JPH0791672B2 - Heat transfer tube manufacturing method - Google Patents
Heat transfer tube manufacturing methodInfo
- Publication number
- JPH0791672B2 JPH0791672B2 JP4015582A JP1558292A JPH0791672B2 JP H0791672 B2 JPH0791672 B2 JP H0791672B2 JP 4015582 A JP4015582 A JP 4015582A JP 1558292 A JP1558292 A JP 1558292A JP H0791672 B2 JPH0791672 B2 JP H0791672B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heat transfer
- transfer tube
- manufacturing
- tubular shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
- F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Electrochemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えば空調用の熱交換
器の蒸着管や凝縮管、あるいはウィックを有するヒート
パイプなどを構成するのに好適な伝熱管の製造方法に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a heat transfer tube suitable for forming a vapor deposition tube or a condenser tube of a heat exchanger for air conditioning, a heat pipe having a wick, or the like.
【０００２】[0002]
【従来の技術】内外の媒体の熱交換を行なわせるための
伝熱管において、その伝熱効率を上げるためには、 （１）伝熱面積を大きくする。 （２）核沸騰を起こしやすくする。 （３）乱流を起こしやすくする。 ことが有効とされている。2. Description of the Related Art In a heat transfer tube for exchanging heat between internal and external media, in order to increase the heat transfer efficiency, (1) the heat transfer area is increased. (2) Make nucleate boiling easy. (3) Make turbulence easy to occur. Is said to be effective.
【０００３】上記（１），（３）を満たすような方法と
して、銅管の内面に螺旋状の溝を転造法などにより形成
する方法が用いられている。As a method for satisfying the above (1) and (3), a method of forming a spiral groove on the inner surface of a copper tube by a rolling method or the like is used.
【０００４】また、（２）を満たすような方法として
は、伝熱体の表面に核沸騰の核となる多孔質層を形成す
る方法が知られており、板状の伝熱体においては焼結あ
るいは鑞付法によりそのような多孔質層を形成すること
が行われている。As a method for satisfying the condition (2), there is known a method of forming a porous layer serving as nucleate boiling nuclei on the surface of the heat transfer body, and a plate-shaped heat transfer body is burnt. Such a porous layer is formed by a binding or brazing method.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記の
ような従来の方法においては、それぞれ次のような課題
があった。すなわち、螺旋溝を形成する場合には、上記
の伝熱効率を上げる方法のうち、最も効果の高い核沸騰
現象を利用しておらず、また、転造工具の製作技術上及
び転造の技術上から、螺旋溝の条数やねじれの角度に制
限があることなどの理由により、通常の溝無し管と比べ
ても熱特性値が１．２〜１．５倍程度にしかならず、性
能が不充分であった。また、製造において、転造工具と
管内面の摩擦力が大きいため、大きな加圧力を必要と
し、従って大規模な装置を必要とするとともに、工具の
寿命が短くなって、製作コストが高くなるという課題が
あった。However, each of the above conventional methods has the following problems. That is, in the case of forming the spiral groove, the nucleate boiling phenomenon, which is the most effective method among the above methods for increasing the heat transfer efficiency, is not used, and in terms of the manufacturing technique of the rolling tool and the rolling technique. Therefore, due to reasons such as restrictions on the number of spiral grooves and the angle of twist, the thermal characteristic value is only 1.2 to 1.5 times that of ordinary non-grooved tubes, resulting in insufficient performance. Met. Further, in manufacturing, since the rolling tool and the inner surface of the pipe have a large frictional force, a large pressing force is required, and therefore a large-scale device is required, and the life of the tool is shortened, resulting in an increase in manufacturing cost. There were challenges.
