JPH0778927A - Substrate for mounting electronic component and lead frame - Google Patents

Abstract

PURPOSE:To provide a substrate for mounting electronic components which has high versatility, can be easily reduced in size, and can make electronic components to stably operate at a high-speed and, in addition, which can be easily manufactured through a simplified process, can be easily connected to the terminals of mounted electronic components, and has a simple structure. CONSTITUTION:A substrate for mounting electronic components is provided with a first pad 11 arranged on the outer periphery of electronic components 200 to be mounted, formed of a platy member, and has a flat pattern, a second pad 12 arranged on the outer periphery of the pad 11, formed of a platy member integrally with the pad 11, and has a flat pattern, and a plurality of leads 13 arranged on the further outer periphery of the pad 12 and formed of platy members integrally with the pads 11 and 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board for mounting electronic parts and a lead frame.

[0002]

2. Description of the Related Art Various types of electronic component mounting boards have been devised for mounting electronic components such as semiconductor chips and electrically connecting them to the outside. There is a device in which various terminals such as a power supply terminal, a ground terminal, and an I / O terminal of the mounted electronic component are electrically connected to each lead. And JP-A-63-246
According to Japanese Patent Laid-Open No. 851, as an electronic component mounting substrate of this type, as shown in FIG. 10, a first pad having a solid pattern is provided on an outer peripheral portion of an electronic component to be mounted, and a solid pattern is provided on an outer peripheral portion of the first pad. A device having a second pad is disclosed.

In such an electronic component mounting board, the first pad and the second pad have a solid pattern and are arranged on the outer peripheral portions of the electronic components to be mounted, so that, for example, the first pad and the second pad are used. By connecting the power supply terminal and the ground terminal of the electronic parts to the two pads respectively, it can be used with various electronic parts with different positions of the power supply terminal and the ground terminal, and it has excellent versatility. is there.

Further, when a large current electronic component having a plurality of power supply terminals and ground terminals is mounted, if each power supply terminal and each ground terminal of the electronic component are connected to the first pad and the second pad, the electronic component Since it is not necessary to provide a lead corresponding to each power supply terminal and each ground terminal in a one-to-one correspondence, the miniaturization can be easily achieved.

Further, when each power supply terminal and each ground terminal of the electronic component for large current is connected to the first pad and the second pad, the inductance generated due to the solid pattern of the first pad and the second pad, respectively. Can be lowered, and electronic parts can be stably operated at high speed.

On the other hand, each lead of such an electronic component mounting board is formed of a lead frame integrally formed from a plate material such as a copper plate having excellent conductivity. It is integrally formed of a plate material such as a copper plate having excellent conductivity so as to connect and hold the leads to each other.

[0007]

However, in the conventional electronic component mounting substrate, as shown in FIG. 10, a first pad, a second pad and a lead are laminated via an insulating base material. Therefore, as disclosed in Japanese Unexamined Patent Publication No. 63-246851, the first pad, the second pad and the lead, which are respectively formed from separate plate materials, are sequentially formed through the insulating base material during the production thereof. The stacking was complicated and required many steps.

Generally, each terminal of the mounted electronic component is connected to the first pad and the second pad by a bonding wire, but the first pad and the second pad are arranged in different layers. Therefore, the number of bonding steps is increased, and complicated work is required when connecting to each terminal of the electronic component.

On the other hand, the conventional lead frame is integrally formed from a plate material so as to hold a plurality of leads by connecting them to each other, but is different from the plate material forming the first pad and the second pad. Since it is formed from the plate material of the body, when manufacturing the electronic component mounting substrate, as described above, the second pad is laminated on the upper layer of the first pad,
Further, not only is it complicated to stack the leads on the upper layer and requires many steps, but also the plate material cannot be effectively used.

The respective inventions of the present invention have been made in view of such circumstances, and an object of the invention is, first, in the invention of claim 1, excellent versatility and easy miniaturization. In addition to being able to stably operate the electronic parts at a high speed, the electronic parts can be easily manufactured by a simplified process and can be easily connected to each terminal of the mounted electronic parts. The purpose is to provide a possible electronic component mounting substrate with a simple structure.

