaction in the presence of an alkali.

As the 4,4'-biphenols as a raw material for producing the biphenol type epoxy resin (II),
For example, 4,4'-biphenol, 3,3'-dimethyl-
4,4'-biphenol, 3,5-dimethyl-4,4 '
-Biphenol, 3,3'-dibutyl-4,4'-biphenol, 3,5-dibutyl-4,4'-biphenol, 3,3'-diphenyl-4,4'-biphenol,
3,3'-dibromo-4,4'-biphenol, 3,
3 ', 5,5'-tetramethyl-4,4'-biphenol, 3,3'-dimethyl-5,5'-dibutyl-4,
4'-biphenol, 3,3 ', 5,5'-tetrabutyl-4,4'-biphenol, 3,3', 5,5'-tetrabromo-4,4'-biphenol and the like can be mentioned.

If one or a mixture of two or more of these biphenols is reacted with epihalohydrin in the same manner as in the production of the 4,4'-bisphenol F type epoxy resin, the biphenol type epoxy resin used in the present invention. (II) is obtained.

Since the biphenol type epoxy resin (II) used in the present invention is commercially available under various trade names, the present invention can be carried out using the commercially available products.

The epoxy resin in the epoxy resin composition for semiconductor encapsulation of the present invention comprises the 4,4'-bisphenol F type epoxy resin (I) and the biphenol type epoxy resin (II) separately. Or a mixture of both epoxy resins obtained by reacting epihalohydrin with a mixture of 4,4′-bisphenol F and a biphenol which are raw materials for producing each epoxy resin. And the mixture may be used.

As described above, the mixing ratio of the 4,4'-bisphenol F type epoxy resin (I) and the biphenol type epoxy resin (II) is 20 to 90% by weight of the 4,4'-bisphenol F type epoxy resin. Parts, preferably 30-8
Biphenol type epoxy resin (II) for 0 parts by weight
Is 10 to 80 parts by weight, preferably 20 to 70 parts by weight. When the amount of 4,4′-bisphenol F type epoxy resin is too much, the composition has excellent fluidity but the cured product has poor heat resistance. On the other hand, if the amount of the biphenol type epoxy resin is too large, the cured product will have excellent heat resistance, but the fluidity of the composition will be poor.

The epoxy resin in the epoxy resin composition for semiconductor encapsulation of the present invention is the above-mentioned 4,4'-bisphenol F type epoxy resin (I) and the above biphenol type epoxy resin (II). It is an epoxy resin having an epoxy resin of the following ratio as a main component, and it is preferable that both epoxy resins (I) and (II) are alone, but other epoxy resins can be mixed and used.

Other epoxy resins which can be used as a mixture thereof include, for example, bisphenol A, bisphenol AD, hydroquinone, methylhydroquinone, dibutylhydroquinone, resorcin, methylresorcin, dihydroxydiphenyl ether, dihydroxynaphthalene, phenol novolac resin, Cresol novolac resin, bisphenol A novolac resin,
Various phenols such as dicyclopentadiene phenol resin, terpene phenol resin, phenol aralkyl resin, naphthol novolac resin, brominated bisphenol A, brominated phenol novolac resin, and various phenols, hydroxybenzaldehyde, crotonaldehyde, glyoxal, etc. Of various phenolic compounds such as polyhydric phenolic resins obtained by condensation reaction with various aldehydes, and an epoxy resin produced from epihalohydrin; various amine compounds such as diaminodiphenylmethane, aminophenol, and xylenediamine, Epoxy resin produced from epihalohydrin; epoxy resin produced from various carboxylic acids such as methylhexahydrophthalic acid and dimer acid, and epihalohydrin And the like.

The proportion of these other epoxy resins used is
The total amount of the 4,4′-bisphenol F type epoxy resin (I) and the biphenol type epoxy resin (II) is 100 parts by weight or less, preferably 50 parts by weight or less based on 100 parts by weight. If the proportion of the other epoxy resin used is too large, the effects of the present invention will not be sufficiently exhibited.