【０００６】一方、多孔質層を形成する方法において
は、伝熱管のような管状構造のものの内面に、焼結、鑞
付を施すことは困難であった。また、金属表面にスクリ
ーン印刷等によりパターンマスキングを施した後、電気
鍍金することにより多孔質層を形成することも可能では
あるが、この方法により管内面に多孔質層を形成するの
は至難であり、かつ印刷、焼き付け等の複雑な工程を必
要とし、製造コストが高くなるという課題があった。本
発明は、上記の如き課題を解決することを目的とするも
のである。On the other hand, in the method of forming the porous layer, it has been difficult to sinter or braze the inner surface of a tubular structure such as a heat transfer tube. It is also possible to form the porous layer by electroplating after pattern masking the metal surface by screen printing or the like, but it is extremely difficult to form the porous layer on the inner surface of the tube by this method. However, there is a problem in that a complicated process such as printing and printing is required, and the manufacturing cost becomes high. The present invention is intended to solve the above problems.
【０００７】[0007]
【課題を解決するための手段】本発明は、金属製の基板
に、該基板の表面に開口する多数の孔部を形成する行程
と、前記基板の表面に鍍金を施す行程（鍍金行程）と、
前記基板を管状に成形する行程（成形行程）とを主要部
とするものであり、孔部の形成態様、鍍金行程と成形行
程の順序により、以下の各構成となる。SUMMARY OF THE INVENTION The present invention comprises a step of forming a large number of holes on the surface of a metal substrate, and a step of plating the surface of the substrate (plating step). ,
The step of forming the substrate into a tubular shape (forming step) is a main part, and each of the following configurations is obtained depending on the mode of forming the hole, the plating step and the order of the forming step.
【０００８】（１）．金属製の基板に、該基板の表面に
開口し且つ該基板を貫通しない多数の孔部を形成し、こ
の後、前記基板の表面に鍍金を施して前記各孔部を開口
部が相対的に狭められた形状とし、しかる後、前記基板
を前記表面が内周側となるように管状に成形する。(1). A large number of holes that are open to the surface of the substrate and do not penetrate through the substrate are formed in a metal substrate, and then the surface of the substrate is plated to make the openings relatively close to the holes. Then, the substrate is formed into a narrowed shape, and then the substrate is formed into a tubular shape so that the surface is on the inner peripheral side.
【０００９】（２）．金属製の基板に、該基板の表面に
開口し且つ該基板を貫通しない多数の孔部を形成し、こ
の後、前記基板を前記表面が内周側となるように管状に
成形し、しかる後、管状に成形された前記基板の内周側
に鍍金を施して前記各孔部を開口部が相対的に狭められ
た形状とする。(2). In the metal substrate, a large number of holes that are open to the surface of the substrate and do not penetrate the substrate are formed, and then the substrate is formed into a tubular shape so that the surface is on the inner peripheral side, and then, The inner peripheral side of the substrate formed into a tubular shape is plated to form each of the holes so that the opening is relatively narrowed.
【００１０】（３）．金属製の基板に該基板を貫通する
多数の孔部を形成し、この後、前記基板の表面に鍍金を
施し、前記各孔部の表面側の開口部が相対的に狭められ
た形状とし、しかる後、前記基板の裏面に板状部材を重
着するとともに該基板を管状に成形する。(3). Forming a large number of holes penetrating the substrate in the metal substrate, after that, the surface of the substrate is plated, the opening on the surface side of each hole is relatively narrowed, Then, a plate-shaped member is superposed on the back surface of the substrate and the substrate is formed into a tubular shape.
【００１１】（４）．前記（３）において、前記基板の
一部に孔部を形成しない状態に残した板状部材を前記基
板に一体的に設ける。 (4). In the (3), of the substrate
A plate-like member that is left without forming a hole in a part is
Provided integrally on the plate.
【００１２】（５）．金属製の基板に該基板を貫通する
多数の孔部を形成し、この後、前記基板の裏面に板状部
材を重着するとともに該基板を管状に成形し、しかる
後、管状に成形された前記基板の内周側に鍍金を施し、
前記各孔部の表面側の開口部が相対的に狭められた形状
とする。(5). A large number of holes penetrating the substrate are formed in a metal substrate, and then a plate-like member is superposed on the back surface of the substrate and the substrate is formed into a tubular shape, and then formed into a tubular shape. The inner peripheral side of the substrate is plated,
The opening on the surface side of each hole is relatively narrowed.
