CN116536033A - Shape memory structure and preparation method and application thereof - Google Patents
Shape memory structure and preparation method and application thereof Download PDFInfo
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- 238000002360 preparation method Methods 0.000 title abstract description 12
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 128
- 238000012546 transfer Methods 0.000 claims abstract description 78
- 238000009413 insulation Methods 0.000 claims description 48
- 238000010438 heat treatment Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 14
- 238000000137 annealing Methods 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 11
- 238000012549 training Methods 0.000 claims description 7
- 229910001566 austenite Inorganic materials 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 6
- 230000007704 transition Effects 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 5
- 238000005323 electroforming Methods 0.000 claims description 4
- 229910000734 martensite Inorganic materials 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 238000010791 quenching Methods 0.000 claims description 3
- 230000000171 quenching effect Effects 0.000 claims description 3
- 229910001000 nickel titanium Inorganic materials 0.000 claims description 2
- 238000007740 vapor deposition Methods 0.000 claims description 2
- 238000004804 winding Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 230000007547 defect Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 57
- 230000017525 heat dissipation Effects 0.000 description 8
- 238000004321 preservation Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 230000003446 memory effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000011084 recovery Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 239000005457 ice water Substances 0.000 description 4
- 239000012774 insulation material Substances 0.000 description 4
- 230000001788 irregular Effects 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 2
- 239000004964 aerogel Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000006386 memory function Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
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Abstract
The invention relates to the technical field of shape memory alloy, in particular to a shape memory structure, a preparation method and application thereof. The preparation method of the shape memory structure comprises the following steps: and performing high heat conduction treatment on the surface of the shape memory alloy with the double-pass memory to form the double-pass memory heat transfer structure with the heat transfer layer. The invention overcomes the defect of slow heat transfer of the shape memory alloy by high heat conduction treatment, and expands the application of the shape memory alloy in the heat transfer field.
Description
Technical Field
The invention relates to the technical field of shape memory alloy, in particular to a shape memory structure, a preparation method and application thereof.
Background
Shape Memory Alloys (SMA) are a class of leading edge materials that have shape memory effects and superelasticity, integrating sensing and actuation. As a typical representative of shape memory alloys, niTi shape memory alloys have excellent superelasticity and shape memory effect, corrosion resistance, wear resistance, biocompatibility, good mechanical properties, and the like, and have been widely used in various fields of medical treatment, electronics, aerospace, and the like.
Shape memory effects are significant performance of memory alloys, with their main functional properties including single-pass, double-pass, and full-pass shape memory effects. The double-pass shape memory effect is a phenomenon in which a shape memory alloy spontaneously and reversibly recovers a shape of a high-temperature phase (austenite phase) and a shape of a low-temperature phase (martensite phase) with a change in temperature. This feature has attracted considerable attention from researchers in different fields and is attractive in developing integrated intelligent drivers and systems of material construction that are simple and compact in construction, easy to assemble and small in size.
However, the existing shape memory alloys generally have the defect of slow heat transfer, and therefore, the application in the field of heat transfer is limited.
Disclosure of Invention
Therefore, the technical problem to be solved by the invention is that the prior shape memory alloy has the defect of limited application in the field of heat transfer caused by slow heat transfer, so as to provide a shape memory structure and a preparation method and application thereof.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a method of making a shape memory structure, comprising: and performing high heat conduction treatment on the surface of the shape memory alloy with the double-pass memory to form the double-pass memory heat transfer structure with the heat transfer layer.
Preferably, the high thermal conductivity treatment mode includes but is not limited to electroforming, vapor deposition and spraying;
and/or the high thermal conductivity material used in the high thermal conductivity treatment includes, but is not limited to, copper, silver.
Preferably, the surface of the double-pass memory heat transfer structure is subjected to heat insulation treatment to obtain a shape memory structure with a heat insulation layer;
preferably, the heat insulation treatment comprises the following steps: covering the heat transfer layer with a heat insulating layer, wherein the covering mode comprises single-sided covering or double-sided covering;
methods of the insulation treatment include, but are not limited to, bonding, deposition, spraying;
the heat insulation layer is connected in a single layer or multiple layers;
the heat insulation material adopted for covering is ceramic, aerogel, aluminum silicate or polymer; the polymer includes, but is not limited to, polyimide.
