JP2000269389A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a BGA semiconductor device of high long-term reliability provided with sufficient stiffness properties and flatness that are important as characteristics required for an interposer, at low cost. SOLUTION: A semiconductor device 100 has, as a component member, an interposer 18 that comprises a plurality of conductor leads 11 provided with an integrated circuit-chip mounted region 10 by press machining or etching, a wire bonding region 13 that is adjacent to the integrated circuit-chip mounted region 10 and form an electric conducting circuit with a bonding wire 12 in between on one end part of the conductor lead 11, a conductor circuit pattern 15 that is provided with external connection terminal lands 14 placed in area array in the integrated circuit-chip mounted region 10 on the other end part, and a photosensitive epoxy resin adhesive film 17 that is stuck on a surface side A reverse to the surface of the integrated circuit-chip mounted region 10 of the conductor circuit pattern 15 and provided with a plurality of opening parts 16 exposing the external connection terminal land 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a BGA (ball grid array) type semiconductor device, and more particularly to a semiconductor circuit pattern having a plurality of conductor leads formed by pressing or etching. The present invention relates to a BGA type semiconductor device having an interposer having a photosensitive resin adhesive film adhered to a lower surface thereof as a constituent member.

[0002]

2. Description of the Related Art Recent BGA-type semiconductor devices have been reduced in size and density, and as a result, more sophisticated mounting technology and heat radiation technology have been required.

In this type of BGA type semiconductor device, an opening for exposing an external connection terminal land to which an external connection terminal (for example, a solder ball) is joined is formed by excimer laser processing or punching by pressing. A 75 μm-thick polyimide resin film and a copper foil of 18 μm to 35 μm in thickness are adhered directly or through a polyimide adhesive to one or both surfaces thereof, and this copper foil is patterned by photoetching. A conductor circuit pattern layer of a copper foil having a plurality of conductor lead layers in which a gold plating coating layer having a thickness of 0.5 μm to 1.0 μm is provided on a base plating layer of nickel having a thickness of 1 μm to 3 μm. An interposer having a plurality of openings for exposing a wire bonding region on the conductor lead layer of the interposer. A semiconductor chip fixed via a provided solder resist, a bonding wire for connecting the wire bonding area and an electrode pad of the semiconductor chip to form an electrical conduction circuit, the semiconductor chip, and the copper foil And a sealing resin portion for sealing all the bonding wires, and solder balls connected to the external connection terminal lands of the interposer and protruding toward the printed wiring board. (Japanese Patent Laid-Open No. 09-112002).

[0004]

However, since the interposer uses a polyimide resin tape as a constituent member thereof, it has no rigidity and warps and the like. There was a problem in the swelling and cracking of the solder ball due to thermal stress, and in the ease of handling. In addition, since the polyimide resin tape is used as a constituent member, there is a problem that the material cost of the interposer increases. Furthermore, since expensive excimer laser processing or press punching dies are required to form the openings for mounting the solder balls on the polyimide resin tape, workability and manufacturing of interposers such as processing costs and assembly costs are required. There was a problem that the cost was high. Therefore, there are unstable factors in long-term reliability and economy of a semiconductor device using the same. Therefore,
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has sufficient rigidity and flatness required as important characteristics required for an interposer, and has high economical efficiency and long-term reliability. It is intended to provide a device.

[0005]

A feature of the semiconductor device of the present invention that achieves the above object is that an interposer composed of a conductive circuit pattern formed by press working or etching work and a photosensitive resin adhesive tape is formed. And that

A semiconductor device according to a first aspect of the present invention is an integrated device having an interposer and a plurality of electrode pads mounted on the interposer via an insulating adhesive and connected to the interposer to form an electrically conductive circuit. In a semiconductor device comprising a circuit chip, a sealing resin for sealing these on one side, and an external connection terminal connected to the interposer, the interposer is formed by pressing or etching, and an integrated circuit chip mounting area A plurality of conductor leads provided with a plurality of conductor leads, and one end of the upper side surface of each of the conductor leads is arranged in a peripheral around the integrated circuit chip mounting area, and is connected to an electrode pad of the integrated circuit chip to be electrically connected. A bonding terminal region for forming a conductive circuit, the integrated circuit chip mounting region A conductive circuit pattern having an external connection terminal land that is arranged in an area array in the area and that joins external connection terminals; and affixed to a surface of the conductive circuit pattern opposite to the integrated circuit chip mounting surface; The photosensitive resin adhesive film is provided with an opening for exposing the connection terminal land.

