JPH02289615A - Covering material for hybrid ic and hybrid ic covered therewith on their surface - Google Patents

Abstract

PURPOSE:To obtain the title material which has excellent moisture resistance and thermal shock resistance by using an epoxy resin, a phenolic novolak resin, a curing accelerator, styrene (or its derivative) and an inorganic filler. CONSTITUTION:The subject material is composed of (A) an epoxy resin containing more than 1 epoxy group in every molecule, (B) a phenol novolak resin starting with p-alkylphenol, (C) a curing accelerator such as 2-ethyl-4- methylimidazole, (B) styrene and/or styrene derivative and (E) an inorganic filler such as crystalline silica, alumina, calcium carbonate or the like). The volume proportion of the inorganic filler is preferably more than 70% by volume in the material.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a hybrid IC coating material and a hybrid IC coated with the same, and more particularly to a hybrid IC coating material with excellent moisture resistance and thermal shock resistance. The present invention relates to a material and a hybrid IC coated with the material.

(Prior art) In recent years, as electronic devices used in consumer and industrial equipment have become smaller and thinner, the hybrid ICs (integrated circuits) used in these devices have also become smaller and thinner. There is a trend towards higher integration and higher integration.

In the conventional method of manufacturing hybrid ICs, after mounting ICs, transistors, capacitors, etc. on alumina substrates on which circuits are printed using various methods, an exterior resin is applied to protect them from external forces and improve moisture resistance. A method of covering it with is used.

Powdered epoxy resins, liquid phenolic resins, liquid epoxy resins, etc. are used as the exterior resins. Powdered epoxy resins are processed by the fluidized dipping method, and liquid phenolic resins and liquid epoxy resins are processed by the detubing method. After coating, heat treatment is performed and hardened.

Powdered epoxy resin has the advantage of being mass-producible, but it has the disadvantage of poor moisture resistance (pressure Kutzker test), which has recently become more and more stringent. On the other hand, since liquid phenol resins and liquid epoxy resins contain organic solvents, they tend to form voids after curing and have poor moisture resistance reliability. For this reason, they are impregnated with wax or the like to fill the voids with wax and add water repellency to improve moisture resistance, but this has the disadvantage that the process becomes complicated.

Therefore, it is possible to reduce voids after curing by using a reactive diluent in the organic solvent, but this method has the disadvantage of having a low glass transition temperature and poor moisture resistance (pressure Kutzker test). .

(Problems to be Solved by the Invention) The purpose of the present invention is to solve the problems of the prior art, to simplify the working process, to greatly improve moisture resistance, pressure resistance, and thermal shock resistance. An object of the present invention is to provide a covering material for a hybrid IC that can also improve performance, and a hybrid IC using the same.

(Means for Solving the Problems) The present invention provides (1) an epoxy resin having more than one epoxy group in its molecule; (2) Phenol novolac resin obtained from para-alkylphenol as raw material, (3)
The present invention relates to a coating material for a hybrid IC containing a curing accelerator, (4) styrene and/or a styrene derivative, and (5) an inorganic filler.

Epoxy resins having more than one epoxy group in the molecule used in the present invention include lercyclidyl ether and its derivatives derived from bisphenol A and shrimp chlorohydrin, bisphenol F and shrimp chlorohydrin, and derivatives thereof. Diglycidyl ether and its derivatives, commonly known as Epivis type liquid epoxy resin, diglycidyl ether derived from polyhydric alcohol and shrimp chlorohydrin, glycidyl ester derived from polybasic acid and shrimp chlorohydrin, and its derivatives , diglycidyl ether derived from hydrogenated bisphenol A and shrimp chlorohydrin and its g-conductor, turtle, a-epoxy 6-methylcyclohexylmethyl-3,4-epoxy-6-methylcyclohexane carpoxylate, cyclopentadiene oxide , vinylcyclohexene oxide, bis(2,3-epoxycyclopentyl) ether, 3,4-epoxycyclohexylmethyl (3.
4-epoxycyclohexane) carboxylate, bis(λ4-epoxy-6-methylcyclohexylmethyl)
Examples include alicyclic epoxies such as adipate and limonene dioxide, derivatives thereof, and methyl-substituted epoxies derived from isoptylene, and there are no restrictions on the types thereof.

The phenol novolak resin used in the present invention is a phenol novolak resin obtained from para-alkyl phenols such as para-tertiary butylphenol, bara-octylphenol, bara-isopropylphenol, and paranonylphenol.

From the viewpoint of curability of the coating material of the present invention, it is preferable that the OH group of the above-mentioned phenol novolak resin is in the range of 0.9 to 1.1 equivalents to the epoxy group of the above-mentioned epoxy resin.

Styrene derivatives used in the present invention include vinyltoluene, divinylbenzene, tertiary butylstyrene, and the like.

From the viewpoint of workability, the amount of styrene and/or styrene derivative should be 20 to 40 volumetric units based on the total volume of the above epoxy resin, above phenol nopolac resin, curing accelerator, styrene and/or styrene derivative, and inorganic filler. It is preferable to do so.

