JPH081076A - Formation of thin film by coating - Google Patents

Formation of thin film by coating

Info

Publication number
JPH081076A
JPH081076A JP6138468A JP13846894A JPH081076A JP H081076 A JPH081076 A JP H081076A JP 6138468 A JP6138468 A JP 6138468A JP 13846894 A JP13846894 A JP 13846894A JP H081076 A JPH081076 A JP H081076A
Authority
JP
Japan
Prior art keywords
film
substrate
cds
vibration
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6138468A
Other languages
Japanese (ja)
Inventor
Tetsuya Niimoto
哲也 新本
Nobuo Nakayama
信男 中山
Kuniyoshi Omura
邦嘉 尾村
Mikio Murozono
幹夫 室園
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6138468A priority Critical patent/JPH081076A/en
Publication of JPH081076A publication Critical patent/JPH081076A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/543Solar cells from Group II-VI materials

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)
  • Powder Metallurgy (AREA)
  • Photovoltaic Devices (AREA)

Abstract

PURPOSE:To form an excellent thin film at a low cost by vibrating either a substrate or an applied pasty material with an acoustic device with noncontact during or after the coating stage of the pasty material. CONSTITUTION:The fine powder of cadmium sulfide(CdS) is admixed with propylene glycol as a binding agent to prepare pasty CdS. The CdS paste is screen-printed on a borosilicate glass substrate 10 to form a CdS coating film 11. The coating film 11 is then ultrasonically vibrated by the acoustic device 12 at a distance of about 10mm from the substrate 10 and simultaneously vibrated horizontally by a vibrator 14 with a contact process. Consequently, the ruggednesses marked on the CdS printed film disappear, and an excellent smooth face is obtained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、各種電子部品、半導体
素子、磁気記録材料等の製造に広く用いられている、微
粉末状の材料と粘結剤を混合したペースト状材料を各種
基板上に塗布して薄膜を形成する塗布製膜方法に関する
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention provides a paste-like material, which is widely used in the production of various electronic parts, semiconductor elements, magnetic recording materials, etc., in which a fine powdery material and a binder are mixed, on various substrates. The present invention relates to a coating film forming method of forming a thin film by coating on.

【0002】[0002]

【従来の技術】既存の技術として、各種粉末状材料と粘
結剤を混合してペースト状にした材料を各種基板に塗布
する場合に、基板に対して振動を与えることによって表
面の平滑性を向上させ、膜中の微細な穴を減少させ、基
板と塗布膜の密着性を向上させる等の効果を得る方法が
知られている。
2. Description of the Related Art As an existing technique, when a powdery material and a binder are mixed to form a paste material, which is applied to various substrates, vibration is applied to the substrates to improve the surface smoothness. There is known a method of improving, reducing fine holes in the film, and improving the adhesion between the substrate and the coating film.

【0003】[0003]

【発明が解決しようとする課題】ペースト状材料を塗布
した基板に振動する物体を接触させて振動を与える場
合、表面の平滑性等の好ましい変化を塗布膜に生じさせ
るためには、ペースト状材料の種類によっては高いエネ
ルギーの振動を必要とする場合がある。このような場合
には、与えられた振動によって基板が劣化して、その機
械的強度が下がり、ひび割れ等が生じることがある。ま
た、一般的な超音波振動子を用いて振動を与える場合に
は、振動の周波数を連続的に変化させることはできず、
塗布された膜の条件により最適な周波数の振動を与える
ことが困難である。
When a vibrating object is brought into contact with a substrate coated with the pasty material to give vibration, in order to cause a preferable change in the smoothness of the surface or the like in the coating film, the pasty material is used. Depending on the type, high energy vibration may be required. In such a case, the applied vibration may deteriorate the substrate, reduce its mechanical strength, and cause cracks and the like. Also, when applying vibration using a general ultrasonic vibrator, the frequency of vibration cannot be continuously changed,
It is difficult to give the vibration of the optimum frequency depending on the conditions of the applied film.