【００１３】（６）．前記（５）において、前記基板の
一部に孔部を形成しない状態に残した板状部材を前記基
板に一体的に設ける。 (6). In (5) above,
A plate-like member that is left without forming a hole in a part is
Provided integrally on the plate.
【００１４】[0014]
【作用】上記構成に係る伝熱管の製造方法によれば、伝
熱管に、内周面に開口するとともに外周側に貫通せず且
つ開口部が相対的に狭められた形状の多数の孔部が形成
される。該孔部を有する伝熱管は、該孔部が核となって
核沸騰を起こしやすいとともに乱流も起こしやすく、さ
らに伝熱面積も大きくなり、伝熱特性に優れる。According to the method of manufacturing a heat transfer tube having the above-described structure, the heat transfer tube has a large number of holes that are open to the inner peripheral surface, do not penetrate to the outer peripheral side, and have relatively narrow openings. It is formed. The heat transfer tube having the holes has excellent heat transfer characteristics because the holes serve as nuclei to easily cause nucleate boiling and turbulent flow, and the heat transfer area increases.
【００１５】[0015]
［実施例１］図１乃至し図４に示す方法で伝熱管を形成
した。長さ５００mm、幅１００mm、厚さ０．３mmの鋼板
１の幅方向のほぼ半分に直径２００μの多数の貫通孔２
を、比表面積が１５％になるように打ち抜き加工した。
次に、鋼板１を陰極とし、鋼板を陽極として硫酸銅液中
で陰極電流密度１０Ａ／dm2で １５分鍍金を施し、表裏
面に銅の電析金属層３を形成するとともに、貫通孔２の
開口部に狭窄部４を形成した（図２）。Example 1 A heat transfer tube was formed by the method shown in FIGS. A large number of through holes 2 with a diameter of 200μ are formed in almost half of the width direction of a steel plate 1 having a length of 500 mm, a width of 100 mm and a thickness of 0.3 mm.
Was punched to have a specific surface area of 15%.
Next, the steel sheet 1 is used as a cathode, and the steel sheet is used as an anode, and is plated in a copper sulfate solution at a cathode current density of 10 A / dm 2 for 15 minutes to form an electrodeposited metal layer 3 of copper on the front and back surfaces and to form a through hole 2 A narrowed portion 4 was formed in the opening (Fig. 2).
【００１６】次に、上記行程を経た鋼板１に、孔あき加
工部（貫通孔２の形成された側）を内側にして図３に示
すように二重に巻き加工を施した。続いて、このように
形成された管状体を高周波誘導加熱等の手段により局部
的に銅の融点以上且つ鋼板１の融点以下の温度に加熱し
て、鋼板１上に形成された電析金属層３（外側に巻かれ
た鋼板１と内側に巻かれた鋼板１との接合面に位置する
部分の電析金属層３であって、管状体の内周面部分の電
析金属層３を含まない）を瞬時に溶融させ、且つ直ちに
冷却する処理を施した。そして、この加熱、冷却処理
を、管状体上の部位を移動させつつ順次繰り返し、管状
体の全周に渡って同処理を施した。これにより、外側に
巻かれた鋼板１と内側に巻かれた鋼板１とが、電析金属
層３が溶融・固化してできた銅の接合層を介して接合さ
れ、図４に示す一体の伝熱管が製造された（図４はシー
ム部及び接合層の部分の表示を省略している）。Next, the steel sheet 1 which has gone through the above-mentioned steps is double-wound as shown in FIG. 3 with the perforated portion (the side where the through-hole 2 is formed) inside. Subsequently, the tubular body thus formed is locally heated to a temperature not lower than the melting point of copper and not higher than the melting point of the steel plate 1 by means of high-frequency induction heating or the like, and the electrodeposited metal layer formed on the steel plate 1 is heated. 3 (including the electrodeposited metal layer 3 of the inner peripheral surface portion of the tubular body, which is the portion of the electrodeposited metal layer 3 located on the joint surface between the steel sheet 1 wound on the outside and the steel sheet 1 wound on the inside) No) was instantly melted and immediately cooled. Then, this heating and cooling treatment was sequentially repeated while moving the site on the tubular body, and the same treatment was performed over the entire circumference of the tubular body. As a result, the steel sheet 1 wound on the outside and the steel sheet 1 wound on the inside are joined together via the copper joining layer formed by melting and solidifying the electrodeposited metal layer 3, and the integrated steel sheet shown in FIG. A heat transfer tube was manufactured (FIG. 4 omits the illustration of the seam portion and the joining layer portion).
