JPH0810680B2 - Heat treatment boat - Google Patents
Heat treatment boatInfo
- Publication number
- JPH0810680B2 JPH0810680B2 JP62113348A JP11334887A JPH0810680B2 JP H0810680 B2 JPH0810680 B2 JP H0810680B2 JP 62113348 A JP62113348 A JP 62113348A JP 11334887 A JP11334887 A JP 11334887A JP H0810680 B2 JPH0810680 B2 JP H0810680B2
- Authority
- JP
- Japan
- Prior art keywords
- heat treatment
- semiconductor wafer
- heat
- side plate
- boat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、半導体ウエーハなどの被熱処理物を熱処
理装置で特定の熱処理を行うためにその被熱処理物を載
せる熱処理用ボートに関する。Description: TECHNICAL FIELD The present invention relates to a heat treatment boat on which an object to be heat treated such as a semiconductor wafer is mounted in order to perform a specific heat treatment on the object to be heat treated.
従来、拡散炉などの熱処理装置において、半導体ウエ
ーハに特定の処理を施す場合、その処理は半導体ウエー
ハを処理用治具としての熱処理用ボートに載せて処理チ
ューブ内で行われる。熱処理用ボートは、円板状の半導
体ウエーハを一定の間隔を以て保持するものである。Conventionally, when a semiconductor wafer is subjected to a specific treatment in a heat treatment apparatus such as a diffusion furnace, the treatment is carried out in a treatment tube by placing the semiconductor wafer on a heat treatment boat as a treatment jig. The heat treatment boat holds disc-shaped semiconductor wafers at regular intervals.
従来、この熱処理用ボートは、半導体ウエーハを着脱
することから、その上面側を解放状態とし、底面側に半
導体ウエーハを保持するための複数の溝を一定の間隔で
形成したものである。Conventionally, in this heat treatment boat, since the semiconductor wafer is attached and detached, the upper surface side thereof is opened and a plurality of grooves for holding the semiconductor wafer are formed on the bottom surface side at regular intervals.
このため、縦型炉のように処理チューブが垂直に設置
された場合、処理チューブに熱処理用ボートが垂直に立
てられることになり、処理チューブの下方で熱処理用ボ
ートの出し入れが行われる。この場合、半導体ウエーハ
に振動によって傷を生じさせたり、脱落させたりするこ
とがあった。また、処理中に処理チューブ内で回転させ
る場合にも、遠心力で半導体ウエーハが変位してしまう
などのおそれもあった。For this reason, when the processing tube is installed vertically like a vertical furnace, the heat treatment boat is set upright on the processing tube, and the heat treatment boat is taken in and out below the processing tube. In this case, the semiconductor wafer may be scratched or dropped due to vibration. Further, even when the semiconductor wafer is rotated in the processing tube during processing, the semiconductor wafer may be displaced due to centrifugal force.
そこで、この発明は、半導体ウエーハなどの被熱処理
物を収容する熱処理用ボートにおいて、その被熱処理物
の脱落や振動を伴うことなく、水平または垂直など任意
の角度に設定可能にしたものである。In view of this, the present invention enables a heat treatment boat for accommodating an object to be heat-treated, such as a semiconductor wafer, to be set at an arbitrary angle such as horizontal or vertical without dropping or vibration of the object to be heat treated.
この発明の熱処理用ボートは、第１図に例示するよう
に、側板部６、８の間に板状を成す被熱処理物（たとえ
ば半導体ウエーハ２）の全周縁の半周より狭い間隔で複
数の支柱10、12、14、16が取り付けられ、各支柱に前記
被熱処理物を保持する複数の溝部（溝24）を設け、各溝
部に前記被熱処理物の周縁の一部を挿入して前記被熱処
理物を支持する支持部４と、この支持部の前記側板部に
前記支柱を延長する方向に突設されてチャック32、34に
より把持可能な把持突部５と、前記側板部との間に前記
チャックによって把持可能な間隔を設けて前記把持突部
の周縁方向に突設された鍔部30とを備えたことを特徴と
する。As shown in FIG. 1, the boat for heat treatment of the present invention has a plurality of support columns arranged at intervals narrower than a half circumference of the entire peripheral edge of an object to be heat-treated (eg, semiconductor wafer 2) having a plate shape between the side plate portions 6, 8. 10, 12, 14 and 16 are attached, a plurality of groove portions (grooves 24) for holding the object to be heat treated are provided on each column, and a part of the peripheral edge of the object to be heat treated is inserted into each groove portion to be heat treated. Between the side plate portion and the support portion 4 for supporting an object, the side wall portion of the support portion, and the grip projection portion 5 protruding from the side plate portion in the direction in which the support column is extended and capable of being gripped by the chucks 32, 34. It is characterized in that it is provided with a collar portion 30 which is provided so as to be spaced by a chuck so as to be provided in a circumferential direction of the holding projection portion.
