JPH077132A - Assembling method for mounting microcomponent three-dimensionally - Google Patents

Abstract

PURPOSE:To provide a method for mounting/assembling a pin switch part, comprising a beam lead type pin diode and a microchip type capacitor, as an input signal receptor for a radio frequency spectrum analyzer by taking advantage of high speed switching performance and long service life of the pin switch in ultrahigh frequency band. CONSTITUTION:One beam lead 7 of a beam lead type pin diode is wedge bonded 16 to a microchip capacitor 9 thus constituting a pin switch part 5. The bottom electrode 11 of capacitor is then bonded through a conductive adhesive 12 to the structural base part 15 and grounded. The other beam lead 8 at the pin switch part 5 is placed on the input signal transmission path, i.e., a coupling loop 4, while being superposed on a solder paste ball 13. The solder paste ball 13 is then irradiated with a laser beam 14 and thermally fused thus effecting solder joint.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an assembling method for three-dimensionally mounting a pin switch used as an input signal preselector in the manufacture of a radio frequency spectrum analyzer, which is a technical field of measuring instruments.

[0002]

2. Description of the Related Art Conventionally, a mechanical changeover switch has been used for changing over a frequency band system of a preselector for an input signal of a radio frequency spectrum analyzer (hereinafter referred to as SPA) of this type. Therefore, the switching speed cannot be increased. Since it is mechanical, characteristics deteriorate quickly and its life is short. There were problems such as. [The pre-selector is for switching the frequency band of the input signal between two systems of a base band (for example, 10 kHz to 3.5 GHz) and a high band (for example, 3.5 GHz to 26.5 GHz). ]

Therefore, in order to switch from mechanical (mechanical) to electrical switching, a pin switch composed of a beam lead type pin diode and a microchip type capacitor is applied as an input signal preselector of SPA, and the above-mentioned conventional technique is applied. I tried to solve the problem in.
FIG. 5 shows the concept of the wedge bonding method, and FIG.
Shows a planar mounting using a circuit board. The beam lead type pin diode 6 is adhered to the wiring pattern 19 provided on the substrate 18 by the wedge bonding method using temperature, pressure, ultrasonic waves, etc., and then the circuit board 18 is constituted together with the microchip type capacitor 9. It was mounted on a flat surface by connecting to the transmission path of the input signal or grounding.

However, in the above method, the effect of electrically switching depending on the presence / absence of voltage application is that the speed is increased and the life is semi-permanent because it is a non-contact type, and it has been possible to improve markedly. ,
It is a very small component for high frequency, and the circuit board cannot be made small due to the limitation of the method of assembly work. Therefore, the wiring becomes long as a whole, and the characteristics in the super high frequency band are distorted. In addition, the planar mounting method such as this method has a problem that the number of connection points increases and it is not sufficient to guarantee its reliability and life for a longer period.

[0005]

SUMMARY OF THE INVENTION In the present invention, a pin switch composed of a beam lead type pin diode and a microchip type capacitor having excellent characteristics is used as an ultra high frequency band component without damaging the characteristics. , Practical application as a pre-selector for SPA input signals. As a result, it is possible to provide wide coverage from the base band to a high band in a higher ultra-high frequency band, to increase the switching speed, and to provide an assembly method of a pin switch section that can extend the life of the pin switch section. Has an aim.

[0006]

In order to achieve the above object, the assembling method of the present invention can be mounted in an allowable space space (shown in FIG. 2). Work is easy. We want to avoid that the high-frequency components that we want to apply are not destroyed or are about to be destroyed by the pressure and temperature during assembly. We want to minimize the wiring circuit length so as not to distort the characteristics in the ultra-high frequency band. There were many issues to be solved such as Therefore, the parts themselves constituting the pin switch are directly connected without the wiring circuit board, one of them is adhered to the base part, and the other one is a coupling ring stretched in the air which is a transmission path of an input signal. By placing a solder paste ball on a group and irradiating it with a laser beam, it was possible to carry out solder bonding without applying any mechanical pressure, and three-dimensional mounting was realized.

