JP2567329Y2 - LED assembly module mounting structure - Google Patents

LED assembly module mounting structure

Info

Publication number
JP2567329Y2
JP2567329Y2 JP3578693U JP3578693U JP2567329Y2 JP 2567329 Y2 JP2567329 Y2 JP 2567329Y2 JP 3578693 U JP3578693 U JP 3578693U JP 3578693 U JP3578693 U JP 3578693U JP 2567329 Y2 JP2567329 Y2 JP 2567329Y2
Authority
JP
Japan
Prior art keywords
substrate
lens plate
locking portion
assembly module
led assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP3578693U
Other languages
Japanese (ja)
Other versions
JPH077161U (en
Inventor
真一 佐野
博昭 村田
篤 大堀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Cable Industries Ltd
Original Assignee
Mitsubishi Cable Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Cable Industries Ltd filed Critical Mitsubishi Cable Industries Ltd
Priority to JP3578693U priority Critical patent/JP2567329Y2/en
Priority to EP94110046A priority patent/EP0632511A3/en
Publication of JPH077161U publication Critical patent/JPH077161U/en
Application granted granted Critical
Publication of JP2567329Y2 publication Critical patent/JP2567329Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【考案の詳細な説明】[Detailed description of the invention]

【０００１】[0001]

【産業上の利用分野】本考案は、ＬＥＤ集合体モジュー
ルの取付構造に関し、詳しくは基板とレンズ板との取着
が容易で、かつレンズ板の樹脂収縮による基板の反りが
少なく信頼性の高いＬＥＤ集合体モジュールの取付構造
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of an LED assembly module, and more particularly, to easily mount a substrate and a lens plate, and to reduce a warp of the substrate due to resin shrinkage of the lens plate and to obtain a high reliability. The present invention relates to a mounting structure for an LED assembly module.

【０００２】[0002]

【従来の技術・考案が解決しようとする課題】ＬＥＤ集
合体モジュールの取付け構造として、例えば多数のＬＥ
Ｄ（light emitting diode；発光ダイオード）を搭載し
た基板上にレンズ板を接着剤等で貼り合わせてなるｎ×
ｎマトリックス型ＬＥＤ集合体モジュールが知られてい
る。ところが、接着剤等による貼り合わせでは、接着剤
層に気泡が混在することが避けられない。また、接合時
に光軸合わせが必要でその組み立てに手間を要する等の
問題があった。さらに、レンズ板は成形後に樹脂収縮す
るので、これを基板に接合すると、基板とレンズ板との
熱膨張の差によりモジュールに反りが発生するという問
題があり、特にサイズの大きいモジュールではこの反り
の問題が顕著である。2. Description of the Related Art As a mounting structure of an LED assembly module, for example, a large number of LEs are used.
Nx consisting of a lens plate bonded with an adhesive or the like on a substrate equipped with D (light emitting diode)
An n-matrix LED assembly module is known. However, in bonding with an adhesive or the like, it is inevitable that bubbles are mixed in the adhesive layer. In addition, there is a problem that optical axis alignment is required at the time of joining, and the assembling requires time and effort. Further, since the lens plate shrinks in resin after molding, when this is bonded to the substrate, there is a problem that the module is warped due to a difference in thermal expansion between the substrate and the lens plate. The problem is noticeable.

【０００３】本考案は、上記のような問題を解消し、基
板とレンズ板との取着が容易で、かつ基板の反りが少な
く信頼性の高いＬＥＤ集合体モジュールの取付け構造を
得ることを課題とする。An object of the present invention is to solve the above-mentioned problems and to obtain a highly reliable mounting structure of an LED assembly module in which the substrate and the lens plate can be easily attached and the substrate is less warped. And

【０００４】[0004]

【課題を解決するための手段】上記目的は、本考案、即
ち発光ダイオードを搭載した矩形状基板上に、小面積に
分割された複数のレンズ板を設けてなるＬＥＤ集合体モ
ジュールの取付構造であって、上記基板を覆う複数のレ
ンズ板が形成されるとともに、該レンズ板の上記基板頂
部に位置するコーナー部を除く周辺に一体に形成される
係止部と、該コーナー部の対角方向に位置するコーナー
部に一体に形成される係止部とで、上記発光ダイオード
を搭載した基板とレンズ板とを固定してなるものによっ
て達成される。SUMMARY OF THE INVENTION The object of the present invention is to provide an LED assembly module mounting structure comprising a plurality of lens plates divided into small areas on a rectangular substrate on which light emitting diodes are mounted. A plurality of lens plates covering the substrate are formed, and a locking portion integrally formed around the lens plate except for a corner located at the top of the substrate; and a diagonal direction of the corner. This is achieved by fixing the substrate on which the light emitting diode is mounted and the lens plate with the locking portion formed integrally with the corner portion located at the position.

