JPH04337367A - Powder coating composition - Google Patents
Powder coating compositionInfo
- Publication number
- JPH04337367A JPH04337367A JP13867691A JP13867691A JPH04337367A JP H04337367 A JPH04337367 A JP H04337367A JP 13867691 A JP13867691 A JP 13867691A JP 13867691 A JP13867691 A JP 13867691A JP H04337367 A JPH04337367 A JP H04337367A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- powder coating
- coating composition
- present
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 title claims abstract description 31
- 239000008199 coating composition Substances 0.000 title claims abstract description 20
- 239000003822 epoxy resin Substances 0.000 claims abstract description 32
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 32
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- 239000000945 filler Substances 0.000 claims abstract description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 18
- 229920003986 novolac Polymers 0.000 claims description 17
- 238000000576 coating method Methods 0.000 abstract description 14
- 239000011248 coating agent Substances 0.000 abstract description 7
- 239000000203 mixture Substances 0.000 abstract description 6
- 239000005011 phenolic resin Substances 0.000 abstract description 3
- 230000035939 shock Effects 0.000 description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000007598 dipping method Methods 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 150000002431 hydrogen Chemical class 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical class C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、エポキシ系粉体塗料に
関し、更に詳しくは耐湿性及び耐熱衝撃性に優れた電子
部品被覆用エポキシ樹脂粉体塗料組成物に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy powder coating, and more particularly to an epoxy resin powder coating composition for coating electronic parts that has excellent moisture resistance and thermal shock resistance.
【０００２】0002
【従来の技術】粉体塗料は無公害、省資源、省エネルギ
ー型塗料として従来の溶剤型塗料に置き変わりつつある
。この内、エポキシ樹脂を用いた粉体塗料は、絶縁用と
して種々の電気用途に用いられている。例えば、電気電
子部品の絶縁、モーターの絶縁、あるいは電線、電気製
品のカバー等に広く実用化されている。近年、民生機器
や産業用機器に使用される電子機器が小型化及び薄型化
へ移るにつれて、これに使用されるハイブリッドＩＣに
代表される電子部品も又同様に小型化、薄型化及び高集
積化が図られる傾向にある。従来のハイブリッドＩＣの
製造法に於いては、回路が印刷されたセラミックあるい
はアルミナ基板上にＩＣ、トランジスタ、コンデンサー
等を種々の方法で搭載した後、外力からの保護と耐湿信
頼性を向上する為に外装用樹脂で被覆する方法が取られ
ている。BACKGROUND OF THE INVENTION Powder coatings are replacing conventional solvent-based coatings as pollution-free, resource-saving, and energy-saving coatings. Among these, powder coatings using epoxy resins are used for various electrical purposes as insulation. For example, it is widely put into practical use for insulation of electrical and electronic parts, insulation of motors, and covers for electric wires and electrical products. In recent years, as electronic devices used in consumer and industrial equipment have become smaller and thinner, the electronic components used in these devices, such as hybrid ICs, have also become smaller, thinner, and more highly integrated. There is a tendency for this to be achieved. In conventional hybrid IC manufacturing methods, ICs, transistors, capacitors, etc. are mounted on ceramic or alumina substrates with printed circuits using various methods, and then the ICs are mounted on ceramic or alumina substrates on which circuits are printed, in order to improve protection from external forces and moisture resistance. A method of covering the exterior with resin is used.
