JP3369323B2 - Epoxy resin composition for semiconductor encapsulation - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for semiconductor encapsulation which gives a cured product having excellent curability and low hygroscopicity.

[0002]

2. Description of the Related Art In recent years, as semiconductor elements have been highly integrated, various characteristics required for a sealing material for semiconductor elements have become strict, and in particular, crack resistance and rapid hardening when immersed in a solder bath are important. It has become a challenge. However, the epoxy resin composition currently generally used cannot satisfy the required characteristics sufficiently.

That is, as the degree of integration of semiconductor devices increases,
As the size of semiconductor devices has increased significantly, the packages themselves have become smaller and thinner. In addition, the mounting of semiconductor devices is also shifting to surface mounting. In surface mounting, when a semiconductor device is directly immersed in a solder bath and exposed to a high temperature, a large stress is applied to the entire package due to expansion of moisture absorbed, and a crack occurs in the sealing material. Therefore, excellent low moisture absorption is required for the encapsulant with good solder crack resistance, and the epoxy resin encapsulation consisting of the cresol novolac type epoxy resin currently mainly used and the phenol novolac resin curing agent is used. In wood,
Low hygroscopicity is no longer sufficient.

Further, the semiconductor device is sealed by a low-pressure transfer molding method. However, as mass production is required, the epoxy resin sealing material is required to have a fast curing property in order to increase the molding cycle. There is.

Studies on low moisture absorption have been widely conducted for each of the epoxy resin and the curing agent. A typical method is to introduce a hydrophobic group such as a dicyclopentane skeleton or a xylene skeleton (JP-A-4-24882).
No. 8, JP-A-5-301946, etc.), the effect of lowering the moisture absorption cannot be said to be sufficient, and the solder crack resistance is not sufficiently improved.

JP-A-62-53327 discloses a curable epoxy resin composition which gives a low hygroscopic cured product using a curing agent obtained by esterifying benzoic acid, trimellitic acid or pyromellitic acid with a phenol compound. Is listed. Esterified products of benzoic acids and naphthalene-based carboxylic acids having a carboxyl group on the naphthalene ring and phenol compounds can give cured products with excellent low hygroscopicity, but the ester group (aromatic ester bond) is Since the reaction rate is slow, the curable epoxy resin composition described in the publication cannot satisfy the requirement for fast curing.

[0007]

DISCLOSURE OF THE INVENTION The present invention is intended to provide an epoxy resin composition for semiconductor encapsulation which is capable of giving a cured product having excellent curability, that is, fast curing property and low hygroscopicity. To do.

[0008]

Means for Solving the Problems As a result of various studies to solve the above problems, the present inventors have found that both an aromatic ester bond that directly bonds aromatic rings and a phenolic hydroxyl group. An aromatic ester compound having
Alternatively, the object could be achieved by using a mixture of the aromatic ester compound and a polyhydric phenol compound having a phenolic hydroxyl group as a curing agent for an epoxy resin.

That is, the epoxy resin composition for semiconductor encapsulation of the present invention is an epoxy resin composition containing an epoxy resin, a curing agent, a filler and a curing accelerator, and the aromatic ring is substituted as the curing agent. 50% or more of the phenolic hydroxyl groups of the polyhydric phenol compound which may have a group and / or a substituent atom, and benzoic acid which may have a substituent and / or a substituent atom on the benzene ring and a substituent and / or a substituent on the naphthalene ring. Aromatic ester compound (I) obtained by esterification with at least one aromatic carboxylic acid selected from naphthoic acid having an atom, and a substituent on the aromatic ester compound (I) and aromatic ring And / or a curing agent comprising at least one selected from the group consisting of a mixture (II) with a polyhydric phenol compound which may have a substituent atom, in all curing agents A curing agent having a total aromatic ester bond / total phenolic hydroxyl group molar ratio of 1 / (0.1 to 1.0) is used, and silica powder is used as the above-mentioned filler in an amount of 60 to 95 based on the total composition. The composition is characterized in that it is used in a weight percentage.

The curing agent used in the present invention is a carboxylic acid ester bond that directly bonds aromatic rings as a group involved in the curing reaction (in the present specification, this is abbreviated as "aromatic ester bond"). And that it contains both a phenolic hydroxyl group.

