JPH04339819A - Hybrid ic coating material and hybrid ic coated therewith - Google Patents

Abstract

PURPOSE:To obtain the title material excellent in driability after application, can give a hybrid IC excellent in humidity and thermal shock resistances even when applied once. CONSTITUTION:A hybrid IC coating material comprising an epoxy resin, a phenol novolac resin made from a p-alkylphenol a cure accelerator, styrene and/or its derivative, an aromatic alkyl organic solvent, an organic ketonic solvent, an organic alcoholic solvent and an inorganic filler, and a hybrid IC coated therewith.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a covering material for a hybrid IC, and more particularly to a covering material for a hybrid IC having excellent moisture resistance and thermal shock resistance, and a hybrid IC coated with the covering material.

0002

[Background Art] In recent years, as electronic devices used in consumer and industrial equipment have become smaller and thinner, the hybrid ICs (integrated circuits) used in these devices have also become smaller and thinner. There is also a trend toward higher integration.

In the conventional method of manufacturing hybrid ICs, after mounting ICs, transistors, capacitors, etc. on an alumina substrate on which circuits are printed using various methods, an exterior packaging is applied to protect them from external forces and improve moisture resistance. A method of coating with a commercially available resin is used.

[0004] Exterior resins include powder epoxy resins,
Liquid phenolic resins, liquid epoxy resins, etc. are used. Powder epoxy resins are coated with a fluidized dipping method, and liquid phenol resins and liquid epoxy resins are coated with a hybrid IC using a dipping method, followed by heat treatment and curing. .

[0005] Powder epoxy resins have the advantage of being mass-producible, but have the disadvantage of poor moisture resistance, which has become increasingly severe in recent years. On the other hand, since liquid phenol resins and liquid epoxy resins contain organic solvents, they tend to produce voids after curing and have poor moisture resistance reliability. For this reason, efforts have been made to improve moisture resistance by impregnating wax or the like to fill the voids with wax and impart water repellency, but this method has the disadvantage of complicating the process.

[0006] Therefore, a method of reducing voids after curing by using a reactive diluent instead of an organic solvent has been considered, but this method has the drawbacks of a low glass transition temperature and poor moisture resistance. Because fluidity is maintained, liquid drips are likely to occur, and there are disadvantages such as liquid clumps.

[0007]

OBJECTS OF THE INVENTION The object of the present invention is to solve the above-mentioned problems of the prior art, and to achieve moisture resistance and
In particular, it is an object of the present invention to provide a covering material for a hybrid IC that can improve boiling resistance and thermal shock resistance, and a hybrid IC coated with the covering material.

[0008]

[Means for Solving the Problems] The present invention provides (1) an epoxy resin, (2) a phenol novolac resin obtained using para-alkylphenol as a raw material, (3) a curing accelerator,
(4) Styrene and/or styrene derivatives, (5)
aromatic alkyl organic solvent, (6) ketone organic solvent,
The present invention relates to a hybrid IC coating material containing (7) an alcoholic organic solvent and (8) an inorganic filler, and a hybrid IC coated with the hybrid IC coating material.

Epoxy resins (1) used in the present invention include diglycidyl ethers derived from bisphenol A and epichlorohydrin and derivatives thereof, diglycidyl ethers derived from bisphenol F and epichlorohydrin, and derivatives thereof, commonly known as EP-bis. liquid epoxy resins, diglycidyl ethers derived from polyhydric alcohols and epichlorohydrin, glycidyl esters and derivatives thereof derived from polybasic acids and epichlorohydrin, diglycidyl ethers and derivatives thereof derived from hydrogenated bisphenol A and epichlorohydrin, 3,4-Epoxy-6-methylcyclohexylmethyl-3,4-epoxy-6-methylcyclohexanecarboxylate, cyclopentadiene oxide, vinylcyclohexene oxide, bis(2,3-epoxycyclopentyl)ether, 3,4-epoxycyclohexyl Alicyclic epoxy and derivatives thereof such as methyl (3,4-epoxycyclohexane) carboxylate, bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate, limonene dioxide, and methyl substituted type derived from isobutylene Examples include epoxy and the like, and there are no restrictions on the type.

