JPH02289615A - Covering material for hybrid ic and hybrid ic covered therewith on their surface - Google Patents
Covering material for hybrid ic and hybrid ic covered therewith on their surfaceInfo
- Publication number
- JPH02289615A JPH02289615A JP9663689A JP9663689A JPH02289615A JP H02289615 A JPH02289615 A JP H02289615A JP 9663689 A JP9663689 A JP 9663689A JP 9663689 A JP9663689 A JP 9663689A JP H02289615 A JPH02289615 A JP H02289615A
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- inorganic filler
- styrene
- epoxy
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 16
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 17
- 239000003822 epoxy resin Substances 0.000 claims abstract description 15
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 14
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000011256 inorganic filler Substances 0.000 claims abstract description 11
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 11
- 229920003986 novolac Polymers 0.000 claims abstract description 10
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 6
- 150000003440 styrenes Chemical class 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 14
- -1 curing accelerator Substances 0.000 claims description 6
- 230000035939 shock Effects 0.000 abstract description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 abstract description 2
- 229910002026 crystalline silica Inorganic materials 0.000 abstract description 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 abstract 1
- 238000000034 method Methods 0.000 description 11
- 239000000203 mixture Substances 0.000 description 7
- 241000238557 Decapoda Species 0.000 description 5
- XENVCRGQTABGKY-ZHACJKMWSA-N chlorohydrin Chemical compound CC#CC#CC#CC#C\C=C\C(Cl)CO XENVCRGQTABGKY-ZHACJKMWSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- LLPKQRMDOFYSGZ-UHFFFAOYSA-N 2,5-dimethyl-1h-imidazole Chemical compound CC1=CN=C(C)N1 LLPKQRMDOFYSGZ-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001868 water Inorganic materials 0.000 description 2
- DXIJHCSGLOHNES-UHFFFAOYSA-N 3,3-dimethylbut-1-enylbenzene Chemical compound CC(C)(C)C=CC1=CC=CC=C1 DXIJHCSGLOHNES-UHFFFAOYSA-N 0.000 description 1
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N 4-nonylphenol Chemical compound CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- XAYDWGMOPRHLEP-UHFFFAOYSA-N 6-ethenyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1CCCC2OC21C=C XAYDWGMOPRHLEP-UHFFFAOYSA-N 0.000 description 1
- RBHIUNHSNSQJNG-UHFFFAOYSA-N 6-methyl-3-(2-methyloxiran-2-yl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2(C)OC2CC1C1(C)CO1 RBHIUNHSNSQJNG-UHFFFAOYSA-N 0.000 description 1
- ASZFCDOTGITCJI-UHFFFAOYSA-N 6-oxabicyclo[3.1.0]hex-2-ene Chemical compound C1C=CC2OC12 ASZFCDOTGITCJI-UHFFFAOYSA-N 0.000 description 1
- ADAHGVUHKDNLEB-UHFFFAOYSA-N Bis(2,3-epoxycyclopentyl)ether Chemical compound C1CC2OC2C1OC1CCC2OC21 ADAHGVUHKDNLEB-UHFFFAOYSA-N 0.000 description 1
- YNBPBIBQCXGVFK-UHFFFAOYSA-N CC1CCCCC1CC1C(C)CC2OC2C1 Chemical compound CC1CCCCC1CC1C(C)CC2OC2C1 YNBPBIBQCXGVFK-UHFFFAOYSA-N 0.000 description 1
- 241000270666 Testudines Species 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- VJECBOKJABCYMF-UHFFFAOYSA-N doxazosin mesylate Chemical compound [H+].CS([O-])(=O)=O.C1OC2=CC=CC=C2OC1C(=O)N(CC1)CCN1C1=NC(N)=C(C=C(C(OC)=C2)OC)C2=N1 VJECBOKJABCYMF-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は,ハイブリッドICの被覆材料およびこれで外
装被覆されたハイブリッドICに関し,さらに詳しくは
耐湿性および耐熱衝撃性に優れたハイブリッドICの被
覆材料およびこれで外装被覆されたハイブリッドICに
関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a hybrid IC coating material and a hybrid IC coated with the same, and more particularly to a hybrid IC coating material with excellent moisture resistance and thermal shock resistance. The present invention relates to a material and a hybrid IC coated with the material.