The semiconductor device 100 according to claim 2
In the semiconductor device 100 according to the first aspect, a photosensitive epoxy resin adhesive film is used as the photosensitive resin adhesive film.

In the semiconductor device according to the present invention, a photosensitive epoxy resin is an example of a photosensitive resin adhesive film, instead of an expensive polyimide resin film used in the prior art, as a constituent member of the interposer. Since the adhesive film is used, the photomask on which the pattern of the external connection terminal lands is formed is exposed to the photosensitive epoxy resin adhesive film without using a conventional excimer laser or a punching die or the like. By patterning the external connection terminal lands, an opening exposing the external connection terminal lands 14 can be easily formed. Furthermore, since the lead frame formed by pressing or etching is used for the conductor circuit pattern of the interposer, the workability and rigidity of the conductor circuit pattern are improved as compared with the related art, and the flatness is improved. Swelling during reflow and ensuring
Cracks of the solder balls due to thermal stress, and handling properties thereof can be significantly improved. In particular, the semiconductor device 100 according to claim 2 uses a photosensitive epoxy resin adhesive film instead of the polyimide resin film forming the interposer, so that the material cost of the interposer can be reduced.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a cross-sectional view showing a configuration of a semiconductor device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing a configuration of an interposer used in the semiconductor device according to an embodiment of the present invention. FIG. 3 is a plan view showing the external connection terminal side of the interposer shown in FIG. 2, and FIG. 4 is a process diagram showing a manufacturing process of the interposer used in the semiconductor device according to one example of the embodiment of the present invention. .

First, the BG of the present invention will be described with reference to FIGS.
The A-type semiconductor device will be described in detail.

FIG. 1 shows a structure of a face-up structure BGA type semiconductor device using an interposer according to an embodiment of the present invention as a constituent member.

As shown in FIG. 1, this type of BGA type semiconductor device 100 has an electrode pad 10 of the integrated circuit chip 10a formed on an upper surface A thereof by pressing or etching.
b, a wire bonding region 13 for forming an electrical conduction circuit and a semiconductor chip mounting region 10 for mounting the semiconductor chip 10a, and an external portion located in the region of the semiconductor chip mounting region 10 on the lower surface side B. A conductor circuit pattern (for example, a lead frame) 15 having a predetermined shape in which a plurality of conductor leads 11 having connection terminal lands 14 are arranged.
And a photosensitive epoxy resin adhesive film 17 attached to the lower surface B of the conductive circuit pattern 15 and provided with an opening 16 for exposing the external connection terminal land 14 formed on the lower surface B. 18 (see FIG. 2 and FIG. 3) and a surface attached to the semiconductor chip mounting area 10 of the interposer 18 in a face-up structure via an insulating adhesive layer (for example, an epoxy-based adhesive layer) 20. An integrated circuit chip 10a having a plurality of electrode pads 10b;
A bonding wire 12 connected to a bonding region 13 and the other end connected to the electrode pad 10b of the integrated circuit chip 10a corresponding to each of the wire bonding regions 13 to form an electrically conductive circuit; A single-sided sealing resin 19 including the integrated circuit chip 10 a, the conductor circuit pattern 15, and the bonding wires 12, and the external connection terminal lands 14 exposed at the openings 16 of the photosensitive epoxy resin adhesive film 17. 1 having a fan-in type external connection terminal (for example, a solder ball) 14 which is bonded and arranged in an area array in the area of the semiconductor chip mounting area 10. Have been.

FIG. 2 shows the BGA type semiconductor device 1 described above.
The configuration of the interposer 18 which is a component of the 00 is shown.

