JPH0810190Y2 - ボンディング装置 - Google Patents
ボンディング装置Info
- Publication number
- JPH0810190Y2 JPH0810190Y2 JP1990110222U JP11022290U JPH0810190Y2 JP H0810190 Y2 JPH0810190 Y2 JP H0810190Y2 JP 1990110222 U JP1990110222 U JP 1990110222U JP 11022290 U JP11022290 U JP 11022290U JP H0810190 Y2 JPH0810190 Y2 JP H0810190Y2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- bonding
- compression
- pressing
- molded body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H10W72/07178—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990110222U JPH0810190Y2 (ja) | 1990-10-23 | 1990-10-23 | ボンディング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990110222U JPH0810190Y2 (ja) | 1990-10-23 | 1990-10-23 | ボンディング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0467335U JPH0467335U (cg-RX-API-DMAC10.html) | 1992-06-15 |
| JPH0810190Y2 true JPH0810190Y2 (ja) | 1996-03-27 |
Family
ID=31857529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990110222U Expired - Fee Related JPH0810190Y2 (ja) | 1990-10-23 | 1990-10-23 | ボンディング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0810190Y2 (cg-RX-API-DMAC10.html) |
-
1990
- 1990-10-23 JP JP1990110222U patent/JPH0810190Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0467335U (cg-RX-API-DMAC10.html) | 1992-06-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |