JPH0768330B2 - Hybrid IC coating material and hybrid IC externally coated with the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a hybrid IC coating material and a hybrid IC externally coated with the same, and more specifically to a hybrid IC excellent in moisture resistance, thermal shock resistance and edge cover property. And a hybrid IC externally coated with the same.

[Conventional technology]

In recent years, as electronic devices used in consumer equipment and industrial equipment have become smaller and thinner, the hybrid ICs (integrated circuits) used in them have also become smaller, thinner and highly integrated. It tends to be achieved.

In the conventional hybrid IC manufacturing method, after mounting the IC, transistor, capacitor, etc. on the alumina substrate on which the circuit is printed by various methods, the external resin is used to protect from external force and improve moisture resistance. The method of coating is taken.

Powder epoxy resin, liquid phenol resin, liquid epoxy resin, etc. are used as the exterior resin, and the hybrid epoxy is coated by the fluid immersion method for powder epoxy resin and the dipping method for liquid phenol resin and liquid epoxy resin. It is then heat treated and cured.

The powdered epoxy resin has a feature that it can be mass-produced, but has a drawback that it is inferior in moisture resistance (pressure cooker test) which has become more severe recently.

On the other hand, liquid phenolic resin and liquid epoxy resin are
Since it contains an organic solvent, voids are likely to occur after curing, resulting in poor moisture resistance reliability. Therefore, it is impregnated with wax or the like to embed the wax in the voids and impart water repellency to improve the moisture resistance, but there is a drawback that the process becomes complicated. In order to solve this drawback, a method of reducing voids after curing by using a reactive diluent instead of an organic solvent can be considered, but the glass transition temperature becomes low and the humidity resistance (pressure cooker test) is poor. It causes the drawback.

Hybrid IC using liquid resin by dipping method
In order to obtain a hybrid IC with excellent appearance in which the edges of the components mounted on the board and the end faces of the board are well covered with resin, in order to obtain a hybrid IC with good appearance, it exhibits appropriate fluidity during painting and remains as it is after painting. It is necessary to impart appropriate thixotropy to the resin so that the resin can be cured.

[Problems to be Solved by the Invention]

The object of the present invention is to solve the problems of the prior art, to improve workability,
It is an object of the present invention to provide a hybrid IC coating material that is excellent in moisture resistance (particularly pressure / cooker resistance) and thermal shock resistance and that can provide a hybrid IC with a good appearance, and a hybrid IC externally coated with the same.

[Means for Solving the Problems]

The present invention includes (A) an epoxy resin having one or more epoxy groups in a molecule, (B) a phenol novolac resin obtained by using paraalkylphenol as a raw material, (C) a curing accelerator, (D) an organic bentonite, and (E). The present invention relates to a hybrid IC coating material containing styrene and / or a styrene derivative and (F) an inorganic filler, and a hybrid IC externally coated with the coating material.

Examples of the epoxy resin (A) having one or more epoxy groups in the molecule used in the present invention include diglycidyl ether derived from bisphenol A and epichlorohydrin and its derivative, and diglycidyl derived from bisphenol F and epichlorohydrin. Commonly known epi-bis type liquid epoxy resin such as ether and its derivative, diglycidyl ether derived from polyhydric alcohol and epichlorohydrin, glycidyl ester derived from polybasic acid and epichlorohydrin and its derivative, hydrogenated bisphenol A and epichlorohydrin Derived diglycidyl ether and its derivatives, 3,4-epoxy-6-methylcyclohexylmethyl-3,4-epoxy-
6-methylcyclohexanecarboxylate, cyclopentadiene oxide, vinylcyclohexaneoxide, bis (2,3-epoxycyclopentyl) ether,
From cycloaliphatic epoxies such as 3,4-epoxycyclohexylmethyl (3,4-epoxycyclohexane) carboxylate, bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate, and limonenedioxide, and their derivatives, isobutylene Examples thereof include methyl-substituted epoxies that are derived, and the type thereof is not limited.

Phenol novolac resin (B) used in the present invention
Is a phenol novolac resin obtained from a paraalkylphenol such as paratertiary butylphenol, paraoctylphenol, paraisopropylphenol, and paranonylphenol as a raw material.