The above will be specifically described with reference to FIG. First, a coupling group (50um □) 4, which is also a transmission line for a signal input through a semi-rigid cable (for example, outer diameter = 1.0 to 1.2 mmΦ, core diameter = 0.3 mmΦ) 1, is stretched over the air. On the other hand, beam lead pin diode (length = 1.0 mm, width = 80 to 100 um, beam lead thickness = 0.2 to 0.5 um) 6
And microchip type capacitor (0.5 mm □, thickness = 100
um) 9, the capacitor 9 side of the pin switch portion 5 bonded by wedge bonding is grounded and bonded to the base portion 15 of the structure 21 forming the transmission line by the conductive adhesive 12. Then, on Caplin Group 4,
A solder paste ball (30umΦ) 13 is placed by an enlarged monitor or pin vise not shown in the figure, and the other beam lead 8 on the pin diode 6 side is placed on the solder paste ball 13
Place them on top of each other and place carbon dioxide gas (CO
2) Laser beam (80umΦ) 14 etc. is irradiated and heated to melt the solder paste balls 13 for solder joining.

[0008]

The invention based on the idea that a pin switch composed of a beam lead type pin diode and a microchip type capacitor can be applied to the input signal preselector of the SPA has already been made, but for practical use, it is Without spoiling the good characteristics in the super high frequency band we have,
There were many issues that had to be solved in terms of mounting technology, such as how to assemble. So, in the conventional technology,
Although the pin switch part was configured on the circuit board by the method of manufacturing technology of thin film hybrid integrated circuit, it was planarly mounted and part of the circuit structure for the ultra high frequency band. (Shown in FIG. 2), and in order to be applied to the ultra-high frequency band, it is necessary to make the size smaller, and there is a limit including workability to satisfy it.

Therefore, in the present invention, a wiring pattern is provided on the circuit board for the connection between the high frequency components, the connection with the input signal cable, the connection with the coupling group, and the connection for grounding. Focusing on the fact that they are necessary and difficult to make smaller, we decided to eliminate the circuit board and connect the components directly. Moreover, the assembling method by three-dimensional mounting, in which each of the above connection points is directly connected, can be realized in the minimum required space space. At the connection point between the Coupling group (50um □), which is an ultrafine rectangular wire, and the beam lead (0.2 to 0.5um thickness), which is an ultrathin foil plate, a laser beam (80umΦ) is inserted through a solder paste ball (30umΦ). By irradiating it, soldering was possible. FIG. 3 shows the dimensions of each of the components that make up the pin switch, but these are all vulnerable to external pressure and high heat. Therefore, during the work of wedge bonding, U.S.P.
By adding S (Ultra Sonic = ultrasonic wave) together with pressure and temperature, the conditions were set to be as short as possible to prevent deterioration of characteristics. (Refer to Fig. 7) Soldering with a soldering iron is impossible due to the physical constraints (= size) of the tool, but laser beam irradiation can locally heat in a short time, and Since no mechanical external pressure is applied, there is no damage to each component or coupling group due to heating or external pressure.

[0010]

FIG. 1 shows an embodiment according to the present invention. A description will be given with reference to this figure. FIG. 1 is an enlarged view showing a structure of only a portion where a pin switch constituted by a pin diode and a capacitor according to the present invention is mounted as an input signal preselector of SPA.

A semi-rigid cable 1 and a coupling loop 4 serving as a transmission line for an ultra high frequency signal are arranged, and a structure 21 for supporting them is cut as shown in FIG. The coupling group 4 is located at a distance that one beam lead of the pin switch 5 reaches. First, in order to configure the pin switch 5 in advance, one beam lead 7 of the beam lead type pin diode is formed.
And the upper portion of the microchip type capacitor 9 are bonded by wedge bonding. (Refer to FIG. 7) Next, the bottom electrode 11 of the capacitor of the pin switch 5 is bonded to the base portion 15 which is the mounting portion provided by processing the structure body 21 with the conductive adhesive 12, and grounding is performed. Make a connection. Next, the solder paste ball 13 is placed on the coupling group 4 by using a magnifying glass monitor, a pin vise, or the like (not shown). Finally, the other side 8 of the beam lead of the pin switch 5
Was placed on the solder paste ball 13, and the laser beam 14 was irradiated to the portion and heated to melt the solder paste ball 13 to enable soldering. Thus, the assembly by the three-dimensional mounting is completed.