【０００５】[0005]

【作用】本考案においては、発光ダイオードを搭載した
基板をレンズ板成形時に一体的に形成した係止部に係合
させて取着するようにしたので、接着剤が不要となり、
接着剤で貼り合わせる際の気泡の混入の問題や、光軸合
わせ等の組み立て時の手間の問題を無くすことができ
る。さらに、上記係止部をレンズ板のコーナー部を除く
端部に形成するようにしたので、成形後にレンズ板が対
角方向へ収縮する力がレンズ板のコーナー部において解
放されるようになるとともに、上記レンズ板を小面積に
分割して基板上に形成するようにしたので、レンズ板の
樹脂収縮が部分的に生じるようになってその応力が小さ
くなる。この結果ＬＥＤ集合体モジュールの反りを抑止
できるようになる。In the present invention, since the substrate on which the light emitting diode is mounted is engaged with the locking portion formed integrally when the lens plate is formed and attached, no adhesive is required.
It is possible to eliminate the problem of mixing of bubbles when bonding with an adhesive and the trouble of assembling such as optical axis alignment. Further, since the locking portion is formed at the end of the lens plate excluding the corner, the force of the lens plate contracting diagonally after molding is released at the corner of the lens plate. Since the lens plate is divided into small areas and formed on the substrate, resin shrinkage of the lens plate partially occurs, and the stress is reduced. As a result, the warpage of the LED assembly module can be suppressed.

【０００６】[0006]

【実施例】以下、本考案を実施例により具体的に説明す
る。図１は、ＬＥＤ集合体モジュールの取付構造の一実
施例を示す模式上面図である。同図において、ＭはＬＥ
Ｄ集合体モジュールで、発光ダイオードを搭載した基板
１面を、小面積の複数のレンズ板２ａ，２ｂ，２ｃ，２
ｄに分割されたレンズ板２で覆った構成となっている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to embodiments. FIG. 1 is a schematic top view showing one embodiment of the mounting structure of the LED assembly module. In the figure, M is LE
In the D-assembly module, one surface of the substrate on which the light emitting diode is mounted is connected to a plurality of small-area lens plates 2a, 2b, 2c, 2
It is configured to be covered by a lens plate 2 divided into d.

【０００７】図２は、ＬＥＤ集合体モジュールの模式下
面図である。同図において、２１ａはレンズ板２に一体
的に形成される係止部で、発光ダイオードを搭載した基
板１の各頂部に位置するレンズ板２のコーナー部を除く
周辺に形成されている。２１ｂもレンズ板２に一体的に
形成される係止部であるが、レンズ板２の上記コーナー
部の対角方向に位置するコーナー部に形成されている。
図３は、上記レンズ板２の係止部２１ａにおける基板１
の係合状態を示す部分拡大断面図である。同図におい
て、発光ダイオード（ＬＥＤ）を搭載した基板１は、表
面を覆うレンズ板２に一体的に成形される係止部２１ａ
にその外部周辺を係合されている。また、図４は、係止
部２１ｂにおける基板１の係合状態を示す部分拡大断面
図である。同図において、係止部２１ｂは、発光ダイオ
ードを搭載した基板１を厚み方向に貫通する貫通孔１１
を成形樹脂が通過して基板裏面側に回り込んで形成され
て、上記基板１の中央部を係合している。FIG. 2 is a schematic bottom view of the LED assembly module. In the figure, reference numeral 21a denotes an engaging portion formed integrally with the lens plate 2 and formed around the top of the substrate 1 on which the light emitting diodes are mounted, except for the corners of the lens plate 2. Reference numeral 21b denotes a locking portion integrally formed with the lens plate 2, but is formed at a corner portion of the lens plate 2 which is located diagonally to the corner portion.
FIG. 3 shows the substrate 1 in the locking portion 21a of the lens plate 2.
FIG. 4 is a partially enlarged sectional view showing an engaged state of FIG. In the figure, a substrate 1 on which a light emitting diode (LED) is mounted is provided with a locking portion 21a formed integrally with a lens plate 2 covering the surface.
The outer periphery is engaged. FIG. 4 is a partially enlarged cross-sectional view showing an engagement state of the board 1 in the locking portion 21b. In the figure, a locking portion 21b is provided with a through hole 11 penetrating through a substrate 1 on which a light emitting diode is mounted in a thickness direction.
Is formed around the back side of the substrate by passing the molding resin through the central portion of the substrate 1.