【０００３】該外装用樹脂としては、液状エポキシ樹脂
、液状フェノール樹脂、粉体エポキシ樹脂などが使用さ
れており、前２者ではディッピング法により、後者では
流動浸漬法によりハイブリッドＩＣを被覆した後に加熱
処理が行われ、硬化される。液状エポキシ樹脂、液状フ
ェノール樹脂は耐湿信頼性には良好な結果を示すが、通
常多量の無機充填剤の添加を必要とするため、作業時に
それらの無機充填剤が沈降し易く、しかも膜厚が５００
ー１０００μと厚くなり、ハイブリッドＩＣの薄型化が
できにくく、又耐熱衝撃性に劣るという欠点を有する。
一方、粉体エポキシ樹脂は、大量生産が出来るという特
徴を有しているが、最近一段と厳しくなっている耐湿信
頼性に劣るという欠点がある。Liquid epoxy resin, liquid phenol resin, powder epoxy resin, etc. are used as the exterior resin, and the former two are coated with a hybrid IC by a dipping method, and the latter are coated with a hybrid IC by a fluid dipping method and then heated. It is treated and cured. Liquid epoxy resins and liquid phenolic resins show good results in terms of moisture resistance reliability, but because they usually require the addition of large amounts of inorganic fillers, these inorganic fillers tend to settle during work, and the film thickness is low. 500
-1000μ, making it difficult to make hybrid ICs thinner and having poor thermal shock resistance. On the other hand, powdered epoxy resins have the feature that they can be mass-produced, but have the disadvantage of poor moisture resistance reliability, which has become increasingly severe in recent years.
【０００４】0004
【本発明が解決しようとする課題】本発明の目的は、前
記のハイブリッドＩＣで代表される電子部品用粉体塗料
の欠点を改良し、小型化及び薄膜化を図り、且つ耐湿信
頼性、耐熱衝撃性にも優れた電子部品用粉体塗料を提供
することにある。[Problems to be Solved by the Invention] The purpose of the present invention is to improve the drawbacks of powder coatings for electronic components, typified by the above-mentioned hybrid ICs, to achieve miniaturization and thinner coatings, and to improve moisture resistance, reliability, and heat resistance. An object of the present invention is to provide a powder coating for electronic parts that also has excellent impact resistance.
【０００５】[0005]
【課題を解決するための手段】本発明者らは前記した様
な問題点を解決すべく鋭意研究の結果、耐湿信頼性及び
耐熱衝撃性に優れるエポキシ樹脂粉体塗料組成物を得る
に到った。即ち、本発明は必須成分としてエポキシ樹脂
及び硬化剤、又任意成分として充填剤等を含有するエポ
キシ系粉体塗料において、硬化剤として軟化点が７５℃
以下であるフェノールノボラック樹脂を含有することを
特徴とするエポキシ樹脂系粉体塗料組成物を提供するも
のである。[Means for Solving the Problems] As a result of intensive research to solve the above-mentioned problems, the present inventors have succeeded in obtaining an epoxy resin powder coating composition that has excellent moisture resistance and thermal shock resistance. Ta. That is, the present invention provides an epoxy powder coating containing an epoxy resin and a curing agent as essential components, and a filler, etc. as an optional component.
The present invention provides an epoxy resin powder coating composition containing the following phenol novolak resin.
【０００６】本発明の粉体塗料組成物に含有されるフェ
ノールノボラック樹脂の軟化点は７５℃以下好ましくは
５０℃以下の物性を有するものである。フェノールノボ
ラック樹脂は従来ＩＣチップの封止用エポキシ樹脂の硬
化剤等に利用され公知であるが、それらに使用される通
常のフェノールノボラック樹脂は軟化点８０ー１００℃
の物性を有するもので、その硬化物は硬くて脆い性質を
有しており、外装用に用いた場合、その塗膜は熱衝撃に
よりクラックを生じ易く使用に耐えないものである。そ
こで本発明者等は、外装用に使用が可能な硬化剤として
のフェノールノボラック樹脂について種々検討した結果
、軟化点が７５℃以下好ましくは５０℃以下のフェノー
ルノボラック樹脂を硬化剤として用いると耐湿信頼性に
優れ、熱衝撃によりクラック等の発生のないエポキシ樹
脂粉体塗料組成物が得られることを見いだしたものであ
る。The phenol novolak resin contained in the powder coating composition of the present invention has physical properties of a softening point of 75°C or lower, preferably 50°C or lower. Phenol novolac resin is conventionally known as being used as a curing agent for epoxy resin for sealing IC chips, but the normal phenol novolac resin used for these has a softening point of 80-100°C.