The phenol novolak resin (2) used in the present invention includes paratertiary butylphenol, paraoctylphenol, paraisopropylphenol,
It is a phenolic novolak resin obtained from para-alkylphenol such as para-nonylphenol. From the viewpoint of curability of the resulting coating material, this phenol novolac resin has an OH group of 0.9 to 1% relative to the epoxy group of the epoxy resin (1).
．． A range of 1 equivalent is preferable.

[0011] Examples of the curing accelerator (3) used in the present invention include 2-ethyl-4-methylimidazole,
Imidazole compounds such as 1-cyanoethyl-2-ethyl-4-methylimidazole, benzyldimethylamine,
Examples include tertiary amines such as 2,4,6-tris(dimethylaminomethyl)phenol, and salts such as 2-methyl-4-methylimidazolium and tetraphenylborate. The blending ratio of the curing accelerator is preferably 0.3 to 25 parts by weight based on 100 parts by weight of the phenol novolak resin from the viewpoint of curability and storage stability.

Styrene derivatives of styrene and/or styrene derivative (4) used in the present invention include vinyltoluene, divinylbenzene, tert-butylstyrene, etc.
) include toluene, xylene, etc.
Examples of the ketone organic solvent (6) include acetone and methyl ethyl ketone, and examples of the alcohol organic solvent (7) include methyl alcohol and ethyl alcohol.

From the viewpoint of workability and moisture resistance, the blending ratio of these components (4) to (7) is such that styrene and/or styrene derivative (4), aromatic alkyl organic solvent (
5), 40 to 70% by volume of styrene and/or styrene derivative (4) based on the total volume of ketone organic solvent (7) and alcohol organic solvent (7), and aromatic alkyl organic solvent (5). 5-30% by volume, 5-50% by volume of ketone organic solvent (6), alcohol-based organic solvent (7)
) is preferably 5 to 30% by volume. In addition, the total volume of the above components (4) to (7) is 20 to 40% of the total volume of the epoxy resin (1), phenol novolac resin (2), curing accelerator (3), and inorganic filler (8). volume%
It is preferable that

Examples of the inorganic filler (8) used in the present invention include crystalline silica, fused silica, alumina,
Hydrated alumina, calcium carbonate, etc. are included, and the amount added is determined from the viewpoint of the balance of thermal shock resistance and moisture resistance reliability, epoxy resin (1), phenol novolac resin (
2), the curing accelerator (3) and the inorganic filler (8) preferably account for 70 to 85% by volume of the total volume.

[0015] A coupling agent, a coloring agent, an antifoaming agent, etc. can be added to the coating material of the hybrid IC of the present invention, if necessary.

[0016] As an exterior coating method for hybrid IC,
The outer coating of the hybrid IC is carried out by a conventional method, such as a dipping method, a potting method, a drop method, or a roller method.

[0017]

[Examples] The present invention will be explained below with reference to Examples. In addition, in the examples, parts mean parts by weight. Example 1 Epoxy resin (product name manufactured by Yuka Shell Co., Ltd., Ep-828)
100 parts, phenol novolac resin (manufactured by Hitachi Chemical Co., Ltd., trade name, PR-1140, phenol novolac resin made from para-tertiary butylphenol)
95 parts of vinyl toluene and 160 parts of vinyl toluene were dissolved in a glass flask at 100°C for 4 hours, and after returning to room temperature, an inorganic filler (trade name, manufactured by Denki Kagaku Kogyo Co., Ltd., F-16) was dissolved.
0.0, fused silica), 0.5 parts of dimethylbenzylamine, 96 parts of acetone, 32 parts of toluene, and 32 parts of methanol were added and uniformly dispersed to obtain a composition.

Using the obtained resin composition, printing resistance and silver-palladium electrode spacing of 0.3
After the hybrid IC equipped with a comb-shaped pattern of mm was coated, it was air-dried for 1 hour, heated at 40° C. for 1 hour, 80° C. for 30 minutes, and then heated and cured at 150° C. for 2 hours. The obtained cured product was evaluated for the following properties, and the results are shown in Table 1.
It was shown to.