(従来の技術)
近年,民生機器や産業用機器に使用される電子機器が小
型化および薄型化するにつれて,これに使用されるハイ
ブリッドIC(インテグレーテイド・サーキット)もま
た同様に小型化,薄型化および高集積化が図られる傾向
にある。(Prior art) In recent years, as electronic devices used in consumer and industrial equipment have become smaller and thinner, the hybrid ICs (integrated circuits) used in these devices have also become smaller and thinner. There is a trend towards higher integration and higher integration.
従来のハイブリッドICの製造法においては,回路が印
刷されたアルミナ基板上にIC,}ランジスタ,コンデ
ンサ等を種々の方法で搭載した後,外力からの保護と耐
湿性を向上するために外装用樹脂で被覆する方法がとら
れている。In the conventional method of manufacturing hybrid ICs, after mounting ICs, transistors, capacitors, etc. on alumina substrates on which circuits are printed using various methods, an exterior resin is applied to protect them from external forces and improve moisture resistance. A method of covering it with is used.
該外装用樹脂としては,粉体エポキシ樹脂,液状フェノ
ール樹脂,液状エポキシ樹脂などが使用されており,粉
体エポキシ樹脂では流動浸漬法,液状フェノール樹脂お
よび液状エポキシ樹脂ではデイツビング法によシハイブ
リッドICを被覆した後に加熱処理が行われ,硬化され
ている。Powdered epoxy resins, liquid phenolic resins, liquid epoxy resins, etc. are used as the exterior resins. Powdered epoxy resins are processed by the fluidized dipping method, and liquid phenolic resins and liquid epoxy resins are processed by the detubing method. After coating, heat treatment is performed and hardened.
粉体エポキシ樹脂は大量生産ができるという特長を有し
ているが,最近さらに厳しく力っている耐湿性(プレッ
シャー・クツカー試験)に劣る欠点がある。一方,液状
フェノール樹脂および液状エポキシ樹脂は,有機溶剤を
含んでいるため,硬化後ポイドが生じやすく耐湿信頼性
に劣る。そのため,ワックスなどを含浸し,ボイドへの
ワックス埋め込みとともに撥水性を付与し耐湿性向上を
行っているが,工程が煩雑になるという欠点がある。Powdered epoxy resin has the advantage of being mass-producible, but it has the disadvantage of poor moisture resistance (pressure Kutzker test), which has recently become more and more stringent. On the other hand, since liquid phenol resins and liquid epoxy resins contain organic solvents, they tend to form voids after curing and have poor moisture resistance reliability. For this reason, they are impregnated with wax or the like to fill the voids with wax and add water repellency to improve moisture resistance, but this has the disadvantage that the process becomes complicated.
そこで,有機溶剤のかわシに反応性希釈剤を用いて,硬
化後のボイドを低減する方法が考えられるが,ガラス転
移温度が低〈なシ耐湿性(プレッシャー・クツカー試験
)に劣る欠点がある。Therefore, it is possible to reduce voids after curing by using a reactive diluent in the organic solvent, but this method has the disadvantage of having a low glass transition temperature and poor moisture resistance (pressure Kutzker test). .
(発明が解決しようとする課題)
本発明の目的は,従来技術の問題点を解決し,作業工程
が簡単で,しかも耐湿性,%に耐プレッシャー・クツカ
ー性を大幅に向上させ,かつ耐熱衝撃性をも向上させる
ことができるハイブリッドICの被覆材料およびこれを
用いたノ・イプリツドICを提供することにある。(Problems to be Solved by the Invention) The purpose of the present invention is to solve the problems of the prior art, to simplify the working process, to greatly improve moisture resistance, pressure resistance, and thermal shock resistance. An object of the present invention is to provide a covering material for a hybrid IC that can also improve performance, and a hybrid IC using the same.