Since the aromatic ester bond does not generate a hydroxyl group which increases hygroscopicity at the time of curing reaction with an epoxy group as in the case of curing with a phenolic curing agent or an amine curing agent, It contributes to give a cured product excellent in low hygroscopicity.

When the ester bond is an ester bond for connecting aliphatic chains to each other or an ester bond for connecting an aromatic ring and an aliphatic ring, those ester bonds are completely different from the epoxy group. Even if it does not react, or if it reacts, the reaction rate is extremely slow. On the other hand, the aromatic ester bond has a higher reaction rate than these ester bonds.

Moreover, the curing agent used in the present invention contains 0.1 to 1.0 mol of phenolic hydroxyl group per 1 mol of aromatic ester bond, and this phenolic hydroxyl group reacts with the epoxy group at a reaction rate. Since it is extremely fast, it is possible to satisfy both the fast curing property and the low moisture absorption property. Then, if the proportion of ester bonds in the total curing agent is too large, a cured product excellent in low hygroscopicity can be provided, but the curing speed becomes too slow to be practical. If the proportion of phenolic hydroxyl groups is too high, the curing rate will be high, but the low hygroscopicity of the cured product will be impaired. Therefore, the curing agent of the present invention is designed so that the molar ratio of total aromatic ester bond / total phenolic hydroxyl group in the total curing agent is 1 / (0.1 to 1.0).

Next, each component of the epoxy resin for semiconductor encapsulation of the present invention will be described in detail below.

The epoxy resin used in the present invention includes:
For example, bisphenol A, bisphenol F, tetramethylbiphenol F, bisphenol AD, hydroquinone, methylhydroquinone, dimethylhydroquinone, dibutylhydroquinone, resorcin, methylresorcin, biphenol, tetramethylbiphenol,
Dihydroxynaphthalene, dihydroxydiphenyl ether, phenol novolac resin, cresol novolac resin, bisphenol A novolac resin, dicyclopentadiene phenol resin, terpene phenol resin,
Various phenols such as phenol aralkyl resins and naphthol novolac resins; various phenolic resins such as polyhydric phenol resins obtained by condensation reaction of various phenols with various aldehydes such as hydroxybenzaldehyde, crotonaldehyde and glyoxal Epoxy resin produced from compound and epihalohydrin; various amine compounds such as diaminodiphenylmethane, aminophenol, xylenediamine, etc. Epoxy resin produced from epihalohydrin; various carboxylic acids such as methylhexahydrophthalic acid and dimer acid Examples thereof include epoxy resins produced from acids and epihalohydrin.

Among these epoxy resins, a crystalline epoxy resin having a melting point of 40 to 170 ° C., which is a crystalline solid at room temperature and melts at the time of molding to become a low-viscosity liquid, is preferable. These crystalline epoxy resins are produced from phenol compounds such as bisphenol A, bisphenol F, tetramethylbiphenol F, hydroquinone, dimethylhydroquinone, dibutylhydroquinone, biphenol, tetramethylbiphenol, dihydroxynaphthalene, dihydroxydiphenyl ether, and epihalohydrin. Examples of the epoxy resin include epoxy resins prepared from biphenol and tetramethylbiphenol, which are selected from the viewpoint of cured physical properties, and epihalohydrin.

Further, in order to make the cured product flame-retardant, a part of the epoxy resin used can be a brominated epoxy resin. As the brominated epoxy resin, for example,
Examples thereof include epoxy resins produced from brominated bisphenol A or brominated phenol novolac resin and epihalohydrin.

As described above, the curing agent used in the present invention has 50% or more of the phenolic hydroxyl groups of the polyhydric phenol compound which may have a substituent and / or a substituent atom on the aromatic ring, and a substituent on the benzene ring. And / or an aromatic ester esterified with at least one aromatic carboxylic acid selected from benzoic acid having a substituent atom and naphthoic acid having a substituent and / or a substituent atom on the naphthalene ring. At least one selected from the group consisting of compound (I) and a mixture (II) of the aromatic ester compound (I) and a polyhydric phenol compound which may have a substituent and / or a substituent atom in the aromatic ring. A curing agent consisting of
The curing agent has a molar ratio of all aromatic ester bonds / all phenolic hydroxyl groups in all curing agents of 1 / (0.1 to 1.0).