(1) Moisture resistance test (boiling test) The hybrid IC after outer covering was placed in boiling water at 100°C and left to stand.
After 30 minutes, take it out and D. C. After applying 12V for 1 hour, it was dried at 120℃ for 30 minutes, and if the insulation resistance value of the comb pattern was 108 Ω or less, it was considered a defective product.
The number of defects was investigated. This test was conducted using 20 samples.

(2) Thermal shock resistance The hybrid IC after being coated was subjected to a cycle of thermal shock at -40°C for 30 minutes and then at 125°C for 30 minutes, and changes in printing resistance were measured every 25 cycles. However, those that changed by 1.5% or more from the initial value were treated as defective items, and the number of defects generated in each cycle was investigated. This test was conducted using 20 samples in the same manner as above.

(3) Workability (Measurement of time required for fluidity to disappear after application) After coating a hybrid IC using the dip method, air drying is performed to determine the moment when the fluidity of the surface liquid disappears, and the surface gloss of the coating material disappears. The time for which the surface gloss disappeared was determined to be 2 minutes or less.

Example 2 A resin composition was prepared in the same manner as in Example 1, except that 192 parts of styrene was used instead of 160 parts of vinyltoluene, and the amounts of toluene and methanol used were 16 parts each. The same evaluation as in Example 1 was performed, and the results are shown in Table 1.

Comparative Example 1 Epoxy resin (trade name, Ep-828, manufactured by Yuka Shell Co., Ltd.)
100 parts of phenol novolak resin (trade name, PR-1140, manufactured by Hitachi Chemical Co., Ltd.), 95 parts of toluene, and 70 parts of methanol in a glass flask.
After melting at ℃ for 4 hours and returning to room temperature, 50 parts of acetone and an inorganic filler (trade name, manufactured by Denki Kagaku Kogyo Co., Ltd., F-
160) 1560 parts and 0.1 parts of dimethylbenzylamine.
5 parts were added and uniformly dispersed to obtain a composition. A hybrid IC was externally coated using this composition in the same manner as in Example 1, and the characteristics of the obtained cured product were evaluated in the same manner as in Example 1. The results are shown in Table 1.

Comparative Example 2 The hybrid IC coated in Comparative Example 1 was further impregnated with wax and evaluated in the same manner as in Example 1. The results are shown in Table 1.

Comparative Example 3 Epoxy resin (trade name, Ep-828, manufactured by Yuka Shell Co., Ltd.)
100 parts of phenol novolac resin (trade name, PR-1140, manufactured by Hitachi Chemical Co., Ltd.) and 320 parts of vinyl toluene were dissolved in a glass flask at 100°C for 4 hours, and after returning to room temperature, an inorganic filler was added. (trade name, manufactured by Denki Kagaku Kogyo Co., Ltd., F-160) 1560 parts and 0.5 part of dimethylbenzylamine were added and uniformly dispersed to obtain a composition. A hybrid IC was externally coated using this composition in the same manner as in Example 1, and the characteristics of the obtained cured product were evaluated in the same manner as in Example 1. The results are shown in Table 1.

[0026]

[Table 1]

Table 1 shows that the hybrid ICs coated with the compositions of the examples have excellent thermal shock resistance, moisture resistance, and workability compared to the comparative examples.

[0028]

[Effects of the Invention] According to the hybrid IC coating material of the present invention, a linear expansion coefficient equivalent to that of the substrate can be obtained, and a hybrid IC with excellent moisture resistance and thermal shock resistance can be obtained with a single exterior coating.
It is possible to manufacture C and has excellent drying properties after coating, making the work process simple and highly reliable.
can be obtained at low cost.

Claims (3)

[Claims] Claim 1: (1) epoxy resin, (2) phenol novolak resin obtained from para-alkylphenol, (3) curing accelerator, (4) styrene and/or
or a styrene derivative, (5) an aromatic alkyl organic solvent, (6) a ketone organic solvent, (7) an alcohol organic solvent, and (8) an inorganic filler. 2. The blending ratio of the inorganic filler is 70 to 85% by volume based on the total volume of the epoxy resin (1), the phenol novolac resin (2), the curing accelerator (3), and the inorganic filler (8). Hybrid I according to claim 1
Coating material for C. 3. A hybrid IC coated with the hybrid IC coating material according to claim 1.