JPH04190145A - Apparatus for automatically inspecting mounted printed circuit board - Google Patents

Abstract

PURPOSE:To judge whether the reflected light detected by a light detecting part is primary reflected light or secondary reflected light by respectively converting the quantities of the lights detected by light detecting surfaces divided into two or more parts to digital values to output said values to a processing apparatus. CONSTITUTION:When the first separated beam B1 is scanned by a galvanometer 23 in such a state that chip parts T1, T2 are allowed to approach to be mounted on a printed circuit board P to be inspected, the directions of the reflected beams detected by photodetectors D1-D6 are detected. However, the reflecting directions of the reflected beams are determined by the photodetectors D1-D6 detecting the reflected beams but the quantities of the beams detected by the photodetectors D1-D6 are converted to digital values by digital converting parts 18 (18A1-18A6) to be outputted to a processing apparatus and, therefore, by judging the digital values by the processing apparatus, it can be judged whether the detected reflected beams are primary or secondary reflected beams.

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention sweeps a beam spot of a narrowly focused laser beam over a printed circuit board to be inspected to detect bridges, solder flange, floating leads, or chip components. This invention relates to an automatic inspection device for a mounted printed circuit board that automatically detects the presence or absence of a printed circuit board.

[Conventional technology]

Conventionally, in order to inspect for bridges or solder bulges on a printed circuit board to be inspected that has chip components mounted on it, a contact inspection method uses a head with a large number of pins arranged to match the component holes of the printed circuit board to be inspected. There is.

However, this contact inspection method requires a different head for each type of printed circuit board to be inspected, and the spacing between the pins of the head is limited by the thickness of the pins. There are disadvantages such as difficulty in inspecting a printed circuit board to be inspected with a dense pattern on which chips and the like are mounted.

In order to eliminate the inconveniences of such contact inspection methods, we have developed a non-contact mounting method that sweeps a beam spot of laser light or other light over the printed circuit board to be inspected and detects the reflected light of the beam spot to perform bridge inspection. An automatic inspection device for printed circuit boards has previously been proposed by the present applicant (Utility Application No. 5625/1983).

FIG. 9 is a front view showing a mounted printed circuit board automatic inspection apparatus previously proposed by the present applicant.

In FIG. 9, 11 is a casing, 12 is an X-Y stage disposed inside the casing 11, and this X-Y
The stage 12 is a printed circuit board P to be inspected as an object to be inspected.
is moved in the X-axis direction and the Y-axis direction.

Reference numeral 13 indicates a light receiving section disposed (arranged) above the XY stage 12, and as will be described later, a large number of light receiving elements for detecting sputtered light are arranged on the light receiving surface.

Reference numeral 14 indicates a light receiver arranged (arranged) below the X-Y stage 12, and as described later, the beam passing through the light receiver 13 is used when setting the reference point of the printed circuit board P to be inspected. The light is received through a reference hole provided in the printed circuit board P to be inspected.

Reference numeral 15 indicates a group of operation switches provided on the upper surface of the casing 11, 16 indicates an indicator light indicating the operating state, and 17 indicates a printer for printing out the test results.

In this mounted printed circuit board automatic inspection device, prior to the inspection, inspection data such as board salt that identifies the reference position, inspection position, or type of the printed circuit board P to be inspected is stored in advance. is registered in.

When inspecting, the printed circuit board P to be inspected is
When placed on the X-Y stage 12 and inputting the substrate salt etc. from the terminal device, the test is automatically performed based on the test data such as the position information of the test points registered in advance.
When the inspection is completed, the inspection results such as the position or number of detected bridges, etc. are printed out from the printer 17, and a mark (not shown) is placed near the position of the bridges, etc. on the printed circuit board P to be inspected. .

FIG. 10 is a perspective view showing the optical system of the mounted printed circuit board automatic inspection apparatus shown in FIG. 9.

