JPH0260918A - Resin composition for hybrid ic and hybrid ic manufactured by using the same - Google Patents
Resin composition for hybrid ic and hybrid ic manufactured by using the sameInfo
- Publication number
- JPH0260918A JPH0260918A JP21181888A JP21181888A JPH0260918A JP H0260918 A JPH0260918 A JP H0260918A JP 21181888 A JP21181888 A JP 21181888A JP 21181888 A JP21181888 A JP 21181888A JP H0260918 A JPH0260918 A JP H0260918A
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- resin
- resin composition
- epoxy resin
- epichlorohydrin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims description 25
- 239000003822 epoxy resin Substances 0.000 claims abstract description 20
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920003986 novolac Polymers 0.000 claims abstract description 11
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims abstract description 10
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 6
- 239000001294 propane Substances 0.000 claims abstract description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 8
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 5
- 229930003836 cresol Natural products 0.000 claims description 5
- 239000003960 organic solvent Substances 0.000 claims description 4
- 239000000047 product Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 abstract description 9
- 239000011248 coating agent Substances 0.000 abstract description 9
- 238000000576 coating method Methods 0.000 abstract description 9
- 238000002156 mixing Methods 0.000 abstract description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 4
- 239000002904 solvent Substances 0.000 abstract description 4
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical class C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
Landscapes
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明はハイブリッドＩＣ用樹脂組成物に関し。[Detailed description of the invention] (Industrial application field) The present invention relates to a resin composition for hybrid IC.
薄型でかつ高信頼性のハイブリッドＩＣを製造するのに
適した樹脂組成物およびこれを塗布したハイブリッドＩ
ＣＫ関する。Resin composition suitable for manufacturing a thin and highly reliable hybrid IC and Hybrid I coated with the same
Regarding CK.
（従来の技術）
近年、民生機器や産業用機器に使用される電子機器が小
型化および薄型化するにつれて、これに使用されるハイ
ブリッドＩＣ（インテグラル・サーキット）もまた同様
に小型化、薄型化および高集積化が図られる傾向にある
。(Prior Art) In recent years, as electronic devices used in consumer and industrial equipment have become smaller and thinner, the hybrid ICs (integral circuits) used in these devices have also become smaller and thinner. There is also a trend toward higher integration.
従来のハイブリッドＩＣの製造法においては。In the conventional hybrid IC manufacturing method.
回路が印刷されたアルミナ基板上にＩＣ，）ランジスタ
、コンデンサ等を種々の方法で搭載した後。After mounting ICs, transistors, capacitors, etc. on the printed alumina substrate using various methods.
外力からの保護と耐湿信頼性を向上するために外装用樹
脂で被覆する方法がとられている。In order to improve protection from external forces and moisture resistance reliability, a method of coating with exterior resin is used.
該外装用樹脂としては、粉体エポキシ樹脂、液状フェノ
ール樹脂、液状エポキシ樹脂などが使用されており、粉
体エポキシ樹脂では流動浸漬法。As the exterior resin, powdered epoxy resin, liquid phenol resin, liquid epoxy resin, etc. are used. For powdered epoxy resin, the fluidized dipping method is used.
液状フェノール樹脂および液状エポキシ樹脂ではデイン
ピング法によりハイブリッドＩＣを被覆した後に加熱処
理が行なわれ、硬化されている。With liquid phenol resin and liquid epoxy resin, a hybrid IC is coated by a deimping method and then heated and cured.
粉体エポキシ樹脂は大量生産ができるという特長を有し
ているが、最近さらに厳しくなっている耐湿信頼性（プ
レッシャー・クツカー試験）に劣る欠点がある。一方、
液状フェノール樹脂および液状エポキシ樹脂は、プレッ
シャー・クツカー試験には良好な結果を示すが、無機質
充填剤を多量拠金んでいるため作業時に沈降しやすく、
シかも膜厚が５００〜１ｏｏｏμｍと厚くなり、ハイブ
リッドＩＣの薄型化ができに〈〈、また耐冷熱衝撃性に
劣るという欠点を有する。Powdered epoxy resin has the advantage of being mass-producible, but it has the disadvantage of inferior moisture resistance reliability (pressure Kutzker test), which has recently become more stringent. on the other hand,
Liquid phenolic resins and liquid epoxy resins show good results in the pressure Kutzker test, but because they contain a large amount of inorganic filler, they tend to settle during work.