Next, an epoxy resin curing agent is added as an essential component to the epoxy resin composition for semiconductor encapsulation of the present invention. The epoxy resin curing agent is not particularly limited, and a general epoxy resin curing agent can be used. Agents can be used.

Examples of the epoxy resin curing agent used include bisphenol A, bisphenol F, bisphenol AD, hydroquinone, resorcin, methylresorcin, biphenol, tetramethylbiphenol, dihydroxynaphthalene, dihydroxydiphenyl ether, phenol novolac resin, cresol novolac resin, and Various phenols such as bisphenol A novolac resin, dicyclopentadiene phenol resin, terpene phenol resin, phenol aralkyl resin, naphthol novolac resin, brominated bisphenol A, brominated phenol novolac resin; various phenols, hydroxybenzaldehyde, croton Many compounds obtained by condensation reaction with various aldehydes such as aldehydes and glyoxal Various phenolic resins such as phenolic resins; active ester compounds obtained by esterifying all or part of the phenolic hydroxyl groups of these various phenols (resins) with benzoate or acetate and the like; methyltetrahydrophthalic anhydride Acids, acid anhydrides such as hexahydrophthalic anhydride, pyromellitic dianhydride, and methyl nadic acid; amines such as diethylenetriamine, isophoronediamine, diaminodiphenylmethane, diaminodiphenylsulfone, and dicyandiamide.

Among these various epoxy resin curing agents, various phenols (resins) or active ester compounds thereof are preferable from the viewpoint of cured physical properties and the like.

The amount of the epoxy resin curing agent used in the epoxy resin composition for semiconductor encapsulation of the present invention is such that the epoxy group in the total epoxy resin curing agent component is based on 1 mole of the epoxy group in the total epoxy resin component. The total amount of the groups that react with the groups is preferably 0.5 to 2.0 mol, more preferably 0.7 to 1.2 mol.

Next, the epoxy resin composition for semiconductor encapsulation of the present invention is compounded with an inorganic filler. Examples of the kind of the inorganic filler include fused silica, crystalline silica, glass powder, alumina, calcium carbonate and the like. Its shape is a crush type or a spherical shape. Various inorganic fillers may be used alone or in combination of two or more, and among them, fused silica or crystalline silica is preferable. The amount used is 60 to 95% by weight of the entire composition.
And more preferably 80 to 93% by weight.

A curing accelerator is added to the epoxy resin composition for semiconductor encapsulation of the present invention, and the curing accelerator reacts with the epoxy group in the epoxy resin and the active group in the curing agent. It is a accelerating compound.

Examples of the curing accelerator include phosphine compounds such as tributylphosphine, triphenylphosphine, tris (dimethoxyphenyl) phosphine, tris (hydroxypropyl) phosphine, tris (cyanoethyl) phosphine; tetraphenylphosphonium tetraphenylborate, Phosphonium salts such as methyltributylphosphonium tetraphenylborate and methyltricyanoethylphosphonium tetraphenylborate; 2-methylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole, 2-
Undecyl imidazole, 1-cyanoethyl-2-methyl imidazole, 2,4-dicyano-6- [2-methyl imidazolyl- (1)]-ethyl-S-triazine,
Imidazoles such as 2,4-dicyano-6- [2-undecylimidazolyl- (1)]-ethyl-S-triazine; 1-cyanoethyl-2-undecylimidazolium trimellitate, 2-methylimidazolium isocyanate Nurate, 2-ethyl-4-methylimidazolium tetraphenylborate, 2-ethyl-1,4-dimethylimidazolium tetraphenylborate and other imidazolium salts; 2,4,6-tris (dimethylaminomethyl) phenol, benzyl Amines such as dimethylamine, tetramethylbutylguanidine, N-methylpiperazine and 2-dimethylamino-1-pyrroline; ammonium salts such as triethylammonium tetraphenylborate; 1,5-diazabicyclo (5,4,0) -7 −
Undecene, 1,5-diazabicyclo (4,3,0)-
5-nonene, 1,4-diazabicyclo (2,2,2)-
Diazabicyclo compounds such as octane; tetraphenylborate, phenol salt, phenol novolac salt, 2-ethylhexanoate, etc. of these diazabicyclo compounds.