【０００８】本考案のＬＥＤ集合体モジュールは、金型
キャビティー内に保持される基板１を、複数の小部分に
区画分けし、各区画毎にレンズ板２を独立させてインサ
ート成形することによって作製され、その際に上記係止
部２１ａ，２１ｂも一体に形成される。The LED assembly module of the present invention divides the substrate 1 held in the mold cavity into a plurality of small parts, and insert-molds the lens plate 2 independently for each section. It is manufactured, and at this time, the locking portions 21a and 21b are also integrally formed.

【０００９】上記レンズ板２は、分割された部分がそれ
ぞれ２００〜３０００mm2 、好ましくは６００〜８００
mm2 となるように形成されていることが好ましい。この
分割部分が３０００mm2 を越えると、該分割部分のそれ
ぞれにおいて樹脂収縮の度合いが大となって基板への影
響が大となり、一方２００mm2 未満となると、レンズ板
２が必要以上に細分化されてその形成や基板１の固定が
困難となる。The lens plate 2 has a divided portion of 200 to 3000 mm 2 , preferably 600 to 800 mm 2 .
It is preferably formed so as to be mm 2 . When the divided portion exceeds 3000 mm 2, the degree of the resin contraction in each of said divided portions when the influence of the substrate becomes large becomes large. On the other hand 200mm less than 2, the lens plate 2 is subdivided into more than necessary Therefore, the formation and fixing of the substrate 1 are difficult.

【００１０】上記係止部２１ａは、基板１の各頂部に位
置するレンズ板２のコーナー部を除く端部に形成され
る。上記基板１の各頂部に位置するレンズ板２のコーナ
ー部を除く端部とは、図１に示すように、レンズ板２の
頂部Ｃからの距離（ｄ）が少なくとも２mm離れた箇所、
好ましくは４〜３０mm離れた箇所をいう。また該係止部
２１ａの大きさはモジュールのサイズによって変動する
が、図１に示すように、通常、幅（ｗ）および長さ
（ｌ）がそれぞれ０．５mm以上程度であることが適当で
ある。本考案において、上記係止部２１の幅ｗまたは長
さｌが０．５mm未満となると、基板１とレンズ板２とが
安定して固定されないことがあるため好ましくない。な
お、上記係止部２１の幅ｗおよび長さｌは、モジュール
のサイズに対して大きすぎたり、レンズ板用樹脂の使用
量が大きく増加するといった問題を生じない範囲であれ
ば、それぞれ大であるほど基板１とレンズ板２とが安定
して固定され好ましい。The locking portions 21a are formed at the ends of the lens plate 2 located at the tops of the substrate 1 except for the corners. As shown in FIG. 1, the ends of the lens plate 2 except for the corners located at the tops of the substrate 1 are the places where the distance (d) from the top C of the lens plate 2 is at least 2 mm,
Preferably, it refers to a location 4 to 30 mm apart. The size of the locking portion 21a varies depending on the size of the module. However, as shown in FIG. 1, the width (w) and the length (l) are each preferably about 0.5 mm or more. is there. In the present invention, if the width w or the length 1 of the locking portion 21 is less than 0.5 mm, the substrate 1 and the lens plate 2 may not be fixed stably, which is not preferable. The width w and the length 1 of the locking portion 21 are large as long as they do not cause a problem that the size is too large with respect to the size of the module or the amount of the resin for the lens plate is greatly increased. It is preferable that the substrate 1 and the lens plate 2 are more stably fixed.

【００１１】なお、本考案では、上記係止部２１ａはレ
ンズ板２の分割部分２ａ〜２ｄの外側の各辺に少なくと
も１箇所形成されるが、該係止部の長さが短いときは、
各辺に２箇所以上形成するようにしてもよい。In the present invention, at least one engaging portion 21a is formed on each side of the lens plate 2 outside the divided portions 2a to 2d.
Two or more locations may be formed on each side.

