JPH077160U - Mounting structure for LED assembly module - Google Patents
Mounting structure for LED assembly moduleInfo
- Publication number
- JPH077160U JPH077160U JP3544393U JP3544393U JPH077160U JP H077160 U JPH077160 U JP H077160U JP 3544393 U JP3544393 U JP 3544393U JP 3544393 U JP3544393 U JP 3544393U JP H077160 U JPH077160 U JP H077160U
- Authority
- JP
- Japan
- Prior art keywords
- lens plate
- assembly module
- substrate
- led assembly
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
(57)【要約】
【目的】 基板とレンズ板との取着が容易で、かつ、基
板の反りが少なく信頼性の高いＬＥＤ集合体モジュール
の取付け構造を得ること。
【構成】 レンズ板２のコーナー部を除く端部にレンズ
板２と一体的に形成される係止部２１で、上記発光ダイ
オードを搭載した基板１とレンズ板２とを固定したこと
を特徴とするものである。
(57) [Abstract] [Purpose] To obtain a highly reliable LED assembly module mounting structure in which a substrate and a lens plate can be easily attached to each other and warp of the substrate is small. [Structure] The substrate 1 on which the light emitting diode is mounted and the lens plate 2 are fixed to each other by a locking portion 21 integrally formed with the lens plate 2 at an end portion other than a corner portion of the lens plate 2. To do.
Description
【０００１】[0001]
本考案は、ＬＥＤ集合体モジュールの接合構造に関し、詳しくは発光ダイオー ドを搭載した基板とレンズ板との取着が容易で、かつ、基板の反りが少なく信頼 性の高いＬＥＤ集合体モジュールの取付け構造に関する。 The present invention relates to a bonding structure of an LED assembly module, and more specifically, it is easy to attach a substrate on which a light emitting diode is mounted to a lens plate, and the mounting of the LED assembly module is highly reliable with less warp of the substrate. Regarding the structure.
【０００２】[0002]
ＬＥＤ集合体モジュールの取付け構造として、例えば多数のＬＥＤ（light em itting diode；発光ダイオード）を搭載した基板上にレンズ板を接着剤等で貼り 合わせてなるｎ×ｎマトリックス型ＬＥＤ集合体モジュールが知られている。 ところが、接着剤等による貼り合わせでは、接着剤層に気泡が混在することが 避けられない。また、接合時に光軸合わせが必要でその組み立てに手間を要する 等の問題があった。さらに、レンズ板は成形後に樹脂収縮するので、これを基板 に接合すると、基板とレンズ板との熱膨張の差によりＬＥＤ集合体モジュールに 反りが発生するという問題がある。 As a mounting structure of an LED assembly module, for example, an n × n matrix type LED assembly module is known in which a lens plate is attached to a substrate on which a large number of LEDs (light emitting diodes) are mounted with an adhesive or the like. Has been. However, it is unavoidable that air bubbles are mixed in the adhesive layer in the pasting with an adhesive or the like. In addition, there is a problem that the optical axis alignment is required at the time of joining and the assembly is troublesome. Further, since the lens plate contracts resin after molding, if the lens plate is bonded to the substrate, there is a problem that the LED assembly module is warped due to a difference in thermal expansion between the substrate and the lens plate.
【０００３】 本考案は、上記のような問題を解消し、基板とレンズ板との取着が容易で、か つ、基板の反りが少なく信頼性の高いＬＥＤ集合体モジュールの取付け構造を得 ることを課題とする。The present invention solves the above problems and provides a highly reliable LED assembly module mounting structure in which the substrate and the lens plate can be easily attached to each other and the substrate is less warped. This is an issue.
【０００４】[0004]
本考案者は、ＬＥＤ搭載基板として一般的な矩形状基板と、上記ＬＥＤにそれ ぞれ対応するレンズ部を有し特に上記基板と略同形の外形を有するレンズ板との 取付け構造について検討を重ねたところ、レンズ板成形時にＬＥＤ搭載基板を係 合する係止部を一体的に形成すると、上記課題を達成できるＬＥＤ集合体モジュ ールの取付け構造が得られることを見出した。 さらに本考案者は、上記係止部をレンズ板のコーナー部を除く端部に形成する ようにすると、レンズ板の対角方向への樹脂収縮力が上記各頂部において分散さ れ、この結果ＬＥＤ集合体モジュールの反りが抑止されることを見出し、本考案 を完成するに至った。 即ち、本考案のＬＥＤ集合体モジュールの取付け構造は、レンズ板のコーナー 部を除く端部にレンズ板と一体的に形成される係止部で、上記発光ダイオードを 搭載した矩形状基板とレンズ板とを固定したことを特徴とするものである。 The present inventor has repeatedly studied the mounting structure of a generally rectangular substrate as an LED mounting substrate and a lens plate having a lens portion corresponding to each of the LEDs and having an outer shape of substantially the same shape as the substrate. However, it has been found that a mounting structure for an LED assembly module that can achieve the above-mentioned object can be obtained by integrally forming a locking portion that engages the LED mounting substrate during molding of the lens plate. Further, the inventor of the present invention forms the locking portion at the end portion of the lens plate excluding the corner portion, and the resin shrinkage force in the diagonal direction of the lens plate is dispersed at each of the top portions, resulting in the LED We found that the warpage of the assembly module was suppressed, and completed the present invention. That is, the mounting structure of the LED assembly module of the present invention is a locking part integrally formed with the lens plate at the end excluding the corner part of the lens plate. It is characterized by fixing and.