【００１７】なお、上記加熱、冷却処理は瞬時に行われ
るため、管状体の内周側の開口部に形成された狭窄部４
は、図４に示されるようにその初期形状を維持する。ま
た、二重巻き加工を施した管状体を不活性又は還元性雰
囲気中で７００℃以上かつ銅の融点以下の温度に加熱
し、電析金属層３と鋼板１との間で拡散接合を行っても
よい。このようにして内側に巻かれた鋼板１と外側に巻
かれた鋼板１とを接合しても、管状体の内周側の開口部
に形成された狭窄部４の形状を維持できる。Since the heating and cooling treatments are instantaneously performed, the narrowed portion 4 formed in the opening on the inner peripheral side of the tubular body.
Maintains its initial shape as shown in FIG. Further, the tubular body that has been subjected to double winding is heated to a temperature of 700 ° C. or higher and a melting point of copper or lower in an inert or reducing atmosphere to perform diffusion bonding between the electrodeposited metal layer 3 and the steel sheet 1. May be. Thus, even if the steel plate 1 wound on the inner side and the steel plate 1 wound on the outer side are joined together, the shape of the narrowed portion 4 formed in the opening on the inner peripheral side of the tubular body can be maintained.
【００１８】この伝熱管を、万力を用いて押しつぶした
が、接合面の剥離は全く見られなかった。The heat transfer tube was crushed using a vise, but no peeling of the joint surface was observed.
【００１９】この伝熱管についてＲ−２２を用いて熱特
性試験を行ったところ、冷媒流量５０ｋｇ／ｈｒ、乾き
度０．５、蒸発温度５℃の条件において、８０００ｋｃ
ａｌ／ｍ 2 ｈｒ℃の沸騰熱伝達率を示した。この値は、
通常の伝熱管として使用される同じサイズの銅管の３〜
４倍の性能値であった。A thermal characteristic test was conducted on this heat transfer tube using R-22. As a result, a refrigerant flow rate of 50 kg / hr, a dryness of 0.5, and an evaporation temperature of 5 ° C. were 8000 kc.
It showed a boiling heat transfer coefficient of al / m 2 hr ° C. This value is
3 ~ of the same size copper tube used as a normal heat transfer tube
The performance value was four times .
【００２０】なお、この伝熱管をさらに引抜加工して形
状を整えるとともに、開口部をより狭めるようにしても
よい。The heat transfer tube may be further drawn to adjust its shape and the opening may be narrowed.
【００２１】この伝熱管は、鋼製の基板に銅鍍金を施す
ことにより狭口空孔を形成され、伝熱特性が向上されて
いるとともに、この電析銅を基板の融着用として使用す
ることにより、強度が大きく向上されている。In this heat transfer tube, a narrow hole is formed by plating a steel substrate with copper to improve the heat transfer characteristics, and the electrodeposited copper is used for fusing the substrate. As a result, the strength is greatly improved.