FIG. 2 shows a dimensional range in which a space space for mounting a pin switch as a preselector for an input signal is allowed.

[0013]

EFFECTS OF THE INVENTION According to the present invention, a coupling line which is an ultrafine rectangular wire (50um □) and an ultrathin foil plate (0.2 to 0.5um thickness)
By irradiating the laser beam (80umΦ) with the beam lead of one of the pin switches, which is overlaid with the solder paste ball (30umΦ) in between, soldering was possible. The effects described below were produced. In other words, [A] a wide range from a relatively low frequency band to a super high frequency band (10K) that a pin switch composed of a beam lead type pin diode and a microchip type capacitor has.
Utilizing good switching characteristics in the range of Hz to 3.5 GHz and 3.5 GHz to 26.5 GHz, it was applied as a pre-selector for SPA and could be put into practical use. [B] The characteristic of the pin switch is that it can be electrically switched depending on the presence / absence of voltage application, and since it was obtained stably, the switch life was fast and nearly infinite. [C] By directly bonding the high-frequency components and omitting the circuit board, the number of manufacturing components is reduced, and the space space required for mounting can be reduced accordingly. In addition, wiring circuits such as wiring patterns are short, connection points are halved, workability and reliability are improved, and it is possible to avoid impairing good high-frequency characteristics of a single component. [D] In the wedge bonding method, pressure and temperature (150
℃ ~ 200 ℃) and U. Although S and the like are required, there is a risk that component parts may be destroyed due to variations in work or characteristics may be deteriorated to the point just before breakage. However, in that work, by omitting the circuit board and applying a laser beam, It was possible to prevent the characteristic deterioration by only once.

[Brief description of drawings]

FIG. 1 is an enlarged view of a structure portion in which a pin switch is stereoscopically mounted and assembled as an input signal preselector of SPA of the present invention.

FIG. 2 is a conceptual diagram showing a dimensional range allowed as a space space in which a pin switch as a preselector for an input signal is mounted in the present invention.

FIG. 3 is a view showing dimensions of parts constituting a pin switch part in the present invention.

FIG. 4 is a block diagram of a portion in which the input signal preselector of the SPA of the present invention switches between two systems of baseband and highband.

FIG. 5 is a conceptual diagram showing a method of bonding by wedge bonding using a conventional circuit board.

FIG. 6 is a conceptual diagram showing a situation in which a circuit board according to a conventional technique is used and a pin switch unit is mounted on a plane and is connected to a transmission path of an input signal.

FIG. 7 is a conceptual diagram showing a method of bonding a beam lead pin diode and a microchip capacitor by wedge bonding.

[Explanation of symbols]

 1 semi-rigid cable 2 semi-rigid cable (jacket) 3 semi-rigid cable (core wire) 4 coupling group 5 pin switch section 6 beam lead type pin diode 7, 8 beam lead 9 microchip type capacitor 10 top electrode 11 bottom electrode 12 conductive Adhesive 13 Solder paste ball 14 Laser beam 15 Structure base 16 Wedge bonding 17 Au pattern 18 Circuit board 19 Wiring pattern 20 Wedge 21 Structure (support)

Claims (1)

[Claims] When mounting a micro component, one of the beam leads (7) of the beam lead type pin diode is bonded (16) to the micro chip type component (9) by wedge bonding, and the pin switch portion (5) is formed. ), And the beam lead (8) at the other end of the pin switch part (5)
Place the solder paste ball (13) on the coupling group (4), which is the transmission path of the input signal, overlapping the solder paste ball (13) and irradiate it with a laser beam (14) to heat and melt the solder. An assembling method for three-dimensionally mounting a pin switch part, which is characterized by joining.