JPH0786469B2 - Mounted printed circuit board automatic inspection device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention sweeps a beam spot such as a laser beam that is narrowed down on a printed circuit board to be inspected to obtain a bridge, a solder funnel, a floating lead or a chip component. The present invention relates to a mounted printed circuit board automatic inspection device that automatically detects the presence or absence of a printed circuit board.

[Conventional technology]

Conventionally, a contact inspection method that uses a head or the like with a large number of pins arranged in accordance with the component holes of the printed circuit board to be inspected in order to inspect solder bumps, etc. on the bridge sulphate on the printed circuit board to be inspected that has chip components mounted. There is.

However, this contact inspection method requires different heads for different types of printed circuit boards to be inspected, and the distance between the pins of the head is controlled by the thickness of the pins. There are inconveniences such as difficulty in inspecting a printed circuit board on which a pattern on which chips and the like are mounted and having a precise pattern is difficult.

In order to eliminate such inconveniences of the contact inspection method, a non-contact type mounted that sweeps the beam spot such as laser light on the printed circuit board to be inspected and detects the reflected light of the beam spot to inspect the bridge etc. An automatic printed circuit board inspection apparatus has been previously proposed by the present applicant (actual application)
62-5625).

FIG. 9 is a front view showing the mounted printed circuit board automatic inspection apparatus previously proposed by the applicant.

In FIG. 9, 11 is a casing, 12 is an XY stage arranged in the casing 11, and this XY stage 12 is a printed circuit board P to be inspected which is an inspected printed board P in the X-axis direction and the Y-axis direction. It is to move in the direction.

Reference numeral 13 denotes a light receiving portion arranged (arranged) above the XY stage 12, and as will be described later, a large number of light receiving elements for detecting sputtered light are arranged in the light receiving portion.

Reference numeral 14 denotes a light receiving portion arranged (arranged) below the XY stage 12, and as will be described later, a printed circuit board P to be inspected is provided.
The beam that passes through the light receiving portion 13 when setting the reference point is received through the reference hole provided in the printed circuit board P to be inspected.

15 is a group of operation switches provided on the upper surface of the casing 11,
Reference numeral 16 is an indicator light showing an operating state, and 17 is a printer for printing out the inspection result.

In this mounted printed circuit board automatic inspection device, inspection data such as a reference position of the inspected printed circuit board P, an inspection position or a board name for identifying the type of the inspected printed circuit board P is stored in advance in a storage device or the like before the inspection. It is registered.

When performing the inspection, the printed circuit board P to be inspected
Is installed on the XY stage 12 and a board name or the like is input from the terminal device, the inspection is automatically performed based on the inspection data such as the upper position of the inspection point registered in advance, and when the inspection is completed, The inspection result of the detected position or number of bridges or the like is printed out from the printer 17, and a mark (not shown) is provided near the position of the bridge or the like of the printed circuit board P to be inspected.

FIG. 10 is a perspective view showing an optical system of the mounted printed circuit board automatic inspection apparatus shown in FIG.

In FIG. 10, 21 is a He-Ne laser gun that emits laser light, 22 is an expander, and this expander 22 is
In order to sufficiently narrow the beam spot, the laser beam emitted by the He-Ne laser gun 21 is temporarily converted into a parallel beam B having a diameter of about 5 mm.
It is intended to be extended to.

Reference numeral 23 denotes a galvanometer as a beam scanning means, which is a Y-axis rotary mirror 23y for scanning the beam B in the Y-axis direction of the XY stage 12 so as to sweep the beam B, and XY.
The stage 12 is provided with an X-axis rotating mirror 23x for scanning so as to sweep the beam B in the X-axis direction.
The beam B is radially scanned within a solid angle based on a movable range of the rotary mirrors 23x and 23y with a fixed point O corresponding to a point O ₁ located between 3y and the X-axis rotary mirror 23x as a center.

Reference numeral 24 denotes a beam splitter, which splits the beam B supplied from the galvanometer 23 into a first split beam B ₁ and a second split beam B ₂ .

