JPH0320649A - Photomask inspecting apparatus - Google Patents

Photomask inspecting apparatus

Info

Publication number
JPH0320649A
JPH0320649A JP1155422A JP15542289A JPH0320649A JP H0320649 A JPH0320649 A JP H0320649A JP 1155422 A JP1155422 A JP 1155422A JP 15542289 A JP15542289 A JP 15542289A JP H0320649 A JPH0320649 A JP H0320649A
Authority
JP
Japan
Prior art keywords
photomask
laser
foreign matter
scattering
detected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1155422A
Other languages
Japanese (ja)
Inventor
Noriko Ohashi
大橋 則子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP1155422A priority Critical patent/JPH0320649A/en
Publication of JPH0320649A publication Critical patent/JPH0320649A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To simultaneously perform pattern comparing inspection and surface foreign matter inspection by providing a laser beam reflecting part and a scattering beam detecting part. CONSTITUTION:The laser beam emitted from a laser source 6 irradiates a photomask 7 at a certain angle. The reflected beam thereof is detected at the same angle by a beam detection part 8 and the height of an optical system 1 is adjusted to a place where the intensity of the reflected beam is high to match the focus of the optical system 1. Next, the scattering beam of the laser beam applied to the photomask 7 is detected by a scattering beam detecting part 9. Herein, since the scattering beam from foreign matter becomes reverse to the laser beam from the laser source 6 in phase, a polarizing filter is provided to the detecting part 9 so that only beam changed in its phase by 90 deg. from the phase of the laser beam 6 is detected. The scattering beam scattered from the foreign matter is detected by the detecting part 9 and optical data where intensity is high is stored in a memory buffer 4.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、半導体素子製造に用いるフォトマスクの検査
装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an inspection apparatus for photomasks used in the manufacture of semiconductor devices.

従来の技術 半導体素子製造に際して半導体基板上に所定の素子構或
パターンを露光するために該パターンを金属、例えばク
ロム(CI)が蒸着されたガラス基板上に1〜10倍に
拡大して形戊したフォトマスクが使用される。フォトマ
スクの欠陥やフォトマスク上の異物はその11半導体基
板上に転写されるため、半導体素子歩留の低下に大きく
影響を与える。このフォトマスクの欠陥検査に関して所
定の集積回路を形或する本体パターンが複数@配置され
たフォトマスクや単個配置でも繰り返しパターンの多い
メモリーパターンなどを検査する場合、隣り合ったパタ
ーン電気信号に変換し相違を検査する方式がある(以後
パターン比較検査と称す)。
2. Description of the Related Art When manufacturing semiconductor devices, in order to expose a predetermined device structure or pattern on a semiconductor substrate, the pattern is enlarged 1 to 10 times and formed on a glass substrate on which a metal such as chromium (CI) is vapor-deposited. A photomask is used. Defects in the photomask and foreign matter on the photomask are transferred onto the semiconductor substrate, which greatly affects the reduction in semiconductor device yield. Regarding this photomask defect inspection, when inspecting a photomask in which multiple main body patterns forming a predetermined integrated circuit are arranged, or a memory pattern with many repeated patterns even in a single arrangement, the adjacent patterns are converted into electrical signals. There is a method of testing for differences (hereinafter referred to as pattern comparison testing).

第2図に上述したパターン比較検査装置の概要図を示す
。フォトマスク7上の隣りあったパターンは光学系1を
介し光学変換装置2により比較データDに変換される。
FIG. 2 shows a schematic diagram of the pattern comparison inspection apparatus described above. Adjacent patterns on the photomask 7 are converted into comparison data D by the optical conversion device 2 via the optical system 1.

光学系の焦点をあわすためにはレーザ源6より発せられ
たレー ザ光がフォトマヌク7に照射され、反射光を受
光部8で受け、反射光強度が最大のところに光学系1の
高さを調整することにより行なわれる。実パターンの比
較データDは比較部3により比較され異なる場合のみ比
較情報を不良パターンメモリ4に貯え外部出力6に出力
し欠陥箇所のパターン確認を行う。
In order to focus the optical system, the laser light emitted from the laser source 6 is irradiated onto the photomanuk 7, the reflected light is received by the light receiving part 8, and the height of the optical system 1 is set at the point where the intensity of the reflected light is maximum. This is done by making adjustments. The comparison data D of the actual pattern is compared by the comparing section 3, and only when there is a difference, the comparison information is stored in the defective pattern memory 4 and outputted to the external output 6 to confirm the pattern of the defective part.

