JPH08102650A - Semiconductor switch with operation display lamp - Google Patents

Abstract

PURPOSE: To make it possible to reduce size though an operation display lamp is integrated in a package and to attain mass production by transfer molding. CONSTITUTION: A light emitting part 4, a light receiving part 5 and an operation display lamp 6 are packaged on a circuit pattern 3 formed on one plane by a conductive plate. Both the parts 4, 5 are photocoupled by a photoconductive part 8 made of translucent synthetic resin and the outside of the photoconductive part 8 is covered with a reflection layer 9 made of white synthetic resin. The display lamp 6 is a visual light emitting diode bare chip and packaged on the pattern 3 by a bonding wire 7 and the pattern 3 is covered with a transparent synthetic resin made package 1 together with the display lamp 6 and the reflection layer 9.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor switch in which a light emitting component and a light receiving component are optically coupled and arranged in a package, and the light receiving component is turned on / off according to whether the light emitting component is turned on or off. The present invention relates to a semiconductor switch with an operation indicator lamp to which a lamp is added.

[0002]

2. Description of the Related Art Conventionally, a light emitting component such as a light emitting diode and a photodiode for detecting lighting / extinguishing of the light emitting component are combined with an appropriate switch element to turn on / off the switch element according to lighting / extinction of the light emitting component. There is a semiconductor switch that is arranged in a package so as to face a light receiving component that is turned off. A switch element that is turned on / off by light such as a phototriac may be used as the light receiving component. This type of semiconductor switch is generally provided as a product such as a solid state relay and a photo coupler.

By the way, in this type of semiconductor switch,
There is provided a package in which an operation indicator lamp for displaying lighting of a light-emitting component or for displaying an electric current is incorporated in a package. That is, if the light emitting component and an operation indicator lamp including a light emitting diode are connected in series and a drive current is passed through a series circuit of the light emitting component and the operation indicator lamp, the lighting of the light emitting component can be indicated by the operation indicator lamp. .

By the way, the semiconductor switch in which the operation indicator lamp is incorporated in one package is currently constructed as a hybrid IC composed of a general semiconductor switch and an operation indicator lamp. In this type of semiconductor switch, The package is formed by potting.

[0005]

The hybrid IC as described above has a relatively large package and has a limit to miniaturization. Therefore, it is suitable as a component to be incorporated in electronic equipment which is required to be miniaturized as in recent years. There is a problem that there is no. The present invention has been made in view of the above problems, and an object thereof is to make it possible to reduce the size while incorporating an operation indicator light in one package, and to adopt a structure to which a transfer molding manufacturing technique can be applied. It is to provide a semiconductor switch with an operation indicator light that enables mass production.

[0006]

In order to achieve the above object, the invention of claim 1 provides a light emitting component and a light receiving component in which a circuit pattern made of a conductive plate is formed on one plane and mounted on the circuit pattern. In a semiconductor switch that forms a light guide part made of translucent synthetic resin in the form of optical coupling and turns on and off the light receiving part according to lighting and extinguishing of the light emitting part, it covers the outer circumference of the light guide part and receives light A reflective layer that reflects the light transmitted to and from the component and blocks the incidence of external light on the light guide, and a bonding wire that is placed on a different part of the circuit pattern from the light emitting component and the light receiving component. It is composed of a chip-shaped operation indicator light mounted on the circuit pattern and a package made of a transparent synthetic resin that covers the circuit pattern including the reflection layer and the operation indicator light.

According to the second aspect of the invention, a circuit pattern made of a conductive plate is formed on one plane, and the light emitting component and the light receiving component mounted on the circuit pattern are optically coupled to each other and are made of a transparent synthetic resin. In a semiconductor switch that forms a light guide part and turns on and off a light receiving part depending on whether the light emitting part is turned on or off, covers the outer periphery of the light guide part and reflects light transmitted between the light emitting part and the light receiving part At the same time, a reflection layer that blocks the incidence of external light on the light guide section, an operation indicator light that is mounted on a part of the circuit pattern that is different from the light emitting component and the light receiving component, and at least one covering the circuit pattern including the reflection layer. And a package capable of taking out the light of the operation indicator lamp from the unit.