According to the second aspect of the invention, when manufacturing the electronic component mounting substrate, not only the complicated step of sequentially stacking the first pad, the second pad and the lead but also a large number of steps can be omitted. The purpose of the present invention is to provide a lead frame having a simple structure, which can effectively use the plate material.

[0012]

Means for Solving the Problems In order to solve the above problems, the means adopted by the present invention will be described with reference to the reference numerals used in the drawings. A solid-patterned first pad 11 formed of a plate material to be arranged on the outer peripheral portion of the electronic component 200, and arranged on the outer peripheral portion of the first pad 11 and integrated with the first pad 11 from the plate material. The second pad 12 having a solid pattern formed on the second pad 12, and a plurality of leads 13 arranged on the outer peripheral portion of the second pad 12 and integrally formed with the first pad 11 and the second pad 12 from a plate material. And an electronic component mounting substrate 100 ".

According to the second aspect of the present invention, "the first pad 11 having a solid pattern, the second pad 12 having a solid pattern disposed on the outer peripheral portion of the first pad 11, and the second pad 12 Further, a plurality of leads 1 arranged in the outer peripheral portion
And a lead frame 10 integrally formed from a plate material so as to hold the first pad 11, the second pad 12 and the leads 13 connected to each other. Is.

[0014]

Next, the operation of each of the inventions thus constructed will be described. The lead frame 1 of the invention of claim 2
0 is used when manufacturing the electronic component mounting substrate 100 according to the first aspect of the present invention, and since it operates in the same manner,
A description will be given below based on the electronic component mounting substrate 100 of the invention of claim 1.

First, the electronic component mounting board 100 according to the first aspect of the present invention has a solid pattern first pad 11 disposed on the outer peripheral portion of the electronic component 200 to be mounted, and an outer peripheral portion of the first pad 11. The second pad 12 having the solid pattern arranged is provided, and as described above, the versatility of being sufficiently compatible with various electronic components 200 in which the positions of the power supply terminal and the ground terminal are different can be used. It is excellent.

When the electronic component 200 having a plurality of power supply terminals and ground terminals is mounted, each power supply terminal and each ground terminal of the electronic component 200 are connected to the first pad 11 and the second pad 12 of the solid pattern. By doing so, the leads 13 corresponding to the power supply terminals and the ground terminals of the electronic component 200 in a one-to-one correspondence can be omitted, and the miniaturization can be easily achieved.

Further, each power supply terminal and each ground terminal of the electronic component 200 for large current are connected to the first pad 11 having a solid pattern.
By connecting to the second pad 12 and the second pad 12, the generated inductance is reduced, and the electronic component 200 can be stably operated at a high speed.

Next, the first pad 11, the second pad 12 and each lead 13 of the electronic component mounting substrate 100 of the first aspect of the invention are formed from the lead frame 10 of the second aspect of the invention. The lead frame 10 is integrally formed from a plate material so as to connect and hold the first pad 11, the second pad 12, and the leads 13 to each other. Therefore, the first pad 11, the second pad 12, and the leads 13 are arranged in the same layer, and when the electronic component mounting substrate 100 is formed, the first pad 11, the A number of complicated steps for sequentially stacking the two pads 12 and the leads 13 are simplified.

Further, since the first pad 11 and the second pad 12 are arranged in the same layer of the electronic component mounting board 100, when the bonding wire 210 is connected to each terminal of the electronic component 200, it is conventionally required. As described above, the number of bonding steps is smaller than that in the case where the first pad 11 and the second pad 12 are arranged in different layers, and the work is simplified.

Further, the first pad 11 and the second pad 12
Further, by integrally forming the lead frame 10 including the leads 13 from a plate material, the plate material can be effectively used.

[0021]

EXAMPLE Next, the electronic component mounting substrate 100 of the present invention
An embodiment of the lead frame 10 will be described in detail with reference to the drawings.