【0004】また、基板に対して一定の周波数をもつ振
動を印加し続けると、基板内に2次元の定在波(振動す
る位置としない位置が一定である波)が生じ、長時間の
振動により塗布された膜は振動の少ない部分に集まり、
逆に振動の大きな部分では膜厚が薄くなり、全体として
は膜厚にむらが生じることがある。そこで本発明は、こ
のような従来の課題を解決するもので、ペースト状材料
の塗布による薄膜形成法の特徴を有効に活用し、低コス
トで良好な薄膜の塗布製膜方法を提供することを目的と
する。
Further, when vibration having a constant frequency is continuously applied to the substrate, a two-dimensional standing wave (a wave in which a vibrating position and a non-vibrating position are constant) is generated in the substrate, and the vibration is caused for a long time. The film applied by gathers in the part with less vibration,
On the contrary, the film thickness becomes thin in the portion where the vibration is large, and the film thickness may be uneven as a whole. Therefore, the present invention is to solve such a conventional problem, to effectively utilize the characteristics of the thin film forming method by applying a paste-like material, and to provide a good thin film coating film forming method at low cost. To aim.

【0005】[0005]

【課題を解決するための手段】本発明の薄膜の塗布製膜
方法は、微粉末と粘結剤を混合したペースト状材料を基
板上に塗布する工程、および前記ペースト状材料の塗布
工程中または塗布工程後に、基板および塗布されたペー
スト状材料の少なくとも一方に、音響装置を用いて非接
触で振動を与える工程を有するものである。
A method for coating a thin film according to the present invention comprises a step of applying a paste-like material in which a fine powder and a binder are mixed onto a substrate, and a step of applying the paste-like material or After the applying step, there is a step of applying non-contact vibration to at least one of the substrate and the applied paste-like material by using an acoustic device.

【0006】また、本発明は、微粉末と粘結剤を混合し
たペースト状材料を基板上に塗布する工程、および前記
ペースト状材料の塗布工程中または塗布工程後に、基板
および塗布されたペースト状材料の少なくとも一方に、
音響装置を用いて非接触で振動を与えながら同時に別の
振動装置を用いて基板に接触方式で振動を与える工程を
有するものである。
Further, according to the present invention, a step of applying a paste-like material in which fine powder and a binder are mixed onto a substrate, and the substrate and the applied paste-like material during or after the applying step of the paste-like material. On at least one of the materials,
The method has a step of applying non-contact vibration using an acoustic device and simultaneously applying vibration to the substrate in a contact method using another vibration device.

【0007】さらに、本発明は、上記の振動を印加中に
音響装置の出力周波数を変化させる。ここにおいて、塗
布方法として、スクリーン印刷法、描画印刷法、凸版印
刷法、凹版印刷法、スプレー法のいずれを用いることも
できる。
Further, the present invention changes the output frequency of the acoustic device during the application of the above vibration. Here, as a coating method, any of a screen printing method, a drawing printing method, a relief printing method, an intaglio printing method, and a spray method can be used.

【0008】[0008]

【作用】薄膜塗布に伴って振動を与える方法は、各種材
料微粒子と粘結剤を混合してペースト状にしたものを基
板上に塗布して薄膜を形成する際に、各種周波数の振動
を加えることにより、膜表面の凹凸を無くして平滑にさ
せ、膜中のピンホールを減少させ、ペースト状材料に巻
き込まれた気泡等を除去し、塗布された膜と基板の密着
性を高め、材料粒子の充填密度と配向性を高める。その
結果として、薄膜形成時の光学特性や電気磁気的特性を
高め、さらに機械的強度も向上させ、良好な機能性薄膜
を簡便に作成することを可能とする特徴を持っている。
[Function] A method of vibrating along with thin film coating is to apply vibrations of various frequencies when a thin film is formed by coating a paste prepared by mixing fine particles of various materials and a binder. As a result, the unevenness of the surface of the film is eliminated and smoothed, pinholes in the film are reduced, bubbles and the like caught in the paste-like material are removed, and the adhesion between the applied film and the substrate is increased and the material particles Increase the packing density and orientation. As a result, it has characteristics that the optical characteristics and the electromagnetic characteristics at the time of forming a thin film are improved, and the mechanical strength is also improved, and a good functional thin film can be easily prepared.