このように構成すると、被熱処理物としてたとえば、
半導体ウエーハ２の周縁を全周縁の1/2以下の間隔で支
持点が設定されることになり、半導体ウエーハ２の支持
によるストレスを防止でき、角度設定は、把持突部５を
以て操作し、任意の角度に設定できるとともに、把持突
部５及び鍔部30を用いて垂直に保持させることができ
る。If constituted in this way, as the heat-treated object, for example,
Support points are set on the peripheral edge of the semiconductor wafer 2 at intervals of 1/2 or less of the entire peripheral edge, stress due to the support of the semiconductor wafer 2 can be prevented, and the angle can be set by operating the grip projections 5 The angle can be set, and it can be held vertically by using the grip projection 5 and the collar 30.
第１図の（Ａ）、（Ｂ）および（Ｃ）はこの発明の熱
処理用ボートの実施例を示す。FIGS. 1 (A), (B) and (C) show an embodiment of the heat treatment boat of the present invention.
この熱処理用ボートは、石英などの耐熱性材料によっ
て一体的構造を成しており、被熱処理物としての半導体
ウエーハ２を支持するための支持部４とともに、移送の
ための把持突部５を備えている。This heat treatment boat has an integral structure made of a heat-resistant material such as quartz, and is provided with a support portion 4 for supporting the semiconductor wafer 2 as the heat-treated object and a grip projection 5 for transfer. ing.
支持部４は、両端に円板状の側板部６、８を設けると
ともに、側板部６、８間に支持部材として４本の支柱1
0、12、14、16を設置したものである。支柱10〜16は、
被支持物としての半導体ウエーハ２の円周上に、半導体
ウエーハ２の全周縁の1/2以下の間隔で設置されてい
る。すなわち、支柱10〜16は、全周縁の1/2以下の間隔
で設定されることから、各支柱10、14は、水平軸ｌに対
して僅かな角度θだけ上方になるように設定されるので
ある。側板部６、８の中央には気体の通流を補助するた
めの透孔18が形成され、支柱10〜16の中途部には、支柱
10〜16をその中間で補強するとともに仕切板を兼ねる中
間補強板20が設けられている。そして、中間補強板20と
側板部６または側板部８との間に保持腕部22が設けられ
ている。したがって、支持部４は、側板部６、８、支柱
10〜16、中間補強板20および保持腕部22によって機械的
を強固な筐体構造を成し、半導体ウエーハ２を収容する
容器を成しているのである。中間補強板20は、第２図
（第１図（Ｂ）のII−II線断面図）に示すように、側板
部６、８と同様に円板状を成し、中央部に透孔18を備え
ている。The support part 4 is provided with disk-shaped side plate parts 6 and 8 at both ends, and four columns 1 are provided as support members between the side plate parts 6 and 8.
It has 0, 12, 14, and 16 installed. The columns 10-16 are
The semiconductor wafer 2 as a supported object is installed on the circumference of the semiconductor wafer 2 at intervals of 1/2 or less of the entire peripheral edge of the semiconductor wafer 2. That is, since the columns 10 to 16 are set at an interval of 1/2 or less of the entire peripheral edge, the columns 10 and 14 are set so as to be above the horizontal axis 1 by a slight angle θ. Of. A through hole 18 for assisting gas flow is formed in the center of the side plate portions 6 and 8, and a pillar is provided in the middle of the pillars 10 to 16.
An intermediate reinforcing plate 20 is provided which reinforces 10 to 16 in the middle and also serves as a partition plate. A holding arm portion 22 is provided between the intermediate reinforcing plate 20 and the side plate portion 6 or the side plate portion 8. Therefore, the support portion 4 includes the side plate portions 6 and 8, the support column.
10 to 16, the intermediate reinforcing plate 20, and the holding arm portion 22 form a mechanically strong casing structure to form a container for housing the semiconductor wafer 2. As shown in FIG. 2 (a sectional view taken along the line II-II of FIG. 1B), the intermediate reinforcing plate 20 has a disc shape similar to the side plate portions 6 and 8, and has a through hole 18 at the center thereof. Is equipped with.
各支柱10〜16は、第３図に示すように、一定の間隔で
半導体ウエーハ２を保持する溝24を形成するとともに、
その溝24の開口部に半導体ウエーハ２の挿入を容易にす
るための傾斜した拡がりを持つ案内面26を設けてある。As shown in FIG. 3, each of the columns 10 to 16 forms a groove 24 for holding the semiconductor wafer 2 at regular intervals, and
The opening of the groove 24 is provided with a guide surface 26 having an inclined expansion for facilitating the insertion of the semiconductor wafer 2.
そして、一方の側板部８には、外面側に段部28を設け
て同心円上に円筒状の一定の長さを持つ把持突部５が設
けられ、この把持突部５の中途部に鍔部30が設けられて
いる。把持突部５は、第４図に示すように、側板部８の
透孔18に通じるように円筒状を成すとともに、側板部８
の同心円軸上に設置されている。Then, one side plate portion 8 is provided with a step portion 28 on the outer surface side and is provided with a cylindrical gripping projection 5 having a constant length on a concentric circle, and a collar portion is provided in the middle of the gripping projection 5. 30 are provided. As shown in FIG. 4, the gripping protrusion 5 has a cylindrical shape so as to communicate with the through hole 18 of the side plate portion 8, and the side plate portion 8
Are installed on the concentric circle axis.
このように熱処理用ボートを構成することによって、
第５図に示すように、４本の支柱10〜16上に半導体ウエ
ーハ２を支持することができる。この場合、支柱10、14
は、周縁側に半導体ウエーハ２の全周縁の1/2以下の間
隔で設置されているので、半導体ウエーハ２の中心Ｏを
通る水平軸ｌより角度θだけ上方に位置して、半導体ウ
エーハ２はその周縁を散点的に支持されている。このよ
うな支持によって、半導体ウエーハ２に対するストレス
を抑制して半導体ウエーハ２の変形などを防止できると
ともに、移送の際の振動や脱落が防止されるのである。By configuring the heat treatment boat in this way,
As shown in FIG. 5, the semiconductor wafer 2 can be supported on the four columns 10 to 16. In this case, the columns 10, 14
Are installed on the peripheral edge side at intervals equal to or less than 1/2 of the entire peripheral edge of the semiconductor wafer 2, so that the semiconductor wafer 2 is positioned above the horizontal axis 1 passing through the center O of the semiconductor wafer 2 by an angle θ. The periphery is supported in a scattered manner. By such support, the stress on the semiconductor wafer 2 can be suppressed to prevent the semiconductor wafer 2 from being deformed and the like, and at the same time, the vibration and the dropout during the transfer can be prevented.
そして、この熱処理用ボートには、その側部に把持突
部５が設置されていることから、第６図に示すように、
開閉可能なチャック32、34を用いて側板部８と鍔部30と
の間の把持突部５を把持して熱処理用ボートを移送する
ことができる。その場合、熱処理用ボートは、チャック
32、34を持つ移送手段によって矢印Ｘ、Ｙ、Ｚの方向に
移送できるとともに、矢印RHで示す水平方向、矢印RVで
示す垂直方向に旋回して立てることができる。Further, since the grip projections 5 are installed on the side portions of this heat treatment boat, as shown in FIG.
By using the chucks 32 and 34 that can be opened and closed, the grip projection 5 between the side plate portion 8 and the collar portion 30 can be gripped to transfer the boat for heat treatment. In that case, the boat for heat treatment
It can be transferred in the directions of arrows X, Y and Z by means of the transfer means having 32 and 34, and can be erected while standing in the horizontal direction indicated by arrow R H and the vertical direction indicated by arrow R V.
また、チャック32、34に把持させて移送された熱処理
用ボートは、第７図に示すように、昇降手段の支持部材
36の保持孔38に把持突部５の一部を挿入し、把持突部５
およびその鍔部30によって支持させれば、矢印Ｗで示す
方向に昇降させることができ、たとえば、加熱装置の処
理チューブに対する出し入れを容易に行うことができ
る。この場合、半導体ウエーハ２は、支持部４によって
確実に支持され、特に、支持部材36を矢印Ｖで示すよう
に回転させた場合にも、半導体ウエーハ２の中心が熱処
理用ボートによって回転中心に合致されているので、遠
心力による脱落を防止できる。Further, as shown in FIG. 7, the boat for heat treatment carried by the chucks 32, 34 while being held is supported by the supporting member of the lifting means.
Insert a part of the grip projection 5 into the holding hole 38 of the 36
If it is supported by the collar portion 30 thereof, it can be moved up and down in the direction shown by the arrow W, and for example, it can be easily taken in and out of the processing tube of the heating device. In this case, the semiconductor wafer 2 is surely supported by the support portion 4, and especially when the support member 36 is rotated as shown by the arrow V, the center of the semiconductor wafer 2 is aligned with the rotation center by the heat treatment boat. Therefore, it can be prevented from falling off due to centrifugal force.
なお、実施例では被熱処理物として半導体ウエーハを
例に取って説明したが、この発明は、半導体ウエーハ以
外の被熱処理物の支持に用いることができる。Although the semiconductor wafer has been described as an example of the object to be heat-treated in the embodiments, the present invention can be used to support an object to be heat-treated other than the semiconductor wafer.