Preferably, the shape memory alloy with the double-pass memory is a NiTi shape memory alloy;
and/or the shape of the shape memory alloy with two-way memory includes, but is not limited to, triangle, trapezoid, ellipse, leaf, circle;
and/or the high-temperature phase state of the shape memory alloy with the double-way memory is a plane state, and the low-temperature phase state is an arc;
preferably, the arc is an equal-diameter or variable-diameter arc, and more preferably, the radius of the arc is 0.1-100mm.
Preferably, the obtaining process of the shape memory alloy with double-way memory comprises the following steps: annealing heat treatment, double-pass memory training and shape processing are sequentially carried out on the shape memory alloy.
Preferably, the step of the two-way memory training is as follows:
1) Cooling the shape memory alloy to below the martensitic complete transformation temperature (Mf);
2) Extruding or winding the shape memory alloy into a desired shape by using a die;
3) Taking the shape memory alloy out of the die, and heating to above the austenite finish transition temperature (Af);
4) And circularly carrying out the steps 1) to 3) until the shape memory alloy obtains the double-pass memory.
Preferably, the annealing heat treatment process is as follows: heat treating the shape memory alloy at 400-600 deg.c for 0.5-10 hr, and subsequent air cooling or quenching; the high-temperature phase state of the shape memory alloy after heat treatment is a plane state;
and/or, the shape memory alloy is used for heating the shape memory alloy which is obtained by the two-way memory training before the shape processing to above the austenite finish transition temperature (Af) so as to restore the shape memory alloy to a plane state; the shape processing mode includes but is not limited to cutting and stamping; the shape of the shape memory alloy after the shape processing includes, but is not limited to, circular, irregular curved, triangular.
The invention also provides a shape memory structure, which is prepared by the preparation method of the shape memory structure.
Preferably, in the shape memory structure, the thickness of the shape memory alloy is 0.1-1mm;
and/or the thickness of the heat transfer layer is 0.05-1mm;
and/or the shape memory structure further comprises a heat insulation layer, wherein the thickness of the heat insulation layer is 0.1-2mm; preferably, the end face of one end of the shape memory alloy is located in the same plane with the end face of the heat transfer layer in the same direction, and the distance between the end face of the heat insulation layer covered on the heat transfer layer in the same direction and the end face of the heat transfer layer is 0.1-2mm, and the shape memory alloy is used for being inserted into a base to fix and sense external temperature so as to generate deformation.
In the present invention, the temperature at which the shape memory alloy is deformed can be adjusted by changing the shape memory alloy or adjusting the heat treatment process, for example, the deformation temperature of the NiTi-01 shape memory alloy is 20-40 ℃, the deformation temperature of the NiTi-02 shape memory alloy is 45-90 ℃, and the deformation temperature of the NiTi-SS shape memory alloy is 5-15 ℃.
The invention also provides application of the shape memory structure in the field of heat transfer. For the needs of different heat transfer fields, the shape memory structure is adaptively adjusted, for example:
in the invention, the position of the heat insulation treatment can be adjusted according to the working condition. In particular, the surface of the shape memory structure with high thermal conductivity may not be subjected to heat insulation treatment for the case of transferring heat or sensing temperature to transfer the temperature to the outside; for the scene of heat transfer or sensing temperature to drive shape memory structures to deform, the highly thermally conductive shape memory structure surface may or may not be thermally insulated. The surface of the shape memory structure needs to be subjected to heat insulation treatment in the scene of needing to prevent heat loss in the heat transfer field, so that the shape memory structure is bent towards the side which is not subjected to heat insulation treatment at low temperature, heat dissipation of the side which is not subjected to heat insulation can be reduced through crimping, and the purpose of heat preservation is achieved. In addition, the invention can also adopt a double-sided heat insulation treatment mode in a heat-sensitive application scene, and compared with single-sided heat insulation treatment, the double-sided heat insulation treatment can be better attached to other surfaces, and gaps among the shape memory structures are further filled, so that the phenomenon of heat leakage is reduced.
The technical scheme of the invention has the following advantages:
1. a method of making a shape memory structure, comprising: and performing high heat conduction treatment on the surface of the shape memory alloy with the double-pass memory to form the double-pass memory heat transfer structure with the heat transfer layer. The invention overcomes the defect of slow heat transfer of the shape memory alloy by high heat conduction treatment, and expands the application of the shape memory alloy in the heat transfer field.