【００１２】また、上記係止部２１ａの態様としては、
ＬＥＤ搭載基板１とレンズ板２とを固定することができ
るものであれば特に限定されるものではないが、例えば
図３の断面図に示すように、爪状係止部２１ａとするこ
とが好ましい。[0012] The mode of the locking portion 21a is as follows.
There is no particular limitation as long as the LED mounting board 1 and the lens plate 2 can be fixed, but for example, as shown in the cross-sectional view of FIG. .

【００１３】一方、係止部２１ｂは、上記基板１の各頂
部に位置するレンズ板２のコーナー部の対角方向に位置
するコーナー部に形成される。On the other hand, the locking portions 21b are formed at corners located diagonally to corners of the lens plate 2 located at the tops of the substrate 1.

【００１４】上記係止部２１ｂの態様としては、ＬＥＤ
搭載基板１とレンズ板２とを固定することができるもの
であれば特に限定されるものではないが、例えば図４の
断面図に示すように、基板１を厚み方向に貫通する貫通
孔１１を成形樹脂が通過して基板裏面側に回り込んで形
成されてなるリベット状係止部２１ｂとすることが好ま
しい。The mode of the locking portion 21b is as follows.
There is no particular limitation as long as the mounting substrate 1 and the lens plate 2 can be fixed. For example, as shown in a cross-sectional view of FIG. 4, a through hole 11 penetrating the substrate 1 in the thickness direction is formed. It is preferable that the rivet-shaped locking portion 21b is formed by passing the molding resin and wrapping around the rear surface of the substrate.

【００１５】この場合、貫通孔１１の形状は、例えば円
形、方形等が可能であるが、特にこれらに限定されるも
のではない。また、貫通孔１１の大きさは、モジュール
のサイズによって変動するが、例えばモジュールのサイ
ズが６０mm×６０mmの平行四辺形の場合、通常１〜３０
mm2程度とすることが好ましい。この場合貫通孔１１の
大きさが１mm2 未満となると、基板１とレンズ板２とが
安定して固定されず、一方３０mm2 を越えると、樹脂収
縮による力が分散されなくなってＬＥＤ集合体モジュー
ルＭに反りが生じるため好ましくない。In this case, the shape of the through hole 11 can be, for example, a circle, a square, or the like, but is not particularly limited thereto. The size of the through hole 11 varies depending on the size of the module. For example, when the size of the module is a parallelogram of 60 mm × 60 mm, the size is usually 1 to 30 mm.
It is preferably about mm 2 . If the size of this through hole 11 is less than 1 mm 2, and the substrate 1 and the lens plate 2 is not stably fixed, whereas if it exceeds 30 mm 2, LED assembly module force by the resin contraction is no longer distributed This is not preferable because M is warped.

【００１６】また、上記係止部２１ｂは、基板１の各頂
部に位置するレンズ板２のコーナー部の対角方向に位置
するコーナー部を挟む２辺よりそれぞれ０．５〜１０mm
2 の距離をおいた位置に形成すると、レンズ板２が基板
１に安定して固定されるため好ましい。Each of the locking portions 21b is 0.5 mm to 10 mm from two sides sandwiching a corner portion of the lens plate 2 located on the top of the substrate 1 in a diagonal direction of a corner portion of the lens plate 2.
It is preferable to form the lens plate 2 at a distance of 2 because the lens plate 2 is stably fixed to the substrate 1.

【００１７】なお、上記係止部２１ａおよび２１ｂの位
置および数は図２に示すようなものに限定されるもので
はなく、少なくともそれぞれある程度の距離をおいた２
点であればよい。The positions and numbers of the locking portions 21a and 21b are not limited to those shown in FIG. 2, but are at least a certain distance apart from each other.
Any point.

【００１８】上記レンズ板２としては、光透過性に優れ
る樹脂よりなるものが好ましく、このような樹脂として
は、例えばエポキシ樹脂、シリコン樹脂、アクリル樹
脂、ポリカーボネート等が挙げられる。The lens plate 2 is preferably made of a resin having excellent light transmittance. Examples of such a resin include an epoxy resin, a silicone resin, an acrylic resin, and a polycarbonate.