【０００５】[0005]
本考案の取付け構造によれば、基板をレンズ板成形時に一体的に形成した係止 部に係合させて取着するようにしたので、接着剤が不要となり、接着剤で貼り合 わせる際の気泡の混入の問題や、光軸合わせ等の組み立て時の手間の問題を無く すことができる。 さらに、上記係止部をレンズ板のコーナー部を除く端部に形成するようにした ので、成形後にレンズ板が対角方向へ収縮する力がレンズ板のコーナー部におい て解放されるようになり、この結果ＬＥＤ集合体モジュールの反りを抑止できる ようになる。 According to the mounting structure of the present invention, since the substrate is attached by being engaged with the locking portion integrally formed at the time of molding the lens plate, an adhesive is not required, and when the substrates are bonded by the adhesive. It is possible to eliminate the problem of air bubbles mixed in and the trouble of assembling such as optical axis alignment. Further, since the locking portion is formed on the end portion of the lens plate excluding the corner portion, the force of contracting the lens plate in the diagonal direction after molding is released at the corner portion of the lens plate. As a result, the warp of the LED assembly module can be suppressed.
【０００６】[0006]
以下、本考案のＬＥＤ集合体モジュールの取付け構造を示す図面により具体的 に説明する。 図１は、ＬＥＤ集合体モジュールの取付け構造の一実施例を示す斜視図である 。同図において、ＭはＬＥＤ集合体モジュールであって、レンズ板２に形成され た係止部２１に発光ダイオード（図示せず）を搭載した基板１を係合している。 図２は、上記図１のＡ−Ａ部分の拡大断面図であり、上記係止部２１における 係合状態を示すもので、発光ダイオード（ＬＥＤ）を搭載した基板１は、レンズ 部２ａを有するレンズ板２に一体的に形成された係止部２１に係合されている。 The LED assembly module mounting structure of the present invention will now be described in detail with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of a mounting structure for an LED assembly module. In the figure, M is an LED assembly module, and a locking portion 21 formed on the lens plate 2 is engaged with a substrate 1 on which a light emitting diode (not shown) is mounted. FIG. 2 is an enlarged cross-sectional view of the portion AA of FIG. 1 and shows an engaged state in the locking portion 21, in which the substrate 1 on which a light emitting diode (LED) is mounted has a lens portion 2a. It is engaged with a locking portion 21 formed integrally with the lens plate 2.
【０００７】 上記係止部２１は、レンズ板のコーナー部を除く端部に形成される。上記コー ナー部を除く端部とは、図１に示すように、レンズ板２の頂部Ｃからの距離（ｄ ）が少なくとも２mm離れた箇所、好ましくは４〜３０mm離れた箇所をいう。 また該係止部２１の大きさはモジュールのサイズによって変動するが、図１に 示すように、通常、幅（ｗ）および長さ（ｌ）がそれぞれ０．５mm以上程度であ ることが適当である。 本考案において、上記係止部２１の幅ｗまたは長さｌが０．５mm未満となると 、基板１とレンズ板２とが安定して固定されないことがあるため好ましくない。 なお、上記係止部２１の幅ｗおよび長さｌは、モジュールのサイズに対して大 きすぎたり、レンズ板用樹脂の使用量が大きく増加するといった問題を生じない 範囲であれば、それぞれ大であるほど基板１とレンズ板２とが安定して固定され 好ましい。The locking portion 21 is formed at an end portion of the lens plate excluding a corner portion. As shown in FIG. 1, the end portion excluding the corner portion means a portion where the distance (d 1) from the top portion C of the lens plate 2 is at least 2 mm apart, preferably 4 to 30 mm apart. Further, the size of the locking portion 21 varies depending on the size of the module, but as shown in FIG. 1, it is usually appropriate that the width (w) and the length (l) are each 0.5 mm or more. Is. In the present invention, if the width w or the length l of the engaging portion 21 is less than 0.5 mm, the substrate 1 and the lens plate 2 may not be fixed stably, which is not preferable. Note that the width w and the length l of the locking portion 21 are respectively large as long as they do not cause a problem that the width w and the length l are too large relative to the size of the module and the amount of the lens plate resin used is greatly increased. It is more preferable that the substrate 1 and the lens plate 2 are stably fixed.