Among the compounds serving as the curing accelerator, phosphine compounds, imidazole compounds, diazabicyclo compounds, and salts thereof are preferable.

These curing accelerators are used alone or in admixture of two or more, and the amount used is 0.1 to 7% by weight, preferably 1 to 5% by weight, based on the epoxy resin. .

The epoxy resin composition for semiconductor encapsulation of the present invention may optionally contain a coupling agent, a plasticizer, a pigment and the like, if necessary. Also, as a flame retardant aid,
Antimony trioxide, phosphoric acid, etc. can be appropriately mixed.

Since the epoxy resin composition for semiconductor encapsulation of the present invention provides a cured product having excellent fluidity and solder crack resistance, it can be advantageously used in the field of semiconductor encapsulation.

The epoxy resin production examples, examples and comparative examples will be described in more detail below.

Epoxy Resin Production Example 1 Contents of 3000 ml equipped with thermometer, stirrer and cooling tube
Add 4,4'-bisphenol F20 to a 3-necked flask.
0 g, epichlorohydrin 1295 g, and isopropyl alcohol 504 g were charged, the temperature was raised to 35 ° C. to uniformly dissolve, and 190 g of a 48.5 wt% sodium hydroxide aqueous solution was added dropwise over 1 hour. During that time, the temperature was gradually raised so that the temperature inside the system became 65 ° C. at the end of the dropping. Then, the reaction was carried out by holding at 65 ° C. for 30 minutes. After completion of the reaction, the by-product salt and excess sodium hydroxide were removed by washing with water. Then, excess epichlorohydrin and isopropyl alcohol were distilled off from the product under reduced pressure to obtain a crude epoxy resin.

This crude epoxy resin was dissolved in 400 g of methyl isobutyl ketone, 6 g of a 48.5 wt% sodium hydroxide aqueous solution was added, and the mixture was reacted at a temperature of 65 ° C. for 1 hour. After the reaction was completed, sodium phosphate monobasic was added to neutralize excess sodium hydroxide, and the product was washed with water to remove by-product salts. Then, methyl isobutyl ketone was completely removed under reduced pressure to obtain 4,4′-bisphenol F type epoxy resin.

This epoxy resin has an epoxy equivalent of 164
g / eq. It was a yellowish white crystalline solid having a melting point of 51 ° C. and a value of m in the general formula (I) of 0.1.

Production Example 2 of Epoxy Resin 200 g of 4,4′-bisphenol F used in Production Example 1
Instead of 160 g of 4,4'-bisphenol F,
A mixture of 40 g of 4,4'-biphenol was reacted with epichlorohydrin in the same manner as in Production Example 1 and post-treated to obtain a mixture of 4,4'-bisphenol F type epoxy resin and biphenol type epoxy resin.

This epoxy resin has an epoxy equivalent of 163.
g / eq. Of the general formula (I)
4,4'-bisphenol F having a value of m of 0.1
80% by weight of a type epoxy resin and n in the general formula (II)
20% by weight of biphenol type epoxy resin with a value of 0.1
Was a mixture of.

Examples 1 to 5 and Comparative Examples 1 to 3 As shown in Table 1, as an epoxy resin, the epoxy resin obtained in Production Example 1, each epoxy resin obtained in Production Example 2, and commercially available biphenol type Epoxy resin (A or B),
A cresol novolac type epoxy resin and a brominated epoxy resin are each used, a commercially available phenol novolac resin (C) or a commercially available terpene phenol resin (D) is used as an epoxy resin curing agent, and a commercially available crushing type melt is used as an inorganic filler. Silica powder (Examples 1-5 and Comparative Examples 1-2 are 82% by weight based on the total composition, Comparative Example 3
Is 75% by weight based on the total composition), triphenylphosphine is used as a curing accelerator, antimony trioxide is used as a flame retardant aid, and commercially available epoxysilane is used as a surface treatment agent for the inorganic filler. Each epoxy resin composition was compounded using carnauba wax as a mold.

Then, the respective blends were melt mixed for 5 minutes at a temperature of 70 to 130 ° C. using a mixing roll. Each of the obtained molten mixtures was taken out in a sheet form and pulverized to obtain each molding material.