【００１９】上記基板１としては、通常使用されている
ものが用いられ、例えばアルミニウム、銅、鉄、ステン
レス、ニッケル等の金属板の表面に、エポキシ樹脂、ポ
リエチレン、ポリイミド、ポリエステル等の絶縁材料を
塗布あるいはフィルム接着してなる絶縁金属板や、これ
らの金属板と同程度の強度を有する樹脂板等が挙げられ
る。As the substrate 1, a commonly used substrate is used. For example, an insulating material such as an epoxy resin, polyethylene, polyimide, or polyester is coated on the surface of a metal plate such as aluminum, copper, iron, stainless steel, and nickel. Examples thereof include an insulating metal plate formed by coating or film bonding, and a resin plate having the same strength as these metal plates.

【００２０】上記構成によれば、ＬＥＤ集合体モジュー
ルの発光ダイオードを搭載した基板を覆う小面積の複数
のレンズ板が形成されるとともに、該レンズ板の上記基
板頂部に位置するコーナー部を除く周辺に一体的に形成
される係止部と、該コーナー部の対角方向に位置するコ
ーナー部に一体的に形成される係止部とで、上記発光ダ
イオードを搭載した基板を係合するようにしたので、レ
ンズ板の樹脂収縮が部分的に生じるようになってその応
力が小さくなる。このように、レンズ板に生じる樹脂収
縮による応力が小さくなるので、ＬＥＤ集合体モジュー
ルの反りが大幅に抑制されるようになる。According to the above structure, a plurality of small-area lens plates are formed to cover the substrate on which the light-emitting diodes of the LED assembly module are mounted, and the periphery of the lens plate except for the corner located at the top of the substrate is formed. A locking portion formed integrally with the light emitting diode and a locking portion formed integrally with a corner portion located in a diagonal direction of the corner portion so as to engage the substrate on which the light emitting diode is mounted. Therefore, the resin shrinkage of the lens plate partially occurs, and the stress is reduced. As described above, since the stress due to the resin shrinkage generated in the lens plate is reduced, the warpage of the LED assembly module is significantly suppressed.

【００２１】なお、本考案のＬＥＤ集合体モジュールの
構造は、ＬＥＤ集合体モジュール以外にも、熱膨張の度
合いに差がある複数のシート状材よりなる積層体であれ
ばいかなるものにも適用することができる。The structure of the LED assembly module of the present invention can be applied to any structure other than the LED assembly module as long as it is a laminate composed of a plurality of sheet materials having different degrees of thermal expansion. be able to.

【００２２】[0022]

【考案の効果】以上詳述したように、本考案のＬＥＤ集
合体モジュールの取付構造によれば、発光ダイオードを
搭載した基板をレンズ板成形時に一体的に形成した係止
部に係合させて取着するようにしたので、接着剤が不要
となり、接着剤で貼り合わせる際の気泡の混入の問題
や、光軸合わせ等の組み立て時の手間の問題を無くすこ
とができる。さらに、上記係止部をレンズ板のコーナー
部を除く端部に形成するようにしたので、成形後にレン
ズ板が対角方向へ収縮する力がレンズ板のコーナー部に
おいて解放されるようになるとともに、上記レンズ板を
小面積に分割して基板上に形成するようにしたので、レ
ンズ板の樹脂収縮が部分的に生じるようになってその応
力が小さくなる。この結果ＬＥＤ集合体モジュールの反
りを抑止できるようになる。したがって、本考案によっ
て、基板とレンズ板との取着が容易で、かつレンズ板の
樹脂収縮による基板の反りが少なく信頼性の高いＬＥＤ
集合体モジュールが得られ、特にサイズの大きなモジュ
ールにおける基板とレンズ板との取り付け性を良好とす
ることができる。As described in detail above, according to the mounting structure of the LED assembly module of the present invention, the substrate on which the light emitting diode is mounted is engaged with the locking portion formed integrally when the lens plate is formed. Since the attachment is performed, an adhesive is not required, and the problem of air bubbles mixing when bonding with the adhesive and the trouble of assembling such as optical axis alignment can be eliminated. Further, since the locking portion is formed at the end of the lens plate excluding the corner, the force of the lens plate contracting diagonally after molding is released at the corner of the lens plate. Since the lens plate is divided into small areas and formed on the substrate, resin shrinkage of the lens plate partially occurs, and the stress is reduced. As a result, the warpage of the LED assembly module can be suppressed. Therefore, according to the present invention, it is possible to easily attach the substrate to the lens plate, and to reduce the warpage of the substrate due to the resin shrinkage of the lens plate and to provide a highly reliable LED
As a result, an aggregate module can be obtained, and in particular, a large-sized module can have good attachment between the substrate and the lens plate.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本考案の一実施例を示すＬＥＤ集合体モジュー
ルの構造の模式斜視図である。FIG. 1 is a schematic perspective view of a structure of an LED assembly module according to an embodiment of the present invention.