(課題を解決するための手段)
本発明は,(1)分子中に1個よシ多くのエポキシ基を
有するエポキシ樹脂.(2)パラアルキルフェノールを
原料として得られるフェノールノボラック樹脂,(3)
硬化促進剤,(4)スチレン及び/又はスチレン誘導体
ならびに(5)無機質充てん剤を含有してなるハイブリ
ッドICの被覆材料に関する。(Means for Solving the Problems) The present invention provides (1) an epoxy resin having more than one epoxy group in its molecule; (2) Phenol novolac resin obtained from para-alkylphenol as raw material, (3)
The present invention relates to a coating material for a hybrid IC containing a curing accelerator, (4) styrene and/or a styrene derivative, and (5) an inorganic filler.
本発明に使用される分子中に1個より多くのエポキシ基
を有するエポキシ樹脂としては,ビスフェノールAとエ
ビクロルヒドリンから誘導さレルシクリシジルエーテル
およびその誘導体,ビスフェノールFとエビクロルヒド
リンから誘導されるジグリシジルエーテルおよびその誘
導体などの通称エピービス型液状エポキシ樹脂,多価ア
ルコールとエビクロルヒドリンから誘導されるジグリシ
ジルエーテル,多塩基酸とエビクロルヒドリンから誘導
されるグリシジルエステルおよびその誘導体,水添ビス
フェノールAとエビクロルヒドリンから誘導されるジグ
リシジルエーテルおよびそのg導体, 亀,a一エポ
キシー6−メチルシクロヘキシルメチル−3.4−エポ
キシ−6−メチルシクロヘキサンカルポキシレート,シ
クロペンタジエンオキサイド,ビニルシクロヘキセンオ
キサイド,ビス(2.3−エポキシシクロペンチル)エ
ーテル,3.4−エポキシシクロヘキシルメチル(3.
4−エポキシシクロヘキサン)カルボキシレート,ビス
(λ4−エポキシ−6−メチルシクロヘキシルメチル)
アジペート,リモネンジオキサイド等の脂環式エポキシ
およびこれらの誘導体,イソプチレンから誘導されるメ
チル置換型エポキシ等があげられ,その種類に制限はな
い。Epoxy resins having more than one epoxy group in the molecule used in the present invention include lercyclidyl ether and its derivatives derived from bisphenol A and shrimp chlorohydrin, bisphenol F and shrimp chlorohydrin, and derivatives thereof. Diglycidyl ether and its derivatives, commonly known as Epivis type liquid epoxy resin, diglycidyl ether derived from polyhydric alcohol and shrimp chlorohydrin, glycidyl ester derived from polybasic acid and shrimp chlorohydrin, and its derivatives , diglycidyl ether derived from hydrogenated bisphenol A and shrimp chlorohydrin and its g-conductor, turtle, a-epoxy 6-methylcyclohexylmethyl-3,4-epoxy-6-methylcyclohexane carpoxylate, cyclopentadiene oxide , vinylcyclohexene oxide, bis(2,3-epoxycyclopentyl) ether, 3,4-epoxycyclohexylmethyl (3.
4-epoxycyclohexane) carboxylate, bis(λ4-epoxy-6-methylcyclohexylmethyl)
Examples include alicyclic epoxies such as adipate and limonene dioxide, derivatives thereof, and methyl-substituted epoxies derived from isoptylene, and there are no restrictions on the types thereof.
本発明に使用されるフェノールノポラツク樹脂は,パラ
ターシャリープチルフェノール,バラオクチルフェノー
ル,バライソプロビルフェノール,パラノニルフェノー
ル等のパラアルキルフェノールを原゛料として得られる
フェノールノボラック樹脂である。The phenol novolak resin used in the present invention is a phenol novolak resin obtained from para-alkyl phenols such as para-tertiary butylphenol, bara-octylphenol, bara-isopropylphenol, and paranonylphenol.
本発明の被覆材料の硬化性の点から,上記のエポキシ樹
脂のエポキシ基に対して,上記のフェノールノボラック
樹脂のOH基を0.9〜1.1当量の範囲とすることが
好ましい。From the viewpoint of curability of the coating material of the present invention, it is preferable that the OH group of the above-mentioned phenol novolak resin is in the range of 0.9 to 1.1 equivalents to the epoxy group of the above-mentioned epoxy resin.