【０００８】 なお、本考案では、上記係止部はレンズ板の各辺に少なくとも１箇所、好まし くはレンズ板の各頂部を挟む２箇所に形成されるが、該係止部の長さが短いとき は、各辺に３箇所以上形成するようにしてもよい。In the present invention, the locking portions are formed at at least one location on each side of the lens plate, and preferably at two locations sandwiching each top of the lens plate. When is short, it may be formed at three or more locations on each side.
【０００９】 また、上記係止部２１の態様としては、ＬＥＤ搭載基板１とレンズ板２とを固 定することができるものであれば特に限定されるものではないが、例えば図２の 断面図に示すように、爪状係止部２１とすることが好ましい。The form of the locking portion 21 is not particularly limited as long as it can fix the LED mounting substrate 1 and the lens plate 2, but for example, the cross-sectional view of FIG. As shown in FIG.
【００１０】 上記レンズ板２の形成方法としては特に限定されるものではないが、上記爪状 係止部２１がレンズ板２と容易に一体形成できるインサート成形が好ましい。The method of forming the lens plate 2 is not particularly limited, but insert molding that allows the claw-shaped locking portion 21 to be easily formed integrally with the lens plate 2 is preferable.
【００１１】 上記レンズ板２としては、光透過性に優れる樹脂よりなるものが好ましく、こ のような樹脂としては、例えばエポキシ樹脂、シリコン樹脂、アクリル樹脂、ポ リカーボネート等が挙げられる。The lens plate 2 is preferably made of a resin having excellent light transmittance, and examples of such a resin include epoxy resin, silicone resin, acrylic resin, polycarbonate and the like.
【００１２】 上記ＬＥＤ搭載用基板１としては、通常使用されているものが用いられ、例え ばアルミニウム、銅、鉄、ステンレス、ニッケル等の金属板の表面に、エポキシ 樹脂、ポリエチレン、ポリイミド、ポリエステル等の絶縁材料を塗布あるいはフ ィルム接着してなる絶縁金属板や、これらの金属板と同程度の強度を有する樹脂 板等が挙げられる。As the LED mounting substrate 1, a commonly used substrate is used, for example, epoxy resin, polyethylene, polyimide, polyester, etc. on the surface of a metal plate of aluminum, copper, iron, stainless steel, nickel or the like. Examples thereof include an insulating metal plate obtained by applying or film-bonding the above insulating material, and a resin plate having the same strength as these metal plates.
【００１３】 上記構成によれば、ＬＥＤを搭載した基板をレンズ板作製時にレンズ板に一体 的に形成した係止部で係合させるようにしたので、従来の接着剤が不要となり、 また、接着剤による貼合わせ時の気泡の混入の問題や、光軸合わせ等の組立て時 の手間の問題を無くすことができて、簡単にＬＥＤ集合体モジュールが作製でき るようになる。According to the above configuration, since the substrate on which the LED is mounted is engaged with the locking portion formed integrally with the lens plate when manufacturing the lens plate, the conventional adhesive is not required, and It is possible to eliminate the problem of bubbles mixed during bonding with an agent and the trouble of assembling such as optical axis alignment, so that the LED assembly module can be easily manufactured.
【００１４】 また、本考案では、上記係止部２１をレンズ板のコーナー部を除く端部にレン ズ板と一体的に形成するようにしたので、レンズ板を成形後にレンズ板が対角方 向へ収縮する力が上記コーナー部において分散され解放されるようになる。 この結果、例えば成形直後のレンズ板２の樹脂収縮によるＬＥＤ集合体モジュ ールＭの反りを抑止できるようになる。Further, according to the present invention, since the locking portion 21 is formed integrally with the lens plate at the end of the lens plate excluding the corners, the lens plate is diagonally formed after the lens plate is molded. The force contracting in the direction is dispersed and released at the corner. As a result, for example, the warp of the LED assembly module M due to the resin contraction of the lens plate 2 immediately after molding can be suppressed.
