JPH0786794A - Electronic component supplying equipment - Google Patents

Abstract

PURPOSE:To exclude the necessity of complicated indication process about the sucking position of a tray, by calculating the sucking position of the tray from pocket position data, and moving a suction pad to the calculated sucking position by controlling an X-motor and a Y-motor. CONSTITUTION:When a suction pad P sucks air form a pocket 3 having no holes, a pressure sensor 79 detects pressure lower than the atmospheric pressure, as the pressure in the pocket 3 closed by the suction pad P. When the suction pad P sucks air erroneously from a pocket 2 having a hole 2a, the pressure detected by the pressure sensor 79 is nearly equal to the atmospheric pressure. Hence whether the suction pad P sucks air from the pocket 3 or the pocket 2 can be recognized by the output of the pressure sensor 79. That is, whether the sucking position of the suction pad is right can be judged. As to a detection means, a light transmitting sensor capable of judging whether the suction pad P can suck a tray 1 is arranged.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component supply apparatus which enables a tray to be transferred in a stable state without teaching the suction position of the tray one by one.

[0002]

2. Description of the Related Art As a device for supplying electronic components to an electronic component mounting device such as a chip mounter, base materials for holding trays are stored in a storage rack in multiple stages, and a desired tray is supplied from the storage rack. An electronic component supply device is often used, which draws out electronic components in a tray, picks up electronic components in a tray with a suction head, and transfers the electronic components to a transfer head of an electronic component mounting device. In this electronic component supply device, the empty tray after the supply of electronic components is transferred to the tray collection area.

FIG. 14 is a perspective view showing a tray or the like that is about to be transferred to the tray collecting area. In FIG. 14, 1 is a tray and 1a is a partition wall for partitioning pockets. FIG. 15 is an enlarged view of the vicinity of the suction pad P on which the tray 1 is transferred. As shown in FIG. 15, a large number of perforated pockets 2 (2a are holes) for accommodating electronic parts are formed in a matrix in the tray 1, and a hole for picking up the tray 1 itself is formed in the center of the tray 1. None pocket 3 is formed. Of course, electronic parts are also stored in the holeless pocket 3. In the conventional electronic component supply device, when the tray 1 becomes empty, the suction pad P is landed on the bottom surface 3a of the holeless pocket 3, the suction pad P is sucked on the bottom surface 3a, and the tray 1 itself is picked up and transferred. It was supposed to do.

[0004]

However, in such a configuration, first, since the position of the holeless pocket 3 is different depending on the product type of the tray 1, the position of the holeless pocket 3 (adsorption is different for each product type of the tray 1). It is necessary to teach the suction position of the pad P), which is complicated.

Secondly, since the suction pad P suctions the bottom surface 3a of the holeless pocket 3, the size of the suction pad P must be smaller than the size of the bottom surface 3a. Therefore, if the size of the bottom surface 3a becomes larger than that of the current suction pad P as the product type of the tray 1 is changed,
It is necessary to replace the suction pad P with a smaller one.
As described above, in the conventional means, the suction pad P is often required to be replaced when the type of the tray 1 is changed, and the operation is forced to be interrupted each time, which causes a problem that loss time is likely to occur.

Third, the suction pad P has a small bottom surface 3a.
The tray 1 itself is supported by adsorbing substantially in the form of dots. If the number of rows or columns of the pockets 2 and 3 is an even number, the position of the holeless pocket 3 (suction position) is eccentric from the center of gravity of the tray 1. As a result, the suction pad P sucks the eccentric suction position in a dot shape to support the tray 1 itself, and the tray 1 picked up fluctuates and becomes unstable as shown by the chain line in FIG. Or, as shown by the broken line, the tray 1 is the suction pad P.
There was a problem that it separated from and fell.

Therefore, it is a first object of the present invention to provide an electronic component supply apparatus which does not require complicated teaching processing for the suction position of the tray. A second object of the present invention is to provide an electronic component supply device capable of picking up a tray in a stable state.

[0008]

According to a first aspect of the present invention, there is provided an electronic component supplying apparatus, wherein a suction pad for sucking and picking up a tray and a movement for moving the suction pad in XY relative to the tray. And means for storing tray pocket position information, and control means for calculating the tray suction position from the pocket position information, controlling the moving means, and moving the suction pad to the calculated suction position.

The electronic component supply apparatus according to the second aspect of the present invention is a suction pad which is formed so that it can land on the upper surface of the partition wall surrounding the holeless pocket, and which sucks air in the landed pocket without holes. Have.