以上説明したように、この発明によれば、半導体ウエ
ーハなどの被熱処理物を確実に支持できるとともに、把
持突部を用いて自由に移送でき、回転や角度設定を容易
に行うことができ、しかも、把持突部にはチャックに対
応した間隔を設けて形成された鍔部が備えられているの
で、把持した際に安定した位置決めや位置的な操作が可
能になり、操作性を高めることができる。As described above, according to the present invention, an object to be heat-treated such as a semiconductor wafer can be surely supported and can be freely transferred by using the grip projection, and rotation and angle setting can be easily performed. Since the grip projection is provided with a collar formed at intervals corresponding to the chuck, stable positioning and positional operation are possible when gripping, and operability can be improved. .
第１図はこの発明の熱処理用ボートの実施例を示す図、
第２図は第１図の（Ｂ）に示した熱処理用ボートのII−
II線断面図、第３図は第１図に示した熱処理用ボートの
支柱の一部を示す図、第４図は第１図に示した熱処理用
ボートの把持突部の断面を示す断面図、第５図は第１図
に示した熱処理用ボートによって半導体ウエーハが支持
される状態を示す図、第６図は第１図に示した熱処理用
ボートの把持突部を把持する形態を示す斜視図、第７図
は第１図に示した熱処理用ボートを支持部材に載せての
昇降を示す図である。 ２……半導体ウエーハ（被熱処理物） ４……支持部 ５……把持突部 ６、８……側板部 10、12、14、16……支柱 24……溝（溝部） 30……鍔部 32、34……チャックFIG. 1 is a diagram showing an embodiment of a heat treatment boat of the present invention,
FIG. 2 shows the heat treatment boat II- shown in FIG.
II line sectional view, FIG. 3 is a view showing a part of the columns of the heat treatment boat shown in FIG. 1, and FIG. 4 is a cross sectional view showing a cross section of the grip projection of the heat treatment boat shown in FIG. 5 is a view showing a state in which a semiconductor wafer is supported by the heat treatment boat shown in FIG. 1, and FIG. 6 is a perspective view showing a mode of gripping the grip projections of the heat treatment boat shown in FIG. FIG. 7 and FIG. 7 are views showing the lifting and lowering with the heat treatment boat shown in FIG. 1 placed on a support member. 2 …… Semiconductor wafer (object to be heat treated) 4 …… Supporting part 5 …… Grip projection 6,8 …… Side plate part 10,12,14,16 …… Strut 24 …… Groove (groove part) 30 …… Crim part 32, 34 …… Chuck
Claims (1)
縁の半周より狭い間隔で複数の支柱が取り付けられ、各
支柱に前記被熱処理物を保持する複数の溝部を設け、各
溝部に前記被熱処理物の周縁の一部を挿入して前記被熱
処理物を支持する支持部と、 この支持部の前記側板部に前記支柱を延長する方向に突
設されてチャックにより把持可能な把持突部と、 前記側板部との間に前記チャックによって把持可能な間
隔を設けて前記把持突部の周縁方向に突設された鍔部
と、 を備えたことを特徴とする熱処理用ボート。1. A plurality of struts are attached between the side plate portions at intervals smaller than a half circumference of the entire peripheral edge of the object to be heat treated, and a plurality of groove portions for holding the object to be heat treated are provided on each of the struts. A support part for supporting the heat-treating object by inserting a part of the peripheral edge of the heat-treating object into the groove part, and a side plate part of the supporting part projectingly provided in a direction in which the support column is extended and graspable by a chuck. A boat for heat treatment, comprising: a grip projection, and a flange portion provided in a circumferential direction of the grip projection with a gap provided between the grip projection and the side plate portion so as to be grippable by the chuck.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62113348A JPH0810680B2 (en) | 1987-05-08 | 1987-05-08 | Heat treatment boat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62113348A JPH0810680B2 (en) | 1987-05-08 | 1987-05-08 | Heat treatment boat |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63278225A JPS63278225A (en) | 1988-11-15 |
| JPH0810680B2 true JPH0810680B2 (en) | 1996-01-31 |
Family
ID=14609976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62113348A Expired - Lifetime JPH0810680B2 (en) | 1987-05-08 | 1987-05-08 | Heat treatment boat |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0810680B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH079374Y2 (en) * | 1988-12-06 | 1995-03-06 | 大阪チタニウム製造株式会社 | Wafer support |
| JP3280438B2 (en) * | 1992-11-30 | 2002-05-13 | 東芝セラミックス株式会社 | Vertical boat |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0648843Y2 (en) * | 1985-04-30 | 1994-12-12 | 株式会社デンコ− | Transfer device for semiconductor processing |
| JPS6219732U (en) * | 1985-07-22 | 1987-02-05 |
-
1987
- 1987-05-08 JP JP62113348A patent/JPH0810680B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63278225A (en) | 1988-11-15 |
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