本発明に使用されるスチレン誘導体としては,ビニルト
ルエン,ジビニルベンゼン,ターシャリープチルスチレ
ン等があげられる。Styrene derivatives used in the present invention include vinyltoluene, divinylbenzene, tertiary butylstyrene, and the like.
作業性から,上記のエポキシ樹脂,上記のフェノールノ
ポラツク樹脂,硬化促進剤,スチレン及び/又はスチレ
ン誘導体ならびに無機質充てん剤の総体積に対して,ス
チレン及び/又はスチレン誘導体を20〜40体積チと
することが好ましい。From the viewpoint of workability, the amount of styrene and/or styrene derivative should be 20 to 40 volumetric units based on the total volume of the above epoxy resin, above phenol nopolac resin, curing accelerator, styrene and/or styrene derivative, and inorganic filler. It is preferable to do so.
本発明に使用される硬化促進剤としては,例えば.2−
工゛チルー4−メチルイミダゾール,1ーシアンエチル
−2−エチル−4−メチルイミダゾール等のイミダゾー
ル化合物,ペンジルジメチルアミン,2,4.6−トリ
ス(ジメチルアミンメチル)フェノール等の第3級アミ
ン類,2−メチル−4−メチルイミダゾリウム,テトラ
フエニルボレート等の塩類彦どがあげられる。Examples of the curing accelerator used in the present invention include: 2-
Imidazole compounds such as methyl-4-methylimidazole and 1-cyanoethyl-2-ethyl-4-methylimidazole; tertiary amines such as penzyldimethylamine and 2,4.6-tris(dimethylaminemethyl)phenol; Examples include salts such as 2-methyl-4-methylimidazolium and tetraphenylborate.
硬化促進剤の配合割合は,硬化性と貯蔵安定性の点から
上記のフェノールノボラック樹脂100重量部に対して
0.3〜25重量部が好ましい。The blending ratio of the curing accelerator is preferably 0.3 to 25 parts by weight based on 100 parts by weight of the above-mentioned phenol novolac resin from the viewpoint of curability and storage stability.
本発明に使用される無機質充てん剤としては,例えば,
結晶シリカ,溶融シリカ,アルミナ,水利アルミナ,炭
酸カルシウムなどがあげられ,その添加量は,耐熱衝撃
性のバランスの点から,上記のエポキシ樹脂,上記のフ
ェノールノボラック樹脂,硬化促進剤および無機質充て
ん剤の総体積のうち無機質充てん剤の体積割合が70体
積チ以上とすることが好ましい。Examples of inorganic fillers used in the present invention include:
Crystalline silica, fused silica, alumina, water-containing alumina, calcium carbonate, etc. are included, and the amount of addition is determined from the viewpoint of the balance of thermal shock resistance, the above-mentioned epoxy resin, the above-mentioned phenol novolak resin, curing accelerator, and inorganic filler. It is preferable that the volume ratio of the inorganic filler to the total volume of is 70 volume or more.
本発明のハイブリッドICの被覆材料には,必要に応じ
てカップリング剤,着色剤,消泡剤等を添加することが
できる。A coupling agent, a coloring agent, an antifoaming agent, etc. can be added to the coating material of the hybrid IC of the present invention, if necessary.
ハイブリッドI.Cの外装被覆法としては,通常の方法
で行われ,例えば,デイツブ法,ボツテイング法,ドロ
ップ法,ローラー法などによってノ・イプリツドICの
外装被覆が行われる。Hybrid I. The exterior coating method for C is carried out by a conventional method, for example, the exterior coating of the newly applied IC is carried out by a dipping method, a botting method, a drop method, a roller method, or the like.
(実施例)
以下,本発明を実施例により説明する。なお,実施例中
,部とあるのは重量部を意味する。(Examples) The present invention will be explained below using examples. In addition, in the examples, parts mean parts by weight.
実施例1
スチレン 320部をガラス
製フラスコ内で100℃で4時間溶解し,室温にもどし
たのちに,さらに
ジメチルペンジルアミン
0.5部
を加え均一に分散して組成物を得た。Example 1 320 parts of styrene was dissolved in a glass flask at 100° C. for 4 hours, and after returning to room temperature, 0.5 part of dimethylpenzylamine was further added and dispersed uniformly to obtain a composition.