【００２２】上記実施例においては、鋼板１に鍍金を施
した後にこの鋼板１を管状に成形したが、鋼板１に貫通
孔２を形成した後に該鋼板１を管状に成形し、しかる後
この管状体の内側に上記のような鍍金を施し、貫通孔２
の開口部に図２に示すような狭窄部４を形成するように
してもよい。In the above embodiment, the steel sheet 1 was plated, and then the steel sheet 1 was formed into a tubular shape. However, after the through hole 2 is formed in the steel sheet 1, the steel sheet 1 is formed into a tubular shape, and then this tubular shape is formed. The inside of the body is plated as described above, and the through hole 2
A narrowed portion 4 as shown in FIG. 2 may be formed in the opening.
【００２３】［実施例２］ 図５乃至図７に示すような方法で銅製の伝熱管を製造し
た。長さ５００ｍｍ、幅１００ｍｍ、厚さ０．３ｍｍの
銅板１ａの表面に、直径１００μ、深さ２００μの貫通
しない凹孔２ａを比表面積が２０％となるようにエンボ
ス加工して形成した（図１）。この銅板１ａを陰極と
し、Ｔｉ−Ｐｔ製の不溶性陽極を用い、硫酸銅鍍金液中
で陰極電流密度１０Ａ／ｄｍ 2 で２０分間鍍金を施し、
凹孔２ａの開口部に狭窄部４ａを形成した（図６）。Example 2 A copper heat transfer tube was manufactured by the method shown in FIGS. The copper plate 1a having a length of 500 mm, a width of 100 mm, and a thickness of 0.3 mm was formed by embossing a recessed hole 2a having a diameter of 100 μ and a depth of 200 μ and not penetrating so as to have a specific surface area of 20% (FIG. 1). ). This copper plate 1a is used as a cathode, an insoluble anode made of Ti-Pt is used, and plating is performed in a copper sulfate plating solution at a cathode current density of 10 A / dm 2 for 20 minutes,
A narrowed portion 4a was formed at the opening of the recess 2a (FIG. 6).
【００２４】次に、上記銅板１を、表面（凹部２ａの開
口する側の面）を内側にして管状に折り曲げ加工し、そ
の両端部を接合して図７に示す伝熱管を製造した。Next, the copper plate 1 was bent into a tubular shape with the surface (the surface on the side where the recess 2a is opened) inside, and both ends were joined to manufacture the heat transfer tube shown in FIG.
【００２５】このように製造した伝熱管の伝熱特性をＲ
−２２を用いて調査したところ、冷媒流量５０ｋｇ／ｈ
ｒ、乾き度０．５、蒸発温度５℃の条件において、１０
０００ｋｃａｌ／ｍ 2 ｈｒ℃の沸騰熱伝達率を示した。The heat transfer characteristics of the heat transfer tube thus manufactured are
A survey using -22 revealed that the refrigerant flow rate was 50 kg / h.
r, dryness 0.5, evaporation temperature 5 ° C., 10
It showed a boiling heat transfer coefficient of 000 kcal / m 2 hr ° C.
【００２６】なお、この例においては凹孔を一面のみに
形成したが、両面に形成するようにしてもよい。また、
鍍金は管状に成形した後に、管軸にワイヤ状の陽極を張
り渡して行ってもよい。Although the concave holes are formed on only one surface in this example, they may be formed on both surfaces. Also,
The plating may be performed by forming a tubular shape and then stretching a wire-shaped anode on the tube axis.
【００２７】[0027]
【発明の効果】以上説明したように、本発明に係る伝熱
管の製造方法によれば、伝熱面積が大きく、核沸騰、乱
流を起こしやすい、伝熱特性に優れた伝熱管を容易かつ
経済的に製造することができる。また、基板を構成する
金属と鍍金により析出する金属を変えることにより、両
者の特性を生かした伝熱管を製造することができる。As described above, according to the method for manufacturing a heat transfer tube of the present invention, a heat transfer tube having a large heat transfer area, easily causing nucleate boiling and turbulent flow, and having excellent heat transfer characteristics can be easily formed. It can be manufactured economically. Further, by changing the metal forming the substrate and the metal deposited by plating, it is possible to manufacture a heat transfer tube making the best use of the characteristics of both.