The cured product is hard and brittle, and when used for exterior applications, the coating film tends to crack due to thermal shock and cannot withstand use. As a result of various studies on phenol novolac resins as curing agents that can be used for exterior applications, the present inventors found that using phenol novolak resins with a softening point of 75°C or lower, preferably 50°C or lower, as a curing agent would provide reliable moisture resistance. It has been discovered that an epoxy resin powder coating composition with excellent properties and no cracks or the like due to thermal shock can be obtained.
【０００７】本発明の粉体塗料組成物を調製するに当た
り使用されるフェノールノボラック樹脂は例えば、以下
のようにして得ることが出来る。即ち、蓚酸等の酸触媒
の存在下過剰のフェノールとホルマリンを反応させた後
、未反応のフェノールを回収することにより得られ、下
記式に於いてｎ＝１及び２で示される成分が好ましくは
３５ー８０％含有されるフェノールノボラック樹脂であ
る。通常使用されているフェノールノボラック樹脂はｎ
＝１及び２で示される成分はせいぜい２５％以下である
。The phenol novolak resin used in preparing the powder coating composition of the present invention can be obtained, for example, as follows. That is, it is obtained by reacting excess phenol with formalin in the presence of an acid catalyst such as oxalic acid, and then recovering unreacted phenol, and the components represented by n=1 and 2 in the following formula are preferably It is a phenolic novolac resin containing 35-80%. The commonly used phenolic novolak resin is n
The components represented by =1 and 2 are at most 25% or less.
【０００８】[0008]
【式１】[Formula 1]
【０００９】（式（１）中Ｒは水素、低級アルキル、低
級アルコキシ、又はハロゲンを示し、ｍが２又は３の時
Ｒは異なった種類であっても良い。ｎは正の整数。）(R in formula (1) represents hydrogen, lower alkyl, lower alkoxy, or halogen, and when m is 2 or 3, R may be of a different type. n is a positive integer.)
【
００１０】本発明で硬化剤として用いられる前記フェノ
ールノボラック樹脂の配合量は通常エポキシ樹脂のエポ
キシ基に対するフェノール性水酸基の当量比に於て０．
５−１．５であり、好ましくは０．８−１．１である。
硬化物としての混合物が０．５より小さいと耐湿性に劣
り、１．５より大きいと耐熱衝撃性が劣る傾向に有る。
本発明のエエポキシ系粉体塗料組成物におけるエポキシ
樹脂としてはビスフェノールＡ型エポキシ樹脂、臭素化
ビスフェノールＡ型エポキシ樹脂、フェノールノボラッ
ク型エポキシ樹脂、臭素化フェノールノボラック型エポ
キシ樹脂、クレゾールノボラック型エポキシ樹脂、脂環
式エポキシ樹脂等公知のエポキシ樹脂が用いられる。[
The amount of the phenolic novolac resin used as a curing agent in the present invention is usually 0.000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000003030303030323010 2010,00000,000000000000000000000000000000000000000000000000000000000000000000000000.
5-1.5, preferably 0.8-1.1. If the mixture as a cured product is smaller than 0.5, the moisture resistance tends to be poor, and if it is larger than 1.5, the thermal shock resistance tends to be poor. Examples of the epoxy resin in the epoxy powder coating composition of the present invention include bisphenol A epoxy resin, brominated bisphenol A epoxy resin, phenol novolac epoxy resin, brominated phenol novolac epoxy resin, cresol novolak epoxy resin, Known epoxy resins such as cyclic epoxy resins are used.
【００１１】本発明で使用する上記硬化剤は硬化速度が
遅い為、それを改良するために硬化促進剤を用いること
が望ましい。本発明に用いられうる硬化促進剤としては
、第３級アミン類、イミダゾール類、テトラ置換ボレー
ト類、トリフェニルフォスフィン類、環状脂肪族アミン
類等公知の硬化促進剤が挙げられるが、これに限定され
るものではない。硬化促進剤の配合割合は、硬化性及び
安定性のバランスからエポキシ樹脂に対して０．１−２
５重量％であり、好ましくは０．３−２０重量％が望ま
しい。Since the curing agent used in the present invention has a slow curing speed, it is desirable to use a curing accelerator to improve the curing speed. Examples of the curing accelerator that can be used in the present invention include known curing accelerators such as tertiary amines, imidazoles, tetra-substituted borates, triphenylphosphine, and cycloaliphatic amines. It is not limited. The blending ratio of the curing accelerator is 0.1-2 to epoxy resin from the balance of curability and stability.