FIG. 1 and FIG. 2 show an embodiment of an electronic component mounting board 100 according to the invention of claim 1. This electronic component mounting board 100 is mounted on the electronic component 20.
A plurality of leads 13 for electrically connecting 0 to the outside are provided inside the insulating base material 20, and a part of each lead 13 is arranged so as to project to the outside of the insulating base material 20. Has been done. In addition, the copper foil 32 is formed on both surfaces of the insulating base material 20.
A conductor circuit 30 having a desired shape is formed, and the conductor circuit 30 is connected to each lead 13 through a through hole 31. Furthermore, the insulating base material 20
An opening 21 for exposing a part of the second pad 12 and the first pad 11 and an opening 22 for accommodating the electronic component 200 are formed therein. Then, this electronic component mounting substrate 1
In the electronic component 200 mounted on the No. 00, various terminals such as a power terminal, a ground terminal, and an I / O terminal are exposed through the conductor circuit 30 on the surface of the insulating base material 20, the opening 21, and the second pad 11. It is connected to the pad 12 by a bonding wire 210. The electronic component mounting substrate 10
No. 0 is equipped with a heat sink 40 that positively dissipates heat generated from the electronic component 200 on one surface of the insulating base material 20.

When manufacturing such an electronic component mounting substrate 100, the lead frame 10 according to the invention of claim 2 as shown in FIG. 3 is used. In this lead frame 10, a plurality of leads 13 are provided in a frame body 15 and a tie bar 14.
Are integrally formed of a copper plate having excellent conductivity so that they are connected to each other and held. Here, the first pad 11 and the second pad 12 arranged on the outer peripheral portion thereof.
Are integrally formed from a plate material together with each lead 13 so as to be connected to one of the leads 13.

FIG. 4 shows an example of a process of manufacturing the electronic component mounting substrate 100 using the lead frame 10. This process will be described below. First, the mask 50 is adhered to both surfaces of the lead 13 protruding from the insulating base material 20, both surfaces of the entire lead frame 10 are covered with the insulating resin 20, and the conductor circuits 30 are formed on both surfaces of the insulating resin 20. The copper foil 32 is attached (a). Next, an opening 22 for housing the electronic component 200 and a hole 23 to be the through hole 31 are formed by machining or the like (b). Next, after plating 33 on the whole, a conductor circuit 30 having a desired shape and a through hole 31 for connecting the conductor circuit 30 and the lead 13 are formed (c). At this time,
The first pad 11 is connected to the conductor circuit 30 on the back surface of the insulating base material 20 by plating 33. Next, the opening 21 is formed by machining or the like to expose a part of the second pad 12 and the first pad 11 (d). Finally, the heat sink 40 is attached to one surface of the insulating base material 20 with the adhesive 41 interposed therebetween to form the electronic component mounting substrate 100. After the electronic component mounting substrate 100 is formed and the electronic component 200 is mounted, the frame body 15 and the tie bar 14 of the lead frame 10 are appropriately cut by punching or the like, and each lead 1
3 will be independent.

Next, FIGS. 5 and 6 show another embodiment of the electronic component mounting substrate 100 according to the first aspect of the present invention. In this electronic component mounting substrate 100, the first pad 11 is connected to the conductor circuit 30 formed on the back surface of the insulating base material 20 through the through hole 31. The through hole 31 that connects the first pad 11 and the conductor circuit 30 on the back surface also serves as a heat pipe that positively releases the heat generated from the electronic component 200.

This electronic component mounting substrate 100 is manufactured by using the lead frame 10 according to the invention of claim 2 as shown in FIG.
At 0, the first pad 11 is not directly held by the lead 13, but is held by being connected to the second pad 12 by the tie bar 14. In addition, the second pad 12 is divided into two parts, each of which is connected to and held by one of the leads 13. Here, as shown in FIG. 8, the back surface portion of the tie bar 14 holding the first pad 11 is removed by etching or the like.

