JPH079507U - Tinbiki guide dies - Google Patents

Abstract

(57) [Summary] [Structure] In a guide die in which a die chip is provided on a metal pedestal, a super-hard precious stone die chip is fitted and fixed to the surface of the metal pedestal at the entrance of the guide die, and the central portion of the die chip Has a circular tubular passage, and the circular tubular passage has a shape in which the diameter gradually increases after passing through the bottleneck portion at the central portion, and extends continuously to the outlet portion of the circular tubular passage of the die chip. A tin-boiled guide die, characterized in that a circular cylindrical passage having a shape is formed at the outlet on the back surface of the metal pedestal. [Effect] Using the die of the present invention, foreign matter is less clogged, the die chip is not damaged, the conductor wire does not vibrate during drawing, and the wire diameter It has advantages such as stabilization and improved smoothness of the conductor wire surface.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an improvement in a guide die used for smoothing a tin-plated conductor surface when performing surface modification by applying tin plating to an electrically conductive conductor wire.

[0002]

[Prior art]

 2. Description of the Related Art Conventionally, tin-bide guide dice using ultra-hard precious stone die chips such as diamond have been widely used, and those having the same structure as a normal wire drawing die have been used. That is, as shown in FIG. 3, a structure was used in which an ultra-hard precious stone die was embedded in the center of the fixing metal pedestal 2. In this conventional guide die, an introduction port E with a taper whose diameter becomes narrower as the conductor wire goes from the entrance into which the conductor wire enters toward the die chip is provided inside the metal pedestal, and the taper of the introduction port E is smooth. A circular tubular passage with a taper of precious stone die chips in a continuous shape is provided. There is a bottleneck portion H with the smallest diameter in the center of the circular tubular passage of the precious stone die chip, and when passing through the bottleneck portion H, the diameter gradually increases, and the exit passage F of the outlet part of the metal pedestal gradually expands smoothly. Connect Conventionally, titanium has been mainly used as a material for the metal pedestal of the guide die because it has a high strength and is particularly resistant to the adhesion of plated tin. However, even if the titanium metal pedestal is used for a long period of time, tin is adhering to the inlet E or sludge is adhering to it from the tin plating tank. Vibration of the conductor wire during the work became severe and it was necessary to stop the work in order to stop the work and remove the sludge. In conventional guide dies, the only method to remove this sludge is to remove it with a needle-shaped metal stick, etc. There was a drawback that an accident that linear scratches were generated on the finished surface of.

[0003]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a tin-stick guide die that does not cause clogging during long-term surface treatment of tin-lead conductor wires.

[0004]

[Means for Solving the Problems]

 The present inventors have found that the accumulation of sludge, which causes the clogging, has a good affinity between the metal surface of the metal pedestal and tin or tin oxide transferred from the tin plating tank. It was discovered that it is a mechanism that causes the accumulation of sludge such as hard metal compound impurities and rocks that have adhered to the metal surface of the die tank before passing through the bottleneck part H of the die chip. We have found that a structure that avoids contact between the metal pedestal surface and the tin-plated surface can prevent the accumulation of clogging substances such as sludge, and based on this finding, we completed the present invention.

That is, the present invention is a guide die in which a die chip is provided on a metal pedestal, and a super-hard precious stone die chip is fitted and fixed on the surface of the metal pedestal at the entrance of the guide die, and the center of the die chip is fixed. There is a circular tubular passage in the portion, and the diameter of the circular tubular passage gradually decreases from the entrance of the die chip to the center of the circular tubular passage. The shape is such that the diameter gradually increases as it goes through the bottleneck part with the smallest diameter of the part and then goes to the exit of the die chip, and the taper angle of the expanding diameter of the exit part of the circular cylindrical passage of the die chip The present invention provides a tin-casting guide die, characterized in that a circular cylindrical passage having a shape that smoothly expands at a taper angle is formed at the outlet on the back surface of the metal pedestal. The metal pedestal used in the guide die of the present invention may be any metal without particular limitation as long as it has a strength and hardness that can firmly fix the die chip as shown in FIG. For example, any metal having strength such as titanium, cemented carbide, or steel can be used without particular limitation, but titanium is preferable because it has a low affinity for tin. In the present invention, the contact between the metal pedestal and the tin-containing conductor wire is the inner surface of the metal pedestal at the exit of the guide die, and the use of titanium is not an absolute condition as in the case of the conventional guide die. For the die chip used in the present invention, ultra-hard precious stones can be used.For example, known precious stone die chips used as natural diamond, sintered diamond, artificial single crystal and other tin-bending die chips are not particularly limited. Can be used. The present invention will be described in more detail with reference to the embodiment of the guide die shown in the sectional view of FIG. 1 and the plan view of FIG.