5% by weight, preferably 0.3-20% by weight.
【００１２】本発明のエポキシ系粉体塗料組成物に任意
成分として添加される充填剤の例としては炭酸カルシウ
ム、シリカ、アルミナ、水酸化アルミニウム、マイカ、
珪酸カルシウム、クレー、タルク、硝子繊維粉末等の無
機系充填剤、及び、ポリエチレンパウダー、ポリアミド
パウダー等の有機系充填剤が挙げられる。これらはエポ
キシ樹脂にたいして０乃至７０％、好ましくは５乃至６
０％添加される。更に本発明の粉体塗料組成物には目的
に応じて、着色剤、カップリング剤、レベリング剤、消
泡剤、難燃剤等を添加することが出来る。Examples of fillers that can be optionally added to the epoxy powder coating composition of the present invention include calcium carbonate, silica, alumina, aluminum hydroxide, mica,
Examples include inorganic fillers such as calcium silicate, clay, talc, and glass fiber powder, and organic fillers such as polyethylene powder and polyamide powder. These amounts are 0 to 70%, preferably 5 to 6%, based on the epoxy resin.
0% added. Furthermore, a coloring agent, a coupling agent, a leveling agent, an antifoaming agent, a flame retardant, etc. can be added to the powder coating composition of the present invention depending on the purpose.
【００１３】本発明のエポキシ樹脂系粉体塗料組成物を
調製するには、通常の方法を用いれば良く、例えば、前
記した各配合成分をヘンシェルミキサー等により乾式混
合した後、ニーダー等による溶融混合処理を施すか、エ
クストルーダーによる溶融混合処理を施した後、混合物
を冷却固化し、微粉砕した後分級すれば良い。本発明の
エポキシ系粉体塗料組成物は耐湿信頼性、耐熱衝撃性等
の要求される電気・電子部品関係（例えばハイブッリド
ＩＣ，フィルムコンデンサ−、セラミックコンデンサ−
、モ−タ−の絶縁材用等）に使用される。[0013] To prepare the epoxy resin powder coating composition of the present invention, a conventional method may be used. For example, the above-mentioned ingredients are dry mixed using a Henschel mixer or the like, and then melt-mixed using a kneader or the like. After processing or melt-mixing using an extruder, the mixture may be cooled and solidified, pulverized, and then classified. The epoxy powder coating composition of the present invention is suitable for electrical and electronic components (e.g., hybrid ICs, film capacitors, ceramic capacitors) that require moisture resistance, reliability, thermal shock resistance, etc.
, motor insulation, etc.).
【００１４】本発明のエポキシ系粉体塗料組成物はそれ
自体公知の流動浸漬法、静電流動槽法、静電スプレイ法
、溶射法、霧箱法等の塗装方法により前記電気・電子部
品関係他に塗装される。塗装条件は通常８０乃至１７０
℃である。The epoxy powder coating composition of the present invention can be applied to the electrical/electronic components by a coating method known per se such as a fluidized dipping method, an electrostatic fluid bath method, an electrostatic spray method, a thermal spray method, or a cloud chamber method. Painted elsewhere. Painting conditions are usually 80 to 170
It is ℃.