Reference numeral 25 denotes a first mirror that reflects the first split beam B ₁ supplied from the beam splitter 24 in a predetermined direction, 26 denotes a first condenser lens, and this first condenser lens 26 is one of The focus is arranged so as to coincide with a fixed point O in the galvanometer 23.

Reference numeral 27 denotes a second mirror that reflects the first separated beam B ₁ supplied from the first condenser lens 26 in a predetermined direction.
The separated beam B ₁ is focused by the second mirror 27 on the printed circuit board P to be inspected.

That is, the first splitting beam B ₁ by the first condensing lens 26 arranged so that the fixed point O and one of the focal points coincide with each other.
Is focused, the focused _first separated beam B ₁ forms a beam spot on the other focal plane, and the optical axis of the beam spot is parallel to the optical axis of the first focusing lens 26. Therefore, the first separated beam B ₁ scanned in all directions is a beam spot focused on the printed circuit board P to be inspected arranged on the image-side focal plane of the first condenser lens 26. An image is formed and the printed circuit board P to be inspected is irradiated at right angles.

Reference numeral 28 denotes a spot position detector, which is a printed circuit board P to be inspected.
A first condensing lens 28a for condensing the scattered light of the beam spot condensed on the second condensing lens, and a light receiving surface S on which the light spot image condensed by the second condensing lens 28a is formed. It is composed of the light spot position detecting element 28b.

The X signal and the Y signal having the intensity corresponding to the position of the light spot imaged on the light receiving surface S are the first as the position information of the beam spot.
The light spot position detecting element 28b is output to a processing device (not shown).

Reference numeral 29 denotes a third condenser lens which condenses the _second separated beam B ₂ supplied from the beam splitter 24, and is arranged so that one focus thereof coincides with a fixed point O in the galvanometer 23.

Reference numeral 30 denotes a second light spot position detecting element disposed (arranged) at the other focal point of the third condensing lens 29, which is a two-dimensional position coordinate of the beam spot by the second separated beam B _2. The X signal and the Y signal having corresponding intensities are output to a servo control circuit (not shown).

FIG. 11 is a block diagram showing the overall configuration of the mounted printed circuit board automatic inspection apparatus previously proposed by the applicant.

In FIG. 11, reference numeral 31 denotes a processing device, data recorded in a storage device (not shown), a terminal device 32 and an operation unit.
The printed circuit board automatic inspection device is controlled on the basis of the data input from 33 and the signal input from the light receiver 14, and is composed of the second condenser lens 28a and the first light spot position detecting element 28b. Spot position detector 28 and light receiver 13
The result of various inspections is determined based on the input from the printer, the inspection result is output to the printer 17, and the marker 34 for marking the detection point on the inspected printed circuit board P is controlled.

Reference numeral 35 denotes a servo control unit, which is composed of a servo control circuit 35a for driving and controlling the galvanometer 23 and a galvano drive circuit 35b, as will be described later.

Reference numeral 36 denotes an XY stage controller, which drives the XY stage 12 based on the position coordinates output from the processing device 31,
The inspected printed circuit board P is moved to a predetermined position.

That is, a two-dimensional coordinate system in the X and Y directions is set in the inspected printed circuit board installation portion of the XY stage 12 (not shown), and the point on the two-dimensional coordinate system output by the processing device 31 is , The XY stage 12 is driven so as to coincide with a fixed point such as the initial setting position of the laser beam.

Reference numeral 37 denotes a light receiving unit moving device, which is based on the output of the processing unit 31 so that the beam spot is not blocked by the light receiving unit 13 when the position of the beam spot on the printed circuit board P to be inspected is detected by the spot position detecting unit 28. Receiver 13
Is to move.

In the mounted printed circuit board automatic inspection apparatus configured as described above, when the position information indicating the position of irradiating the laser beam is output from the processing device 31 to the servo control circuit 35a, the servo control circuit 35a causes the second light spot. Since the X control signal and the Y control signal output to the galvano drive device 35b are corrected and output based on the X signal and the Y signal input from the position detection element 30, the galvanometer 23 is operated by the galvanometer drive device 35b.
Is corrected and driven, and the scanning directions of the beams B, B ₁ and B ₂ are corrected.

When the galvanometer 23 scans the first separated beam B ₁ irradiated on the inspected printed circuit board P and the second separated beam B ₂ irradiated on the second light spot position detecting element 30, Since it is an integrated beam B, if the control of the scanning direction of the beam B is performed based on the scanning position of the second separated beam B ₂ with which the second light spot position detecting element 30 is irradiated, the galvano drive device 35b, etc. Even if a deviation occurs in the scanning direction due to a factor that cannot be directly detected, the position of the beam spot can be controlled with high accuracy.

FIG. 12 is an explanatory view showing a light receiving state of sputtered light by the light receiving portion, and FIG. 13 is a development view of the light receiving portion showing a light receiving surface of the light receiving portion.

In FIGS. 12 and 13, a large number of light receiving elements D are arranged on the entire light receiving surfaces S ₁ and S ₂ , and the sputtered light E _{1 having} a low reflection angle is used as the light receiving elements of the surrounding light receiving surface S ₁ . The sputtered light E ₂ received by D and having a high reflection angle is received by the light receiving element D on the light receiving surface S ₂ of the ceiling.

Thus, the sputtered lights E ₁ and E ₂ in all directions are detected, the amount of received light is increased, and the outputs of the light receiving elements D arranged on the light receiving surfaces S ₁ and S ₂ are appropriately selected. , The reflection direction can be selected to detect the sputtered lights E ₁ and E ₂ .

An opening W is provided on the light receiving surface S ₂ of the ceiling of the light receiving unit 13, and the first separated beam B ₁ is applied to the printed circuit board P to be inspected through the opening W.

FIGS. 14 and 15 (a) and 15 (b) are explanatory views showing the detection of solder funnel in the chip component.

In FIG. 14, the soldering parts H ₁ and H of the chip component T mounted on the printed circuit board P to be inspected by scanning the first separation beam B ₁ are scanned.
₂ is irradiated with a beam spot, the sputter lights E ₁₁ and E ₁₂ from the solder portions H ₁ and H ₂ are received by the light receiving portion 13, and the total amount of received light is detected to detect solder funnel.

That is, as shown in FIGS. 15 (a) and 15 (b), the relationship between the beam spot position and the intensities of the sputtered light E ₁₁ and E ₁₂ light is shown when there is no solder funnel and when there is solder funnel. , Spattered light from the part where solder funnel is generated
E ₁₁ is not detected and the total amount of received light decreases, and solder funnel is detected.

In FIG. 15, S ₁₁ and S ₁₂ indicate the total amount of the sputtered light E ₁₁ received by the solder portions H ₁ and H ₂ , and S ₃₁ indicates the total amount of the sputtered light E ₁₁ received by the terminal portion of the chip component T. .

FIG. 16 is an explanatory diagram showing the determination of the presence / absence of a chip component.

In FIG. 16, the printed circuit board P to be inspected is provided with a chip component T.
Is mounted, the first separated beam B ₁ becomes a beam spot at a point M on the chip component T as shown by a solid line.

However, if the chip component T is not mounted on the printed circuit board P to be inspected, the first separation beam B ₁ becomes a beam spot at the point N on the printed circuit board P to be inspected, as indicated by the dotted line.

Thus, the beam spots generated at the points M and N are imaged by the second condenser lens 28a at two different points on the light receiving surface S of the second light spot position detecting element 28b, that is, points m and n. .

Therefore, according to the image forming position of the light receiving surface S, the chip component T
It is possible to determine the presence or absence and the height of the chip component T.

[Problems to be Solved by the Invention]

Since the conventional mounted printed circuit board automatic inspection device is configured as described above, when the chip component T is mounted in the vicinity of the printed circuit board P to be inspected, the chip component in which the reflected light of the beam spot approaches Since the light is reflected by the solder portion of T (secondary reflection), the second reflected light is received by the light receiving element D, and whether the reflected light received by the light receiving element D is primary reflected light or secondary reflected light. It cannot be determined if there is.