However, the film thickness is as thick as 500 to 100 μm, which makes it difficult to make the hybrid IC thinner, and it also has the disadvantage of poor thermal shock resistance.
これらの欠点を改良したハイブリッドＩＣ用の外装用塗
料としてノンフィラー系のエポキシ樹脂塗料があるが、
この塗料は薄型でかつ耐湿性Ｋｌ−を優れるものの、塗
嘆が硬いため厚く塗布しすぎると耐ヒートサイクル性が
悪化するという欠点を有しているため塗嗅厚さが５０〜
１００μｍ程度に限定される。There is a non-filler epoxy resin paint as an exterior paint for hybrid ICs that improves these drawbacks.
Although this paint is thin and has excellent moisture resistance Kl-, it has the disadvantage that heat cycle resistance deteriorates if applied too thick because the coating is hard.
It is limited to about 100 μm.
（発明が解決しようとする課題）
本発明の目的は、前記の従来の・・イブリントＩＣ用の
外装材の欠点を改良し膜厚を５０〜２００μｍ穆度に必
要に応じて調整でき、かつ薄膜で耐ヒートサイクル性に
優れ九ノ翫イブリッドＩＣ用樹脂組成物ならびにこの樹
脂組成物で被覆したハイブリッドＩＣを提供するもので
ある。(Problems to be Solved by the Invention) It is an object of the present invention to improve the drawbacks of the conventional outer packaging material for Evelint IC, to be able to adjust the film thickness to 50 to 200 μm as needed, and to provide a thin film. The present invention provides a resin composition for a Kunokan hybrid IC that has excellent heat cycle resistance, and a hybrid IC coated with this resin composition.
（課題を解決するための手段）
本発明け、（ａ）エビ−ピス型エポキシ樹脂、（ｂ）タ
レゾールノボランク型エポキシ樹脂、（Ｃ）フェノール
ノボラック樹脂、（ｄ）エピクロルヒドリンと２．２−
ヒス（４′−、オキシフェニル）プロパンとヲホホ等モ
ルで反応させて得られる式（１）で示される分子構造を
有する反応生成物、（ｅ）硬化促進剤および（ｆ）有機
溶剤を含有してなるハイブリッドＩＣ用樹脂組成物に関
する。(Means for Solving the Problems) The present invention includes (a) Ebi-pis type epoxy resin, (b) Talezol novolank type epoxy resin, (C) phenol novolak resin, (d) epichlorohydrin and 2.2-
Contains a reaction product having a molecular structure represented by formula (1) obtained by reacting equimolar amounts of his(4'-,oxyphenyl)propane, (e) a curing accelerator, and (f) an organic solvent. The present invention relates to a resin composition for hybrid IC.
（ただし、ｎは正の整数である）
本発明の（ａ）成分であるエピ−ピス型エポキシ樹脂と
は、ビスフェノールＡとエピクロルヒドリンから誘導さ
れるエポキシ樹脂であり、これらは耐熱衝撃性の点から
エポキシ当量が２５０以上のものが好ましく、油化シェ
ル社ａｌｌ！ＥＰ−１００７（ｒ−ボキシ当ｆｔ２００
０）、ＢＰ−１００４（ｘボキシ当量９５０）などが挙
げられる。(However, n is a positive integer.) The epi-pis type epoxy resin, which is the component (a) of the present invention, is an epoxy resin derived from bisphenol A and epichlorohydrin, and these are used in terms of thermal shock resistance. Epoxy equivalents of 250 or more are preferred, and Yuka Shell Co., Ltd. all! EP-1007 (r-boxy ft200
0), BP-1004 (x-boxy equivalent weight 950), and the like.