Each of these molding materials was molded by a low-pressure transfer molding machine at a mold temperature of 180 ° C. and a molding time of 180 seconds to obtain each test piece, which was post-cured at 180 ° C. for 8 hours. In addition, the spiral flow of each molding material was measured.

Spiral flow of each molding material, solder crack resistance after post-curing of each test piece, moisture absorption rate,
The results of testing the glass transition temperature are shown in Table 1, and the molding materials of Examples 1 to 5 have fluidity (that is, high spiral flow) as compared with the molding materials of Comparative Examples 1 to 3.
And the solder crack resistance was well balanced and excellent.

[0056]

[Table 1]

Note to Table 1: * 1 ... Epoxy resin derived from tetramethylbiphenol (Yukaka Shell Epoxy Co., Ltd. trade name: Epicoat YX4000H, epoxy equivalent 193, n value in the general formula (II) is 0). .2) * 2 ... Epoxy resin derived from biphenol and tetramethylbiphenol (Yukaka Shell Epoxy Co., Ltd., trade name Epicoat YL6121H, epoxy equivalent 1
73, the value of n in the general formula (II) is 0.1) * 3 ... Orthocresol novolac type epoxy resin (Yukaka Shell Epoxy Co., Ltd., trade name Epicoat 18)
OH65, epoxy equivalent 205) * 4 ... Brominated bisphenol A type epoxy resin (Yukaka Shell Epoxy Co., Ltd., trade name Epicoat 5050,
Epoxy equivalent 385, bromine content 49% by weight) * 5 ... Phenol novolac resin (manufactured by Gunei Chemical Co., hydroxyl equivalent 103, softening point 85 ° C) * 6 ... Terpene phenol novolac resin (Oilized shell epoxy stock Company product name Epicure MP402,
Hydroxyl equivalent 175, softening point 130 ° C) * 7 ... Fracturing type fused silica powder (Tatsumori company trade name RD-
8) * 8 ... Shin-Etsu Chemical Co., Ltd. trade name KBM-403 * 9 ... 16 pieces of 44-pin FPP are absorbed at 85 ° C. and 85% RH for 300 hours, then immersed in a solder bath at 260 ° C. for 10 seconds, and cracked. The number of occurrences was calculated. * 10 ... Moisture absorption rate after absorbing moisture at 85 ° C. and 85% RH for 300 hours. * 11 ... Determined from the transition point of the thermal expansion curve using TMA.

As is clear from Table 1, the respective compositions of the examples were compared with the compositions of the comparative examples in terms of fluidity of the composition, and solder crack resistance, low hygroscopicity and heat resistance of the cured product ( The glass transition temperature) is well balanced and excellent.

[0059]

EFFECT OF THE INVENTION The epoxy resin composition of the present invention is excellent in fluidity of the composition, and is excellent in balance of cured product resistance to solder cracking, low moisture absorption, and heat resistance (glass transition temperature). , Can be advantageously used for semiconductor encapsulation.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Reference number within the agency FI Technical indication location H01L 23/31 (72) Inventor Yoshinori Nakanishi No. 1 Shiohamacho, Yokkaichi-shi, Mie Yuka Shell Cepoxy Co., Ltd In development lab

Claims (1)

[Claims] 1. An epoxy resin composition containing at least an epoxy resin, an epoxy resin curing agent, an inorganic filler and a curing accelerator, wherein the epoxy resin is represented by the following general formula (I): (In the formula, m is an average value of 0 to 0.5.) 4,4′-bisphenol F type epoxy resin 20
~ 90 parts by weight and the following general formula (II): (Wherein, R is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms,
A substituted or unsubstituted phenyl group, a substituted or unsubstituted aralkyl group, an alkoxy group having 1 to 10 carbon atoms, or a halogen atom, each R may be the same or different, and n is an average value. And is a number from 0 to 0.5. ) Biphenol type epoxy resin 10
An epoxy resin composition for semiconductor encapsulation, which comprises an epoxy resin containing 80 parts by weight of an epoxy resin as a main component.