【図２】図１のＬＥＤ集合体モジュールの模式下面図で
ある。FIG. 2 is a schematic bottom view of the LED assembly module of FIG. 1;

【図３】係止部における基板の係合状態を示す部分拡大
断面図である。FIG. 3 is a partially enlarged cross-sectional view illustrating an engagement state of a board at a locking portion.

【図４】他の係止部における基板の係合状態を示す部分
拡大断面図である。FIG. 4 is a partially enlarged cross-sectional view showing an engagement state of a substrate at another locking portion.

【符号の説明】[Explanation of symbols]

１ ＬＥＤ搭載基板 ２（２ａ，２ｂ，２ｃ，２ｄ） レンズ板 Ｍ ＬＥＤ集合体モジュール DESCRIPTION OF SYMBOLS 1 LED mounting board 2 (2a, 2b, 2c, 2d) Lens plate M LED aggregate module

Claims (2)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項１】 発光ダイオードを搭載した矩形状基板上
に、小面積に分割された複数のレンズ板を設けてなるＬ
ＥＤ集合体モジュールの取付構造であって、上記基板を
覆う複数のレンズ板が形成されるとともに、該レンズ板
の上記基板頂部に位置するコーナー部を除く周辺に一体
に形成される係止部と、該コーナー部の対角方向に位置
するコーナー部に一体に形成される係止部とで、上記発
光ダイオードを搭載した基板とレンズ板とを固定してな
るＬＥＤ集合体モジュールの取付構造。1. An LED comprising a plurality of lens plates divided into small areas on a rectangular substrate on which light emitting diodes are mounted.
A mounting structure for the ED assembly module, wherein a plurality of lens plates covering the substrate are formed, and a locking portion integrally formed around the lens plate except for a corner portion located at the top of the substrate. A mounting structure for an LED assembly module, wherein a substrate on which the light emitting diode is mounted and a lens plate are fixed by a locking portion formed integrally with a corner portion located in a diagonal direction of the corner portion. 【請求項２】 レンズ板のコーナー部を除く周辺に形成
される係止部が爪状係止部であり、コーナー部に形成さ
れる係止部が発光ダイオードを搭載した基板を貫通する
リベット状係止部である請求項１記載のＬＥＤ集合体モ
ジュールの取付構造。2. A locking portion formed around the lens plate except for a corner portion is a claw-shaped locking portion, and the locking portion formed at the corner portion is a rivet shape penetrating a substrate on which a light emitting diode is mounted. The mounting structure for an LED assembly module according to claim 1, which is a locking portion.
JP3578693U 1993-06-29 1993-06-30 LED assembly module mounting structure Expired - Fee Related JP2567329Y2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP3578693U JP2567329Y2 (en) 1993-06-30 1993-06-30 LED assembly module mounting structure
EP94110046A EP0632511A3 (en) 1993-06-29 1994-06-28 A light emitting diode aggregate module and a method for manufacturing a light emitting diode aggregate module.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3578693U JP2567329Y2 (en) 1993-06-30 1993-06-30 LED assembly module mounting structure

Publications (2)

Publication Number Publication Date
JPH077161U JPH077161U (en) 1995-01-31
JP2567329Y2 true JP2567329Y2 (en) 1998-04-02

Family

ID=12451599

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3578693U Expired - Fee Related JP2567329Y2 (en) 1993-06-29 1993-06-30 LED assembly module mounting structure

Country Status (1)

Country Link
JP (1) JP2567329Y2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3659635B2 (en) * 2001-04-10 2005-06-15 株式会社東芝 Optical semiconductor device
JP4631640B2 (en) * 2005-09-27 2011-02-16 住友電気工業株式会社 Optical connecting component manufacturing method and optical connecting component
KR102057754B1 (en) * 2013-03-14 2019-12-19 레야드 옵토일렉트로닉 컴퍼니 리미티드 Led display device
DE102014112540A1 (en) * 2014-09-01 2016-03-03 Osram Opto Semiconductors Gmbh Optoelectronic component

Also Published As

Publication number Publication date
JPH077161U (en) 1995-01-31

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