【００１５】[0015]
【実施例】次に本発明を実施例により更に具体的に説明
するが、本発明はこれらの例に限定されるものではない
。実施例及び比較例表１に示す成分組成（重量比、部）
の混合物を２軸ニ−ダ−溶融混合し、得られた混合物を
冷却、固化した後、１００メッシュ篩いを通してそれぞ
れ本発明のエポキシ系粉体塗料組成物を得た。次いでそ
れらのエポキシ樹脂粉体塗料組成物を用いて、１５０℃
に予熱したハイブリッドＩＣを流動浸漬法により塗装し
、１５０°Ｃで硬化せしめて、その物性評価を行った。
結果を表２および表３に示す。尚、表１に示した配合成
分は次のとうりの製品等を使用した。EXAMPLES Next, the present invention will be explained in more detail with reference to Examples, but the present invention is not limited to these Examples. Examples and Comparative Examples Component composition shown in Table 1 (weight ratio, parts)
The mixtures were melt-mixed in a twin-screw kneader, the resulting mixtures were cooled and solidified, and then passed through a 100 mesh sieve to obtain the epoxy powder coating compositions of the present invention. Then, using those epoxy resin powder coating compositions,
A preheated hybrid IC was coated by a fluidized dipping method, cured at 150°C, and its physical properties were evaluated. The results are shown in Tables 2 and 3. The following products and the like were used as the ingredients shown in Table 1.
【００１６】
エポミックＲ−３０７：三井石油化学製（ビスフェノー
ルＡ型エポキシ樹脂、エ
ポキシ当量１９５０）エポミックＲ−
３０４：三井石油化学製（ビスフェノールＡ型エポキシ
樹脂、エ
ポキシ当量９４０）エポミックＲ−３０２：三井石油
化学製（ビスフェノールＡ型エポキシ樹脂、エ
ポキシ当量６２
０）エポミックＲ−３０１：三井石油化学製（ビスフェ
ノールＡ型エポキシ樹脂、エ
ポキシ当量４７０）ＥＴＢＡ：日
本化薬社製（臭素化ビスフェノールＡ型エポキシ樹脂、
エポキシ当 量３５０）Ｅ
ＯＣＮ−１０４：日本化薬社製（クレゾールノボラック
型エポキシ樹脂、エポ
キシ当量２２０）ＢＲＥＮ−Ｓ：日本化薬社製（
臭素化フェノールノボラック型エポキシ樹脂、エ
ポキシ当量２８０）ＰＮ−１５
２：日本化薬社製（フェノールノボラック樹脂、軟化点
２３℃、前記 式（１）に
於て、Ｒが水素で、ｎ＝１及び２の成分の含有率が７
５％である。）ＰＮ−１５
４：日本化薬社製（フェノールノボラック樹脂、軟化点
６８℃、前記 式（１）に
於て、Ｒが水素で、ｎ＝１及び２の成分の含有率が４
３％である。）ＰＮ−８０
：明和化成社製（フェノールノボラック樹脂、軟化点８
０℃、前記式 （１）に於て、
Ｒが水素で、ｎ＝１及び２の成分の含有率が２５％
である。）
２ーメチルイミダゾール（２ーＭＺ）：四国化成製シリ
カ：龍森製ＲＤ−８
カップリング剤：３ーグリシドキシプロピルトリメトキ
シシランEpomic R-307: Mitsui Petrochemical (bisphenol A type epoxy resin,
Poxy equivalent 1950) Epomic R-
304: Mitsui Petrochemical (Bisphenol A type epoxy resin,
Poxy equivalent: 940) Epomic R-302: Mitsui Petrochemical (Bisphenol A type epoxy resin,
Poxy equivalent 62
0) Epomic R-301: Mitsui Petrochemical (Bisphenol A type epoxy resin,
Poxy equivalent: 470) ETBA: Nippon Kayaku Co., Ltd. (brominated bisphenol A type epoxy resin,
Epoxy equivalent 350)E
OCN-104: Manufactured by Nippon Kayaku Co., Ltd. (cresol novolac type epoxy resin, Epo
xy equivalent 220) BREN-S: manufactured by Nippon Kayaku Co., Ltd. (
Brominated phenol novolak type epoxy resin,
Poxy equivalent 280) PN-15
2: Manufactured by Nippon Kayaku Co., Ltd. (phenol novolac resin, softening point 23°C, in the above formula (1), R is hydrogen, and the content of components n = 1 and 2 is 7
It is 5%. )PN-15
4: Manufactured by Nippon Kayaku Co., Ltd. (phenol novolak resin, softening point 68°C, in the above formula (1), R is hydrogen, and the content of components n = 1 and 2 is 4
It is 3%. )PN-80
: Manufactured by Meiwa Kasei Co., Ltd. (phenol novolac resin, softening point 8)
At 0°C, in the above formula (1),
R is hydrogen, and the content of components n = 1 and 2 is 25%
It is. ) 2-methylimidazole (2-MZ): Shikoku Kasei Silica: Ryumori RD-8 Coupling agent: 3-glycidoxypropyltrimethoxysilane
【００１７】又、本発明のエポキシ樹脂系粉体
塗料組成物を塗装してえられた塗装製品の評価方法は次