2. According to the preparation method of the shape memory structure, the surface of the double-pass memory heat transfer structure is subjected to heat insulation treatment, namely, the position covered by the heat insulation layer is adjusted, so that the shape memory alloy prepared after the high heat conduction treatment has a temperature-driven double-pass shape memory function and also has obvious heat transfer performance anisotropy.
3. According to the shape memory structure, the shape memory structure is driven to deform by temperature, so that the whole structure can automatically adjust the heat exchange capacity according to the temperature T of the base. When the temperature T of the base is higher (not less than the austenite finish transition temperature Af), the state of the shape memory structure is a plane, and the shape memory structure has stronger heat dissipation capacity; when the temperature T of the base is gradually reduced (less than or equal to R phase starting transition temperature Rs), the shape memory structure starts to curl, the heat-dissipation capacity of the structure is obviously reduced, and the structure has certain heat-preservation capacity; when the temperature T of the base is lower than a certain value (less than or equal to the martensitic complete transformation temperature Mf), the deformation of the shape memory structure reaches the maximum value, and the shape memory structure is interlocked and combined to further preserve heat under the action of the heat preservation layer on the outer surface; the shape memory structure of the invention is driven by temperature, does not need additional control and driving systems, has the advantages of green environmental protection, high reliability, compact structure, large application potential and the like, and can be used in the fields of new energy batteries, green buildings, deep space exploration and the like.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram showing the recovery process of the shape memory alloy of examples 1-4 according to the present invention after the two-way memory training to obtain the two-way memory;
FIG. 2 is a schematic diagram of a two-way memory heat transfer structure according to embodiments 1-4 of the present invention;
FIG. 3 is a schematic illustration of a shape memory structure with an insulating layer according to embodiments 2-4 of the present invention;
1-shape memory alloy, 2-heat transfer layer, 3-heat insulation layer.
Detailed Description
The following examples are provided for a better understanding of the present invention and are not limited to the preferred embodiments described herein, but are not intended to limit the scope of the invention, any product which is the same or similar to the present invention, whether in light of the present teachings or in combination with other prior art features, falls within the scope of the present invention.
The specific experimental procedures or conditions are not noted in the examples and may be followed by the operations or conditions of conventional experimental procedures described in the literature in this field. The reagents or apparatus used were conventional reagent products commercially available without the manufacturer's knowledge.
Example 1
The embodiment provides a preparation method of a shape memory structure, which comprises the following steps:
1) Putting a NiTi-01 shape memory alloy with a triangular shape and a thickness of 0.1mm into a heating furnace, annealing at 400 ℃ for 10 hours, and then air cooling;
2) Placing the shape memory alloy subjected to annealing heat treatment in the step 1) in ice water and cooling to 0 ℃, then extruding the shape memory alloy by using a die, wherein the die core of the die is triangular, taking the shape memory alloy out of the die, and then heating to 50 ℃; repeating the above operation until the shape memory alloy obtains the double-pass memory, wherein the high-temperature phase state of the shape memory alloy obtaining the double-pass memory is a plane, the shape memory alloy obtaining the double-pass memory is curled into an equal-diameter circular arc in the low-temperature phase state, the radius of the circular arc is 0.1mm, and the recovery process of the shape memory alloy obtaining the double-pass memory between the high-temperature phase and the low-temperature phase is schematically shown in figure 1;
3) Heating the shape memory alloy with the double-pass memory obtained in the step 2) to 50 ℃, wherein the shape memory alloy is in a plane state, and then cutting the shape memory alloy to obtain the shape memory alloy with the double-pass memory, wherein the shape of the shape memory alloy is triangular;
4) Carrying out high heat conduction treatment on the shape memory alloy with double-pass memory obtained in the step 3), wherein the material adopted in the high heat conduction treatment is copper, the treatment mode is electroforming, the shape memory alloy after the high heat conduction treatment forms a heat transfer layer on the surface of the shape memory alloy so as to obtain a double-pass memory heat transfer structure, the thickness of the heat transfer layer is 0.05mm, the section of one end of the shape memory alloy is positioned in the same plane with the same end face on the heat transfer layer, and the structure schematic of the double-pass memory heat transfer structure is shown in figure 2;
the double-pass memory heat transfer structure prepared by the embodiment is heated, so that at least 10000 replies can be realized; the double-pass memory heat transfer structure manufactured by the embodiment does not perform heat insulation treatment, and is suitable for application scenes requiring high heat conduction and low heat preservation performance.