According to a third aspect of the present invention, a light guide part made of a translucent synthetic resin is formed by optically coupling a light emitting component and a light receiving component mounted on a circuit pattern formed on one surface of a printed wiring board to emit light. In a semiconductor switch that turns on / off a light-receiving component depending on whether the component is turned on or off, it covers the outer periphery of the light-guiding unit and reflects the light transmitted between the light-emitting component and the light-receiving component and also guides the external light. Reflective layer that blocks the incidence of light, a chip-shaped operation indicator lamp mounted on the circuit pattern using a bonding wire that is placed at a different part of the circuit pattern from the light emitting component and the light receiving component, and the reflective layer and the operation indicator lamp And a package made of a transparent synthetic resin that covers the circuit pattern including.

[0009]

According to the structure of the invention of claim 1, the chip-like operation indicator lamp is mounted on the conductive plate on which the circuit pattern for mounting the light emitting component and the light receiving component is formed. Since the and are packaged in a single package and the chip-shaped operation indicator lamp is mounted on the conductive plate together with the light emitting component and the light receiving component, the package can be formed by transfer molding. Therefore, mass productivity is improved. Further, since the circuit for mounting the operation indicator lamp is formed by the conductive plate together with the mounting parts of the light emitting component and the light receiving component, it is possible to provide the operation indicator lamp in the package of the semiconductor switch which has been conventionally provided. As a result, it is possible to form a small package while incorporating the operation indicator light in one package. Moreover, since the package that covers the operation indicator light is made of transparent synthetic resin, it is possible to see whether the operation indicator light is on or off from almost the entire periphery of the package.
It is easy to confirm that the light is off.

According to the second aspect of the present invention, since the package capable of extracting the light of the operation indicator light from at least a part is used, the operation indicator lamp is not a chip-like one but a resin-molded one. However, it can be used. Moreover, similar to the configuration of the first aspect of the invention, the package can be formed by transfer molding, which improves the mass productivity. Further, since the circuit for mounting the operation indicator lamp is formed by the conductive plate together with the mounting parts of the light emitting component and the light receiving component, it is possible to provide the operation indicator lamp in the package of the semiconductor switch which has been conventionally provided. As a result, it is possible to form a small package while incorporating the operation indicator light in one package.

According to the third aspect of the present invention, the light emitting component and the light receiving component are mounted on the circuit pattern formed on one surface of the printed wiring board, the operation indicator lamp is mounted, and the printed wiring board is installed in the package. Therefore, the package can be formed by transfer molding, and the mass productivity is improved. In addition, since the operation indicator lamp is mounted on the circuit pattern formed on the printed wiring board together with the mounting parts of the light emitting component and the light receiving component, it is possible to provide the operation indicator lamp in the package of the semiconductor switch that has been conventionally provided. In addition, it is possible to form a small package while incorporating the operation indicator light in one package. Moreover, since the package that covers the operation indicator is made of transparent synthetic resin, it is possible to see whether the operation indicator is on or off from almost the entire circumference of the package, and it is easy to check whether the operation indicator is on or off. become.

[0012]

【Example】

(Embodiment 1) The shape of this embodiment is as shown in FIG. 1 and includes a package 1 formed of a transparent synthetic resin (epoxy resin or the like). Three lead pieces 2 are provided so as to project from both side surfaces of the package 1. The lead piece 2 is a circuit pattern 3 formed on a plane by a conductive plate.
The light emitting component 4, the light receiving component 5, and the operation indicator lamp 6 are mounted on the circuit pattern 3.