Therefore, there is an inconvenience that the inspection of solder funnel cannot be performed accurately.

Further, as shown in FIGS. 14 and 15, the quality of the solder portions H ₁ and H ₂ is determined by the transition of the reflection angle of the beam spot.
H _1, H ₂ is the solder in a state of being floated from the objective printed circuit board P, the solder section transition is normal of the reflection angle of the beam spot H _1, H
_Since it becomes the same as that of ₂ , there was a disadvantage that the inspection of the soldering state could not be performed accurately.

Furthermore, unless the output of the spot position detection unit 28 is used,
That is, there is a disadvantage that the presence or absence of the chip component T cannot be detected by the output of the light receiving unit 13 or another light receiving unit.

The present invention has been made in order to eliminate the above-mentioned inconvenience, and has a relatively simple configuration, and the reflected light received by the light receiving unit is primary reflected light or secondary reflected light, or the reflected light is normal. It is possible to judge whether it is from the soldered part that has been soldered to, that is, it is possible to perform accurate inspection such as defective soldering and whether the soldered part is connected to the inspected printed circuit board in a normal state with high accuracy, and the beam spot irradiation (EN) Provided is a mounted printed circuit board automatic inspection device capable of inspecting the presence / absence of a chip component and the correctness of the polarity of a mounted component by the output of a second light receiving unit that receives reflected light in the opposite direction.

[Means for Solving the Problems]

The mounted printed circuit board automatic inspection device according to the present invention,
In order to achieve the above-mentioned object, a plurality of digital conversion units for converting the received light amount of the light receiving surface divided into a plurality of digital values and outputting them to the processing device are provided.

Further, in the mounted printed circuit board automatic inspection apparatus according to another invention, the mirror is a half mirror that reflects the beam and transmits the reflected light, and the second light receiving unit that receives the reflected light transmitted through the half mirror is provided. In addition to the above, a plurality of digital converters for converting the light receiving amount of the light receiving surface and the light receiving amount of the second light receiving unit divided into a plurality of digital values and outputting them to the processing device are provided.

[Operation] The mounted printed circuit board automatic inspection device according to the present invention is
With the above-described configuration, the direction of the reflected light of the beam spot and the intensity of the reflected light can be detected by processing the outputs of the plurality of digital conversion units with the processing device.

Therefore, based on the direction of the reflected light of the beam spot and the strength of the reflected light, the reflected light is the primary reflected light or the secondary reflected light, or whether the reflected light is from the soldered part normally soldered, That is, it is possible to perform an accurate inspection such as soldering failure and whether the solder part is connected to the inspected printed circuit board in a normal state. Also, the presence or absence of the chip part and the polarity of the mounted component can be inspected. This can be performed based on the output of the second light receiving unit.

〔Example〕

 An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a block diagram showing an optical system and a digital converting section of a mounted printed circuit board automatic inspection apparatus according to an embodiment of the present invention. The same parts as those in FIGS. Is omitted.

In FIG. 1, 27A indicates a half mirror, which reflects the first separated beam B ₁ as described above and transmits the reflected light of the beam spot.

Reference numeral 18 denotes a first digital conversion unit, which is a signal (a signal corresponding to the amount of received light supplied from the light receiving element that receives light according to the reflection angle of the reflected light of the beam spot received by the light receiving unit (first light receiving unit) 13). Amplifier 18a for amplifying analog signal) and amplifier 1
It is composed of an analog / digital converter (A / D converter) 18b for converting the output of 8a into a digital value, and the digital value of the A / D converter 18b is output to the processing device 31.

It should be noted that the first digital conversion section 18 is a second digital conversion section which will be described later.
As shown in the figure, it is composed of a plurality of digital conversion units.

Reference numeral 19 denotes a second light receiving portion, which receives the reflected light of the beam spot transmitted through the half mirror 27A and outputs an analog signal according to the amount of received light.