Example 2
The embodiment provides a preparation method of a shape memory structure, which comprises the following steps:
1) Putting a NiTi-01 shape memory alloy with a triangular shape and a thickness of 0.1mm into a heating furnace, annealing at 400 ℃ for 10 hours, and then air cooling;
2) Placing the shape memory alloy subjected to annealing heat treatment in the step 1) in ice water and cooling to 0 ℃, then extruding the shape memory alloy by using a die, wherein the die core of the die is triangular, taking the shape memory alloy out of the die, and then heating to 50 ℃; repeating the above operation until the shape memory alloy obtains the double-pass memory, wherein the high-temperature phase state of the shape memory alloy obtaining the double-pass memory is a plane, the shape memory alloy obtaining the double-pass memory is curled into an equal-diameter circular arc in the low-temperature phase state, the radius of the circular arc is 0.1mm, and the recovery process of the shape memory alloy obtaining the double-pass memory between the high-temperature phase and the low-temperature phase is schematically shown in figure 1;
3) Heating the shape memory alloy with the double-pass memory obtained in the step 2) to 50 ℃, wherein the shape memory alloy is in a plane state, and then cutting the shape memory alloy to obtain the shape memory alloy with the double-pass memory, wherein the shape of the shape memory alloy is triangular;
4) Carrying out high heat conduction treatment on the shape memory alloy with double-pass memory obtained in the step 3), wherein the high heat conduction treatment adopts copper as a material, the treatment mode is electroforming, the shape memory alloy after the high heat conduction treatment forms a heat transfer layer on the surface of the shape memory alloy so as to obtain a double-pass memory heat transfer structure, the thickness of the heat transfer layer is 0.05mm, the end face of one end of the shape memory alloy is positioned in the same plane with the same end face on the heat transfer layer, and the structural schematic diagram of the double-pass memory heat transfer structure is shown in figure 2;
5) And (3) performing heat insulation treatment on the surface of the double-pass memory heat transfer structure obtained in the step (4), wherein the heat insulation treatment method is bonding, the adopted heat insulation material is ceramic, the covering mode is shown in a figure 3 (a), the heat insulation layer is a single layer, the thickness of the heat insulation layer is 0.1mm, the distance between the end face of the heat insulation layer covered on the heat transfer layer in the same direction and the end face of the heat transfer layer is 0.1mm, and finally the shape memory structure with the heat insulation layer is prepared.
The shape memory structure with the heat insulation layer prepared by the embodiment is heated, so that at least 10000 replies can be realized; the embodiment only covers one side of the double-way memory heat transfer structure, and the shape memory structure is in a plane state at high temperature, and is curled towards one side which is not heat-insulating at low temperature, mutually locked with the adjacent shape memory structure and jointly insulated with the outer heat insulating layer to realize heat preservation, so that the double-way memory heat transfer structure can be applied to a passive heat dissipation scene of high-temperature heat dissipation and low-temperature heat preservation.