得られた樹脂組成物を用い,デイツブ方式によシ,印刷
抵抗および銀−パラジウム電極間隔0.3一のくし型パ
ターンを搭載したハイブリッドICを外装被覆した後,
120℃で30分,次いで150℃で2時間加熱硬化し
た。得られた硬化物について下記の特性の評価を行った
。その結果を第1表K示す。Using the obtained resin composition, a hybrid IC equipped with a printed resistor and a comb-shaped pattern with a silver-palladium electrode spacing of 0.31 was coated using the date method, and then
It was heat cured at 120°C for 30 minutes and then at 150°C for 2 hours. The following properties of the obtained cured product were evaluated. The results are shown in Table 1K.
(1)耐湿性試験(プレッシャー・クツカー試験)12
1℃,2気圧,100%R,H,の水蒸気下に外装被覆
後のハイブリッドICをさらし,第1表に示す時間毎に
くし型パターンの絶縁抵抗の変化を測定し,抵抗値がl
Ql1Ω以下となったものを不良発生物とし,各時間毎
の不良発生数を調べた。この試験は試料数20個で行っ
た。(1) Moisture resistance test (pressure Kutzker test) 12
The hybrid IC after the outer covering was exposed to water vapor at 1°C, 2 atm, 100% R, H, and the change in insulation resistance of the comb pattern was measured at intervals shown in Table 1, and the resistance value was l.
Those with a Ql1Ω or less were considered to be defective, and the number of defects generated at each time was investigated. This test was conducted using 20 samples.
(2)耐熱衝撃性
外装被覆後のハイブリッドICに−40℃で30分,続
いて125℃で30分を1サイクルとした熱衝撃を加え
,25サイクル毎に印刷抵抗の変化を測定し,初期値の
1.5チ以上変化し九物を不良発生物とし,各サイクル
毎の不良発生数を調べた。この試験は前記と同様に試料
数20個で行った。(2) Thermal shock resistance The hybrid IC after being coated was subjected to thermal shock at -40°C for 30 minutes and then at 125°C for 30 minutes, and the change in printing resistance was measured every 25 cycles. Nine items with a value change of 1.5 inches or more were treated as defective items, and the number of defective items for each cycle was investigated. This test was conducted using 20 samples in the same manner as above.
実施例2
外装被覆用の樹脂組成物を下記の成分からなるエポキシ
樹脂組成物に代えた以外は実施例1と同様にしてハイブ
リッドICを外装被覆し,実施例1と同様の評価を行っ
た。Example 2 A hybrid IC was externally coated in the same manner as in Example 1, except that the resin composition for the outer coating was replaced with an epoxy resin composition consisting of the following components, and the same evaluation as in Example 1 was performed.
その結果を第1表K示した。The results are shown in Table 1.
ビニルトルエン 320部をガラス
製フラスコ内で100℃で4時間溶解し,室温にもどし
たのちに,さらに
ジメチルベンジルアミン 0.5部を加え
均一に分散して組成物を得た。320 parts of vinyltoluene was dissolved in a glass flask at 100° C. for 4 hours, and after returning to room temperature, 0.5 part of dimethylbenzylamine was further added and dispersed uniformly to obtain a composition.
比較例1
外装被覆用の樹脂組成物を下記の成分からなるエポキシ
樹脂組成物に代え,硬化条件として60℃で1時間を追
加した以外は実施例1と同様KしてハイブリッドICを
外装被覆し,実施例1と同様の評価を行った。その結果
を第1表に示した。Comparative Example 1 A hybrid IC was coated in the same manner as in Example 1, except that the resin composition for the outer coating was replaced with an epoxy resin composition consisting of the following components, and 1 hour was added at 60°C as the curing condition. , the same evaluation as in Example 1 was performed. The results are shown in Table 1.
トルエン 200部メタノ
ール 70部をガラス製フラ
スコ内で100℃で4時間溶解し,室温にもどしたのち
K,さらに
アセトン 50部ジメチル
ペンジルアミン 0.5部を加え均一に分
散して組成物を得た。200 parts of toluene and 70 parts of methanol were dissolved in a glass flask at 100°C for 4 hours, and after returning to room temperature, K, 50 parts of acetone and 0.5 parts of dimethylpenzylamine were added and dispersed uniformly to obtain a composition. .