The light emitting component 4 is composed of a light emitting diode, and is mounted by die bonding on a light emitting component pattern 3b which is continuous with the central lead piece 2 among the three lead pieces 2 arranged on the lower side in FIG. 1 (a). . One end of the light emitting component 4 has a common pattern 3c continuous with the lead piece 2 at the lower right end via a bonding wire 7 (gold or aluminum).
Electrically connected to. In addition, a phototransistor or a phototriac is used for the light receiving component 5, as shown in FIG.
Of the three lead pieces 2 arranged on the upper side of (a), the light receiving component pattern 3d continuous to the left end lead piece 2 is the light emitting component 4.
The light receiving component 5 is extended to the vicinity of the mounting portion and the light receiving component 5 is mounted on the extended portion by die bonding. One end of the light receiving component 5 is connected via a bonding wire 7 to a wire pattern 3e continuous with the lead piece 2 at the upper right end. The operation indicator lamp 6 is a bare chip of a visible light emitting diode, and is mounted by die bonding on the tip of a common pattern 3c extending between the light emitting component pattern 3b and the light receiving component pattern 3d. Further, one end of the operation indicator light 6 has a wire pattern 3 continuous with the lead piece 2 at the lower left end.
It is connected to a through a bonding wire 7.
The mounting position of the operation indicator light 6 is in the vicinity of the lead piece 2 at the lower left end of FIG. 1A, and the operation indicator light 6 is arranged in a biased position when viewed from the front. Nothing is connected to the lead piece 2 in the upper center as a play terminal.

By the way, in the structure of this embodiment, the light emitting component 4
In order to transmit light between the light receiving component 5 and the light receiving component 5, a light guide portion 8 made of translucent synthetic resin (silicon resin) is formed so as to straddle the light emitting component 4 and the light receiving component 5, and is further guided. Light section 8
In order to prevent light leakage from the light receiving component 5 and prevent the light receiving component 5 from receiving external light, the entire light guiding portion 8 is covered with a reflective layer 9 made of white synthetic resin (silicon resin). The light guide 8 is formed in a dome shape, and the light from the light emitting component 4 passes through the light guide 8 and is reflected by the surface of the reflective layer 9 to enter the light receiving component 5. Therefore, the lighting of the light emitting component 4
The pair of lead pieces 2 to which both ends of the light receiving component are connected are turned on / off according to turning off.

When manufacturing the semiconductor switch of this embodiment, as shown in FIG. 2, the light emitting component 4, the light receiving component 5, and the operation indicator lamp 6 are diced on the lead frame of the conductive plate on which the circuit pattern 3 is formed. It is mounted by bonding, and then wire bonding is performed to make electrical connection. Next, FIG.
After forming the light guide 8 and the reflective layer 9, as shown in FIG.
As shown in FIG. 1, a package 1 is formed by molding a transparent synthetic resin.

As described above, the light emitting component 4, the light receiving component 5, and the operation indicator lamp 6 are formed on the conductive plate on which the circuit pattern 3 is formed.
Since the package 1 made of the transparent synthetic resin is formed in the state of being mounted, it is possible to form the package 1 by transfer molding. Further, since the operation indicator lamp 6 is directly mounted on the conductive plate on which the circuit pattern 3 is formed, the size can be reduced as compared with the hybrid IC formed by conventional potting. Moreover, as described above, since the operation indicator lamp 6 is arranged at a position displaced from the center of the surface of the package 1 and in the vicinity of one lead piece 2, the operation indicator lamp 6 indicates the direction of the package 1. It can also be used as a mark to do.

If a resistor is mounted instead of the operation indicator lamp 6, the resistor can be connected in series to the light emitting component 6 so that driving can be performed by voltage input without adding another component. (Embodiment 2) In this embodiment, a resin-molded component is used as the operation indicator lamp 6 instead of the bare chip. Further, as shown in FIG. 4, the front end surface of the operation indicator lamp 6 is flat and flush with the outer surface of the package 1.

When manufacturing such a semiconductor switch, the circuit pattern 3 having a shape as shown in FIG. 5 is formed. Circuit pattern 3 of Example 1 of this circuit pattern 3
The main difference is that the land 10 is formed in the portion where the operation indicator light 6 is mounted. Then, as shown in FIG. 6, the operation indicator lamp 6 is connected to the land 10 by a conductive adhesive such as solder or silver paste. After that, as shown in FIG. 4, the package 1 may be formed by resin molding. Here, the package 1 can be used with either a transparent synthetic resin or an opaque synthetic resin. When an opaque synthetic resin is used, the light from the operation indicator lamp 6 can be taken out of the package 1.