【0009】本発明は、その振動を加える方法として、
特に空気中を振動が伝搬する方式であるスピーカーや笛
状の構造をもつ音響装置を用いて塗布膜に非接触式で直
接振動を与えることにより、またそれと同時に基板に対
して接触式で弱い振動を与えることにより、振動による
塗布された基板への損傷、劣化などの悪影響を引き起こ
すことなく上記の効果を得ることができる。また、それ
と同時に、音響装置であれば連続的に周波数を変化させ
ることが容易で、塗布された膜の条件により最適の周波
数を選ぶことができる。さらに、振動を与えている間に
周波数を変化させることにより、定在波の波長を連続的
に変化させて、塗布膜にむらが生じることを防ぐことが
可能である。
The present invention provides, as a method of applying the vibration,
In particular, by directly vibrating the coating film in a non-contact manner using a speaker or a whistle-like structure, which is a method in which vibration propagates in the air, and at the same time, a weak vibration in a contact manner with respect to the substrate. By applying the above, the above effect can be obtained without causing adverse effects such as damage and deterioration of the coated substrate due to vibration. At the same time, in the case of an acoustic device, it is easy to continuously change the frequency, and the optimum frequency can be selected according to the conditions of the coated film. Furthermore, by changing the frequency while applying vibration, it is possible to continuously change the wavelength of the standing wave and prevent unevenness in the coating film.

【0010】[0010]

【実施例】以下、本発明を実施例により説明する。図1
は、一般的なCdS/CdTe系焼結薄膜太陽電池の模
式断面図を示す。図中1はガラス基板であり、基板1上
に順次CdS焼結膜2、CdTe焼結膜3、カーボン膜
4が形成されている。5はCdS膜上に形成したAgI
n電極、6はカーボン膜上に形成したAgIn電極、7
および8はリード線を示す。この太陽電池はガラス基板
側が受光面となる。図の矢印は入射光を示す。
The present invention will be described below with reference to examples. FIG.
Shows a schematic cross-sectional view of a general CdS / CdTe-based sintered thin film solar cell. In the figure, 1 is a glass substrate, and a CdS sintered film 2, a CdTe sintered film 3, and a carbon film 4 are sequentially formed on the substrate 1. 5 is AgI formed on the CdS film
n electrode, 6 is an AgIn electrode formed on a carbon film, 7
And 8 show lead wires. This solar cell has a light receiving surface on the glass substrate side. Arrows in the figure indicate incident light.

【0011】以下、本発明の製膜方法について説明す
る。まず、粒径2〜3μmの硫化カドミウム(CdS)
の微粉末100gに対して粘結剤としてプロピレングリ
コールを35g添加した混合物を混合機(擂潰機)中で
約2時間混合してペースト状CdSを作成した。このよ
うにして得たCdSペーストを、大きさ350mm×4
50mm,厚さ1.1mmのほうけい酸ガラス基板上に
スクリーン印刷法によって、厚さ約60μmのCdS印
刷塗布膜を形成した。その後、ガラス基板上10mm以
下の距離から、塗布膜に対して音響装置によって周波数
10〜50kHzの超音波振動を1〜30秒間与えると
同時に水平方向に1〜10kHzの周波数を持つ振動を
与えた。これによりスクリーン印刷の際にスクリーンを
構成している縦糸、横糸の網目が印刷膜上に刻印されて
生じていたCdS印刷膜上の凹凸が消滅して、良好な平
滑面が得られた。
The film forming method of the present invention will be described below. First, cadmium sulfide (CdS) with a particle size of 2-3 μm
A mixture obtained by adding 35 g of propylene glycol as a binder to 100 g of the fine powder of was mixed for about 2 hours in a mixer (grinding machine) to prepare paste CdS. The CdS paste obtained in this way was measured in a size of 350 mm × 4.
A CdS printing coating film having a thickness of about 60 μm was formed by a screen printing method on a borosilicate glass substrate having a thickness of 50 mm and a thickness of 1.1 mm. Then, from a distance of 10 mm or less on the glass substrate, ultrasonic vibration having a frequency of 10 to 50 kHz was applied to the coating film by an acoustic device for 1 to 30 seconds, and simultaneously vibration having a frequency of 1 to 10 kHz was applied in the horizontal direction. As a result, during screen printing, the unevenness on the CdS print film, which had been caused by marking the mesh of the warp yarns and the weft yarns forming the screen on the print film, disappeared, and a good smooth surface was obtained.