比較例2
比較例1で外装被覆したノ・イプリツドICにさらにワ
ックスを含浸させ実施例1と同様の評価を行った。Comparative Example 2 The same evaluation as in Example 1 was conducted by further impregnating wax on the replicated IC coated in Comparative Example 1.
その結果を第1表に示した。The results are shown in Table 1.
比較例3
外装被覆用の樹脂組成物を下記の成分からなるエポキシ
樹脂組成物に代えた以外は実施例1と同様にしてハイブ
リッドICを外装被覆し,実施例1と同様の評価を行っ
た。Comparative Example 3 A hybrid IC was exterior coated in the same manner as in Example 1, except that the resin composition for exterior coating was replaced with an epoxy resin composition consisting of the following components, and the same evaluation as in Example 1 was performed.
その結果を第1表に示した。The results are shown in Table 1.
カージュラーE 320部をガラ
ス製フラスコ内で100℃で4時間溶解し,室温にもど
したのちに,さらに
ジメチルベンジルアミン
を加え均一に分散して組成物を得た。320 parts of Cardular E was dissolved in a glass flask at 100° C. for 4 hours, and after returning to room temperature, dimethylbenzylamine was further added and dispersed uniformly to obtain a composition.
0.5部
以下余白
宙−.鶏,
(発明の効果)
本発明のハイブリッドICの被覆材料は.基板と同等の
線膨張係数に調整され,1回の外装被覆で耐湿性および
耐熱衝撃性を付与することができるため,作業工程が簡
単で,これにより,信頼性の向上されたハイブリッドI
Cを低コストで得ることができる。0.5 parts or less space. (Effects of the Invention) The covering material of the hybrid IC of the present invention is... The linear expansion coefficient is adjusted to be the same as that of the substrate, and moisture resistance and thermal shock resistance can be imparted with a single exterior coating, simplifying the work process and improving reliability.
C can be obtained at low cost.
Claims (1)
エポキシ樹脂、(2)パラアルキルフェノールを原料と
して得られるフェノールノボラック樹脂、(3)硬化促
進剤、(4)スチレン及び/又はスチレン誘導体ならび
に(5)無機質充てん剤を含有してなるハイブリッドI
Cの被覆材料。 2、エポキシ樹脂、フェノールノボラック樹脂、硬化促
進剤および無機質充てん剤の総体積のうち無機質充てん
剤の体積割合が70体積%以上である請求項1記載のハ
イブリッドICの被覆材料。 3、請求項1記載のハイブリッドICの被覆材料で外装
被覆されたハイブリッドIC。[Claims] 1. (1) an epoxy resin having more than one epoxy group in the molecule, (2) a phenol novolak resin obtained from para-alkylphenol, (3) a curing accelerator, (4) Hybrid I containing styrene and/or styrene derivative and (5) inorganic filler
C coating material. 2. The coating material for a hybrid IC according to claim 1, wherein the volume ratio of the inorganic filler to the total volume of the epoxy resin, phenol novolak resin, curing accelerator, and inorganic filler is 70% by volume or more. 3. A hybrid IC coated with the hybrid IC coating material according to claim 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9663689A JPH02289615A (en) | 1989-02-03 | 1989-04-17 | Covering material for hybrid ic and hybrid ic covered therewith on their surface |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2636689 | 1989-02-03 | ||
JP1-26366 | 1989-02-03 | ||
JP9663689A JPH02289615A (en) | 1989-02-03 | 1989-04-17 | Covering material for hybrid ic and hybrid ic covered therewith on their surface |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02289615A true JPH02289615A (en) | 1990-11-29 |
Family
ID=26364144
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9663689A Pending JPH02289615A (en) | 1989-02-03 | 1989-04-17 | Covering material for hybrid ic and hybrid ic covered therewith on their surface |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02289615A (en) |
-
1989
- 1989-04-17 JP JP9663689A patent/JPH02289615A/en active Pending
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