発明が解決しようとする課題 しかしながら従来の検査装置ではフォトマスク7上に付
着したゴミとフォトマスクのDr残り部の弁別をオペレ
ータが確認する必要があり、筐たCrパターン上のゴミ
の確認は不可能であるという問題点を有していた。
Problems to be Solved by the Invention However, with conventional inspection equipment, it is necessary for the operator to distinguish between dust attached to the photomask 7 and the remaining portion of the Dr on the photomask, and it is not possible to check dust on the Cr pattern on the casing. The problem was that it was possible.

本発明は上記の問題点を解決するものでパターン比較検
査と表面異物検査を同時に実施することを目的とする。
The present invention solves the above-mentioned problems and aims to simultaneously perform pattern comparison inspection and surface foreign matter inspection.

課題f解決するための手段 この目的を達或するために本発明によるノオ1・マヌク
検査装置はパターン比較検査に訃ける焦点合わせのため
のレーザ光の反射光受光部にくわえ、.散乱光の受光部
を有している。
Means for Solving the Problem f To achieve this object, the No. 1 Manuk inspection device according to the present invention is provided with a reflected light receiving section for laser light for focusing in pattern comparison inspection. It has a light receiving section for scattered light.

作   用 以上のような構或の検査装置を使用することにより、フ
ォトマスクに照射されたレーザ光は反射光の強度により
焦点あわせを行い、散乱光強度によう異物検出を行う。
By using the inspection apparatus having the above structure, the laser beam irradiated onto the photomask is focused based on the intensity of the reflected light, and foreign matter is detected based on the intensity of the scattered light.

このようにしてパターン比較検査と表面異物検査が並行
して行われる。
In this way, the pattern comparison inspection and the surface foreign matter inspection are performed in parallel.

実施例 以下本発明の一実施例について、図面を参照しながら説
明する。
EXAMPLE An example of the present invention will be described below with reference to the drawings.

第1図は本発明のフォトマスク検査装置概要の一実施例
を示す1. なお、図V?:′訃いて1は光学系、2け光電変換部、
3ぱ比較部、4は不良パターンメ七り、6は外部出力で
これらは従来例のパターン比較検査機の構或と同じもの
である。アはフォトマスク、61dレーザ源、8はフォ
トマスクからのl,/−ザ反射光を・受光する反躬光受
光部、9はフ,ti−マヌクからのレーザ散乱光を受光
する敢乱光受光部である。
FIG. 1 shows an example of an outline of a photomask inspection apparatus according to the present invention. Furthermore, Figure V? :'1 is the optical system, 2 is the photoelectric conversion section,
3 a comparison section, 4 a defective pattern list, and 6 an external output, which are the same in structure as the conventional pattern comparison inspection machine. A is a photomask, 61d laser source, 8 is a reflected light receiver that receives l,/- laser reflected light from the photomask, and 9 is a scattered light that receives laser scattered light from F, ti-manuk. This is the light receiving section.

以上のように構或された本実施例のフォトマスク検査装
置について以下その機構を゛説明する。1ずレーザ源6
から発生したレーザ光がフォトマスク7にある角度をも
って照射される。反射光が同角度で受光部8によりつけ
られ、反射光強度の強いところにくるように光学系1の
高さが調整され焦点があわされる。フォトマスクに照射
されたレーザ光の散乱光が散乱光受光部9によシ受光さ
れる。異物からの散乱光はレーザ源からのレーザ光と位
相が逆になるので受光部9はレーザ源の位相と90’変
化した光のみ受光するものにするように偏光フィノレタ
を有している。異物から散乱さわされた散乱光が散乱光
受光部9で受光され強度が強いところでの光データがメ
モリーバッファ4に記憶される。
The mechanism of the photomask inspection apparatus of this embodiment constructed as described above will be explained below. 1zu laser source 6
Laser light generated from the photomask 7 is irradiated at a certain angle. The reflected light is applied by the light receiving section 8 at the same angle, and the height of the optical system 1 is adjusted and focused so that the reflected light is located at a position where the intensity of the reflected light is strong. Scattered light of the laser light irradiated onto the photomask is received by the scattered light receiver 9. Since the phase of the scattered light from the foreign object is opposite to that of the laser light from the laser source, the light receiving section 9 has a polarization finoreta so as to receive only the light whose phase has changed by 90' from that of the laser source. Scattered light scattered by a foreign object is received by a scattered light receiver 9, and light data where the intensity is strong is stored in a memory buffer 4.