[0010]

With the first configuration, the pocket position information is read from the memory, and the control means calculates the tray suction position. Therefore, the user does not need to teach the suction position one by one.

Further, according to the second structure, since the suction pad lands on the upper surface of the partition wall surrounding the pocket without holes, the suction pad supports the tray in a planar manner, and the tray is picked up in a stable state. Further, unlike the conventional means, the suction pad is not limited to the size that it must be smaller than the bottom surface of the pocket without holes, so that it is necessary to replace the suction head even if the size of the bottom surface is reduced by changing the tray type. Not only that, it can reduce the lost time.

[0012]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a perspective view showing a state in which an electronic component supply device TF according to an embodiment of the present invention is set in an electronic component mounting device CM. CV of the electronic component mounting equipment CM
Is a conveyor that is provided in the horizontal direction in the X direction and that conveys and positions the substrate A, and H is a transfer head that mounts electronic components at a predetermined position on the substrate A. In addition to the electronic component supply device TF of this embodiment, a tape feeder F is provided in parallel in the electronic component mounting device CM as a means for supplying electronic components to the transfer head H.

Next, with reference to FIG. 2, the structure of the electronic component supply apparatus TF of this embodiment will be described.

Reference numeral B denotes a vertically long main body box, and storage shelves CA and CB as storage bodies are arranged in upper and lower two stages on the inner side of the inner space of the main body box B. The base material 4 can be stored in each of the horizontal stages of the storage shelves CA and CB. Then, on one base material 4, a plurality of trays 1 for accommodating electronic components of the same type in a matrix are placed in a stacked state.

Reference numeral 16 denotes a moving body which moves in the XY directions in a component supplying area of the electronic component supplying apparatus TF (an area having an intermediate height between the storage shelves CA and CB), and the conveyor CV side of the moving body 16. The component take-out head 17 as a component take-out means having a chuck 17a for sandwiching the electronic component and a nozzle 17b for sucking the electronic component at the bottom thereof.
A tray transfer head 18 having a suction pad P for sucking and picking up the empty tray 1 and transferring it to the tray collecting means is provided on the side of the storage shelves CA, CB. That is, the tray transfer head 18 and the component take-out head 17 are integrally provided with the moving body 16 and integrally move the component supply area in the XY directions. Further, 19 is an X-axis arm that holds the movable body 16 so as to be movable in the X direction,
Reference numeral 20 denotes an X motor that moves a moving body 16 in the X direction by driving a feed screw (not shown) built in the X axis arm 19, and reference numeral 21 holds the X axis arm 19 movably in the Y direction. A Y-axis arm, 22 is a Y-axis arm 2
The Y motor is a Y motor that moves the X-axis arm 19 in the Y direction by driving a feed screw (not shown) built in 1. Therefore, the X motor 20, Y as a moving means
When the motor 22 is driven, the tray transfer head 18 including the suction pad P can be moved in the component supply area in the XY directions relative to the tray 1.

Further, 23 is arranged in the vicinity of the conveyor CV, and the chuck 17a of the component take-out head 17 or the nozzle 1 is provided.
The camera stage has a built-in camera for observing the position, posture, etc. of the electronic parts taken out from the tray 1 by 7b, etc., and 24 is for mounting the electronic parts taken out from the tray 1 and for correcting misalignment etc. It is a component positioning unit of. The camera stage 23 and the component positioning unit 24 are selectively used according to the type of electronic component. For example, one having a fine lead such as QFP is to the camera stage 23, and odd-shaped components are to the component positioning unit 24. It is designed to be transferred by the component take-out head 17. Then, the electronic component observed on the camera stage 23 and the electronic component whose position is corrected by the component positioning unit 24 are adsorbed by the transfer head H (see FIG. 1) of the electronic component mounting apparatus CM, and on the substrate A. Mounted in place. 25 is a component positioning unit 24
The height adjusting motor 26 is a nozzle holder for holding the replacement nozzle 27.

Next, a delivery means for delivering the base material 4 from the storage shelves CA, CB to the elevating means and an elevating means for bringing the base material 4 to the component supply area will be described. In FIG. 2, 30 is a frame vertically provided in the internal space of the main body box B, 31 and 32 are vertical feed screws rotatably supported by the frame 30, and 35 and 36 are these feed screws 31. , 32 are motors for driving the table up and down independently of each other. Further, 33 and 34 are guide rods which are vertically supported by the frame 30, and the slider 3 provided on the backs of the upper and lower two lifting tables T1 and T2.
8 is slidably engaged with the guide rods 33 and 34, so that they can be guided up and down independently of each other on the same lifting path.