Reference numeral 20 denotes a second digital conversion unit, which amplifies an analog signal according to the amount of received light supplied from the second light receiving unit 19 and converts the output of the amplifier 20a into a digital value.
The digital value of the A / D converter 20b is output to the processing device 31.

FIG. 2 is a development view of the light receiving section showing the relationship between the angle of reflected light and the light receiving element of the light receiving section.

In FIG. 2, D _{1 to} D ₆ indicate light receiving elements arranged according to the reflection angle of the beam spot. Among the light receiving elements D _{1 to} D ₆ , the reflection angles of the reflected light received by the light receiving element D ₁ are shown. Is the smallest, and the reflection angle of the reflected light received by the light receiving element D ₆ is the largest.

18a _{1 to} 18a ₆ are light receiving elements D ₁ of the light receiving section (first light receiving section) 13.
~ Amplifier for amplifying the analog signal supplied from D ₆ according to the amount of received light, 18b _{1 to} 18b ₆ are A / D converters for converting the output of each amplifier 18a _{1 to} 18a ₆ into a digital value. The digital values of the / D converters 18b _{1 to} 18b ₆ are output to the processing device 31.

Amplifier 18a ₁ and A / D converter 18b ₁ , amplifier 18a ₂ and A / D converter 18b ₂ , amplifier 18a ₃ and A / D converter 18b ₃ , amplifier 18a ₄ and A
A / D converter 18b ₄ , amplifier 18a ₅ and A / D converter 18b ₅ , amplifier 18a
₆ and A / D converter 18b _6, respectively the digital converting unit 18A ₁ ~ 18
A ₆ is configured, and the first digital conversion unit 18 is configured by the digital conversion units 18A _{1 to} 18A ₆ .

FIG. 3 is an explanatory diagram showing secondary reflection, and FIG. 4 is an explanatory diagram showing characteristics of secondary reflection.

In FIG. 3, T ₁ and T ₂ represent chip components, which are mounted close to the printed circuit board P to be inspected.

H indicates a solder part of each of the chip components T ₁ and T ₂ , and the inclination angle is 45 degrees.

In FIG. 4, the measurement sequence indicates the light receiving elements D _{1 to} D ₆ , and the analog value indicates the amount of reflected light received by the light receiving elements D _{1 to} D ₆ .

As shown in FIG. 3, the mounted printed circuit board automatic inspection apparatus of the present invention configured as described above, in a state where the chip components T ₁ and T ₂ are mounted in close proximity to the printed circuit board P to be inspected, When the galvanometer 23 scans the _first separated beam B ₁ , the direction of the reflected light received by the light receiving elements D _{1 to} D ₆ is detected as shown in FIG.

However, the reflection direction of the reflected light is the light receiving element that receives the reflected light.
Is determined by D ₁ to D _6, the processor 31 received light amount is converted into a digital value by the amount of received light received by the light receiving element D ₁ to D ₆ are digital converting section 18 (18A ₁ ~18A ₆₎ Since it is output, it is possible to determine whether the received reflected light is the primary reflected light or the secondary reflected light by determining this digital value by the processing device 31.

That is, for example, when the maximum amount of reflected light received is 100,
If the received light amount of the reflected light is a value as shown in FIG. 4, that is, if the value is 80 or 76, it can be determined that the reflected light is primary reflected light, and if it is a low value such as 34 or 23. For example, the reflected light can be determined to be the secondary reflected light.

Therefore, as shown in FIG. 3, when the chip components T ₁ and T ₂ are mounted close to each other on the printed circuit board P to be inspected, the solder surface is conventionally flat based on the reflection direction of reflected light (measurement sequence). Judgment is made, that is, defective solder (bridge etc.)
However, according to the present invention, the soldering state of the solder portion H is also determined with reference to the received light amount of the reflected light, so that the soldering can be determined to be normal.

In this way, the solder state of the solder portion H is determined by also referring to the amount of received light. Therefore, even if it can be determined that the solder portion H is normal by the transition of the reflection angle of the beam spot, the solder portion is determined by the state of the cream solder. If H is not connected to the inspected printed circuit board P in a normal state, the analog value of the amount of received light becomes a low value, so that not only the shape of the solder part H but also the inspected printed circuit board P of the solder part H is The connection status can also be determined.