【0012】図2は、ここに用いた加振装置の構成を示
す。図中9は基板と各部材を支持するステージ(台)、
10は基板、11は塗布された薄膜、12は音波を発信
する音響装置、13は基板を支えるバネ、14は接触方
式による振動装置、15は音響装置により発生した音波
を示す。この後、空気中120℃で120分間乾燥する
ことによって、印刷膜中の粘結剤を除去した後、窒素雰
囲気をもった700℃の電気炉内に160分間挿入して
CdS焼結膜を形成した。
FIG. 2 shows the configuration of the vibration device used here. In the figure, 9 is a stage (stand) for supporting the substrate and each member,
Reference numeral 10 is a substrate, 11 is a coated thin film, 12 is an acoustic device that emits sound waves, 13 is a spring that supports the substrate, 14 is a contact-type vibrating device, and 15 is a sound wave generated by the acoustic device. After that, the binder in the printed film was removed by drying in air at 120 ° C. for 120 minutes and then inserted into an electric furnace at 700 ° C. having a nitrogen atmosphere for 160 minutes to form a CdS sintered film. .

【0013】印刷後に振動を与えずに製膜した従来のC
dS膜、印刷直後の乾燥前に従来の接触方式で振動を加
えて製膜したCdS焼結膜、非接触方式で振動を加えて
製膜したCdS焼結膜、および非接触方式で振動を加え
ながら同時に接触方式で基板に弱い振動を与えたCdS
焼結膜の表面粗さの比較を図3に示す。この図3から明
らかなように、3種類の振動を加えた塗布方法による
と、従来のスクリーン印刷で製膜したものと比較して、
膜表面の起伏が1/2以下になり、平滑度が改善されて
いることが分かる。
Conventional C film-formed without vibration after printing
dS film, CdS sintered film which was formed by applying vibration by a conventional contact method immediately after printing immediately before printing, CdS sintered film which was formed by applying vibration by a non-contact method, and simultaneously applying vibration by a non-contact method CdS that gives weak vibration to substrate by contact method
A comparison of the surface roughness of the sintered film is shown in FIG. As is clear from FIG. 3, according to the coating method in which three kinds of vibrations are applied, as compared with the film formed by the conventional screen printing,
It can be seen that the undulations on the film surface are reduced to 1/2 or less, and the smoothness is improved.

【0014】次に、このようにして得られたCdS焼結
膜上に、等モル比率のCdおよびTeの微粉末100g
に対して粘結剤としてプロピレングリコール48gを添
加した混合物を混合機(擂潰機)中で約10時間混合し
てペースト状CdTeを作成した。得られたCdTeペ
ーストを上記のCdS焼結膜上にスクリーン印刷法によ
って厚さ約30μmのCdTe膜を印刷後、ガラス基板
上10mm以下の距離から塗布膜に対して音響装置を用
いて周波数10〜50kHzの超音波振動を1〜30秒
間与えた。これによりスクリーン印刷の際にCdTe膜
表面に生じた凹凸が消滅して、極めて良好な平滑面が得
られるとともにピンホールが消滅して上記CdS焼結膜
2との密着性も改善された。
Next, 100 g of fine powder of Cd and Te in equimolar ratios was formed on the CdS sintered film thus obtained.
On the other hand, a mixture in which 48 g of propylene glycol was added as a binder was mixed in a mixer (grinding machine) for about 10 hours to prepare paste CdTe. The obtained CdTe paste is printed on the above CdS sintered film by a screen printing method to form a CdTe film having a thickness of about 30 μm, and then a frequency of 10 to 50 kHz is applied to the coating film from a distance of 10 mm or less on the glass substrate using an acoustic device. Ultrasonic vibration for 1 to 30 seconds was applied. As a result, the irregularities generated on the surface of the CdTe film during screen printing disappeared, a very good smooth surface was obtained, and pinholes disappeared, and the adhesion with the CdS sintered film 2 was improved.