【図１】本発明の一実施例に係る伝熱管の製造行程を示
す断面図である。FIG. 1 is a cross-sectional view showing a manufacturing process of a heat transfer tube according to an embodiment of the present invention.
【図２】本発明の一実施例に係る伝熱管の製造行程を示
す断面図である。FIG. 2 is a cross-sectional view showing a manufacturing process of the heat transfer tube according to the embodiment of the present invention.
【図３】本発明の一実施例に係る伝熱管の製造行程を示
す断面図である。FIG. 3 is a cross-sectional view showing a manufacturing process of the heat transfer tube according to the embodiment of the present invention.
【図４】本発明の一実施例に係る伝熱管を示す断面図で
ある。FIG. 4 is a sectional view showing a heat transfer tube according to an embodiment of the present invention.
【図５】本発明の他の実施例に係る伝熱管の製造行程を
示す断面図である。FIG. 5 is a cross-sectional view showing a process of manufacturing a heat transfer tube according to another embodiment of the present invention.
【図６】本発明の他の実施例に係る伝熱管の製造行程を
示す断面図である。FIG. 6 is a cross-sectional view showing a process of manufacturing a heat transfer tube according to another embodiment of the present invention.
【図７】本発明の他の実施例に係る伝熱管を示す断面図
である。FIG. 7 is a sectional view showing a heat transfer tube according to another embodiment of the present invention.
１，１ａ 基板 ２，２ａ 孔部 ３，３ａ 電析金属層 ４，４ａ 狭窄部 1, 1a Substrate 2, 2a Hole 3,3a Electrodeposited metal layer 4,4a Constriction
Claims (6)
且つ該基板を貫通しない多数の孔部を形成し、この後、
前記基板の表面に鍍金を施して前記各孔部を開口部が相
対的に狭められた形状とし、しかる後、前記基板を前記
表面が内周側となるように管状に成形することを特徴と
する伝熱管の製造方法。1. A metal substrate is provided with a large number of holes that are open to the surface of the substrate and do not penetrate the substrate, and thereafter,
Characterized in that the surface of the substrate is plated to form each of the holes with a shape in which the opening is relatively narrowed, and thereafter, the substrate is formed into a tube so that the surface is on the inner peripheral side. Method for manufacturing heat transfer tube.
且つ該基板を貫通しない多数の孔部を形成し、この後、
前記基板を前記表面が内周側となるように管状に成形
し、しかる後、管状に成形された前記基板の内周側に鍍
金を施して前記各孔部を開口部が相対的に狭められた形
状とすることを特徴とする伝熱管の製造方法。2. A metal substrate is provided with a large number of holes that are open to the surface of the substrate and do not penetrate the substrate, and thereafter,
The substrate is formed into a tubular shape so that the surface is on the inner peripheral side, and thereafter, the inner peripheral side of the substrate formed into a tubular shape is plated so that the openings of the respective hole portions are relatively narrowed. A method for manufacturing a heat transfer tube, which is characterized by having a curved shape.
孔部を形成し、この後、前記基板の表面に鍍金を施し、
前記各孔部の表面側の開口部が相対的に狭められた形状
とし、しかる後、前記基板の裏面に板状部材を重着する
とともに該基板を管状に成形することを特徴とする伝熱
管の製造方法。3. A metal substrate is provided with a number of holes penetrating the substrate, and then the surface of the substrate is plated.
The heat transfer tube characterized in that the opening on the front surface side of each hole is relatively narrowed, and thereafter, a plate-like member is superposed on the back surface of the substrate and the substrate is formed into a tubular shape. Manufacturing method.