本発明に使用される（ｂ）成分のクレゾールノボラック
型エポキシ樹脂としては、ブレゾールノボランク樹脂と
エピクロルヒドリンから誘導されるエポキシ樹脂が用い
られ、東部化成社′！ＭＹＤＣＮ−７０２（エポキシ当
ｉ−２１０）、住人化成社製ＥＳ ＣＮ−１９５（エホ
＃シ当−３２２０）などが挙げられる。該クレゾールノ
ボランク型エポキシ樹脂の配合割合は、耐熱性、耐湿信
頼性および耐熱衝撃性の点から全エポキシ樹脂の５〜５
５重量愛であることが好ましい。As the cresol novolak type epoxy resin used in the present invention as component (b), an epoxy resin derived from a bresol novolak resin and epichlorohydrin is used. Examples include MYDCN-702 (Epoxy-210) and ES CN-195 (Epoxy-3220) manufactured by Sumitomo Chemical Co., Ltd. The blending ratio of the cresol novolanc type epoxy resin is 5 to 5% of the total epoxy resin from the viewpoint of heat resistance, moisture resistance reliability, and thermal shock resistance.
Preferably 5 weight love.
本発明に使用される（ｃ）成分のフェノールノボラック
樹脂としては、フェノール類とホルムアルデヒドの重縮
金物が用いられ、明和化成社裂Ｈ−１（水酸基当ｔ１０
６）、日本化薬社製ＰＮ（水酸基当ｆｔｌ ０６ ）な
どが挙げられる。その配合量は耐熱劣化特性および強度
の点から組成物中のエポキシ基１個に対し０．８５〜１
．１モルの範囲が好ましい。As the phenol novolak resin of component (c) used in the present invention, a polycondensed metal of phenols and formaldehyde is used, and Meiwa Kasei's Fragment H-1 (t10 per hydroxyl group) is used.
6), Nippon Kayaku Co., Ltd.'s PN (hydroxyl group ftl 06 ), and the like. From the viewpoint of heat deterioration resistance and strength, the blending amount is 0.85 to 1 per epoxy group in the composition.
．． A range of 1 mole is preferred.
本発明に使用される（ｄｌ戒分のエピクロルヒドリン、
！＝２．２−ピス（４′−オキシフェニル）プロパンと
をほぼ等モルで反応させて得られる反応生成物とは以下
に示す分子構造を有するものである。Used in the present invention (dl precept epichlorohydrin,
! The reaction product obtained by reacting approximately equimolar amounts of 2.2-pis(4'-oxyphenyl)propane has the molecular structure shown below.
はぼ等モルとは高分子量の反応生成物を生成する配合割
合を指し９通常エピクロルヒドリン１モルに対して２．
２−ピス（４′−オキシフェニル）プロパン０．９０〜
１．１０モルの範囲とされる。上記の構造においてｎけ
正の整数であるが、ｎが８０〜１２０の範囲が、密着性
が良好でかつ溶剤の希釈性も良好であるので好ましい。``Equimolar'' refers to the mixing ratio that produces a high molecular weight reaction product.9 Usually, 2.0 molar to 1 mole of epichlorohydrin.
2-pis(4'-oxyphenyl)propane 0.90~
The range is 1.10 moles. In the above structure, n is a positive integer, and it is preferable that n is in the range of 80 to 120 because it provides good adhesion and good dilutability with a solvent.
また（ｄｌ成分の反応生成物は上式においてｎが１００
程度では、室温で固体であるため、ブチルセロソルブ、
メチルエチルケトンなどの溶解可能な溶剤で溶解して使
用しても良い。市販の樹脂としては、ユニオンカーバイ
ド社製のフェノキシ樹脂がある。ｆｄｌ成分の使用割合
としてＦｉｆ＆）（ｂ＋およびＦＣ）成分の総量１００
重量部に対し０．１重量部から２００重量部の範囲で使
用することが好ましい。Also, (the reaction product of the dl component is n in the above formula is 100
Butyl cellosolve, because it is solid at room temperature,
It may be used by dissolving it in a soluble solvent such as methyl ethyl ketone. Commercially available resins include phenoxy resins manufactured by Union Carbide. The total amount of Fif &) (b+ and FC) components is 100 as the usage ratio of fdl components.