発明の効果 以上のように本発明によればフォトマスクの焦欝あわせ
用に設置されたレーザ光を任意角で照射し、散乱光を受
光することによりフォトマスク上の表面異物検査を行う
ことができる。このようにパターン比較検査と表面異物
検査を同時に行い、パターンの欠落・Cr残シ・ガラス
面の異物・Cr面の異物が分類できる。
Effects of the Invention As described above, according to the present invention, a laser beam installed for focusing a photomask is irradiated at an arbitrary angle, and the surface foreign matter on a photomask can be inspected by receiving the scattered light. can. In this way, pattern comparison inspection and surface foreign matter inspection are performed simultaneously, and it is possible to classify missing patterns, Cr residue, foreign matter on the glass surface, and foreign matter on the Cr surface.

1た、本発明の場合、パターン比較部で余分パターンで
あると認識された信3がCr残りか異物かを異物検査部
で確認できるため、欠陥自動分類をする装置の場合に正
確な分類が行なうことができ、検査時間の短縮に大いに
役立つものである。
1. In the case of the present invention, since the foreign object inspection section can confirm whether the signal 3 recognized as an extra pattern by the pattern comparison section is Cr residue or a foreign object, accurate classification can be achieved in the case of an automatic defect classification device. This method greatly helps in shortening the inspection time.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例におけるパターン比較釦よび
表面異物検出フォトマスク検査装置の概要図、第2図は
従来のパターン比較フオl・マスク検査装置の概要図で
ある。 1・・・・・・光学系、2・・・・・・光電変換部、3
・・・・・・比較部、4・・・・・・メモリーバッファ
、5・・・・・・外部出力、6・・・・・・レーザ源、
了・・・・・・フォトマスク、8・・・・・・反射光受
光部、9・・・・・・散乱光受光部。
FIG. 1 is a schematic diagram of a pattern comparison button and surface foreign matter detection photomask inspection device according to an embodiment of the present invention, and FIG. 2 is a schematic diagram of a conventional pattern comparison photomask inspection device. 1...Optical system, 2...Photoelectric conversion section, 3
... Comparison section, 4 ... Memory buffer, 5 ... External output, 6 ... Laser source,
End: Photomask, 8: Reflected light receiver, 9: Scattered light receiver.

Claims (1)

【特許請求の範囲】[Claims] レーザ光の反射光と散乱光の受光部を備えたことを特徴
とするフォトマスク検査装置。
A photomask inspection device characterized by comprising a light receiving section for reflected laser light and scattered light.
JP1155422A 1989-06-16 1989-06-16 Photomask inspecting apparatus Pending JPH0320649A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1155422A JPH0320649A (en) 1989-06-16 1989-06-16 Photomask inspecting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1155422A JPH0320649A (en) 1989-06-16 1989-06-16 Photomask inspecting apparatus

Publications (1)

Publication Number Publication Date
JPH0320649A true JPH0320649A (en) 1991-01-29

Family

ID=15605658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1155422A Pending JPH0320649A (en) 1989-06-16 1989-06-16 Photomask inspecting apparatus

Country Status (1)

Country Link
JP (1) JPH0320649A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001066262A (en) * 1999-06-25 2001-03-16 Nkk Corp Surface scratch marking device, and metal belt with marking and its manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001066262A (en) * 1999-06-25 2001-03-16 Nkk Corp Surface scratch marking device, and metal belt with marking and its manufacturing method

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