【００１５】 なお、本考案のＬＥＤ集合体モジュールの取付け構造は、ＬＥＤ集合体モジュ ール以外にも、熱膨張の度合いに差がある複数のシート状材よりなる積層体であ ればいかなるものにも適用することができる。The mounting structure of the LED assembly module of the present invention is not limited to the LED assembly module, and may be any laminated body composed of a plurality of sheet materials having different degrees of thermal expansion. Can also be applied to.
【００１６】[0016]
以上詳述したように、本考案のＬＥＤ集合体モジュールの取付け構造によれば 、レンズ板に一体的に形成した係止部にＬＥＤ搭載基板が係合され取着されてい るので、接着剤が不要となり、接着剤で貼り合わせる際の気泡の混入の問題や、 光軸合わせ等の組み立て時の手間の問題が無くなる。 さらに、上記係止部をレンズ板のコーナー部を除く端部に形成するようにした ので、成形後にレンズ板が対角方向へ収縮する力がレンズ板のコーナー部におい て解放されるようになり、この結果ＬＥＤ集合体モジュールの反りを抑止できる ようになる。 したがって、本考案によって、ＬＥＤ搭載基板とレンズ板との取着が容易で、 かつ、基板の反りが少なく信頼性の高いＬＥＤ集合体モジュールの取付け構造が 得られる。 As described above in detail, according to the LED assembly module mounting structure of the present invention, since the LED mounting substrate is engaged and attached to the locking portion formed integrally with the lens plate, the adhesive is not attached. This eliminates the need for air bubbles when bonding with an adhesive and the trouble of assembling the optical axis. Furthermore, since the locking part is formed on the end part of the lens plate excluding the corner part, the force that the lens plate contracts in the diagonal direction after molding is released at the corner part of the lens plate. As a result, the warp of the LED assembly module can be suppressed. Therefore, according to the present invention, it is possible to easily attach the LED mounting substrate and the lens plate to each other, and to obtain a highly reliable LED assembly module mounting structure in which the substrate is less warped.
【図１】本考案の一実施例によるＬＥＤ集合体モジュー
ルの取付け構造を示す模式斜視図である。FIG. 1 is a schematic perspective view showing a mounting structure of an LED assembly module according to an embodiment of the present invention.
【図２】図１のＡ−Ａ部における接合構造を示す部分拡
大断面図である。FIG. 2 is a partially enlarged cross-sectional view showing a joining structure in a portion AA of FIG.
１ ＬＥＤ搭載基板 ２ レンズ板 ２１ 係止部 Ｍ ＬＥＤ集合体モジュール 1 LED mounting board 2 Lens plate 21 Locking part M LED assembly module
Claims (1)
にレンズ板を設けてなるＬＥＤ集合体モジュールの取付
け構造であって、該レンズ板のコーナー部を除く端部に
レンズ板と一体的に形成される係止部で、上記発光ダイ
オードを搭載した基板とレンズ板とを固定したことを特
徴とするＬＥＤ集合体モジュールの取付け構造。1. An LED assembly module mounting structure comprising a lens plate provided on a rectangular substrate on which light emitting diodes are mounted, the lens plate being integrally formed with the lens plate at an end thereof excluding a corner portion. The mounting structure of the LED assembly module, wherein the substrate on which the light emitting diode is mounted and the lens plate are fixed by the locking portion.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3544393U JP2577197Y2 (en) | 1993-06-29 | 1993-06-29 | LED assembly module mounting structure |
| EP94110046A EP0632511A3 (en) | 1993-06-29 | 1994-06-28 | A light emitting diode aggregate module and a method for manufacturing a light emitting diode aggregate module. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3544393U JP2577197Y2 (en) | 1993-06-29 | 1993-06-29 | LED assembly module mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH077160U true JPH077160U (en) | 1995-01-31 |
| JP2577197Y2 JP2577197Y2 (en) | 1998-07-23 |
Family
ID=12441980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3544393U Expired - Fee Related JP2577197Y2 (en) | 1993-06-29 | 1993-06-29 | LED assembly module mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2577197Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008270011A (en) * | 2007-04-23 | 2008-11-06 | Stanley Electric Co Ltd | Lighting fixture for vehicle |
| WO2009054048A1 (en) * | 2007-10-23 | 2009-04-30 | Kazuhiro Miyashita | Soft luminescent band using light emitting diode as light source |
-
1993
- 1993-06-29 JP JP3544393U patent/JP2577197Y2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008270011A (en) * | 2007-04-23 | 2008-11-06 | Stanley Electric Co Ltd | Lighting fixture for vehicle |
| WO2009054048A1 (en) * | 2007-10-23 | 2009-04-30 | Kazuhiro Miyashita | Soft luminescent band using light emitting diode as light source |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2577197Y2 (en) | 1998-07-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |