JP2582232Y2 - Tin bronze guide dies - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a guide die used for smoothing the surface of a tin-plated conductor when the surface of the conductive wire is tin-plated for surface modification.

[0002]

2. Description of the Related Art Heretofore, tinning guide dies using ultra-hard precious stone die chips of diamond or the like have been widely used, and those having the same structure as ordinary drawing dies have been used. That is, as shown in FIG. 5, a structure in which a super-hard precious stone die is embedded in the center of the fixing metal base 3 has been used. In this conventional guide die, a tapered inlet E whose diameter becomes smaller as the conductor wire goes from the entrance where the conductor wire enters to the die chip is provided inside the metal base, and the taper of the inlet E smoothly extends. A tapered circular cylindrical passage of a continuous shape precious stone die tip is provided. At the center of the circular cylindrical passage of the precious stone die chip, there is a bottleneck portion H having the smallest diameter, and when passing through the bottleneck portion H, the diameter gradually increases, and smoothly leads to an outlet passage F gradually expanding at the outlet portion of the metal base. Conventionally, the material of the metal base of the guide die has strength, especially as a metal to which plated tin is difficult to adhere.
Titanium was used exclusively. However, when the titanium metal table is used for a long period of time, adhesion of tin or adhesion of sludge brought in from the tin plating tank is observed at the inlet E,
This was drawn into the tapered portion of the precious stone die tip, and the guide die was clogged. The vibration of the continuously running conductor wire during the work became severe, and the work had to be stopped and the work had to be interrupted to remove sludge. In conventional guide dies, there is no other way to remove this sludge except by removing it with a needle-shaped metal stick or the like.At that time, the surface of the die is damaged, and the tinned conductor wire passing through the guide die is removed. There is a drawback that an accident occurs in which a linear scratch occurs on the finished surface. Also, the conductor wire is subjected to acid cleaning before tin plating. Thereafter, it is treated in an acid stripping process, but there is also a disadvantage that a small amount of acid is accompanied and the metal base is gradually corroded.

[0003]

SUMMARY OF THE INVENTION An object of the present invention is to provide a tinned guide die which does not cause clogging in a long-time surface treatment of a tinned conductor wire.

[0004]

SUMMARY OF THE INVENTION The inventors of the present invention have found that the accumulation of sludge causing clogging is caused by the affinity between the metal surface of the metal base and tin or tin oxide transferred from the tin plating bath. For good reasons, it was found that this adhered to the metal surface of the inlet E, and this adhesion was a mechanism that caused the accumulation of sludge such as hard metal compound impurities and rocks transferred from the plating tank at the inlet E. However, by using a heat-resistant high-molecular material as the material of the inlet E, the clogging in the tinning operation was successfully eliminated, and the present invention was completed.

That is, the present invention comprises a pedestal having a cylindrical passage and an ultra-hard precious stone die chip fixed inside the cylindrical passage, and the die chip has two side cylindrical passages leading to the front and back openings of the pedestal. And the cylindrical passage of the die chip has a bottleneck portion having a minimum diameter at the center, and a gently tapered passage having a gradually increasing diameter before and after the bottleneck portion. Formed on both sides of the cylindrical passage of the die chip, in a guide die of a structure in which the cylindrical passage of the pedestal that spreads at an angle substantially equal to the taper inclination of the die chip is connected smoothly and continuously, the pedestal is made of heat-resistant resin or A tin die guide die made of ceramics, and a pedestal having a cylindrical passage and an ultra-hard precious stone die chip fixed to the pedestal surface at one end of the cylindrical passage. The die chip has a cylindrical passage that is continuous with a cylindrical passage that communicates with the back side outlet of the pedestal. The cylindrical passage of the die chip has a bottleneck portion having a minimum diameter at the center, and the bottleneck portion has Before and after, a gently tapered passage whose diameter gradually increases is formed, and on the back side of the die chip cylindrical passage, a pedestal cylindrical passage that spreads at an angle almost equal to the taper inclination of the die chip smoothly continues The present invention provides a tin die guide die, wherein the base is made of heat-resistant resin or ceramics.

The heat-resistant resin used for the pedestal of the guide die of the present invention is a resin having strength and hardness capable of firmly fixing the die chip, as shown in FIG. 1 or FIG. 3, and is thermally deformable to withstand high temperatures due to frictional heat. Any resin can be used without limitation as long as it is a heat-resistant engineering resin having a temperature of 180 ° C or higher, preferably 200 ° C or higher, particularly preferably 250 ° C or higher. For example, polyimide,
Polyamide imide, polyether imide, aromatic polyamide, aromatic polyester, polyallyl sulfone, polyether ketone, polyether ether ketone, polyether nitrile, polysulfone, polyallyl sulfone,
Polyether sulfone, polyphenylene sulfide, polythioether sulfone, polyamide bismaleimide,
Heat-resistant engineering resins such as bismaleimide triazine and polybezoimidazole can be used. Among these, polyimide-based resins having a low coefficient of metal friction resistance of 0.5 or less, preferably 0.35 or less, and low friction heat resistance and good abrasion resistance, such as polyimide, polyamideimide, polyetherimide, and polyamide Bismaleimide, bismaleimide triazine, polybezoimidazole (friction resistance 0.27), aromatic amides and aromatic polyesters are particularly preferred. A die chip is put into these heat-resistant resin powders, and is then subjected to a high-temperature compressor.
The guide die can be manufactured by compression molding at a pressure of 000 kg / cm ² . For example, when a polyimide resin is used, FIG. 1 or FIG.
Can be manufactured by pressing and cooling at 300 ° C. with a hot press at a pressure of 1000 kg / cm ² .

The ceramic used for the base of the guide die of the present invention can be used without any particular limitation as long as it has strength. For example, zirconia, alumina (particularly, sol-gel sintered alumina), magnesium oxide, oxide Ceramic materials such as zirconium, silicon nitrite, polonite, calcined dolomite, beryllia, and cordierite can be used. In particular, those having a high brazing strength for fixing a die chip are desirable. When using ceramics for the base of the present invention,
The pedestal of the guide die of the present invention is obtained by firing a compression molded body of ceramic powder in the form of vertically or horizontally divided into two at a temperature of 1500 ° C. or higher, and fitting and fixing a die chip to this via a brazing material. The brazing of the pedestal and the die chip and the brazing of the pedestals are heated, for example, to about 800 to 1000 ° C. in an inert gas atmosphere or a hydrogen gas atmosphere in an electric furnace to manufacture the guide die of the present invention. .
As the brazing material used here, for example, a material having good wettability to diamond and ceramics of a die chip such as silver brazing can be selected and used.
The die chips used in the present invention can be made of precious stones, for example, natural diamond, sintered diamond,
Known precious stone die chips that have been used as artificial single crystals or other tinned die chips can be used without any particular limitation.

The present invention will be described in more detail with reference to the drawings of embodiments. In the first embodiment of the present invention, a die chip 1 is fixed inside a cylindrical passage of a pedestal 2 as shown in the sectional view of FIG. 1 and the plan view of FIG. in this case,
The die chip 1 can be provided at any position as long as it is inside the cylindrical passage of the pedestal 2 without any particular limitation. It is desirable that the pedestal 2 be located closer to the entrance by about 5 to 30% of the thickness of the pedestal 2 than the center. Die chip 1 of this embodiment
Has a circular cylindrical passage in the center, the circular cylindrical passage has a bottleneck portion H having the smallest diameter at the center of the passage, and the bottleneck portion H
To form a circular passage with a taper that extends to both sides. The diameter of the bottleneck portion H can be set to a diameter slightly smaller than the diameter of the tinned conductor wire to be introduced. And
The angle of the taper of the passage extending from the narrow road portion H is 60 to 120 degrees with respect to the center line of the passage, preferably 70 to 120 degrees.
It can be tapered at an angle of 90 degrees. If the angle of the taper is larger than this range, the appearance of the finished surface will be poor, and if it is narrow, the working efficiency will be reduced. The guide die according to the present embodiment has an inlet E and an outlet passage flaring toward the front entrance and the rear exit at substantially the same taper angles as the taper angles gradually increasing toward both side surfaces of the circular passage of the die chip of FIG. F is provided on both front and back sides of the pedestal 2.