に残した板状部材を前記基板に一体的に設けたことを特
徴とする請求項３記載の伝熱管の製造方法。 4. A state in which a hole is not formed in a part of the substrate.
The method for manufacturing a heat transfer tube according to claim 3 , wherein the plate-like member left over is provided integrally with the substrate .
孔部を形成し、この後、前記基板の裏面に板状部材を重
着するとともに該基板を管状に成形し、しかる後、管状
に成形された前記基板の内周側に鍍金を施し、前記各孔
部の表面側の開口部が相対的に狭められた形状とするこ
とを特徴とする伝熱管の製造方法。5. A metal substrate is provided with a large number of holes penetrating the substrate, and thereafter, a plate-like member is superposed on the back surface of the substrate and the substrate is molded into a tubular shape. A method for manufacturing a heat transfer tube, characterized in that plating is applied to the inner peripheral side of the substrate formed into a tubular shape, and the openings on the front surface side of the respective hole portions are relatively narrowed.
に残した板状部材を前記基板に一体的に設けたことを特
徴とする請求項５記載の伝熱管の製造方法。 6. A state in which a hole is not formed in a part of the substrate.
The method for manufacturing a heat transfer tube according to claim 5 , wherein the plate-like member left over is provided integrally with the substrate .
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60254505A JPS62116797A (en) | 1985-11-13 | 1985-11-13 | Formation of porous layer |
| JP4015582A JPH0791672B2 (en) | 1985-11-13 | 1992-01-30 | Heat transfer tube manufacturing method |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60254505A JPS62116797A (en) | 1985-11-13 | 1985-11-13 | Formation of porous layer |
| JP4015582A JPH0791672B2 (en) | 1985-11-13 | 1992-01-30 | Heat transfer tube manufacturing method |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60254505A Division JPS62116797A (en) | 1985-11-13 | 1985-11-13 | Formation of porous layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05311494A JPH05311494A (en) | 1993-11-22 |
| JPH0791672B2 true JPH0791672B2 (en) | 1995-10-04 |
Family
ID=26351759
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60254505A Granted JPS62116797A (en) | 1985-11-13 | 1985-11-13 | Formation of porous layer |
| JP4015582A Expired - Lifetime JPH0791672B2 (en) | 1985-11-13 | 1992-01-30 | Heat transfer tube manufacturing method |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60254505A Granted JPS62116797A (en) | 1985-11-13 | 1985-11-13 | Formation of porous layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JPS62116797A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109416211A (en) * | 2016-09-08 | 2019-03-01 | 株式会社中温 | The cooling freezer of multiple pipe |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006207968A (en) * | 2005-01-31 | 2006-08-10 | Denso Corp | Heat transfer device |
| CN1840258B (en) * | 2005-03-28 | 2010-08-25 | 新灯源科技有限公司 | Method for manufacturing heat pipe with flat end surface |
| JP5749305B2 (en) * | 2013-09-03 | 2015-07-15 | 三桜工業株式会社 | Heat transfer tube, heat transfer tube manufacturing method, and heat exchanger |
| JP6920231B2 (en) * | 2018-02-06 | 2021-08-18 | 新光電気工業株式会社 | Loop type heat pipe |
-
1985
- 1985-11-13 JP JP60254505A patent/JPS62116797A/en active Granted
-
1992
- 1992-01-30 JP JP4015582A patent/JPH0791672B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109416211A (en) * | 2016-09-08 | 2019-03-01 | 株式会社中温 | The cooling freezer of multiple pipe |
| US10852048B2 (en) | 2016-09-08 | 2020-12-01 | Chuon Co., Ltd. | Multilayer pipe cooling cold storage |
| CN109416211B (en) * | 2016-09-08 | 2021-02-26 | 株式会社中温 | Multiple tube cooling refrigerator |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62116797A (en) | 1987-05-28 |
| JPH05311494A (en) | 1993-11-22 |
| JPH0480994B2 (en) | 1992-12-21 |
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| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19960409 |