From the viewpoint of curability of the obtained coating material, the phenol novolac resin (B) is used so that the OH groups of the phenol novolac resin are in the range of 0.9 to 1.1 equivalents relative to the epoxy groups in the epoxy resin. preferable.

Examples of the curing accelerator (C) used in the present invention include imidazole compounds such as 2-ethyl-4-methylimidazole and 1-cyanoethyl-2-ethyl-4-methylimidazole, benzyldimethylamine, 2,4, Examples thereof include tertiary amines such as 6-tris (dimethylaminomethyl) phenol and salts such as 2-methyl-4-methylimidazolium and tetraphenylborate.

From the viewpoint of curability and storage stability, the amount of the curing accelerator (C) used is preferably 0.3 to 25 parts by weight with respect to 100 parts by weight of the phenol novolac resin (B).

As the organic bentonite (D) used in the present invention,
Benton SD-1, Benton S from NL Chemicals Inc.
D-2, Benton 27 and the like are used, and the amounts thereof used are components (A), (B), (C), (D) and (F) from the viewpoint of the balance between edge cover properties and thixotropic stability. The amount is preferably 0.05 to 1.5% by volume, and more preferably 0.07 to 0.7% by volume.

Examples of the styrene derivative of the styrene and / or the styrene derivative (E) used in the present invention include vinyltoluene, divinylbenzene, and tert-butylstyrene.

From the viewpoint of workability, the amount of the styrene and / or styrene derivative (E) used is the components (A), (B), (C),
It is preferably 20 to 40% by volume with respect to the total amount of (D), (E) and (F).

Examples of the inorganic filler (F) used in the present invention include crystalline silica, fused silica, alumina, hydrated alumina,
Calcium carbonate and the like can be mentioned. The amount of the components used is components (A), (B), from the viewpoint of the balance of thermal shock resistance.
It is preferably 70% by volume or more, more preferably 73 to 80% by volume, based on the total amount of (C), (D) and (F).

A coupling agent, a coloring agent, a defoaming agent, etc. can be added to the coating material for hybrid IC of the present invention, if necessary.

As a method for coating the exterior of the hybrid IC, a usual method, for example, a dipping method, a botting method, a dropping method, a roller method or the like can be mentioned.

〔Example〕

Hereinafter, the present invention will be described with reference to examples. In the examples, "parts" means "parts by weight".

Example 1 Epoxy resin (trade name Ep-828 manufactured by Yuka Shell Co., Ltd.) 100 parts Phenol novolac resin (PR-1140 manufactured by Hitachi Chemical Co., Ltd., phenol novolac resin using paratertiary butylphenol as a raw material) 95 parts and styrene 320 parts (28% by volume with respect to components (A), (B), (C), (D), (E) and (F)) were dissolved in a glass flask at 100 ° C for 4 hours, and the mixture was allowed to stand at room temperature. After returning, further, organic bentonite (Benton SD-1) 5 parts (0.38% by volume relative to components (A), (B), (C), (D) and (F)) Inorganic filler (electrochemical Kogyo Co., Ltd. trade name F-160, fused silica) 1560 parts and 2-phenyl-4-methyl-5-hydroxymethylimidazole 1 part were added and uniformly dispersed to obtain a resin composition.

Using the obtained resin composition, a dip method was used to coat a hybrid IC having a comb pattern with a printing resistor and a silver-palladium electrode gap of 0.3 mm, and then 120
It was heat-cured at 30 ° C. for 30 minutes and then at 150 ° C. for 2 hours. The following properties of the obtained cured product were evaluated. The results are shown in Table 1.

(1) Moisture resistance test (pressure cooker test) 121
The hybrid IC after exterior coating is exposed to water vapor at ℃, 2 atmospheres and 100% RH, and the change in the insulation resistance of the comb pattern is measured every time shown in Table 1, and the resistance value becomes 10 ¹² Ω or less. The number of occurrences of defects at each time was examined by using the products as defective products. This test was performed with 20 samples.

(2) Thermal shock resistance After coating the hybrid IC for 30 minutes at -40 ° C, then 12
A thermal shock was applied at 5 ° C for 30 minutes as one cycle, and the change in printing resistance was measured every 25 cycles, and the one that changed more than 1.5% of the initial value was defined as a defective product, and the number of defective products in each cycle was calculated. Examined. This test was conducted with 20 samples as described above.