Examples of the polyhydric phenol compound which may have a substituent and / or a substituent atom in the aromatic ring as a raw material for obtaining the aromatic ester compound (I) include, for example, bisphenol A, bisphenol F, resorcinol and hydroquinone. , Dihydroxynaphthalene, biphenol, tetramethylbiphenol, tetrabromobisphenol A, phenol novolac resin, cresol novolac resin, bisphenol A novolac resin, dicyclopentadiene phenol resin, terpene phenol resin, phenol aralkyl resin, naphthol novolac resin,
Various polyhydric phenols such as brominated phenol novolac resins; polyhydric phenol resins obtained by condensation reaction of various phenols with various aldehydes such as hydroxybenzaldehyde, crotonaldehyde and glyoxal.

In the esterification reaction of the above polyhydric phenol compound with an aromatic carboxylic acid to obtain the aromatic ester compound (I), it is not always necessary to use a free carboxylic acid as an esterifying agent, and other It can be carried out using various esterifying agents. That is,
A typical esterification method is a method of esterification using an esterifying agent represented by the following general formula.

[0021]

[Chemical 1] (Wherein A is a substituted or unsubstituted phenyl group or a substituted or unsubstituted naphthyl group, R is a hydroxyl group, an alkoxy group, a substituted or unsubstituted phenoxy group, a substituted or unsubstituted naphthoxy group, a substituted or It is an unsubstituted benzoate group, a substituted or unsubstituted naphthoate group, or a halogen atom.)

The esterification reaction can be carried out by various methods using various conditions depending on the kind and combination of the polyhydric phenol compound as the raw material and the esterifying agent, and typical esterification In the conditions and method of (2), both raw material components are mixed in the presence of a solvent as a reaction medium or in the absence of a solvent, and reacted in the presence of a catalyst at a temperature of 0 to 150 ° C. for 1 to 10 hours while mixing. After completion of the reaction, by removing unreacted esterifying agent, by-products, solvent, etc.,
The target aromatic ester compound (I) is obtained.

Examples of the reaction catalyst include amines such as trimethylamine, triethylamine, benzyldimethylamine, dimethylaniline and pyridine, alkali metal hydroxides such as sodium hydroxide and potassium hydroxide, potassium t-butoxide and sodium. Alkali metal alcoholates such as ethoxide, butyl lithium,
Alkyl metals such as sodium biphenyl, hydrochloric acid, sulfuric acid, oxalic acid, fluoroacetic acid, toluenesulfonic acid, acid salts showing acidity, fluorinated boric acid, heteropolyacids,
Examples thereof include polyphosphoric acids and acidic catalysts such as activated clay.

As the reaction solvent, ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone, aromatic hydrocarbons such as benzene, toluene and xylene, ethers such as dioxane and ethylene glycol dimethyl ether, dimethyl sulfoxide and dimethyl formamide. Inert organic solvents such as aprotic polar solvents and water, and the like.

The aromatic ester compound (I) thus produced, for example, when a phenol novolac resin is used as the polyhydric phenol compound and benzoyl chloride is used as the esterifying agent (benzoating agent), It is a compound (mixture of compounds) having a repeating unit represented by a structural formula.

[0026]

[Chemical 2] (In the formula, n ¹ is a number of 1 to 10 on average, and n ² is
The average value is a number of 0 to 10, and n ¹ + n ² is a number of 2 or more. )

The esterification rate in the above reaction, that is, the benzoate rate or naphthoate rate {in the case of the above structural formula, n ¹ ÷ (n ¹ + n ² ) × 100} is 50.
% Or more. Since the unreacted phenolic hydroxyl group is a functional group that reacts with the epoxy group, it contributes to the rapid curing of the epoxy resin, but as described above, it reduces the moisture resistance of the cured product during the reaction between the phenolic hydroxyl group and the epoxy group. Since a hydroxyl group is generated, when the esterification rate is less than 50%, the number of phenolic hydroxyl groups is larger than that of an aromatic ester bond, which lowers the moisture resistance of the cured product and is used as the curing agent of the present invention. become unable.

The aromatic ester compound (I) produced as described above has a molar ratio of total aromatic ester bond / total phenolic hydroxyl group of 1 / (0.1 to 1.0).
When the phenolic hydroxyl group is contained in an amount satisfying the condition, the aromatic ester compound (I) can be used as it is as the curing agent of the present invention.

