JPH0766514A - Electric circuit board - Google Patents

Abstract

PURPOSE:To eliminate the copper foil plating step on an insulating layer and the etching step of the soldering part of a heating element by a method wherein a multilayered printed-wiring board is fixed to a part of an insulating film while the heating element is fixed to the other part whereto the board is not fixed. CONSTITUTION:A both surfaced glass expoxy resin plate 14 whereon copper foils 12 is plated is bonded onto an insulating layer 11 of a multilayered printed board part 20a while a semiconductor 15 to be a heating element is bonded onto a fixed part 21 through the intermediary of a heat sink 13 (e.g. molybdenum, copper). On the other hand, the semiconductor 15 soldered onto the heat sink 13 has a continuity to the copper foils 12 by wires 16. Accordingly, when the thickness, material quality, etc., of the heat sink 13 and a bonding agent layer 30 are set up not to be unfavorably affected by the heat of the semiconductor 15, the working manhours in the manufacturing step such as etching step, etc., can be cut down thereby enabling the manufacturing cost to be cut down also.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board used for electric equipment.

[0002]

2. Description of the Related Art Conventionally, in a metal substrate used for efficiently dissipating heat from a heat generating element, a conductor has one layer, and a one-layer portion for efficiently dissipating heat of the heat generating element,
2. Description of the Related Art There is known an electric circuit board including a two-layer portion of a multilayer printed circuit board having two conductors for forming a complicated electric circuit on the same substrate. As this type of technique, a technique disclosed in a catalog “Denka HITT plate partial two-layer substrate” issued by Denki Kagaku Kogyo Co., Ltd. in 1992 is known. FIG. 2 is a sectional view of an electric circuit board of this technique. In the figure, an insulating layer 101 made of a resin is formed on an aluminum plate 100, and on this insulating layer 101, a copper foil 102 has a two-layer portion 103 made up of two layers a and b, and one layer of copper foil 102. 1 layer part consisting of 1
It is divided into 04. Copper foil 102 of two-layer portion 103
Is affixed to both surfaces of the double-sided glass epoxy resin plate 105, and is divided into an upper part a and a lower part b. Further, a nickel pad portion 106 is plated on the copper foil 102 as a surface treatment. The first layer portion 104 is a copper foil 10
The semiconductor 108, which is a heating element, is mounted on the heat sink 10
Soldered via 7. This semiconductor 108
The wire 109 is electrically connected to the copper foil 102 of the two-layer portion 103.

Of the circuit components mounted on the electric circuit board, the heat-generating element is mounted on the one-layer portion 104, so that the heat radiation property is much larger than that on the two-layer portion 103. We are trying to improve

To manufacture the electric circuit board shown in FIG. 2, an aluminum plate 100 is coated with an insulating layer 101, and then the insulating layer 1 is added.
A copper foil 102 (copper foil of the one-layer portion 104) is put on 01. Then, an etching process is performed to leave the copper foil 102 in the portion of the one-layer portion 104, and the shape of the one-layer portion 104 is arbitrarily formed.
On the other hand, copper foil 1 on both sides of the double-sided glass epoxy resin plate 105
02 is attached to form a through hole 105a at an arbitrary position and copper plating is performed. Next, an etching process is performed to arbitrarily form a circuit using the copper foil 102. Then, the double-sided glass epoxy resin plate 105 to which the copper foil 102 is stuck is stuck to the insulating layer 101 to be formed.

[0005]

However, in the above-mentioned conventional technique, the heating element is adhered to the copper foil of one layer, so that the step of forming the one layer is , A step of applying a copper foil on the insulating layer, a step of etching a portion to which the heat generating component is soldered, and a step of soldering a heat dissipation material must be performed. This causes a problem that the manufacturing cost is high.

A technical object of the present invention is to provide a structure capable of reducing the manufacturing cost.

[0007]

Means for Solving the Problems In order to solve the above-mentioned technical problems, the technical means taken by the present invention is to provide an electric circuit board in which at least a part of the surface of a metal substrate is insulation-coated, and a part of the insulation coating is used. Is to fix the multi-layer printed circuit board to, and to fix the heating element to the portion of the insulating coating where the multi-layer printed circuit board is not fixed.

[0008]

The function of the present invention will be described. Since the heating element is directly bonded on the insulating coating, a step of placing a copper foil on the insulating layer,
Also, the manufacturing cost can be reduced because the step of etching the portion to which the heating element is soldered can be omitted.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view of an electric circuit board of this embodiment. In the figure, an insulating layer 11 made of resin is formed on an aluminum plate 10, and a multi-layer printed circuit board 20 made of two layers of a copper foil 12 constituting a circuit and a portion 12a and a portion 12b is adhered on the insulating layer 11. The multi-layer printed circuit board portion 20a is divided into a fixed portion 21 to which the heating element 13 is adhered without adhering the multilayer printed circuit board 20. On the insulating layer 11 of the multilayer printed circuit board portion 20a, a double-sided glass epoxy resin plate 14 to which copper foils 12 are attached on both sides is adhered, and 30 is an adhesive layer. A semiconductor 15 serving as a heating element is bonded to the fixing portion 21 via a heat sink (for example, molybdenum or copper) 13, and 30 is an adhesive layer. In this embodiment, the semiconductor 15 is soldered to the heat sink 13, and the semiconductor 15 is electrically connected to the copper foil 12 of the multilayer printed board portion 20a by the wire 16.

In the present embodiment, the heat sink 13 and the adhesive layer 3 are provided to the extent that the semiconductor 15 is not adversely affected by heat.
The thickness, material, etc. of 0 may be freely set. Further, since the heat sink 13 is simply bonded, the number of man-hours required for manufacturing such as etching can be reduced, and the manufacturing cost can be reduced.

[0012]

The effects of the present invention will be described. The heating element is
Since it is directly adhered to the insulating coating, the step of placing a copper foil on the insulating layer and the step of etching the portion to which the heating element is soldered can be omitted, so that the manufacturing cost is reduced.

[Brief description of drawings]

FIG. 1 shows a cross-sectional view of an electric circuit board according to the present invention.

FIG. 2 shows a cross-sectional view of a conventional electric circuit board.

[Explanation of symbols]

 10 ... Aluminum plate 11 ... Insulating layer 12 ... Copper foil 13 ... Heat sink 15 ... Semiconductor 20 ... Multilayer printed circuit board 20a ... Multilayer printed circuit board part 21 ... Fixed part 30 ... Adhesive layers

Claims (1)

[Claims] 1. An electric circuit board in which at least a part of a surface of a metal substrate is insulation-coated, a multi-layer printed board is fixed to a part of the insulation coating, and the multi-layer printed board on the insulation is not fixed. An electric circuit board having a heating element fixed to a portion thereof.