の通りである。
（耐湿信頼性）１２１℃、２気圧、１００％ＲＨの水蒸
気圧下に塗装されたハイブリッドＩＣを放置し１００時
間毎に印刷抵抗の変化を測定し、初期値が１．５％以上
変化した物を不良発生物とし、時間毎の不良発生数を調
べた。本試験は試料数１０ケで行った。数字の小さいも
の程良い。
（耐熱衝撃性）塗装したハイブリッドＩＣにー５５℃で
３０分続いて１５０℃で３０分を１サイクルとした熱衝
撃を加え、５０サイクル毎にクラックの発生の有無を見
て、クラックが発生した物の不良発生数を調べた。本試
験は試料数２０ケで行った。数字の小さいもの程良い。
表２及び表３から明らかなように本発明のエポキシ樹脂
系粉体塗料組成物からえられた塗装製品は耐湿信頼性及
び耐熱衝撃性に優れたいた。The method for evaluating coated products obtained by coating with the epoxy resin powder coating composition of the present invention is as follows. (Moisture resistance reliability) A coated hybrid IC was left under water vapor pressure of 121°C, 2 atm, and 100% RH, and the change in printing resistance was measured every 100 hours. Those whose initial value changed by 1.5% or more were The number of defects generated per hour was investigated. This test was conducted using 10 samples. The smaller the number, the better. (Thermal shock resistance) A thermal shock was applied to the painted hybrid IC, with one cycle of 30 minutes at -55℃ and 30 minutes at 150℃, and the presence or absence of cracks was checked every 50 cycles. We investigated the number of defective products. This test was conducted using 20 samples. The smaller the number, the better. As is clear from Tables 2 and 3, the coated products obtained from the epoxy resin powder coating compositions of the present invention had excellent moisture resistance and thermal shock resistance.
【００１９】[0019]
【００２０】[0020]
【００２１】[0021]
【００２２】[0022]
【発明の効果】耐湿信頼性及び耐熱衝撃性に優れた塗装
製品を与えるエポキシ樹脂系粉体塗料組成物が得られた
。ADVANTAGE OF THE INVENTION An epoxy resin powder coating composition was obtained which provides a coated product with excellent moisture resistance and thermal shock resistance.
Claims (1)
又任意成分として充填剤等を含有するエポキシ系粉体塗
料において、硬化剤として軟化点が７５℃以下であるフ
ェノールノボラック樹脂を含有することを特徴とするエ
ポキシ樹脂系粉体塗料組成物。Claim 1: An epoxy resin and a curing agent as essential components;
Also, an epoxy resin powder coating composition containing a filler or the like as an optional component, which contains a phenol novolac resin having a softening point of 75° C. or less as a hardening agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13867691A JPH04337367A (en) | 1991-05-15 | 1991-05-15 | Powder coating composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13867691A JPH04337367A (en) | 1991-05-15 | 1991-05-15 | Powder coating composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04337367A true JPH04337367A (en) | 1992-11-25 |
Family
ID=15227507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13867691A Pending JPH04337367A (en) | 1991-05-15 | 1991-05-15 | Powder coating composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04337367A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015209436A (en) * | 2014-04-23 | 2015-11-24 | ソマール株式会社 | Powdered paint, and method of producing coating using powdered paint |
-
1991
- 1991-05-15 JP JP13867691A patent/JPH04337367A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015209436A (en) * | 2014-04-23 | 2015-11-24 | ソマール株式会社 | Powdered paint, and method of producing coating using powdered paint |
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