As a specific configuration for extracting the light from the operation indicator lamp 6 from the opaque synthetic resin package 1, the tip surface of the operation indicator lamp 6 is flush with the outer surface of the package 1 as described above. Or a configuration in which the tip portion of the operation indicator lamp 6 is projected from the package 1, and the tip end surface of the operation indicator lamp 6 is located inward of the outer surface of the package 1 and an output lens (not shown) is provided. ) Can be closely attached to the tip surface of the operation indicator lamp 6 and a part of the output lens can be projected from the package 1. Among these configurations, in the configuration in which the light output portion is projected from the outer side surface of the package 1, the range in which the operation indicator lamp 6 can be visually recognized whether it is on or off is wide. On the other hand, when the package 1 is made of transparent synthetic resin, it is not necessary to expose the light output portion from the operation indicator lamp 6 to the outside of the package 1. Other configurations and operations are similar to those of the first embodiment.

(Embodiment 3) In this embodiment, as shown in FIG. 7, a bare chip of a light emitting diode is used for the operation indicator lamp 6 as in Embodiment 1, but the circuit pattern 3 is formed of a conductive plate. Instead, the circuit pattern 3 is formed on one surface of the printed wiring board 11. That is, the components are mounted by so-called chip-on-board. Other configurations are similar to those of the first embodiment.

When manufacturing this semiconductor switch, first, as shown in FIG. 8, the light emitting component 4, the light receiving component 5, and the light receiving component 5 are provided on the printed wiring board 11 on which the circuit pattern 3 is formed.
After mounting the operation indicator lamp 6 by die bonding or wire bonding, the light guide portion 8 and the reflection layer 9 are formed. Next, as shown in FIG. 9, the printed wiring board 11 is connected to the lead pieces 2 formed on the lead frame with a conductive adhesive such as solder or silver paste. After that, the package 1 is formed by molding the transparent synthetic resin.

[0022]

According to the invention of claim 1, a chip-like operation indicator lamp is mounted on a conductive plate on which a circuit pattern for mounting a light emitting component and a light receiving component is formed, and the light emitting component, the light receiving component and the operation indicator lamp are mounted. Since it is housed in a single package and the chip-shaped operation indicator light is mounted on the conductive plate together with the light emitting component and the light receiving component, it is possible to form the package by transfer molding, which improves mass productivity. Has the advantage that Further, since the circuit for mounting the operation indicator lamp is formed by the conductive plate together with the mounting parts of the light emitting component and the light receiving component, it is possible to provide the operation indicator lamp in the package of the semiconductor switch which has been conventionally provided. As a result, there is an effect that it is possible to form a small size while incorporating the operation indicator light in one package. Moreover, since the package that covers the operation indicator is made of transparent synthetic resin, it is possible to see whether the operation indicator is on or off from almost the entire circumference of the package, and it is easy to check whether the operation indicator is on or off. become.

According to the second aspect of the present invention, since the package capable of extracting the light of the operation indicator light from at least a part thereof is used, it is possible to use not the chip-like operation indicator lamp but the resin-molded one. There is an advantage that you can. Moreover, like the invention of claim 1, there is an advantage that the package can be formed by transfer molding and the mass productivity is improved, and the operation indicator lamp is mounted by the conductive plate together with the mounting portions of the light emitting component and the light receiving component. It is possible to provide the operation indicator light in the package of the semiconductor switch which has been conventionally provided because the circuit for forming the operation indicator is formed, and it is possible to form the operation indicator lamp in a small size while incorporating the operation indicator light in one package. There is an advantage that you can.