It is preferable to use it in a range of 0.1 parts by weight to 200 parts by weight.
本発明に使用される（ｅ）成分の硬化促進剤としては、
第三級アミン類、イミダゾール類、テトラ置換ボレート
、トリフェニルホスフィンなどが挙ケられる。As the curing accelerator of component (e) used in the present invention,
Examples include tertiary amines, imidazoles, tetra-substituted borates, and triphenylphosphine.
硬化性および安定性のバランスから、硬化促進剤の配合
割合はフェノールノボラック樹脂に対して０．３〜２５
重量％の範囲が好呻しい。From the balance of curability and stability, the blending ratio of curing accelerator to phenol novolak resin is 0.3 to 25.
The weight % range is favorable.
本発明に使用される（ｆ）成分の有機溶剤としては。The organic solvent as component (f) used in the present invention is as follows.
芳香族系炭化水素、アルコール系溶剤、ケトン系溶剤な
どが挙げられる。有機溶剤の配合割合は樹脂組成物中の
４０〜８０重ｔ％とすることが好ましい。Examples include aromatic hydrocarbons, alcohol solvents, ketone solvents, and the like. The blending ratio of the organic solvent is preferably 40 to 80% by weight in the resin composition.
凍た１本発明の樹脂組成物を・・イブリッドＩＣに塗布
する方法としては特に制限はなく、浸漬後。There are no particular restrictions on the method of applying the resin composition of the present invention to hybrid ICs, including after immersion.
スプレー法、はけ塗りなど一般的な塗料の塗装方法が採
用できる。塗布後にハイブリッドＩＣは加熱されて塗布
膜は硬化される。General paint application methods such as spraying and brushing can be used. After coating, the hybrid IC is heated to harden the coating film.
本発明の樹脂組成物には目的に応じて着色剤。The resin composition of the present invention may contain a coloring agent depending on the purpose.
カンプリング剤、消泡剤、難燃剤を添加することが出来
る。Camping agents, antifoaming agents, and flame retardants can be added.
（実施例） 次に本発明を実施例および比較例により説明する。(Example) Next, the present invention will be explained with reference to Examples and Comparative Examples.
比較例１
エピ−ピス型エポキシ樹脂
（油化シェル社ＮＥＰ−１００７） ８０重量部
クレゾールノボラック型エポキシ樹脂
（東部化我社！！ＹＤＣＮ−７０２） ２０重量
部フェノールノボラック樹脂
（明和化成社製Ｈ−１） １４．３重量部
ジメチルベンジルアミン ０．３ ｆｆ１ｆ
ｌ工チレングリコールモノエチルエーテル１００重量部
トルエン １５重量部を
ガラス製フラスコ内で７０〜１００℃で３〜４時間溶解
し、透明な樹脂組成物Ａを得た。Comparative Example 1 Epi-pis type epoxy resin (Yuka Shell Co., Ltd. NEP-1007) 80 parts by weight Cresol novolak type epoxy resin (Tobu Kagasha!! YDCN-702) 20 parts by weight Phenol novolac resin (H- manufactured by Meiwa Kasei Co., Ltd.) 1) 14.3 parts by weight dimethylbenzylamine 0.3 ff1f
A transparent resin composition A was obtained by dissolving 100 parts by weight of ethylene glycol monoethyl ether and 15 parts by weight toluene at 70 to 100°C for 3 to 4 hours in a glass flask.
得られた樹脂組成物Ａを用い、デイツプ方式によシバイ
ブリッドＩＣを外装被覆した後、１２０℃で１時間加熱
乾燥を行ないさらに樹脂組成物Ａにデイツプし、１２０
’Ｃで１時間、ついで１５０℃で２時間加熱硬化した。Using the obtained resin composition A, after coating the exterior of a sibibrid IC by a dip method, it was heated and dried at 120°C for 1 hour, and then further soaked in the resin composition A.
It was cured by heating at 150° C. for 1 hour and then at 150° C. for 2 hours.