On the other hand, when the aromatic ester compound (I) contains no phenolic hydroxyl group at all, the amount of the aromatic ester compound (I) contained is such that the molar ratio of total aromatic ester bond / total phenolic hydroxyl group = 1 / ( 0.1 to 1.0) is not sufficient, or when the amount of phenolic hydroxyl groups satisfies this condition, but is still too small, and in other cases, it is necessary. A mixture of the aromatic ester compound (I) and a polyhydric phenol compound which may have a substituent and / or a substituent atom in the aromatic ring (I
I) and the mixture is used as the curing agent of the present invention. However, also in this case, the molar ratio of total aromatic ester bond / total phenolic hydroxyl group in total curing agent = 1 /
Of course, it is necessary to satisfy the condition (0.1 to 1.0).

Examples of the polyhydric phenol compound having a substituent and / or a substituent atom in the aromatic ring which is used as a mixture with the aromatic ester compound (I) include, for example, phenol novolac resin, cresol novolac resin and bisphenol A. Various phenolic resins such as novolac resin, dicyclopentadiene phenol resin, phenol aralkyl resin, terpene phenol resin, naphthol novolac resin, and various phenols, and various aldehydes such as hydroxybenzaldehyde, crotonaldehyde and glyoxal. Examples include various phenol resins such as polyhydric phenol resins obtained by the condensation reaction of

The amount of the curing agent used in the composition of the present invention is such that the total amount of all aromatic ester bonds and all phenolic hydroxyl groups in the total curing agent is 0.5, based on 1 mol of the epoxy groups in all the epoxy resins. The amount of about 2.0 to 2.0 mol is preferable, and the amount of about 0.7 to 1.2 mol is particularly preferable.

Next, silica powder is added as a filler to the epoxy resin composition for semiconductor encapsulation of the present invention. The type of the silica powder filler is fused silica or crystalline silica, and the shape thereof is a crush type or a spherical shape. The various silica powders are used alone or as a mixture of two or more kinds, and the amount of the silica powder is 60 to 60% of the total amount of the composition.
It is 95% by weight, preferably 70 to 92% by weight.

The curing accelerator used in the epoxy resin composition for semiconductor encapsulation of the present invention is a reaction between an epoxy group in the epoxy resin and an aromatic ester bond in the curing agent, and an epoxy group and a phenolic hydroxyl group. Is a compound that accelerates the reaction of.

Examples of the curing accelerator include phosphine compounds such as tributylphosphine, triphenylphosphine, tris (dimethoxyphenyl) phosphine, tris (hydroxypropyl) phosphine and tris (cyanoethyl) phosphine, tetraphenylphosphonium tetraphenylborate. , Phosphonium salts such as methyltributylphosphonium tetraphenylborate and methyltricyanoethylphosphonium tetraphenylborate, 2-methylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole, 2
-Undecylimidazole, 1-cyanoethyl-2-methylimidazole, 2,4-dicyano-6- [2-methylimidazolyl- (1)]-ethyl-S-triazine,
Imidazole compounds such as 2,4-dicyano-6- [2-undecylimidazolyl- (1)]-ethyl-S-triazine, 1-cyanoethyl-2-undecylimidazolium trimellitate, 2-methylimidazolium Imidazolium salts such as isocyanurate, 2-ethyl-4-methylimidazolium tetraphenylborate, 2-ethyl-1,4-dimethylimidazolium tetraphenylborate, 2,4,6-tris (dimethylaminomethyl) phenol, Amines such as benzyldimethylamine, tetramethylbutylguanidine, N-methylpiperazine and 2-dimethylamino-1-pyrroline, ammonium salts such as triethylammonium tetraphenylborate, 1,5-diazabicyclo (5,4,0)- 7-
Undecene, 1,5-diazabicyclo (4,3,0)-
5-nonene, 1,4-diazabicyclo (2,2,2)-
Examples thereof include diazabicyclo compounds such as octane, tetraphenylborate salts, phenol salts, phenol novolac salts and 2-ethylhexanoate salts of these diazabicyclo compounds.

Among these compounds which act as curing accelerators, phosphine compounds, imidazole compounds, diazabicyclo compounds and salts thereof are preferred.

These curing accelerators are used alone or in admixture of two or more, and the amount used is 0.1 to 7% by weight, preferably 1 to 5% by weight, based on the epoxy resin. .