Example 3
The embodiment provides a preparation method of a shape memory structure, which comprises the following steps:
1) Putting NiTi-02 shape memory alloy with a leaf shape and a thickness of 1mm into a heating furnace, annealing at 600 ℃ for 0.5h, and then quenching;
2) Placing the shape memory alloy subjected to the annealing heat treatment in the step 1) in ice water and cooling to 0 ℃, then extruding the shape memory alloy by using a die, taking out the shape memory alloy from the die by using a die core of the die to form a leaf shape, and then heating to 50 ℃; repeating the above operation until the shape memory alloy obtains the double-pass memory, wherein the high-temperature phase state of the shape memory alloy obtaining the double-pass memory is a plane, the shape memory alloy obtaining the double-pass memory is curled into an equal-diameter circular arc in the low-temperature phase state, the radius of the circular arc is 100mm, and the recovery process of the shape memory alloy obtaining the double-pass memory between the high-temperature phase and the low-temperature phase is schematically shown in figure 1;
3) Heating the shape memory alloy with the double-pass memory obtained in the step 2) to 50 ℃, wherein the shape memory alloy is in a plane state, and then stamping the shape memory alloy to obtain the shape memory alloy with the double-pass memory, wherein the shape memory alloy is in a leaf shape;
4) Performing high heat conduction treatment on the shape memory alloy with the double-pass memory obtained in the step 3), wherein the material adopted in the high heat conduction treatment is silver, the treatment mode is deposition, the shape memory alloy after the high heat conduction treatment forms a heat transfer layer on the surface of the shape memory alloy so as to obtain a double-pass memory heat transfer structure, the thickness of the heat transfer layer is 0.08mm, the end face of one end of the shape memory alloy is positioned in the same plane with the same end face on the heat transfer layer, and the structural schematic diagram of the double-pass memory heat transfer structure is shown in figure 2;
5) And (3) performing heat insulation treatment on the surface of the double-pass memory heat transfer structure obtained in the step (4), wherein the heat insulation treatment method is deposition, the adopted heat insulation material is aerogel, the covering mode is shown in fig. 3 (b), the heat insulation layer is formed by connecting two layers, the thickness of the heat insulation layer is 2mm, the distance between the end face of the heat insulation layer covered on the heat transfer layer in the same direction and the end face of the heat transfer layer is 1mm, and finally the shape memory structure with the heat insulation layer is prepared.
The shape memory structure with the heat insulation layer prepared by the embodiment is heated, so that at least 10000 replies can be realized; in the embodiment, the heat-insulating layer covers the single face and the top face of the double-pass memory heat transfer structure, and because the thickness of the double-pass memory heat transfer structure is larger, heat dissipation is reduced, so that heat insulation treatment is carried out on one side and the top end of the double-pass memory heat transfer structure, the shape memory structure is in a plane state at high temperature, and is curled towards the side which is not subjected to heat insulation treatment at low temperature, and the shape memory structure is mutually locked with the adjacent shape memory structure to realize heat preservation together with the heat-insulating layer, so that the double-pass memory heat transfer structure can be applied to a passive heat dissipation scene of high-temperature heat dissipation-low-temperature heat preservation.
Example 4
The embodiment provides a preparation method of a shape memory structure, which comprises the following steps:
1) The method comprises the steps of (1) placing a NiTi-SS shape memory alloy with an irregular curved surface and a thickness of 0.5mm in a heating furnace, annealing at 500 ℃ for 5h, and then air cooling;
2) Placing the shape memory alloy subjected to annealing heat treatment in the step 1) in ice water and cooling to 0 ℃, then twisting the shape memory alloy by using a die, taking the shape memory alloy out of the die after the die core of the die is an irregular curved surface, and then heating to 50 ℃; repeating the above operation until the shape memory alloy obtains double-pass memory, wherein the high-temperature phase state of the shape memory alloy is a plane, the shape memory alloy is curled into an equal-diameter circular arc in the low-temperature phase state, the radius of the circular arc is 50mm, and the recovery process of the shape memory alloy obtaining double-pass memory between the high-temperature phase and the low-temperature phase is schematically shown in figure 1;
3) Heating the shape memory alloy with the double-pass memory obtained in the step 2) to 50 ℃, wherein the shape memory alloy is in a plane state, and then cutting the shape memory alloy to obtain the shape memory alloy with the double-pass memory, the shape of which is an irregular curved surface;
4) Carrying out high heat conduction treatment on the shape memory alloy with double-pass memory obtained in the step 3), wherein the material adopted in the high heat conduction treatment is copper, the treatment mode is spraying, the shape memory alloy after the high heat conduction treatment forms a heat transfer layer on the surface of the shape memory alloy so as to obtain a double-pass memory heat transfer structure, the thickness of the heat transfer layer is 1mm, the end face of one end of the shape memory alloy is positioned in the same plane with the same end face on the heat transfer layer, and the structural schematic diagram of the double-pass memory heat transfer structure is shown in figure 2;
5) And (3) performing heat insulation treatment on the surface of the double-pass memory heat transfer structure obtained in the step (4), wherein the heat insulation treatment method is spraying, the adopted heat insulation material is aluminum silicate, the covering mode is shown in a figure 3 (c), the heat insulation layer is a single layer, the thickness of the heat insulation layer is 1mm, the distance between the end face of the heat insulation layer covered on the heat transfer layer in the same direction and the end face of the heat transfer layer is 2mm, and finally the shape memory structure with the heat insulation layer is obtained.