【0015】その後乾燥、焼成工程によってCdTe焼
結膜3を形成した。この後、CdTe焼結膜上に順次、
カーボン電極膜4、AgIn電極膜5、6を印刷後いず
れも乾燥前にガラス基板上10mm以下の距離から塗布
膜に対して音響装置を用いて周波数10〜50kHzの
超音波振動を10〜30秒間与えた後、乾燥および熱処
理を行って、各々カーボン膜4とAgIn電極膜5、6
を形成した。以上の工程によって図1の模式断面図に示
すCdS/CdTe太陽電池が得られた。
After that, the CdTe sintered film 3 was formed by the drying and firing steps. Then, on the CdTe sintered film,
After printing the carbon electrode film 4 and the AgIn electrode films 5 and 6, before drying, ultrasonic vibration of a frequency of 10 to 50 kHz was applied to the coating film from a distance of 10 mm or less on the glass substrate for 10 to 30 seconds using an acoustic device. After being applied, the carbon film 4 and the AgIn electrode films 5 and 6 are dried and heat-treated, respectively.
Was formed. Through the above steps, the CdS / CdTe solar cell shown in the schematic sectional view of FIG. 1 was obtained.

【0016】次に、印刷直後のCdS膜に対して振動を
30秒間印加中に周波数を10kHzから50kHzま
で変化させた場合と、一定の周波数(28kHz)で3
0秒間振動を加えた場合の表面粗さの比較を図4に示
す。一定周波数で振動を印加した場合、基板に生じてい
る定在波に起因していると思われる周期的な膜厚の変化
が生じていることがわかる。これに対して周波数を変化
させたものは、非常に平坦になっていることがわかる。
これは周波数の変化に応じて基板に生じている定在波の
波長が変わるためと考えられる。
Next, when the frequency was changed from 10 kHz to 50 kHz while applying vibration to the CdS film immediately after printing for 30 seconds, and when the frequency was changed to 3 at a constant frequency (28 kHz).
A comparison of surface roughness when vibration is applied for 0 seconds is shown in FIG. It can be seen that when vibration is applied at a constant frequency, a periodic change in the film thickness, which is considered to be caused by the standing wave generated on the substrate, occurs. On the other hand, it can be seen that the one in which the frequency is changed is very flat.
It is considered that this is because the wavelength of the standing wave generated on the substrate changes according to the change in frequency.

【0017】従来の接触方式により加振したものと、本
発明の非接触方式により加振したものの比較を表1に示
す。この表は各々の方法により製造された製品(CdS
膜)における不良品の発生率を示しており、加振時の基
板のカケと熱処理中の基板の破損が従来の接触方式の場
合、各々3%、1.5%であるのに対し、非接触方式の
場合、各々0%、0.5%と基板への影響が著しく減少
していることがわかる。また、非接触方式の加振と弱い
接触方式の加振を併用した場合は各々1%、0.8%と
なった。また、焼結後のピンホール数は、従来の接触方
式の場合5.2cm-2、非接触方式が6.1cm-2であ
ったのに対して、非接触方式と弱い接触方式の併用では
1.8cm- 2と著しく減少していた。
Table 1 shows a comparison between the conventional contact method and the non-contact method of the present invention. This table shows the products manufactured by each method (CdS
In the case of the conventional contact method, the chipping of the substrate during vibration and the damage to the substrate during heat treatment are 3% and 1.5%, respectively, whereas In the case of the contact method, it can be seen that the influence on the substrate is significantly reduced to 0% and 0.5%, respectively. Further, when the non-contact type vibration and the weak contact type vibration were used together, they were 1% and 0.8%, respectively. In addition, the number of pinholes after sintering was 5.2 cm -2 in the conventional contact method and 6.1 cm -2 in the non-contact method. 1.8cm - 2 to have been significantly reduced.