The epoxy resin composition for semiconductor encapsulation of the present invention may optionally contain a coupling agent, a plasticizer, a pigment and the like, if necessary.

Further, as the flame retardant aid, antimony trioxide, phosphoric acid, etc. can be appropriately blended.

Since the epoxy resin composition for semiconductor encapsulation of the present invention provides a cured product having excellent curability and low hygroscopicity, it can be advantageously used in the field of semiconductor encapsulation.

[0040]

[Examples] The synthesis examples of the aromatic ester compound used in the epoxy resin composition for semiconductor encapsulation of the present invention, curing agent examples, examples and comparative examples will be described in more detail below.

Synthesis Examples 1 to 4 of Aromatic Ester Compound Internal volume of 3000 ml equipped with thermometer, stirrer and cooling tube
In a three-necked flask, the polyphenol compound, phenol novolac resin or terpene phenol novolac resin, benzoyl chloride as a benzoating agent, or naphthoic acid chloride as a naphthoating agent, and pyridine are charged in the amounts shown in Table 1, The reaction was carried out by holding at 30 ° C. for 2 hours.

Then, methyl isobutyl ketone 1000
After adding g to completely dissolve the product, it was washed with water to remove by-product salts and the like, and methyl isobutyl ketone was removed under reduced pressure to obtain the desired aromatic ester compound.

The phenolic hydroxyl group content, aromatic ester bond content, total ester bond / total hydroxyl group molar ratio, and softening point of these aromatic ester compounds were measured and shown in Table 1.

[0044]

[Table 1]

Note to Table 1: * 1 ・ ・ ・ Phenol novolac resin (manufactured by Gunei Chemical Co., hydroxyl equivalent 103, softening point 85 ° C.) * 2 ・ ・ ・ Terpene phenol novolac resin (trade name of Yuka Shell Epoxy Co., Ltd. Epicure MP402,
Hydroxyl equivalent 175, softening point 130 ° C)

Curing Agent Examples 1-5 As shown in Table 2, the curing agent example 1 or the curing agent example 3 is
Phenol novolac resin (manufactured by Gunei Chemical Co., Ltd.) was added to the aromatic ester compound obtained in Synthesis Example 1 or Synthesis Example 3.
g or 50 g respectively and melt-mixed at 140 ° C. to obtain a curing agent.

Further, in the curing agent example 2, the curing agent example 4, or the curing agent example 5, the respective aromatic ester compounds obtained in the synthesis example 2, the synthesis example 4, or the synthesis example 1 were directly used as the curing agent.

The phenolic hydroxyl group content, aromatic ester bond content, total ester bond / total hydroxyl group molar ratio, and softening point of each of these hardeners are shown in Table 2, respectively.

[0049]

[Table 2]

Note to Table 2: * 1 Phenol novolac resin (manufactured by Gunei Chemical Co., hydroxyl equivalent 103, softening point 85 ° C.)

Examples 1 to 5 Comparative Examples 1 to 3 As shown in Table 3, the epoxy resin derived from tetramethylbiphenol (A) and the epoxy resin derived from biphenol and tetramethylbiphenol (B) were used as the epoxy resin. ), Orthocresol novolac type epoxy resin (C), and brominated bisphenol A type epoxy resin as brominated epoxy resin, respectively, and curing agents of curing agents Examples 1 to 5 as curing agents, and commercially available phenol novolac resin (D). , And a commercially available phenol aralkyl resin (E), respectively, pulverized fused silica powder was used as the silica powder, and 1,5 as the curing accelerator.
-Diazabicyclo (5,4,0) -7-undecene, 2
-Epoxy resin using phenylimidazole or tetraphenylphosphonium-tetraphenylborate, antimony trioxide as a flame retardant, commercially available epoxysilane as a surface treatment agent for silica powder, and carnauba wax as a release agent. The composition was formulated.

Next, each of the blends was melt mixed for 5 minutes at a temperature of 70 to 130 ° C. using a mixing roll. Each of the obtained molten mixtures was taken out as a sheet and pulverized to obtain each molding material.

Using each of these molding materials, a mold temperature of 180 ° C. and a molding time of 120 seconds to 3 in a low-pressure transfer molding machine.
Each test piece was obtained by molding in 00 seconds and post-cured at 180 ° C. for 8 hours. Also, the gel time of each molding material,
The molding time was measured.