In FIG. 2, reference numerals 57 and 58 denote tray sensors as tray height detecting portions. The tray sensors 57 and 58 are arranged in the component supply area and indicate the position of the upper surface of the tray 1 in the height direction. It is detected whether or not the tray 1 is at a height at which the component pickup head 17 can pick up electronic components from the tray 1.

Next, a means for collecting unnecessary trays will be described. In FIG. 2, the tray discharge conveyor 60 is
It is provided between the storage shelves CA and CB and is provided close to the component supply area. And this tray discharge conveyor 60
Is operated by the discharge motor 60a to transfer the empty tray 1 transferred onto the discharge conveyor 60 by the tray transfer head 18 to the elevating lift 62 or the uppermost stage of the empty tray 1 stacked on the elevating lift 62. Is to be delivered to.
Further, the tray stock portion 61 is provided with an elevating lift 62 for vertically mounting the empty tray 1 so as to be vertically movable. 63
Is a motor for raising and lowering the lift 62.
Reference numeral 4 is a tray detection sensor. The tray detection sensor 64 is arranged so as to sense a little upper portion of the tray discharge conveyor 60. When the tray detection sensor 64 shields light, the motor 63 is driven to drive a predetermined distance (for one empty tray 1). The elevating lift 62 is lowered by the thickness of the height. Therefore, the empty trays 1 are collected by these tray collecting means in a state of being sequentially stacked on the lifting lift 62.

FIG. 8 is a block diagram showing the control means 70 of the electronic component supply apparatus of this embodiment. 71 is shown in FIGS.
A CPU 73 for calculating the suction position and controlling other elements by a control program in the ROM 72 according to the flow chart of FIG. 12, 73 is parts stock information for each storage stage of the storage shelves CA and CB shown in FIG. 9, and FIG. Part supply information for each board type shown in FIG. 10A, and tray 1 shown in FIG. 10B.
RA for storing pocket position information for each product type
M and 74 are an elevating mechanism 75, a pick and place mechanism 77, a recovery mechanism 78, a pressure sensor 79 described later,
This is an interface for connecting to the CPU 71, and the control unit 80 of the electronic component mounting apparatus CM is also connected to this interface 74. Here, in the RAM 73, the component supply information of FIG. 10A is provided for each of a plurality of board types, and is adapted to support a plurality of types. Now, the CPU 71 controls the electronic component mounting apparatus control unit 8
When the CPU 71 receives a command from 0 to take out a part of a certain product type, the CPU 71 confirms the product type and stores it in the storage shelves CA, CB.
Among the storage racks of, the storage rack that stores the parts of this type,
Check by referring to the parts stock information. And CPU7
Reference numeral 1 denotes a base material on which a tray for storing electronic components to be supplied this time is placed, and a lifting table T1 or a lifting table T2.
One of the lift tables to reach the component supply area, and the other lift table to the base material on which the tray for storing the electronic components to be supplied next is placed, and the other lift table. The elevator mechanism 75 is controlled so as to reach the standby area. Then, the electronic component is taken out by the component take-out head 17 from the tray located in the component supply area. At this time, the CPU 71
Refers to the pocket position information and controls the pick-and-place mechanism unit 77 to move the chuck 17a and the nozzle 17b of the component take-out head 17 to the center of the pocket for storing the electronic component to pick up the electronic component.
Next, the suction pad P and the like will be described with reference to FIGS. FIG. 3 is a perspective view of the suction pad P viewed from the lower surface Pa side. The lower surface Pa is flat and is formed of, for example, an elastic urethane resin or the like, and is easily adhered to the upper surface S (see FIG. 4) of the partition wall 1a. Pb is a suction hole that opens in the approximate center of the lower surface Pa, and Pc is an inner tube that communicates with the suction hole Pb and the suction means V shown in FIG. Further, as shown in FIG. 5, a pressure sensor 79 is provided as a detection unit that measures the atmospheric pressure in the inner pipe Pc and detects whether or not the suction pad P is suctioning the holeless pocket 3. Then, as shown in FIG. 4, the suction pad P
Is landed planarly on the upper surface S of the partition wall 1a surrounding the holeless pocket 3, the lower surface Pa of the suction pad P and the upper surface S of the partition wall 1a are in close contact, and the air in the holeless pocket 3 is sucked. The suction pad P is sucked by the means V and firmly holds the tray 1. Here, as shown in FIG. 4, since the suction pad P has a size considerably larger than the bottom surface of the pocket 3 without holes, even if the size of the bottom surface of the pocket 3 without holes changes slightly due to a change in the type of the tray 1. It is not necessary to replace the suction pad P.