【0018】[0018]

【表1】 [Table 1]

【0019】なお、これらのペースト状材料を基板上に
印刷・塗布後、その乾燥以前に振動を加えることによっ
て得られる膜表面の平滑化、ピンホールの除去、光透過
率の向上などの効果は、実施例では半導体材料と導電材
料に適用したが、周波数、振幅を変化させることによっ
て磁気記録材料、誘電体材料、絶縁体材料等にも適用可
能である。また、上記のスクリーン印刷法の代わりに凹
版、凸版印刷およびスプレー法や描画印刷法等を適用し
て作成した印刷・塗布膜の場合でも同様の効果が得られ
た。
It should be noted that the effect of smoothing the film surface, removing pinholes, improving light transmittance, etc. obtained by printing and applying these paste-like materials on the substrate and then applying vibration before the drying thereof is achieved. In the embodiments, the material is applied to the semiconductor material and the conductive material, but it is also applicable to the magnetic recording material, the dielectric material, the insulator material and the like by changing the frequency and the amplitude. Further, similar effects were obtained even in the case of a printing / coating film prepared by applying an intaglio printing, a letterpress printing, a spraying method, a drawing printing method or the like instead of the screen printing method.

【0020】[0020]

【発明の効果】以上に説明したように、本発明によれ
ば、薄膜を塗布した基板を傷つけることなく膜表面の凹
凸を無くして平滑にし、膜中のピンホールを減少させ、
ペースト状材料に巻き込まれた気泡等を除去し、塗布さ
れた膜と基板の密着性を高め、材料粒子の充填密度と配
向性を高める。その結果、薄膜形成時の光学特性や電気
磁気的特性を高め、さらに機械的強度も向上させ、良好
な機能性薄膜を簡便に作製することを可能とする。
As described above, according to the present invention, the substrate coated with a thin film is smoothed by removing the unevenness of the film surface without damaging the pinholes in the film,
Bubbles and the like caught in the pasty material are removed, the adhesion between the applied film and the substrate is enhanced, and the packing density and orientation of the material particles are enhanced. As a result, it is possible to improve optical characteristics and electromagnetic characteristics when forming a thin film, improve mechanical strength, and easily produce a good functional thin film.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例により得たCdS/CdTe系
焼結薄膜式太陽電池の模式断面図である。
FIG. 1 is a schematic cross-sectional view of a CdS / CdTe based sintered thin film solar cell obtained according to an example of the present invention.

【図2】本発明の実施例に用いた音響加振装置の構成を
示す模式図である。
FIG. 2 is a schematic diagram showing a configuration of an acoustic vibration device used in an example of the present invention.

【図3】各種方法により得たCdS膜の表面粗さを比較
した図である。
FIG. 3 is a diagram comparing the surface roughness of CdS films obtained by various methods.

【図4】振動を与える音波の周波数変化の有無と得られ
たCdS膜の表面粗さを比較した図である。
FIG. 4 is a diagram comparing the presence or absence of a frequency change of a sound wave giving vibration and the surface roughness of the obtained CdS film.

【符号の説明】[Explanation of symbols]

1 ガラス基板 2 CdS膜 3 CdTe膜 4 カーボン膜 5 AgIn電極 6 AgIn電極 7 リード線 8 リード線 9 ステージ 10 基板 11 塗布膜 12 音響装置 13 バネ 14 振動装置 15 音波 1 Glass Substrate 2 CdS Film 3 CdTe Film 4 Carbon Film 5 AgIn Electrode 6 AgIn Electrode 7 Lead Wire 8 Lead Wire 9 Stage 10 Substrate 11 Coating Film 12 Acoustic Device 13 Spring 14 Vibration Device 15 Sound Wave