The results of testing the gel time of each molding material, the molding time, the moisture absorption rate of each test piece after post-curing, and the glass transition temperature are shown in Table 3.
As compared with the molding material of Comparative Example 1, each of the molding materials of Nos. 5 to 5 has a significantly shorter gel time and molding time and is excellent in curability, and is also comparable in terms of hygroscopicity and glass transition temperature of the cured product. Further, as compared with the molding materials of Comparative Examples 2 and 3, they are remarkably excellent in hygroscopicity and glass transition temperature.

[0055]

[Table 3]

Note A in Table 3: Epoxy resin derived from tetramethylbiphenol (trade name Epicoat YX4, manufactured by Yuka Shell Epoxy Co., Ltd.)
000H, Epoxy equivalent 193) B: Epoxy resin derived from biphenol and tetramethylbiphenol (Okaka Shell Epoxy Company trade name Epicoat YL6121H, Epoxy equivalent 173) C: Orthocresol novolac epoxy resin (Okaka Shell Epoxy trade name Epicoat 180H65, epoxy equivalent 205) D: Phenol novolac resin (manufactured by Gunei Chemical Co., hydroxyl equivalent 103, softening point 85 ° C.) E: Phenol aralkyl resin (Mitsui Toatsu Co., Ltd. trade name Milex XL225LL, hydroxyl equivalent 173, softening point 7)
8 ° C.) F: 1,5-diazabicyclo (5,4,0) -7-undecene G: 2-phenylimidazole H: tetraphenylphosphonium tetraphenylborate * 1: brominated bisphenol A type epoxy resin (oiled shell epoxy Company name Epicoat 5050, epoxy equivalent 385, bromine content 49%) * 2: Fracturing type fused silica powder (Tatsumori company name RD-
8) * 3: Epoxysilane (brand name KBM, Shin-Etsu Chemical Co., Ltd.
-403) * 4: 175 ° C * 5: 85 ° C, 85% RH moisture absorption rate after 168 hours * 6: Obtained from the transition point of the thermal expansion curve using YMA.

[0057]

The epoxy resin composition of the present invention provides a cured product having excellent curability, short gel time and molding time, and low hygroscopicity. You can

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification symbol FI H01L 23/31 (56) References JP-A-62-53327 (JP, A) JP-A-61-285214 (JP, A) Special features Kai 61-238817 (JP, A) JP-A-4-248828 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) C08G 59/40 C08G 59/62 C08K 3/36 C08L 63/00-63/10 H01L 23/29

Claims (5)

(57) [Claims] 1. An epoxy resin composition containing an epoxy resin, a curing agent, a filler and a curing accelerator, wherein the curing agent is a polyhydric phenol having a substituent and / or a substituent atom in an aromatic ring. At least 50% or more of the phenolic hydroxyl groups of the compound are selected from benzoic acid which may have a substituent and / or a substituent atom on the benzene ring and naphthoic acid which may have a substituent and / or a substituent atom on the naphthalene ring. Aromatic ester compound (I) esterified with one kind of aromatic carboxylic acid, and polyhydric phenol compound which may have a substituent and / or a substituent atom in the aromatic ester compound (I) and an aromatic ring And a molar ratio of all aromatic ester bonds / all phenolic hydroxyl groups in the total curing agent, the curing agent being at least one selected from the group consisting of a mixture (II) with For a semiconductor encapsulation, characterized in that a curing agent having a ratio of 1 / (0.1 to 1.0) is used and silica powder is used as the filler in an amount of 60 to 95% by weight based on the total composition. Epoxy resin composition. 2. The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein the epoxy resin is a crystalline epoxy resin having a melting point of 40 to 170 ° C. 3. The semiconductor encapsulation according to claim 1, wherein the epoxy resin is an epoxy resin obtained by reacting at least one phenol compound selected from biphenol and tetramethylbiphenol with epihalohydrin. Epoxy resin composition for use. 4. The total molar ratio of all epoxy groups of all epoxy resins / all aromatic ester bonds of all curing agents and all phenolic hydroxyl groups is 1 / (0.7 to 1.2).
The epoxy resin composition for semiconductor encapsulation according to claim 3. 5. The method according to claim 1, wherein the curing accelerator is at least one compound selected from phosphine compounds, imidazole compounds, diazabicyclo compounds and salts thereof. The epoxy resin composition for semiconductor encapsulation described.