Next, the detection process by the pressure sensor 79 will be described. Now, as shown in FIG. 5 (a), when the suction pad P successfully sucks air from the holeless pocket 3, the pressure sensor 7 a measures the pressure in the holeless pocket 3 sealed by the suction pad P from the atmospheric pressure. Also detects fairly low pressure. On the other hand, as shown in FIG. 5B, even if the suction pad P accidentally tries to suck air from the perforated pocket 2, the hole 2a is open, so the pressure detected by the pressure sensor 79 is significantly different from the atmospheric pressure. There will be nothing. Therefore, whether the suction pad P is sucking the non-perforated pocket 3 or the perforated pocket 2 based on the output of the pressure sensor 79, that is, whether the suction position of the suction pad P is correct can be determined. As the detecting means of this means, the suction pad P
May be able to determine whether or not the tray 1 can be adsorbed. For example, a light transmissive sensor may be arranged slightly above the height of the tray 1, and the adsorption pad P may adsorb the tray 1 to It is possible to make various changes such as determining whether or not the tray shields the light when the sensor rises.

Next, the pocket position information will be described with reference to FIGS. 6, 7 and 10B. Figure 6
(A) is a plan view of tray 1 of product type a, and (b) and (c) are plan views of tray 1 of product types b and c, respectively. In the figure, Xn is the number of columns of the tray 1, and Yn is the number of rows. Further, in FIG. 7 showing the tray 1 of the type b, 6 to 13 are base materials 4
Positioning pins that are planted on the base 1 and contact the side of the tray 1 to position the tray 1 on the base material 4, (0,0) is the origin on the base material 4, X is the horizontal axis, and Y is the vertical axis. Is. Furthermore, as known data, the perforated pocket 2 in the first row and the first column
Position (X1, Y1), row direction (X direction) pitch X
P and the pitch YP in the row direction (Y direction) are stored in the RAM 73 as pocket position information (FIG. 10).
(B)).

By the way, in the product a (FIG. 6 (a)), the number of columns Xn and the number of rows Yn are odd, and the holeless pocket 3 is near the center of gravity of the tray 1. However, product b (Fig. 6)
In FIG. 6B, the number of rows Yn is even, and in the product c (FIG. 6C), the number of columns Xn and the number of rows Yn are even. Here, generally, the holeless pocket 3 is provided in the central portion of the tray 1, but in the case of the type b or c, the number of columns Xn, the number of rows Yn, both pitches XP, YP, etc. are given. Immediately, the holeless pocket 3 (that is, the suction position of the suction pad P)
Can not be determined.

However, in this embodiment, as will be described below, the CPU 71 can automatically detect the position of the pocket 3 without holes by teaching the processes of FIGS. I have to. That is, FIG.
As shown in FIG. 1, when the ejection operation of the tray 1 is started,
The CPU 71 first sets the trial number counter i to 1 (step 1). Then, the initial suction position obtained by the following equation is set to the suction position [X, Y] of the suction pad P (step 2).

[0026]

[Equation 1]

Next, the CPU 71 controls the X motor 20, Y so that the suction pad P is located at the suction position [X, Y].
The motor 22 is operated (step 3), the suction means V is operated, and the suction operation by the suction pad P is performed (step 4). Then, the CPU 71 monitors the output of the pressure sensor 79, and if negative pressure is detected, it is interpreted that the suction of the tray 1 is successful (FIG. 5A), and the tray discharging operation is performed (steps 6 and 7). . On the other hand, if the negative pressure is not detected, it is interpreted that the current suction position [X, Y] is the perforated pocket 2 (FIG. 5B), and the trial number counter is counted until the negative pressure is detected in step 5. i is incremented (step 8), the suction position [X, Y] shown in FIG. 12 is changed (step 9), and the processes of steps 3 to 5 are repeated. Figure 1
When the procedure for changing the suction position [X, Y] shown in 2 is illustrated,
It becomes like FIG. 13 (a). Here, in FIG. 13, the number in the circle indicates the value of the trial number counter i, and in the case of FIG. 13A according to the present embodiment, the suction pad P is circulated counterclockwise so as to circulate through the adjacent pockets. The suction operation is performed on a trial basis (steps 91 to 96). If the value of the counter i exceeds 4, it means that the suction of the tray 1 has failed and the trial operation has completed, so error processing is performed. Of course, various patterns of this trial operation are conceivable. For example, FIG. 13B or FIG.
You may do like (c).