The embodiment of FIG. 1 is a guide die in which the contact portion between the tin-containing conductor wire and the surface of the metal pedestal 2 at the inlet E in the conventional guide die of FIG. 3 is removed. A recessed portion for fixing the die chip is provided on the surface of the central portion of the metal pedestal 2, and the die chip is firmly fixed and fitted into the recessed portion. In order to fit the die chip as in the embodiment, for example, in the case of a titanium metal pedestal, the die chip is placed in titanium metal fine powder, and the die chip is exposed on the surface as shown in FIG. 1 or 2. It can be formed by compression molding at a high pressure into a desired shape and then sintering in an electric furnace in an inert atmosphere or a reductive hydrogen atmosphere. Other known fixing methods can be appropriately adopted as a method for fixing the die. The die chip 1 of the present embodiment has a circular tubular passage in the center, the circular tubular passage has a bottleneck portion H with the smallest diameter in the passageway center, and a tapered circle that spreads on both sides across the bottleneck portion H. It forms a passage. The diameter of the bottleneck portion H can be set to be slightly smaller than the diameter of the tin-containing conductor wire to be introduced. The taper angle of the passage extending from the bottleneck portion H can be set to an angle of 60 to 120 degrees, preferably 70 to 90 degrees with respect to the passage center line. If the taper angle is larger than this range, the appearance of the finished surface will be poor, and if it is narrow, the work efficiency will be reduced. In the guide die of this embodiment, a circular cylindrical passage F having a taper that continuously expands like a trumpet at a taper angle that is substantially the same as the taper angle at which the circular passage outlet of the die chip spreads is provided on the back surface of the metal pedestal 2. is there.

[0007]

[Action]

 In the guide die of this embodiment, the tin-containing conductor wire directly enters the inlet of the cylindrical passage H of the die chip and enters the die chip without contacting the surface of the metal pedestal. The conductor wire from the die chip of this embodiment exits from the die via a tapered circular cylindrical outlet passage F in which the diameter of the metal pedestal 2 is widened. In the guide die of the present embodiment, since the affinity between the precious stones of the die chip and tin is low, tin or sludge will not be clogged at the entrance of the die chip. Further, in the exit passage F of the metal pedestal 2 after passing through the bottleneck portion H, since the space between the conductor wire and the circular passage is open, the friction is much smaller than that before the bottleneck portion H. Sludge does not adhere.

[0008]

[Effect of device]

 When the die of the present invention is used, foreign matter brought in from the tin plating tank is less likely to be clogged as compared with the conventional shape having the inlet E as shown in FIG. 3, and even if the die is clogged, the removal thereof is facilitated. In addition, the die chip is not damaged, the conductor wire does not vibrate during drawing, the wire diameter is stabilized, and the conductor wire surface has improved smoothness.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view of a tin guide die according to an embodiment of the present invention.

FIG. 2 is a plan view of a tin guide die according to an embodiment of the present invention.

FIG. 3 is a vertical sectional view of a diamond die having a conventional structure.

[Explanation of symbols]

 1 Dice chip 2 Metal base E Inlet F Outlet passage H Bottleneck

Claims (1)

[Scope of utility model registration request] 1. A guide die comprising a metal pedestal provided with a die chip, wherein a super-hard precious stone die chip is fitted and fixed on the surface of the metal pedestal at the entrance of the guide die, and a circular cylinder is provided at the center of the die chip. There is a circular passage, and the diameter of the circular tubular passage gradually decreases from the entrance of the die tip toward the center of the circular tubular passage. The diameter is such that the diameter gradually increases as it goes through the bottleneck portion to the outlet of the die chip, and the taper smoothly continues to the taper angle of the expanding diameter of the outlet portion of the circular cylindrical passage of the die chip. A tin-boiler guide die, characterized in that a circular tubular passage having a shape that expands at an angle is formed at the outlet of the back surface of the metal pedestal.