In FIG. 10, 21 is He-N that emits laser light.
e laser gun, 22 indicates an expander, and this expander 22 is equipped with He-
This is for expanding the laser beam emitted by the Ne laser gun 21 into a parallel beam B with a diameter of approximately 5 mm.

23 indicates a galvanometer as a beam scanning means;
an X-axis rotating mirror 23x for scanning the beam B in a sweeping manner in the Y-axis direction of the X-Y stage 12;
It is equipped with an X-axis rotation mirror 23x for sweeping the beam B in the X-axis direction of the X-Y stage 12, and corresponds to a point 01 located between the X-axis rotation mirror 23x and the X-axis rotation mirror 23x. The beam B is scanned radially around a fixed point 0 within a solid angle based on the movable range of each rotating mirror 23x, 23y.

A beam splitter 24 separates the beam B supplied from the galvanometer 23 into a first separated beam B1 and a second separated beam B2.

25 is a first mirror that reflects the first separated beam B1 supplied from the beam splitter 24 in a predetermined direction; 26;
indicates a first condenser lens, and this first condenser lens 26
is arranged so that one focal point coincides with a fixed point 0 within the galvanometer 23.

27 indicates a second mirror that reflects the first separated beam B supplied from the first condensing lens 26 in a predetermined direction, and the first separated beam B is inspected by the second mirror 27. The light is focused onto the printed circuit board P.

That is, when the first separated beam B is condensed by the first condensing lens 26 arranged so that one focal point coincides with the fixed point O, the condensed first separated beam B1 becomes the other. While imaging the beam spot on the focal plane,
Since the optical axis of the beam spot is parallel to the optical axis of the first condensing lens 26, the first separated beam B1 scanned in all directions is directed to the image-side focal plane of the first condensing lens 26. The focused beam spot is imaged onto the printed circuit board P to be inspected, which is placed on the printed circuit board P to be inspected.
irradiated at right angles to.

Reference numeral 28 denotes a spot position detection unit, which is a second part that collects the scattered light of the beam spot focused on the printed circuit board P to be inspected.
A first light spot position detecting element 28b includes a light spot position detecting element 28b having a light receiving surface S on which a light spot image focused by the second condensing lens 28a is formed.

The X signal has an intensity corresponding to the position of the light spot imaged on the light-receiving surface S, and the X signal or the first
The light spot position detection element 28b outputs the light to a processing device (not shown).

A third condenser lens 29 condenses the second separated beam B2 supplied from the beam splitter 24, and is arranged so that one focal point coincides with a fixed point O in the galvanometer 23.

Reference numeral 30 denotes a second light spot position detection element disposed (arranged) at the other focal point of the third condensing lens 29, which detects the position of the beam spot according to the two-dimensional position coordinates of the beam spot by the second separated beam B2. The X signal having the same intensity is output to a servo control circuit (not shown).

FIG. 11 is a block diagram showing the overall configuration of a mounted printed circuit board automatic inspection apparatus previously proposed by the present applicant.

In FIG. 11, 31 indicates a processing device, which implements processing based on data recorded in a storage device (not shown), data input from the terminal device 32 and the operation unit 33, and signals input from the light receiver 14. It controls the automatic printed circuit board inspection equipment and performs various inspections based on inputs from the spot position detection section 28, which is composed of the second condensing lens 28a and the first light spot position detection element 28b, and the light receiving section 13. It determines the results, outputs the inspection results to the printer 17, and controls the marker 34 for marking the detected location on the printed circuit board P to be inspected.

Reference numeral 35 denotes a servo control section, which is composed of a servo control circuit 35a that drives and controls the galvanometer 23 and a galvanometer drive circuit 35b, as will be described later.

Reference numeral 36 indicates an X-Y stage control section, which drives the X-Y stage 12 based on the device coordinates constituted by the processing device 31, and moves the printed circuit board P to be inspected to a predetermined position.