In this embodiment, the conductor wire continuously introduced into the guide die is introduced into the inlet E at a high speed and enters the cylindrical passage of the die chip 1 from this passage. Then, after passing through the bottleneck portion H and undergoing surface finishing, it exits through the exit passage F. In this case, since the pedestal is not made of metal, the conductor is made of tin conductor, and tin and other metal compounds form an alloy and do not adhere to the pedestal. In addition, ceramics or heat-resistant resins have a low coefficient of friction, so they have good wear resistance, little heat generated by friction with conductor wires, and continuous cooling because the newly introduced conductor wires cool the size chips. Work can be carried out for a long time. The second aspect of the present invention is the guide die shown in FIGS. 3 and 4 in which the inlet E at the entrance of the conductor wire of the first aspect is deleted. A concave portion for fixing the die chip is provided on the surface of the central portion of the pedestal 2, and the die chip is firmly fixed and fitted into the concave portion. In the guide die according to the second embodiment of the present invention, the tinned conductor wire directly enters the inlet of the narrow portion H of the die chip and enters the die chip without contacting the pedestal surface. The conductor wire emerging from the die chip of the present embodiment exits the die via a tapered outlet passage F in which the diameter of the pedestal 2 increases. In the guide die of the present embodiment, since the affinity of precious stones and tin of the die chip is small, tin or sludge does not clog the entrance of the die chip. The pedestal 2 after passing through the bottleneck H
In the outlet passage F, since the space between the conductor wire and the circular passage is large, the friction is very small as compared with that in front of the bottleneck portion H, so that little wear occurs.

[0010]

[Effect of the Invention] The use of the dice of the present invention reduces the amount of foreign substances brought in from the tin plating tank and does not cause acid corrosion, as compared with the conventional guide dies of metal pedestals. As a result, there are advantages that the durability is improved, the vibration of the conducting wire during the drawing operation is eliminated, the wire diameter is stabilized, and the conductor wire surface is smooth.

[Brief description of the drawings]

FIG. 1 is a vertical sectional view of a tinning guide die according to a first embodiment of the present invention.

FIG. 2 is a plan view of the tin die guide die of the first embodiment of the present invention.

FIG. 3 is a vertical sectional view of a tinning guide die according to a second embodiment of the present invention;

FIG. 4 is a plan view of a tinning guide die according to a second embodiment of the present invention.

FIG. 5 is a vertical sectional view of a diamond die having a conventional structure.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Die chip 2 Pedestal 3 Metal pedestal E Inlet F Exit passage H Bottleneck

Claims (3)

(57) [Scope of request for utility model registration] 1. A pedestal having a cylindrical passage and an ultra-hard precious stone die chip fixed inside the cylindrical passage, wherein the die chip is connected to both side cylindrical passages leading to front and back openings of the pedestal. The cylindrical passage of the die chip has a bottleneck portion having a minimum diameter at the center, and forms a gently tapered passage having a gradually increasing diameter before and after the bottleneck portion. On both sides of the cylindrical passage of the chip, in a guide die having a structure in which the cylindrical passage of the pedestal spreading at an angle substantially equal to the taper inclination of the die chip is connected smoothly and continuously, the pedestal is made of heat-resistant resin or ceramic. A tin die guide die. 2. A pedestal having a cylindrical passage and an ultra-hard precious stone die chip fixed to a surface of the pedestal at one end of the cylindrical passage, wherein the die chip has a cylindrical passage communicating with an outlet on the back side of the pedestal. And the cylindrical passage of the die chip has a bottleneck portion with a minimum diameter in the center,
Before and after the bottleneck portion, a gently tapered passage whose diameter gradually increases is formed.On the back side of the cylindrical passage of the die chip, a cylindrical passage of a pedestal that spreads at an angle substantially equal to the taper inclination of the die chip is provided. A guide die having a structure in which the base is made of heat-resistant resin or ceramics, the guide die having a structure that is connected smoothly and continuously. 3. The tinning guide die according to claim 1, wherein the pedestal is made of a polyimide heat-resistant resin.