Examples of the curing accelerator used in the present invention include: 2-
Imidazole compounds such as methyl-4-methylimidazole and 1-cyanoethyl-2-ethyl-4-methylimidazole; tertiary amines such as penzyldimethylamine and 2,4.6-tris(dimethylaminemethyl)phenol; Examples include salts such as 2-methyl-4-methylimidazolium and tetraphenylborate.

The blending ratio of the curing accelerator is preferably 0.3 to 25 parts by weight based on 100 parts by weight of the above-mentioned phenol novolac resin from the viewpoint of curability and storage stability.

Examples of inorganic fillers used in the present invention include:
Crystalline silica, fused silica, alumina, water-containing alumina, calcium carbonate, etc. are included, and the amount of addition is determined from the viewpoint of the balance of thermal shock resistance, the above-mentioned epoxy resin, the above-mentioned phenol novolak resin, curing accelerator, and inorganic filler. It is preferable that the volume ratio of the inorganic filler to the total volume of is 70 volume or more.

A coupling agent, a coloring agent, an antifoaming agent, etc. can be added to the coating material of the hybrid IC of the present invention, if necessary.

Hybrid I. The exterior coating method for C is carried out by a conventional method, for example, the exterior coating of the newly applied IC is carried out by a dipping method, a botting method, a drop method, a roller method, or the like.

(Examples) The present invention will be explained below using examples. In addition, in the examples, parts mean parts by weight.

Example 1 320 parts of styrene was dissolved in a glass flask at 100° C. for 4 hours, and after returning to room temperature, 0.5 part of dimethylpenzylamine was further added and dispersed uniformly to obtain a composition.

Using the obtained resin composition, a hybrid IC equipped with a printed resistor and a comb-shaped pattern with a silver-palladium electrode spacing of 0.31 was coated using the date method, and then
It was heat cured at 120°C for 30 minutes and then at 150°C for 2 hours. The following properties of the obtained cured product were evaluated. The results are shown in Table 1K.

(1) Moisture resistance test (pressure Kutzker test) 12
The hybrid IC after the outer covering was exposed to water vapor at 1°C, 2 atm, 100% R, H, and the change in insulation resistance of the comb pattern was measured at intervals shown in Table 1, and the resistance value was l.
Those with a Ql1Ω or less were considered to be defective, and the number of defects generated at each time was investigated. This test was conducted using 20 samples.

(2) Thermal shock resistance The hybrid IC after being coated was subjected to thermal shock at -40°C for 30 minutes and then at 125°C for 30 minutes, and the change in printing resistance was measured every 25 cycles. Nine items with a value change of 1.5 inches or more were treated as defective items, and the number of defective items for each cycle was investigated. This test was conducted using 20 samples in the same manner as above.

Example 2 A hybrid IC was externally coated in the same manner as in Example 1, except that the resin composition for the outer coating was replaced with an epoxy resin composition consisting of the following components, and the same evaluation as in Example 1 was performed.

The results are shown in Table 1.

320 parts of vinyltoluene was dissolved in a glass flask at 100° C. for 4 hours, and after returning to room temperature, 0.5 part of dimethylbenzylamine was further added and dispersed uniformly to obtain a composition.

Comparative Example 1 A hybrid IC was coated in the same manner as in Example 1, except that the resin composition for the outer coating was replaced with an epoxy resin composition consisting of the following components, and 1 hour was added at 60°C as the curing condition. , the same evaluation as in Example 1 was performed. The results are shown in Table 1.

200 parts of toluene and 70 parts of methanol were dissolved in a glass flask at 100°C for 4 hours, and after returning to room temperature, K, 50 parts of acetone and 0.5 parts of dimethylpenzylamine were added and dispersed uniformly to obtain a composition. .

Comparative Example 2 The same evaluation as in Example 1 was conducted by further impregnating wax on the replicated IC coated in Comparative Example 1.

The results are shown in Table 1.

Comparative Example 3 A hybrid IC was exterior coated in the same manner as in Example 1, except that the resin composition for exterior coating was replaced with an epoxy resin composition consisting of the following components, and the same evaluation as in Example 1 was performed.

The results are shown in Table 1.

320 parts of Cardular E was dissolved in a glass flask at 100° C. for 4 hours, and after returning to room temperature, dimethylbenzylamine was further added and dispersed uniformly to obtain a composition.

0.5 parts or less space. (Effects of the Invention) The covering material of the hybrid IC of the present invention is... The linear expansion coefficient is adjusted to be the same as that of the substrate, and moisture resistance and thermal shock resistance can be imparted with a single exterior coating, simplifying the work process and improving reliability.
C can be obtained at low cost.

Claims (1)

[Claims] 1. (1) an epoxy resin having more than one epoxy group in the molecule, (2) a phenol novolak resin obtained from para-alkylphenol, (3) a curing accelerator, (4) Hybrid I containing styrene and/or styrene derivative and (5) inorganic filler
C coating material. 2. The coating material for a hybrid IC according to claim 1, wherein the volume ratio of the inorganic filler to the total volume of the epoxy resin, phenol novolak resin, curing accelerator, and inorganic filler is 70% by volume or more. 3. A hybrid IC coated with the hybrid IC coating material according to claim 1.