The value for distinguishing (determining) the primary reflected light and the secondary reflected light and the connection state of the solder portion H with the inspected printed circuit board P can be set to any value between 50 and 60, for example. .

FIG. 5 is an explanatory diagram showing the sweep direction when determining the polarity of the chip diode.

In FIG. 5, TD indicates a chip diode, which indicates polarity and is provided with a white mark MA.

The arrow direction indicates the sweep direction of the _first separated beam B ₁ .

6 (a) and 6 (b) are waveform diagrams showing the characteristics of reflected light for determining the polarity of the chip diode.

In FIG. 6, the level indicates the amount of received light.

As shown in FIG. 5, when the first separated beam B ₁ is swept in the direction of the arrow, the reflected light of the beam spot applied to the chip diode TD passes through the half mirror 27A and is reflected by the second light receiving unit 19. Since the light is received, the amount of the reflected light received by the second light receiving unit 19 is converted into a digital value by the second digital converting unit 20 and output to the processing device 31.

Therefore, when the processor 31 is supplied with an output as shown in FIG. 6 (a) from the second digital converter 20, for example, when there is an output corresponding to the mark MA upstream in the sweep direction, the chip It is determined that the polarity of the diode TD is normal.

However, the processing device 31 may include, for example, the second digital conversion unit.
When the output shown in Fig. 6 (b) is supplied from 20,
That is, if there is an output corresponding to the mark MA downstream in the sweep direction, it is determined that the polarity of the chip diode TD is abnormal.

FIG. 7 is an explanatory diagram showing the sweep direction when determining the presence / absence of a chip component.

FIGS. 8A and 8B are waveform charts showing the characteristics of reflected light for determining the presence / absence of a chip component.

In FIG. 7, the arrow direction indicates the sweep direction of the _first separated beam B ₁ .

In FIG. 8, the level indicates the amount of received light.

As shown in FIG. 7, when the first separated beam B ₁ is swept in the direction of the arrow, the reflected light of the beam spot applied to the chip component T passes through the half mirror 27A and the second light receiving unit 1
Received at 9.

Therefore, as described with reference to FIG.
When the output as shown in FIG. 8A is supplied from the second digital conversion unit 20, it is determined that the chip component T is mounted, and the second digital conversion unit 20 outputs the output shown in FIG. )
When the output as shown in is supplied, it is determined that the chip component T is not mounted.

In this way, the polarity of the chip diode TD or the like that cannot be inspected by the tilt angle of the reflected light can be inspected based on the reflected light reflected in the direction opposite to the irradiation direction of the _first separated beam B ₁ .

Further, the presence or absence of the chip component T or the like can be inspected based on the output of the second light receiving unit 19 instead of the output of the spot position detection unit 28.

〔The invention's effect〕

As described above, according to the present invention, since a plurality of digital conversion units for converting the received light amount of the light receiving surface divided into a plurality of digital values and outputting the digital values to the processing device are provided, or a mirror is used to form a beam. A half mirror for reflecting and transmitting the reflected light is provided, and a second light receiving portion for receiving the reflected light transmitted through the half mirror is provided, and the light receiving amount of the light receiving surface and the light receiving amount of the second light receiving portion are divided. Since a plurality of digital conversion units for converting the respective digital values into the respective digital values and outputting them to the processing device are provided, by processing the outputs of the plurality of digital conversion units by the processing device, the direction of the reflected light of the beam spot and the reflected light The strength of can be detected.

Therefore, based on the direction of the reflected light of the beam spot and the strength of the reflected light, the reflected light is the primary reflected light or the secondary reflected light, or whether the reflected light is from the soldered part normally soldered, That is, it is possible to perform an accurate inspection such as a soldering failure and whether the solder part is connected to the inspected printed circuit board in a normal state, and to relatively inspect the presence or absence of the chip component and the polarity of the mounted component. There is an effect that it can be performed based on the outputs of the light receiving section and the second light receiving section with a simple configuration.