According to the third aspect of the present invention, the operation indicator lamp is mounted on the circuit pattern formed on one surface of the printed wiring board together with the light emitting component and the light receiving component, and the printed wiring board is housed in the package. There is an effect that it can be formed by transfer molding and mass productivity is improved, and because the operation indicator lamp is mounted on the circuit pattern formed on the printed wiring board together with the mounting parts of the light emitting component and the light receiving component, The operation indicator lamp can be provided in the package of the semiconductor switch which has been provided conventionally, and there is an effect that it can be formed in a small size while incorporating the operation indicator lamp in one package. Moreover, since the package that covers the operation indicator is made of transparent synthetic resin, it is possible to see whether the operation indicator is on or off from almost the entire circumference of the package, and it is easy to check whether the operation indicator is on or off. It becomes.

[Brief description of drawings]

1A and 1B show a first embodiment, in which FIG. 1A is a plan view and FIG. 1B is a side view.

2A and 2B show a manufacturing process of Example 1, (a) is a plan view,
(B) is a side view.

FIG. 3 shows a manufacturing process of Example 1, (a) is a plan view,
(B) is a side view.

4A and 4B show Embodiment 2 in which FIG. 4A is a plan view and FIG. 4B is a side view.

FIG. 5 shows a manufacturing process of Example 2, (a) is a plan view,
(B) is a side view.

FIG. 6 shows a manufacturing process of Example 2, (a) is a plan view,
(B) is a side view.

7A and 7B show a third embodiment, in which FIG. 7A is a plan view and FIG. 7B is a side view.

FIG. 8 shows a manufacturing process of Example 3, (a) is a plan view,
(B) is a side view.

FIG. 9 shows a manufacturing process of Example 3, (a) is a plan view,
(B) is a side view.

[Explanation of symbols]

 1 Package 2 Lead Piece 3 Circuit Pattern 4 Light Emitting Component 5 Light Receiving Component 6 Operation Indicator 7 Bonding Wire 8 Light Guide 9 Reflective Layer 10 Land 11 Printed Wiring Board

Claims (3)

[Claims] 1. A light guide section made of translucent synthetic resin is formed in such a manner that a circuit pattern made of a conductive plate is formed on one plane and a light emitting component and a light receiving component mounted on the circuit pattern are optically coupled. In a semiconductor switch that turns on / off a light-receiving component depending on whether the light-emitting component is turned on or off, it covers the outer circumference of the light-guiding component and reflects the light transmitted between the light-emitting component and the light-receiving component and also guides the external light. A reflective layer for blocking the incidence on
A chip-shaped operation indicator placed on the circuit pattern at a different part from the light-emitting and light-receiving components and mounted on the circuit pattern using bonding wires, and a transparent composite that covers the circuit pattern including the reflective layer and operation indicator. A semiconductor switch with an operation indicator light, which comprises a resin package. 2. A light guide section made of translucent synthetic resin is formed in such a manner that a circuit pattern made of a conductive plate is formed on one plane and the light emitting component and the light receiving component mounted on the circuit pattern are optically coupled. In a semiconductor switch that turns on / off a light-receiving component depending on whether the light-emitting component is turned on or off, it covers the outer circumference of the light-guiding component and reflects the light transmitted between the light-emitting component and the light-receiving component and also guides the external light. A reflective layer for blocking the incidence on
It consists of an operation indicator light mounted on a part of the circuit pattern different from the light emitting component and the light receiving component, and a package that covers the circuit pattern including the reflective layer and can extract the light of the operation indicator light from at least a part. A semiconductor switch with an operation indicator light. 3. A light guide part made of translucent synthetic resin is formed by optically coupling a light emitting component and a light receiving component mounted on a circuit pattern formed on one surface of a printed wiring board, and the light emitting component is turned on / off. In a semiconductor switch that turns on / off the light receiving component in accordance with the above, it covers the outer periphery of the light guide and reflects the light transmitted between the light emitting component and the light receiving component, and blocks the incidence of external light to the light guide. A circuit pattern including a reflective layer, a chip-shaped operation indicator placed on the circuit pattern at a position different from the light emitting component and the light receiving component and mounted on the circuit pattern using a bonding wire, and the reflection layer and the operation indicator. And a package made of a transparent synthetic resin for covering the semiconductor switch with an operation indicator light.