As shown in the figure, the interposer 18
Is formed from a copper-based strip of 50 μm to 150 μm (100 μm in the present embodiment), which is an example of a material, by pressing and / or etching to form a wire bonding region 13 and a semiconductor chip mounting region on the upper surface. A predetermined conductor circuit pattern (see FIG. 3) having a plurality of conductor leads 11 provided with external connection terminal lands 14 on the lower surface thereof.
5 and 25 μm to 75 μm as an example of a photosensitive resin adhesive film adhered to the lower surface B of the conductive circuit pattern 15.
The photosensitive epoxy resin adhesive film 17 has a thickness of 75 μm (in this embodiment, 75 μm). Here, the external connection terminal lands 1 of the conductive circuit pattern 15 are provided on the photosensitive epoxy resin adhesive film 17.
4 is exposed, and the external connection terminal 14a (for example, Sn-A
Openings 16 for connecting solder balls such as g) are arranged in an area array (see FIG. 3).

FIG. 3 shows the BGA type semiconductor device 1 described above.
An opening exposing the external connection terminal land 14 formed on the conductor lead 11 (shown in a perspective view) in the photosensitive epoxy resin adhesive film 17 (hatched portion) of the interposer 18 which is a constituent member of 00. An example of 16 arrangements is shown.

As shown in FIG.
An integrated circuit chip mounting area 10 for mounting the integrated circuit chip 10a, a wire bonding area 13 provided adjacent thereto, and an external connection terminal land 14 exposed at an opening 16 of a photosensitive epoxy resin adhesive film 17 are provided. Configuration is shown.

FIGS. 4 (a), (b), (c), (d),
(E) shows an example of forming processing of the interposer 18 which is a constituent member of the BGA type semiconductor device 100.

In FIG. 4A, the interposer 1
A photosensitive epoxy resin adhesive film 17 which is an example of a photosensitive resin adhesive film which is a constituent member of No. 8 is prepared (film forming step).

As shown in the figure, the photosensitive epoxy resin adhesive film 17 has the structure of a general photosensitive epoxy resin adhesive film 17 provided with protective films 17a on both sides. Here, it is also possible to use a photosensitive epoxy resin adhesive film (not shown) in which fibers or spherical resins are uniformly mixed in the photosensitive epoxy resin adhesive.

In FIG. 4B, a wire bonding region 13 and an external connection terminal land 14 are formed by pressing from a copper-based strip material of 50 μm to 150 μm (100 μm in this embodiment), which is an example of the material. A conductive circuit pattern connecting frame 15a is formed by connecting a plurality of single conductive circuit patterns (for example, a single lead frame) 15 formed in a predetermined shape (see FIG. 3) having a plurality of conductive leads 11. (Formation processing step). here,
Not shown, conductive circuit pattern connection frame 15a
(For example, 4 concatenated) conductor circuit patterns 15
Can be used by cutting and forming a strip-shaped conductor circuit pattern frame connected with the above.

In FIG. 4 (c), one side of the photosensitive epoxy type adhesive film 17 formed in the film forming step is provided on the lower side B of the conductive circuit pattern connecting frame 15a formed in the shape processing step. Protective film 17
After removing a, the exposed surface is laminated to form the laminated conductor circuit pattern connecting frame 22 (lamination processing step).

In FIG. 4D, the photosensitive epoxy resin adhesive film 17 of the laminated conductor circuit pattern connecting frame 22 formed in the laminating step is attached to the external connection terminal lands 14 of the conductor circuit pattern 15. By masking with a mask pattern in which the pattern of the corresponding opening is formed, and exposing and developing the same, the opening 16 in which the external connection terminal land 14 is exposed is formed on the photosensitive epoxy resin adhesive film 17 in an area array. The interposer connection frame 23 is formed in the interposer 18 (patterning step).

In FIG. 4E, a Ni / Pd plating layer 21 which is an example of metal plating is formed on an exposed portion including the opening 16 formed in the patterning process (surface treatment process).