[Brief description of drawings]

FIG. 1 is a block diagram showing an optical system and a digital conversion section of a mounted printed circuit board automatic inspection apparatus according to an embodiment of the present invention, and FIG. 2 is a light receiving section showing the relationship between the angle of reflected light and the light receiving element of the light receiving section. Of FIG. 3, FIG. 3 is an explanatory diagram showing secondary reflection, FIG. 4 is an explanatory diagram showing characteristics of secondary reflection, and FIG. 5 is an explanatory diagram showing a sweep direction when determining the polarity of the chip diode. 6 (a) and 6 (b) are waveform diagrams showing the characteristics of reflected light for determining the polarity of the chip diode, FIG. 7 is an explanatory diagram showing the sweep direction when determining the presence / absence of a chip component, and FIG. (A) and (b) are waveform diagrams showing the characteristics of reflected light for determining the presence / absence of a chip component, and FIG. 9 is a front view showing a mounted printed circuit board automatic inspection apparatus previously proposed by the applicant. The figure shows the optical system of the mounted printed circuit board automatic inspection device shown in Fig. 9. FIG. 11 is a perspective view, FIG. 11 is a block diagram showing the overall configuration of the mounted printed circuit board automatic inspection apparatus previously proposed by the applicant, and FIG. 12 is an explanatory view showing the light receiving state of sputtered light by the light receiving section, FIG. Is a development view of the light receiving part showing the light receiving surface of the light receiving part, FIGS. 14, 15 (a) and 15 (b) are explanatory views showing detection of solder funnels of chip parts, and FIG. It is explanatory drawing which shows determination. 12 ... XY stage, 13 ... Light receiver, 14 ... Light receiver,
18 ... 1st digital conversion part, 18A ₁ 18A ₆ ... Digital conversion part, 19 ... 2nd light receiving part, 20 ... 2nd digital conversion part, 21 ... He-Ne laser gun, 23 ... … Galvanometer (beam scanning means), 24 …… Beam splitter, 27A
...... Half mirror, 30 ...... Second light spot position detection element, 31
...... Processor, 35 …… Servo controller, W …… Aperture, D ₁ ~
D ₆ …… Light receiving element, P …… Inspected printed circuit board, T, T ₁ , T ₂
...... Chip component, TD ・ ・ ・ Chip diode, B …… Beam, B ₁ …… First split beam, B ₂ …… Second split beam.

Claims (2)

[Claims] 1. A beam scanning means under the control of a processing device scans a beam which is narrowed down around a fixed point, and the scanned beam is reflected by a mirror so that a printed circuit board is inspected through an opening of a light receiving portion. A mounted printed circuit board automatic inspection device for inspecting the inspected printed circuit board by detecting the reflected light of the beam spot radiated at a right angle by the light receiving surface of the light receiving part divided into a plurality according to the reflection angle of the reflected light. 2. The mounted printed circuit board automatic inspection device according to claim 1, further comprising a plurality of digital conversion units for converting the received light amount of the plurality of light receiving surfaces into respective digital values and outputting the digital values to the processing device. 2. A beam scanning means based on the control of a processing device scans a beam narrowed down around a fixed point, and the scanned beam is reflected by a mirror to a printed circuit board to be inspected through an opening of a light receiving part. A mounted printed circuit board automatic inspection device for inspecting the inspected printed circuit board by detecting the reflected light of the beam spot radiated at a right angle by the light receiving surface of the light receiving part divided into a plurality according to the reflection angle of the reflected light. In the above, the mirror is a half mirror that reflects the beam and transmits the reflected light, and a second light receiving unit that receives the reflected light that has passed through the half mirror is provided, and the mirror is divided into a plurality of light receiving surfaces. A plurality of digital conversion units for converting the received light amount and the received light amount of the second light receiving unit into respective digital values and outputting the digital values to the processing device are provided. Mounted printed circuit board automatic inspection device.