As described above, in this embodiment, the suction pad P
Is equipped with a pressure sensor 79 for detecting whether or not the holeless pocket 3 is adsorbed, and is the core of the control means.
1 refers to the output of the pressure sensor 79 and refers to the X motor 20,
The Y motor 22 is controlled to update the suction position [X, Y] of the tray 1 until the suction pad P suctions the holeless pocket 3. Therefore, the user does not need to teach the suction position for each tray type,
The suction position is automatically found during the above series of trial operations.

The electronic component supplying apparatus of this embodiment is formed so that it can land on the upper surface S of the partition wall 1a that surrounds the pocket 3 without holes, and sucks the air in the landed pocket 3 without holes. Since P is provided, it is not necessary to replace the suction pad P according to the size of the pocket 3 without holes, and the suction pad P is attracted to the tray 1 in a planar manner to pick up the tray 1 in a stable state. It is possible.

[0030]

According to the present invention, since the tray suction position is calculated from the pocket position information, it is not necessary to teach the tray suction position one by one. Further, according to the present invention, the tray is transferred in a stable state because it is formed so that it can land on the upper surface of the partition wall that surrounds the holeless pocket and has the suction pad that sucks the air in the holeless pocket. be able to.

[Brief description of drawings]

FIG. 1 is a perspective view showing an electronic component supply device and an electronic component mounting device according to an embodiment of the present invention.

FIG. 2 is a perspective view of an electronic component supply device according to an embodiment of the present invention.

FIG. 3 is a perspective view of a suction pad according to an embodiment of the present invention.

FIG. 4 is a perspective view of a suction pad and a tray according to an embodiment of the present invention.

5A is an operation explanatory diagram of the suction pad according to the embodiment of the present invention. FIG. 5B is an operation explanatory diagram of the suction pad according to the embodiment of the present invention.

6A is a plan view of a tray according to an embodiment of the present invention. FIG. 6B is a plan view of a tray according to an embodiment of the present invention. FIG. 6C is a plan view of a tray according to an embodiment of the present invention.

FIG. 7 is a plan view of a tray and a base material according to an embodiment of the present invention.

FIG. 8 is a block diagram of an electronic component supply device according to an embodiment of the present invention.

FIG. 9 is a data configuration diagram of an electronic component supply device according to an embodiment of the present invention.

10A is a data configuration diagram of an electronic component supply device according to an embodiment of the present invention. FIG. 10B is a data configuration diagram of an electronic component supply device according to an embodiment of the present invention.

FIG. 11 is a flowchart of an electronic component supply device according to an embodiment of the present invention.

FIG. 12 is a flowchart of an electronic component supply device according to an embodiment of the present invention.

FIG. 13 (a) is an operation explanatory diagram of an electronic component supply device according to an embodiment of the present invention. (B) An operation explanatory diagram of an electronic component supply device according to another embodiment of the present invention. Explanatory diagram of the operation of the electronic component supply device according to the embodiment

FIG. 14 is a perspective view of a conventional tray.

FIG. 15 is an enlarged perspective view of a conventional tray.

FIG. 16 is a side view showing a pickup state of a conventional tray.

[Explanation of symbols]

 1 Tray 1a Partition wall 2 Hole opening pocket 3 Holeless pocket 20 X motor 22 Y motor 71 CPU 73 RAM 79 Pressure sensor P Adsorption pad

Claims (3)

[Claims] 1. A perforated pocket for storing electronic parts and a holeless pocket for picking up the tray itself are formed, and the holed pocket and the holeless pocket are partitioned by a grid-like partition wall. An electronic component supply device that picks up an electronic component from a tray and supplies it to an electronic component mounting device. A suction pad that suctions and picks up the tray, and a movement that moves the suction pad in XY relative to the tray. Means, a memory for storing the tray pocket position information, and a control means for calculating the tray suction position from the pocket position information, controlling the moving means, and moving the suction pad to the calculated suction position. An electronic component supply device having. 2. A detection means for detecting whether or not the suction pad is suctioning a holeless pocket, and the control means controls the moving means by referring to a detection result of the detection means. 2. The electronic component supply device according to claim 1, wherein the suction position of the tray is updated until the suction pad sucks the holeless pocket. 3. A perforated pocket for accommodating electronic parts and a non-perforated pocket for picking up the tray itself are formed, and the perforated pocket and the non-perforated pocket are partitioned by a grid-like partition wall. An electronic component supply device that picks up electronic components from an existing tray and supplies them to the electronic component mounting device, which is formed so that it can land on the upper surface of the partition wall that surrounds the holeless pocket, and the air in the landed pocket without holes. An electronic component supply device comprising a suction pad for sucking the component.