According to the present invention, as a constituent member of a semiconductor device,
The use of an interposer consisting of a conductive circuit pattern (eg, a lead frame) and a photosensitive epoxy resin adhesive film formed by pressing or / and etching from a copper-based or iron-based strip material. is there. Accordingly, the invention may be embodied in various other forms without departing from its spirit or essential characteristics. Therefore, the above-described embodiments are merely illustrative in every respect,
It should not be interpreted restrictively. The scope of the present invention is defined by the appended claims, and the description,
I am not bound at all. Furthermore, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention. For example, a semiconductor device having a face-down structure is included in addition to a semiconductor device having a face-up structure. In addition to a semiconductor device having a wire bond structure, a semiconductor device having a flip-flop bonding structure, a bump bonding structure, or a bumpless bonding structure is also included. Furthermore, Juan in type BGA
In addition to semiconductor devices of the die type, those of the fan-out or fan-in / fan-out type are also included. Furthermore, in the laminating process, the conductive circuit pattern
Although the patterning in which only the photosensitive epoxy resin adhesive film is laminated on the lower side B of the frame has been described, a laminated conductor circuit pattern connecting frame in which a photosensitive solder resist is applied on the upper side A is formed, not shown. Alternatively, patterning on both sides can be performed simultaneously.
Thus, the wire bonding region and the external connection terminal lands are simultaneously patterned. Moreover, the wire bonding area formed in the patterning process,
In addition, a Ni / Pd or Ni / Au plating layer, which is an example of metal plating, can be easily formed on the exposed portions of the external connection terminal lands by electroless plating.

[0026]

As described in the above embodiment, the semiconductor device according to the first and second embodiments is an example of a photosensitive resin adhesive film instead of the expensive polyimide resin film used in the prior art. As a constituent member of an interposer using a certain photosensitive epoxy resin adhesive film, unlike the conventional photosensitive epoxy resin adhesive film, the external connection can be performed without using equipment such as an excimer laser or a punching die. By exposing a photomask having a pattern of terminal lands formed thereon and patterning the external connection terminal lands, an opening for exposing the external connection terminal lands can be easily formed. As a result, workability can be improved and manufacturing costs can be reduced. Further, the interposer comprises:
Since the lead frame formed by pressing or etching is used for the conductor circuit pattern, the workability and rigidity of the conductor circuit pattern are improved and the manufacturing cost is reduced compared to the conventional technology. can do. In particular, the semiconductor device according to claim 2 is
Since a photosensitive epoxy resin adhesive film is used in place of the polyimide resin film constituting the interposer, the material cost can be reduced as compared with an interposer using a conventional polyimide resin film. . As a result, it is possible to provide a semiconductor device which has sufficient rigidity and flatness required as important characteristics required for an interposer, and has high economic efficiency and high long-term reliability.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a configuration of a semiconductor device according to an example of an embodiment of the present invention.

FIG. 2 is a plan view showing an external connection terminal side of an interposer used in the semiconductor device according to FIG. 1;

FIG. 3 is a sectional view showing a configuration of the interposer according to FIG. 2;

FIG. 4 is a process chart showing a manufacturing process of an interposer used for the semiconductor device according to the embodiment of the present invention;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 100 Semiconductor device 10 Integrated circuit chip mounting area 10a Integrated circuit chip 10b Electrode pad 11 Conductor lead 12 Bonding wire 13 Wire bonding area 14 External connection terminal land 14a External connection terminal 15 Conductor circuit pattern 15a Conductor circuit pattern connection frame 16 Opening Reference Signs List 17 photosensitive epoxy resin adhesive film 17a protective film 18 interposer 19 sealing resin 20 insulator 21 plating layer 22 laminated conductor circuit pattern connection frame 23 interposer connection frame

Claims (2)

[Claims] 1. An integrated circuit chip having an interposer, a plurality of electrode pads mounted on the interposer via an insulating adhesive, and connected to the interposer to form an electric conduction circuit, and these are sealed on one side. In a semiconductor device having a sealing resin stopped and an external connection terminal connected to the interposer, the interposer is formed by pressing or etching,
A plurality of conductor leads having an integrated circuit chip mounting area, and one end side of the upper surface of each of the conductor leads, a peripheral disposed around the integrated circuit chip mounting area, and an electrode pad of the integrated circuit chip; A bonding terminal region for forming an electrically conductive circuit by connecting to the other end of the lower surface thereof is arranged in an area array in the region of the integrated circuit chip mounting region, and external connection terminals are joined. A conductive circuit pattern having external connection terminal lands, and a photosensitive resin adhesive bonded to a surface of the conductive circuit pattern opposite to the integrated circuit chip mounting surface and having an opening for exposing the external connection terminal lands; A semiconductor device comprising: an agent film. 2. The semiconductor device according to claim 1, wherein said photosensitive resin adhesive film is a photosensitive epoxy resin adhesive film.