FIG. 9 shows an example of a process for manufacturing the electronic component mounting substrate 100 by the lead frame 10, and this process will be described below. First, lead 1
A mask 50 is adhered to both surfaces of the portion protruding from the insulating base material 20 in FIG. 3, the both surfaces of the entire lead frame 10 are covered with the insulating resin 20, and the conductor circuit 30 is formed on both surfaces of the insulating resin 20. 32 is attached (a). Next, in the same way as the step shown in FIG.
And a through hole 31 for connecting the conductor circuit 30 to the lead 13 or the first pad 11 is formed (b). Then, an opening 21 exposing a part of the second pad 12 and the first pad 11 is formed by machining or the like,
The electronic component mounting substrate 100 is used (c). Here, a tie bar 14 that connects the first pad 11 and the second pad 12
Are removed when forming the opening 21, and the first pad 11
Are independent of the second pad 12.

As described above, in the present embodiment, each lead 13
Although an example of the electronic component mounting substrate 100 in which a part of the above is projected to the outside of the insulating base material 20 is shown, the present invention is not limited to this. It may be in the form of being connected to the outside by a pin or a separate lead. Further, not only the electronic component mounting substrate 100 having the lead 13 inside the insulating base material 20,
For example, the lead 13 may be provided on the surface of the insulating base material 20.

[0029]

As described above in detail, first, the electronic component mounting substrate of the invention of claim 1 is a solid pattern first pad integrally formed from the same plate material and the first pad. A second pad having a solid pattern arranged on the outer peripheral portion of the pad, and a plurality of leads arranged on the outer peripheral portion of the second pad. It is provided with pads and leads.

A lead frame according to a second aspect of the present invention is used when manufacturing the electronic component mounting substrate according to the first aspect of the present invention, and includes a first pad, a second pad and a plurality of leads. It is formed integrally from a plate material and holds each.

Therefore, first of all, according to the invention of claim 1,
It has excellent versatility, can be easily miniaturized, and can operate electronic parts stably and at high speed.
An electronic component mounting substrate that can be easily manufactured by a simplified process and that can be easily connected to each terminal of the mounted electronic component can be provided with a simple structure.

According to the second aspect of the present invention, when manufacturing the electronic component mounting substrate, it is possible to omit a complicated and many steps of sequentially laminating the first pad, the second pad and the lead. Alternatively, a lead frame that can effectively use the plate material can be provided with a simple structure.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of an electronic component mounting board according to the invention of claim 1. FIG.

FIG. 2 is a sectional view taken along line AA in FIG.

FIG. 3 is a plan view showing an embodiment of a lead frame according to the invention of claim 2;

FIG. 4 is a process diagram showing a manufacturing process of the electronic component mounting substrate shown in FIG. 1.

FIG. 5 is a plan view showing another embodiment of the electronic component mounting board according to the invention of claim 1;

6 is a sectional view taken along line BB in FIG.

FIG. 7 is a plan view showing another embodiment of the lead frame according to the invention of claim 2;

8 is a cross-sectional view taken along line CC of FIG.

FIG. 9 is a process chart showing a manufacturing process of the electronic component mounting substrate shown in FIG. 5;

FIG. 10 is a partial perspective view showing a conventional electronic component mounting board.

[Explanation of symbols]

 10 Lead Frame 11 First Pad 12 Second Pad 13 Lead 14 Tie Bar 15 Frame 20 Insulating Base Material 21 Opening 22 Opening 23 Hole 30 Conductor Circuit 31 Through Hole 32 Copper Foil 33 Plating 40 Heat Sink 41 Adhesive 50 Mask 100 Electronic Component Mounting Substrate 200 Electronic component 210 Bonding wire

Continuation of front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location H05K 1/18 Q 7128-4E // H05K 1/02 J

Claims (2)

[Claims] 1. A first pad having a solid pattern formed from a plate material so as to be arranged at an outer peripheral portion of an electronic component to be mounted, and a first pad formed from the plate material while being arranged at an outer peripheral portion of the first pad. Together with a solid-patterned second pad, and a plurality of leads that are arranged further on the outer peripheral portion of the second pad and are integrally formed from the plate material together with the first pad and the second pad. A board for mounting electronic components, which is characterized by being provided. 2. A first pad having a solid pattern, a second pad having a solid pattern arranged on an outer peripheral portion of the first pad, and a plurality of leads arranged on a further outer peripheral portion of the second pad. And a lead frame integrally formed from a plate material so as to connect and hold the first pad, the second pad, and the leads, respectively.