That is, a two-dimensional coordinate system in the X direction and the , the XY stage 12 is driven so as to coincide with a fixed point such as the initial setting position of the laser beam.

37 indicates a light receiving unit moving device, and a spot position detecting unit 28
When detecting the position of the beam spot on the print substrate ff1P to be inspected, the light receiving section 13 is moved based on the output of the processing device 31 so that the beam spot is not blocked by the light receiving section 13.

In the mounted printed circuit board automatic inspection device configured in this way, when position information indicating the position to be irradiated with the laser beam is output from the processing device 31 to the servo control circuit 35a, the servo control circuit 35a detects the second light spot. Since the X control signal and the X control signal output to the galvano drive circuit 35b are corrected and output based on the X signal and the and each beam B,B.

And the scanning direction of B2 is corrected.

When the first separated beam A B + applied to the printed circuit board P to be inspected and the second separated beam B2 applied to the second light spot position detection element 30 are scanned by the galvanometer 23, Since it is an integrated beam B, the second separated beam B is irradiated onto the second light spot position detection element 30.
If the scanning direction of the beam B is controlled based on the scanning position in step 2, the position of the beam spot can be controlled with high precision even if a deviation occurs in the scanning direction due to factors that cannot be directly detected, such as the galvano drive circuit 35b. be able to.

FIG. 12 is an explanatory diagram showing the state of reception of sputtered light by the light receiving section, and FIG. 13 is a developed view of the light receiving section showing the light receiving surface of the light receiving section.

In FIGS. 12 and 13, a large number of light receiving elements are arranged on the entire surface of the light receiving surfaces S, S2, and the sputtered light E with a low reflection angle is received by the light receiving elements on the surrounding light receiving surface S1. The sputtered light E2 having a high reflection angle is received by the light receiving element on the light receiving surface S2 of the ceiling.

In this way, each of the sputtering lights E1 and B2 in all directions is detected, increasing the amount of light received, and
By appropriately selecting each output of the light receiving element disposed in S2, it is possible to select the direction of reflection and detect the sputtered lights E, E2.

Note that an opening W is provided in the light receiving surface S2 of the ceiling of the light receiving section 13, and the first separated beam B1 is irradiated onto the printed circuit board P to be inspected through this opening W.

FIGS. 14, 15(a) and 15(b) are explanatory diagrams showing detection of solder flange on a chip component.

In FIG. 14, the first separated beam B1 is scanned to irradiate the beam spot onto the solder parts H, H2 of the chip component T mounted on the printed circuit board P to be inspected.
, H2 are received by the light receiving section 13, and the total amount of received light is detected to detect whether there is a solder bulge.

That is, FIGS. 15(a) and 15(b) show the beam spot position and spatter E I I + E 1 □ in the case where no solder bulge occurs and when the solder bulge occurs.
As shown in the relationship between the light intensities, the sputtering light E1□ is not detected from the portion where the solder bulge occurs, and the total amount of light received decreases, and the solder bulge is detected.

In addition, in FIG. 15, SII+321 is the solder part H,
, H, the total amount of received sputtering light E I I + E 12, and SS+ indicates the total amount of received sputtering light El+ at the terminal portion of the chip component T.

FIG. 16 is an explanatory diagram showing determination of the presence or absence of chip components.

In FIG. 16, if a chip component T is mounted on the printed circuit board P to be inspected, the first separated beam B1 becomes a beam spot at a point M on the chip component T, as shown by a solid line.

However, if no chip component T is mounted on the printed circuit board P to be inspected, the first separated beam B1 becomes a beam spot at a point N on the printed circuit board P to be inspected, as shown by the dotted line.

In this way, the beam spots generated at points M and N are directed to the second light spot position detection element 28 by the second condenser lens 28a.
The image is formed at two different points on the light-receiving surface S of b, that is, points m and n.