得られ念硬化物について下記特性の評価を行なった。そ
の結果を第１表に示す。The following properties of the obtained hardened product were evaluated. The results are shown in Table 1.
（１）＠厚の測定
外装被覆前後のハイブリッドＩＣの基板平坦部の厚さの
差を測定し、２等分した値を片面の膜厚とした。(1) @Measurement of Thickness The difference in thickness of the flat part of the hybrid IC substrate before and after the outer coating was measured, and the value divided into two was taken as the film thickness on one side.
（２）桁湿Ｍ頼性試賎（ブレソ／ヤー・クツカー試験）
１２１’Ｃ，２気圧、１００多ＲＨの水蒸気下に外装被
覆後の・・イブリントＩＣをさらし、第１表に示す時間
毎に印刷抵抗の変化を測定し、初期値が１．５％以上変
化した物を不良発生物とし、各時間毎の不良発生数を調
べた。この試、濾は試料数２０個について行なった。(2) Digit humidity M reliability test sample (Bresso/Yar-Kutsker test) After being exposed to water vapor at 121'C, 2 atm, and 100% RH, the Ibrint IC after being coated was exposed for the times shown in Table 1. Changes in printing resistance were measured, and those whose initial value changed by 1.5% or more were considered defective, and the number of defects generated each time was investigated. In this trial, filtration was performed on 20 samples.
（３） ヒートサイクル試験
外装被覆後のハイブリッドＩＣに−４０”Ｃで３０分、
続いて１２５℃で３０分を１サイクルとした熱」！ｊ撃
を加え、２５サイクル毎に印刷抵抗の変化を測定し、初
期値の１，５チ以上変化し念物を不良発生物とし、各サ
イクル毎の不良発生数を調べた。この試験は前記と同様
に試料数２０個について行なった。(3) Heat cycle test After coating the hybrid IC, heat cycle test was carried out at -40"C for 30 minutes.
This was followed by heating at 125°C for 30 minutes per cycle. J shock was applied, and changes in printing resistance were measured every 25 cycles, and items that changed by more than 1.5 inches from the initial value were considered defective items, and the number of defects generated in each cycle was investigated. This test was conducted on 20 samples in the same manner as above.
比較ｆｌ１２
樹脂組成物を下記の成分からなる樹脂組成物Ｂに代えた
以外は実施例１と同様にしてハイブリッドＩＣを作製し
、ｌ１ｆＪ様の評価を行なった。その結果を第１表建示
した。Comparison fl12 A hybrid IC was produced in the same manner as in Example 1, except that the resin composition was replaced with resin composition B consisting of the following components, and evaluation was performed on l1fJ. The results are presented in Table 1.
エピ−ピス型エポキシ樹脂
（油化シェル社製ＥＰ−１００７） ６０重量部
クレゾールノボランク型エポキシ樹脂
（東部化成社製ＹＤＣＮ−７０２） ４０重量部
フェノールノボランク樹脂
（ＦＩＡ和化或社久Ｈ−１） ２３．４ｉ
量部ジメチルベンジルアミン ０．３ 重ｆ
ｉエチレングリコールモノエチルエーテル１００’ｉｉ
ｉ部
トルエン ２０重量部実施
例１
比較例１で得た樹脂組成物人１００重量部に。Epi-pis type epoxy resin (EP-1007 manufactured by Yuka Shell Co., Ltd.) 60 parts by weight Cresol novolank type epoxy resin (YDCN-702 manufactured by Tobu Kasei Co., Ltd.) 40 parts by weight Phenol novolank resin (FIA Waka Orshakyu H- 1) 23.4i
Quantity part dimethylbenzylamine 0.3 weight f
iEthylene glycol monoethyl ether 100'ii
i part toluene 20 parts by weight Example 1 100 parts by weight of the resin composition obtained in Comparative Example 1.