The shape memory structure with the heat insulation layer prepared by the embodiment is heated, so that at least 10000 replies can be realized; the heat-insulating layers cover the two sides and the top surface of the double-pass memory heat transfer structure, the shape memory structure is in a plane state at high temperature, and is curled according to the double-pass memory effect of the shape memory alloy at low temperature, and is mutually condensed with the adjacent shape memory structure to insulate heat, and the heat-insulating layers of the two sides and the top surface of the double-pass memory heat transfer structure further fill the gaps between the adjacent shape memory structures, so that heat leakage is reduced, and the heat-insulating structure can be applied to heat-sensitive active heat dissipation scenes.
According to the embodiments 1-4, the shape memory structure prepared by the invention still has double-way memory, expands the application of the shape memory alloy in the heat transfer field, and has good application prospect.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the invention.
Claims (10)
1. A method of making a shape memory structure comprising: and performing high heat conduction treatment on the surface of the shape memory alloy with the double-pass memory to form the double-pass memory heat transfer structure with the heat transfer layer.
2. The method of claim 1, wherein the high thermal conductivity treatment includes, but is not limited to, electroforming, vapor deposition, and spraying.
3. The method according to claim 1 or 2, wherein the surface of the two-way memory heat transfer structure is further subjected to heat insulation treatment to obtain a shape memory structure having a heat insulating layer;
preferably, the heat insulation treatment comprises the following steps: the heat-insulating layer is coated on the surface of the heat transfer layer in a manner including, but not limited to, single-sided coating or double-sided coating.
4. A method of manufacturing according to any one of claims 1 to 3, wherein the shape memory alloy having a double pass memory is NiTi shape memory alloy;
and/or the high-temperature phase state of the shape memory alloy with the double-way memory is a plane state, and the low-temperature phase state is an arc;
preferably, the arc is an equal-diameter or variable-diameter arc, and more preferably, the radius of the arc is 0.1-100mm.
5. The method according to any one of claims 1 to 4, wherein the obtaining process of the shape memory alloy with double pass memory is: annealing heat treatment, double-pass memory training and shape processing are sequentially carried out on the shape memory alloy.
6. The method according to claim 5, wherein the step of two-way memory training comprises:
1) Cooling the shape memory alloy below the martensite finish temperature;
2) Extruding or winding the shape memory alloy into a desired shape by using a die;
3) Taking the shape memory alloy out of the die, and heating to a temperature above the austenite finish transition temperature;
4) And circularly carrying out the steps 1) to 3) until the shape memory alloy obtains the double-pass memory.
7. The method according to claim 5 or 6, wherein the annealing heat treatment is performed by: heat treating the shape memory alloy at 400-600 deg.c for 0.5-10 hr, and subsequent air cooling or quenching; the high-temperature phase state of the shape memory alloy after heat treatment is a plane state;
and/or, the shape memory alloy which is obtained by the two-way memory training before the shape processing is heated to be above the austenite finish transition temperature so as to restore the shape memory alloy to a plane state.
8. A shape memory structure, characterized in that it is produced by the method for producing a shape memory structure according to any one of the preceding claims 1-7.
9. The shape memory structure of claim 8, wherein in the shape memory structure, the shape memory alloy has a thickness of 0.1-1mm;
and/or the thickness of the heat transfer layer is 0.05-1mm;
and/or the shape memory structure further comprises a heat insulation layer, wherein the thickness of the heat insulation layer is 0.1-2mm; preferably, the end face of one end of the shape memory alloy is positioned in the same plane with the end face of the heat transfer layer in the same direction, and the distance between the end face of the heat insulation layer covered on the heat transfer layer in the same direction and the end face of the heat transfer layer is 0.1-2mm.
10. Use of the shape memory structure of claim 8 or 9 in the field of heat transfer.
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| CN202310448061.3A CN116536033A (en) | 2023-04-23 | 2023-04-23 | Shape memory structure and preparation method and application thereof |
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| CN202310448061.3A CN116536033A (en) | 2023-04-23 | 2023-04-23 | Shape memory structure and preparation method and application thereof |
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