(3) Appearance test The board edge portion of the hybrid IC after exterior coating was visually observed, and the case where the board edge portion was hidden was judged to be good, and the case where the board edge portion was visible was judged to be bad. The exterior coating was performed using the resin composition immediately after preparation or using the resin composition which was left at 25 ° C. for 1 month to be uniformly redispersed.

Example 2 A resin composition was prepared in the same manner as in Example 1 except that vinyltoluene was used instead of styrene, and the hybrid IC was externally coated in the same manner as in Example 1 using the resin composition. The same evaluation as in Example 1 was performed. The result is first
Shown in the table.

Comparative Example 1 A resin composition was prepared in the same manner as in Example 2 except that the organic bentonite was not used, and this was used to coat the hybrid IC in the same manner as in Example 1, The same evaluation as in 1 was performed. The results are shown in Table 1.

Comparative Example 2 A resin composition was prepared in the same manner as in Example 1 except that 5 parts of organic bentonite was removed and 200 parts of toluene and 70 parts of methanol were used instead of 320 parts of vinyltoluene. As a curing condition, a further 60
The hybrid IC was externally coated in the same manner as in Example 1 except that 1 hour was added at ° C, and the same evaluation as in Example 1 was performed. The results are shown in Table 1.

Comparative Example 3 The hybrid IC obtained in Comparative Example 2 with outer coating was impregnated with wax, and then the same evaluation as in Example 1 was performed. The results are shown in Table 1.

Comparative Example 4 A resin composition was prepared in the same manner as in Comparative Example 1 except that Cardular E10 (epoxy resin manufactured by Yuka Shell Epoxy Co., Ltd.) was used in place of vinyltoluene.
The hybrid IC was externally coated in the same manner as in Example 1, and the same evaluation as in Example 1 was performed. The results are shown in Table 1.

Comparative Example 5 A resin composition was prepared in the same manner as in Example 2 except that Erosier (trade name SIG-200 manufactured by Nippon Aerosil Co., Ltd.) was used instead of the organic bentonite, and the procedure was the same as in Example 1. Example 1 by coating the hybrid IC with the exterior
The same evaluation as was done. The results are shown in Table 1.

It can be seen from Table 1 that the hybrid IC coated with the resin composition of the example has superior moisture resistance and thermal shock resistance and excellent appearance as compared with the hybrid IC coated with the resin composition of the comparative example. Is shown.

〔The invention's effect〕

According to the coating material for a hybrid IC of the present invention, the coefficient of linear expansion is adjusted to be equivalent to that of the substrate, so that excellent moisture resistance, thermal shock resistance, and edge cover property (appearance) can be obtained by one exterior coating.
Can be added to a hybrid IC. Further, since the work process can be simplified, the reliability of the hybrid IC can be improved and the cost can be reduced.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Internal reference number FI Technical indication location H01L 23/31 (72) Inventor Satoshi Shiga 4-13-1 Higashimachi, Hitachi City, Ibaraki Prefecture Hitachi Chemical Industrial Co., Ltd. Yamazaki Factory (56) Reference JP-A-2-289615 (JP, A) JP-A-63-186724 (JP, A) JP-A-60-115622 (JP, A) JP-A-56-160056 (JP, A)

Claims (4)

[Claims] 1. An epoxy resin having (A) one or more epoxy groups in the molecule, (B) a phenol novolac resin obtained from paraalkylphenol as a raw material, (C) a curing accelerator, (D) an organic bentonite, ( A coating material for hybrid IC, comprising E) styrene and / or styrene derivative and (F) inorganic filler. 2. The amount of the inorganic filler (F) used is such that the component (A) epoxy resin, (B) phenol novolac resin, (C) curing accelerator, (D) organic bentonite and (F) inorganic filler are used. The coating material for hybrid IC according to claim 1, which is 70% by volume or more based on the total amount of 3. The use ratio of the organic bentonite (F) is such that the component (A) epoxy resin, (B) phenol novolac resin, (C) curing accelerator, (D) organic bentonite and (F) inorganic filler are used. The coating material for hybrid IC according to claim 1, which is in a range of 0.05 to 1.5% by volume with respect to the total amount. 4. A hybrid IC coated with the hybrid IC coating material according to claim 1 as an exterior coating.