フェノキシｍ１ｌｌＫＨＨ（ユニオンカーバイド社製、
商品名）の３０重量％、エチレングリコールモノエチル
エーテル溶液８０重量部を混合攪拌して樹脂組成物Ｃを
得た。樹脂組成物Ａを樹脂組成物Ｃに変えた以外は比較
例１と同様にしてハイフリントＩＣを作製し、比・咬例
１と同様の評価を行なった。その結果を第１表に示した
。Phenoxy mlllkhh (manufactured by Union Carbide,
A resin composition C was obtained by mixing and stirring 30% by weight of the product (trade name) and 80 parts by weight of an ethylene glycol monoethyl ether solution. A high flint IC was produced in the same manner as in Comparative Example 1, except that resin composition A was replaced with resin composition C, and the same evaluations as in Ratio and Mesh Example 1 were performed. The results are shown in Table 1.
実施例２
比較例２で得た樹脂組成物Ｂ Ｌｏｏｍ景部にフェノキ
シ樹脂ＰＫＩ（ｔ（（ユニオンカーバイド社製。Example 2 Resin composition B obtained in Comparative Example 2 Phenoxy resin PKI (manufactured by Union Carbide Co., Ltd.) was added to the room area.
商品名）の３０重号チ、エチレングリコールモノエチル
エーテル溶液８０重景部を混合攪拌して樹脂組成物りを
得意。樹脂組成物Ａを樹脂組成物りに変えた以外は比較
例１と同様にして・・イブリッドＩＣを作製し、比較例
１と同様の評価を行なつた。その結果を第１表に示した
。We are good at preparing resin compositions by mixing and stirring 80 parts of ethylene glycol monoethyl ether solution. An hybrid IC was produced in the same manner as in Comparative Example 1 except that resin composition A was changed to resin composition R, and the same evaluation as in Comparative Example 1 was performed. The results are shown in Table 1.
第１表の結果から本発明になるハイブリッドＩＣ用樹脂
組成物は膜厚を５０〜２００μｍ程度に調整でき、従来
のものと比較し耐湿性は同等で。From the results shown in Table 1, the film thickness of the hybrid IC resin composition of the present invention can be adjusted to about 50 to 200 μm, and the moisture resistance is equivalent to that of the conventional composition.
特にヒートサイクル性に優れることが分かる。It can be seen that it has particularly excellent heat cycle properties.
Claims (1)
ルノボラック型エポキシ樹脂、（ｃ）フェノールノボラ
ック樹脂、（ｄ）エピクロルヒドリンと２，２−ピス（
４′−オキシフェニル）プロパンとをほぼ等モルで反応
させて得られる式（１）で示される分子構造を有する反
応生成物、（ｅ）硬化促進剤および（ｆ）有機溶剤を含
有してなるハイブリッドＩＣ用樹脂組成物。 ▲数式、化学式、表等があります▼（１） （ただしｎは正の整数である） ２、請求項１記載の樹脂組成物の硬化物で被覆されたハ
イブリッドＩＣ。[Claims] 1. (a) Epipis type epoxy resin, (b) Cresol novolac type epoxy resin, (c) Phenol novolak resin, (d) Epichlorohydrin and 2,2-pis (
4'-oxyphenyl)propane in approximately equimolar amounts, containing a reaction product having a molecular structure represented by formula (1), (e) a curing accelerator, and (f) an organic solvent. Resin composition for hybrid IC. ▲There are mathematical formulas, chemical formulas, tables, etc.▼ (1) (where n is a positive integer) 2. A hybrid IC coated with a cured product of the resin composition according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21181888A JPH0260918A (en) | 1988-08-26 | 1988-08-26 | Resin composition for hybrid ic and hybrid ic manufactured by using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21181888A JPH0260918A (en) | 1988-08-26 | 1988-08-26 | Resin composition for hybrid ic and hybrid ic manufactured by using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0260918A true JPH0260918A (en) | 1990-03-01 |
Family
ID=16612103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21181888A Pending JPH0260918A (en) | 1988-08-26 | 1988-08-26 | Resin composition for hybrid ic and hybrid ic manufactured by using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0260918A (en) |
-
1988
- 1988-08-26 JP JP21181888A patent/JPH0260918A/en active Pending
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