───────────────────────────────────────────────────── フロントページの続き (72)発明者 室園 幹夫 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Mikio Murozono 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 微粉末と粘結剤を混合したペースト状材
料を基板上に塗布する工程、および前記ペースト状材料
の塗布工程中または塗布工程後に、基板および塗布され
たペースト状材料の少なくとも一方に、音響装置を用い
て非接触で振動を与える工程を有することを特徴とする
薄膜の塗布製膜方法。
1. A step of applying a paste-like material in which fine powder and a binder are mixed onto a substrate, and at least one of the substrate and the applied paste-like material during or after the step of applying the paste-like material. And a step of applying vibration in a non-contact manner using an acoustic device.
【請求項2】 微粉末と粘結剤を混合したペースト状材
料を基板上に塗布する工程、および前記ペースト状材料
の塗布工程中または塗布工程後に、基板および塗布され
たペースト状材料の少なくとも一方に、音響装置を用い
て非接触で振動を与えながら同時に別の振動装置を用い
て基板に接触方式で振動を与える工程を有することを特
徴とする薄膜の塗布製膜方法。
2. A step of applying a paste-like material obtained by mixing fine powder and a binder onto a substrate, and at least one of the substrate and the applied paste-like material during or after the step of applying the paste-like material. 1. A method for coating and forming a thin film, which further comprises the step of vibrating in a non-contact manner using an acoustic device and simultaneously vibrating the substrate in a contact method using another vibrating device.
【請求項3】 前記振動を印加中に音響装置の出力周波
数を変化させる請求項1または2記載の薄膜の塗布製膜
方法。
3. The thin film coating method according to claim 1, wherein the output frequency of the acoustic device is changed while the vibration is being applied.
JP6138468A 1994-06-21 1994-06-21 Formation of thin film by coating Pending JPH081076A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6138468A JPH081076A (en) 1994-06-21 1994-06-21 Formation of thin film by coating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6138468A JPH081076A (en) 1994-06-21 1994-06-21 Formation of thin film by coating

Publications (1)

Publication Number Publication Date
JPH081076A true JPH081076A (en) 1996-01-09

Family

ID=15222756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6138468A Pending JPH081076A (en) 1994-06-21 1994-06-21 Formation of thin film by coating

Country Status (1)

Country Link
JP (1) JPH081076A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002233807A (en) * 2001-02-06 2002-08-20 Tokyo Electron Ltd Coating method and coating apparatus
JP2008200674A (en) * 2002-09-20 2008-09-04 Tokyo Electron Ltd Method and apparatus for coating
EP3616809A1 (en) * 2018-08-31 2020-03-04 Siemens Aktiengesellschaft Process for the preparation of sintering material, sintering device and method for producing an electrical machine
WO2022163222A1 (en) * 2021-01-29 2022-08-04 富士フイルム株式会社 Ultrasonic agitation device
US11570545B2 (en) 2020-11-12 2023-01-31 Kabushiki Kaisha Toshiba Acoustic inspection apparatus and acoustic inspection method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002233807A (en) * 2001-02-06 2002-08-20 Tokyo Electron Ltd Coating method and coating apparatus
JP4508436B2 (en) * 2001-02-06 2010-07-21 東京エレクトロン株式会社 Coating method and coating apparatus
JP2008200674A (en) * 2002-09-20 2008-09-04 Tokyo Electron Ltd Method and apparatus for coating
EP3616809A1 (en) * 2018-08-31 2020-03-04 Siemens Aktiengesellschaft Process for the preparation of sintering material, sintering device and method for producing an electrical machine
WO2020043565A1 (en) * 2018-08-31 2020-03-05 Siemens Aktiengesellschaft Method for producing sinter, sintering device, and method for producing an electrical machine
US11570545B2 (en) 2020-11-12 2023-01-31 Kabushiki Kaisha Toshiba Acoustic inspection apparatus and acoustic inspection method
WO2022163222A1 (en) * 2021-01-29 2022-08-04 富士フイルム株式会社 Ultrasonic agitation device

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