Therefore, depending on the image formation position of the light-receiving surface S, the chip component T
The presence or absence of the chip component T and the height of the chip component T can be determined.

[Invention or problem to be solved]

The conventional automatic mounting style printed circuit board inspection device is configured as described above, so that when a chip component T is mounted close to the printed circuit board P to be inspected, the reflected light of the beam spot will detect the nearby chip component. Since it is reflected (secondary reflection) by the solder part of T, this secondary reflected light is received by the light receiving element, and it is possible to determine whether the reflected light received by the light receiving element is primary reflected light or whether it is secondary reflected light. I can't determine what's going on.

However, there was an inconvenience in that it was not possible to accurately inspect for solder blemishes.

Furthermore, as shown in FIGS. 14 and 15, since the quality of the solder portions H1-H2 is determined based on the transition of the reflection angle of the beam spot, depending on the state of the cream solder, the solder portions H, H2 may be damaged. Since the soldering is carried out while floating from the test printed circuit board P, and the transition of the reflection angle of the beam spot is the same as that of the normal soldered portion H1+H2, there is a problem that the soldering cannot be performed accurately to inspect the condition.

Furthermore, there is a problem in that the presence or absence of the chip component T cannot be detected unless the output of the spot position detection section 28 is used, that is, the output of the light receiving section 13 or another light receiving section.

This invention has been made to solve the above-mentioned disadvantages, and has a relatively simple configuration, and it is possible to determine whether the reflected light received by the light receiving section is primary reflected light or secondary reflected light, and whether the reflected light is normal or normal. In other words, it is possible to determine whether the solder is coming from a soldered part that has been soldered to the board, which means that it is possible to accurately inspect whether the soldering is defective or whether the soldered part is in a normal state and connected to the printed circuit board to be inspected. The present invention provides an automatic mounted printed circuit board inspection device capable of inspecting the presence or absence of chip components and whether the polarity of the mounted components is correct or not based on the output of a second light receiving section that receives reflected light in the opposite direction.

[Means to solve the problem]

The mounted printed circuit board automatic inspection device according to the present invention includes:
In order to achieve the above object, a plurality of digital converters are provided which convert the amount of light received by the plurality of divided light receiving surfaces into respective digital values and output the digital values to the processing device.

Further, in the automatic inspection device for mounted printed circuit boards according to another invention, the mirror is a half mirror that reflects the beam and transmits the reflected light, and a second light receiving portion receives the reflected light that has passed through the 71-half mirror. and a plurality of digital converters that convert the amount of light received by the divided light receiving surface and the amount of light received by the second light receiving section into respective digital values and output the digital values to the processing device.

[For production]

The mounted printed circuit board automatic inspection device in this invention includes:
With the above configuration, the direction of the reflected light of the beam spot and the intensity of the reflected light can be detected by processing the outputs of the plurality of digital conversion sections with the processing device.

Therefore, based on the direction of the reflected light from the beam spot and the strength of the reflected light, it is possible to determine whether the reflected light is primary reflected light or secondary reflected light, or whether the reflected light is from a normally soldered part. In other words, it is possible to accurately test for defects in soldering and whether the solder parts are connected to the printed circuit board under test in a normal state, as well as to check for the presence or absence of chip components and the correct polarity of mounted components using the light receiving section. This can also be done based on the output of the second light receiving section.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a configuration diagram showing an optical system and a digital conversion section of an automatic inspection device for mounted printed circuit boards according to an embodiment of the present invention, and the same parts as in FIGS. 9 to 12 are given the same reference numerals and explained. omitted.

In FIG. 1, 27A represents a half mirror, which reflects the first separated beam B as described above and transmits the reflected light of the beam spot.

Reference numeral 18 denotes a first digital conversion section, which converts a signal (( an amplifier 18a that amplifies the analog signal);
It is composed of an analog-to-digital converter (A/D converter) 18b that converts the output of the amplifier 18a into a digital value, and the digital value of the A/D converter 18b is output to the processing device 31.

The first digital converter 18 is composed of a plurality of digital converters, as shown in FIG. 2, which will be described later.

Reference numeral 19 denotes a second light receiving section, which receives the reflected light of the beam spot transmitted through the half mirror 27A and outputs an analog signal corresponding to the amount of received light.

20 indicates a second digital conversion section, and the second light receiving section 1
It consists of an amplifier 20a that amplifies an analog signal according to the amount of received light supplied from 9, and an A/D converter 20b that converts the output of the amplifier 20a into a digital value, and the digital value of the A/D converter 20b is processed. It is output to the device 31.

FIG. 2 is a developed view of the light receiving section showing the relationship between the angle of reflected light and the light receiving element of the light receiving section.

In FIG. 2, D1 to D6 indicate light receiving elements arranged according to the reflection angle of the beam spot, and these light receiving elements D1 to
Among D6, the reflection angle of the reflected light received by the light receiving element D1 is the smallest, and the reflection angle of the reflected light received by the light receiving element D6 is the largest.

18a, ~18a are amplifiers that amplify analog signals according to the amount of received light supplied from each of the light receiving elements D1 to D@ of the light receiving section (first light receiving section) 13; 18b, ~18b are each amplifier 18a, This A/D converter 18b shows an A/D converter that converts the output of ~18as into a digital value.
The digital values of 1 to 18b8 are output to the processing device 31.

Note that the amplifier 18a1 and A/D converter 18b1, the amplifier 18a2 and A/D converter 18b2, and the amplifier 18a2 and A
/D converter 18b3, amplifier 18a4 and A/D converter 1
8b4, the amplifier 18a5 and the A/D converter 18b5, and the amplifier 18as and the A/D converter 18b6 constitute digital converters 18A1 to 18A6, respectively, and the first digital converter 18 is constituted by each digital converter 18A1 to 18A6. has been done.

FIG. 3 is an explanatory diagram showing secondary reflection, and FIG. 4 is an explanatory diagram showing the characteristics of secondary reflection.

In FIG. 3, T3. T2 indicates a chip component, which is mounted close to the printed circuit board P to be inspected.

H indicates the solder portion of each chip component T, , T2, and the inclination angle is 45 degrees.

In FIG. 4, the measurement sequence indicates the light receiving elements D1 to D6, and the analog value indicates the amount of reflected light received by the light receiving elements D1 to D6.

As shown in FIG. 3, the automatic printed circuit board inspection apparatus according to the present invention configured as described above has chip components T, ..., T2 mounted in close proximity to the printed circuit board P to be inspected. When the first separated beam B1 is scanned by the galvanometer 23, the direction of the reflected light received by the light receiving elements D1 to D6 is detected as shown in FIG.

However, the direction of reflection of the reflected light is determined by the light receiving element ~D6 that receives the reflected light, or the light receiving element D1~D6 receives the reflected light.
The amount of light received by D6 is determined by the digital converter 18 (18A).
, ~18Aa), the amount of received light is converted into a digital value and output to the processing device 31. By determining this digital value in the processing device 3I, it is possible to determine whether the received reflected light is primary reflected light or secondary reflected light. It is possible to determine whether the light is reflected light.

In other words, for example, when the maximum amount of reflected light received is 100, if the received amount of reflected light is a value as shown in Figure 4, that is, 80.76, then the reflected light is primary reflected light. If it can be determined that there is, and the value is low like 34.23,
The reflected light can be determined to be secondary reflected light.

Therefore, as shown in FIG.
2 is mounted on a printed circuit board P to be inspected in close proximity, conventionally, it is determined that the solder surface is flat based on the direction of reflection of the reflected light (measurement sequence), that is, it is determined that there is a solder defect (bridge, etc.). According to this invention, since the solder condition of the solder portion H is determined by also referring to the amount of received reflected light, it can be determined that the soldering is normal.

In this way, since the solder condition of the solder part H is determined by also referring to the amount of light received, even if it can be determined that the solder part H is normal based on the transition of the reflection angle of the beam spot, the solder part H may be determined to be normal depending on the state of the cream solder. If H is not connected to the printed circuit board P to be inspected in a normal state, the analog value of the amount of light received will be a low value. Connection status can also be determined.

Note that the value for distinguishing (determining) the negative reflected light from the secondary reflected light and the connection state of the solder portion H to the printed circuit board P to be inspected may be any value between 50 and 60, for example. can.

FIG. 5 is an explanatory diagram showing the sweep direction when determining the polarity of the chip diode.

In FIG. 5, TD indicates a chip diode, and a white mark MA indicating polarity is provided.

The direction of the arrow indicates the sweeping direction of the first separated beam B.

FIGS. 6(a) and 6(b) are waveform diagrams showing the characteristics of reflected light for determining the polarity of a chip diode.

In FIG. 6, the level indicates the amount of received light.

As shown in FIG. 5, when the first separated beam B is swept in the direction of the arrow, the reflected light of the beam spot irradiated on the chip diode TD passes through the half mirror 27A and reaches the second light receiving section 19. The amount of reflected light received by the second light receiving section 19 is converted into a digital value by the second digital converting section 20 and output to the processing device 31 .

Therefore, when the processing device 31 is supplied with an output as shown in FIG. It is determined that the polarity of diode TD is normal.

However, when the processing device 31 is supplied with an output as shown in FIG. 6(b) from the second digital conversion section 20, that is, when there is an output corresponding to the mark MA downstream in the sweep direction, the processing device 31 converts the chip into a chip. It is determined that the polarity of diode TD is abnormal.

FIG. 7 is an explanatory diagram showing the sweep direction when determining the presence or absence of a chip component.

FIGS. 8(a) and 8(b) are waveform diagrams showing the characteristics of reflected light for determining the presence or absence of chip components.

In FIG. 7, the direction of the arrow indicates the sweeping direction of the first separated beam B1.

In FIG. 8, the level indicates the amount of received light.

As shown in FIG. 7, when the first separated beam B1 is swept in the direction of the arrow, the reflected light of the beam spot irradiated onto the chip component T passes through the half mirror 27A and is received by the second light receiving section 19. be done.

Therefore, as explained with reference to FIG. 5, when the processing device 31 is supplied with the output as shown in FIG. When the output shown in FIG. 8 (bl) is supplied from the second digital converter 20, the chip component T
It is determined that is not implemented.

In this way, the polarity of the chip diode TD, which cannot be inspected using the inclination angle of the reflected light, can be inspected based on the reflected light reflected in the direction opposite to the irradiation direction of the first separated beam B1.

In addition, the presence or absence of a chip component T can be inspected based on the output of the second light receiving section 19 without depending on the output of the spot position detection section 28.

〔Effect of the invention〕

As described above, according to the present invention, since a plurality of digital converters are provided that convert the amount of light received by a light receiving surface divided into a plurality of parts into respective digital values and output them to a processing device, A half mirror that reflects the reflected light and transmits the reflected light is provided, and a second light receiving section that receives the reflected light that has passed through the half mirror is provided, and the amount of light received by the light receiving surface divided into multiple parts and the amount of light received by the second light receiving section Since we have provided multiple digital converters that convert each digital value into a digital value and output it to the processing device, the outputs of the multiple digital converters can be processed by the processing device to determine the direction of the reflected light from the beam spot and the reflected light. can detect the strength and weakness of

Therefore, based on the direction of the reflected light of the beam spot and the strength of the reflected light, it is possible to determine whether the reflected light is primary reflected light or secondary reflected light, or whether the reflected light is from a normally soldered solder part. In other words, it is possible to accurately check whether the soldering is defective or whether the soldered part is connected to the printed circuit board under test in a normal state, and also to check whether there are chip components or not, and whether the polarity of the mounted components is correct or not. This has the advantage that it can be carried out based on the outputs of the light receiving section and the second light receiving section with a simple configuration.

[Brief explanation of drawings]

FIG. 1 is a configuration diagram showing the optical system and digital conversion section of an automatic inspection device for mounted printed circuit boards according to an embodiment of the present invention, and FIG. 2 is a light receiving section showing the relationship between the angle of reflected light and the light receiving element of the light receiving section. FIG. 3 is an explanatory diagram showing secondary reflection; FIG. 4 is an explanatory diagram showing the characteristics of secondary reflection; FIG. 5 is an explanatory diagram showing the sweep direction when determining the polarity of the chip diode. Figures 6 (a) and (b) are waveform diagrams showing the characteristics of reflected light for determining the polarity of a chip diode, Figure 7 is an explanatory diagram showing the sweep direction when determining the presence or absence of a chip component, and Figure 8 (al, (b) is a waveform diagram showing the characteristics of reflected light for determining the presence or absence of chip components, Figure 9 is a front view showing the automatic inspection device for mounted printed circuit boards previously proposed by the present applicant, Figure 10) is a perspective view showing the optical system of the mounted printed circuit board automatic inspection device shown in FIG. 9; FIG. 11 is a block diagram showing the overall configuration of the mounted printed circuit board automatic inspection device previously proposed by the applicant; Figure 12 is an explanatory diagram showing the state of reception of sputtered light by the light receiver, Figure 13 is a developed view of the light receiver showing the light receiving surface of the light receiver, and Figures 14, 15 (a) and (b) are chip components. FIG. 16 is an explanatory diagram showing the detection of solder flange in FIG. 16 is an explanatory diagram showing the determination of the presence or absence of chip components.
... Light receiver, 18 ... First digital conversion section, 18
A118A, . . . digital conversion section, 19 . . . second
light receiving section, 20... second digital conversion section, 21.
...He-Ne laser gun, 23...galvanometer (
beam scanning means), 24...beam splitter, 27
A... Half mirror 130... Second light spot position detection element, 31... Processing device, 35... Servo control unit,
W: opening, D1 to D6: light receiving element, P: printed circuit board to be inspected, T, T,, T2: chip component,
TD...Chip diode, B...Beam, B1.
...first separated beam, B2...second separated beam.

Claims (2)

[Claims] (1) A beam scanning means based on the control of the processing device scans a narrowly focused beam centered on a fixed point, and the scanned beam is reflected by a mirror and directed from the aperture of the light receiving section to the printed circuit board to be inspected at right angles. In an automatic mounted printed circuit board inspection device that inspects the printed circuit board to be inspected by detecting the reflected light of the irradiated beam spot on a light receiving surface of the light receiving section that is divided into a plurality of parts according to the reflection angle of the reflected light, A mounted printed circuit board automatic inspection apparatus, comprising: a plurality of digital converters that convert the amount of light received by the plurality of divided light receiving surfaces into respective digital values and output the converted values to the processing device. (2) A beam scanning means based on the control of the processing device scans a narrowly focused beam centered on a fixed point, and the scanned beam is reflected by a mirror and directed from the aperture of the light receiving section to the printed circuit board to be inspected at right angles. In an automatic mounted printed circuit board inspection device that inspects the printed circuit board to be inspected by detecting the reflected light of the irradiated beam spot with a light receiving surface of the light receiving section that is divided into a plurality of parts according to the reflection angle of the reflected light, The mirror is a half mirror that reflects the beam and transmits the reflected light, and a second light receiving section that receives the reflected light that has passed through the half mirror is provided, and the amount of light received by the light receiving surface divided into the plurality of parts. and a plurality of digital conversion sections that convert the amount of light received by the second light receiving section into respective digital values and output them to the processing device.