JPH0766514A - Electric circuit board - Google Patents
Electric circuit boardInfo
- Publication number
- JPH0766514A JPH0766514A JP5211826A JP21182693A JPH0766514A JP H0766514 A JPH0766514 A JP H0766514A JP 5211826 A JP5211826 A JP 5211826A JP 21182693 A JP21182693 A JP 21182693A JP H0766514 A JPH0766514 A JP H0766514A
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- circuit board
- fixed
- layer
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、電気機器に用いられる
回路基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board used for electric equipment.
【0002】[0002]
【従来の技術】従来、発熱素子からの熱を効率良く逃が
すために用いられる金属基板において、導電体が1層よ
りなり発熱素子の熱を効率良く逃がすための1層部と、
複雑な電気回路を同一基板上に形成するため、導電体が
2層よりなる多層プリント基板の2層部とを備えた電気
回路基板が知られている。そして、この種の技術として
は、1992年に電気化学工業株式会社より発行された
カタログ「デンカHITTプレート部分2層基板」に開
示される技術が知られている。図2は、この技術の電気
回路基板の断面図である。同図において、アルミニウム
板100上に樹脂よりなる絶縁層101が形成され、こ
の絶縁層101上は銅箔102がa部、b部の2層より
なる2層部103と銅箔102が1層よりなる1層部1
04とに分けられている。2層部103の銅箔102
は、両面ガラスエポキシ樹脂板105の両面に張りつけ
られて、上側のa部と下側のb部に分かれている。更
に、銅箔102上には表面処理としてニッケルパッド部
106がメッキされている。1層部104は、銅箔10
2上に発熱素子である半導体108がヒートシンク10
7を介して半田付けされている。この半導体108は、
ワイヤ109によって、2層部103の銅箔102と導
通するようになっている。2. Description of the Related Art Conventionally, in a metal substrate used for efficiently dissipating heat from a heat generating element, a conductor has one layer, and a one-layer portion for efficiently dissipating heat of the heat generating element,
2. Description of the Related Art There is known an electric circuit board including a two-layer portion of a multilayer printed circuit board having two conductors for forming a complicated electric circuit on the same substrate. As this type of technique, a technique disclosed in a catalog “Denka HITT plate partial two-layer substrate” issued by Denki Kagaku Kogyo Co., Ltd. in 1992 is known. FIG. 2 is a sectional view of an electric circuit board of this technique. In the figure, an insulating layer 101 made of a resin is formed on an aluminum plate 100, and on this insulating layer 101, a copper foil 102 has a two-layer portion 103 made up of two layers a and b, and one layer of copper foil 102. 1 layer part consisting of 1
It is divided into 04. Copper foil 102 of two-layer portion 103
Is affixed to both surfaces of the double-sided glass epoxy resin plate 105, and is divided into an upper part a and a lower part b. Further, a nickel pad portion 106 is plated on the copper foil 102 as a surface treatment. The first layer portion 104 is a copper foil 10
The semiconductor 108, which is a heating element, is mounted on the heat sink 10
Soldered via 7. This semiconductor 108
The wire 109 is electrically connected to the copper foil 102 of the two-layer portion 103.
【0003】この電気回路基板上に実装される回路構成
部品のうち、発熱する素子を1層部104上に実装する
ことにより、2層部103上に実装するのに比較して大
幅な放熱性の向上を図っている。Of the circuit components mounted on the electric circuit board, the heat-generating element is mounted on the one-layer portion 104, so that the heat radiation property is much larger than that on the two-layer portion 103. We are trying to improve
【0004】図2に示す電気回路基板を製造には、アル
ミニウム板100に絶縁層101を塗り、更に絶縁層1
01に銅箔102(1層部104の銅箔)を張る。そし
て、エッチング処理を行って1層部104の部分の銅箔
102を残し、任意に1層部104の形状を形成する。
一方、両面ガラスエポキシ樹脂板105の両面に銅箔1
02を張り付けて、任意の位置にスルホール105aを
穴明けをし、且つ、銅メッキを施す。次に、エッチング
処理を行って、銅箔102による回路を任意に形成す
る。そして、銅箔102が張りつけられた両面ガラスエ
ポキシ樹脂板105を絶縁層101上に張り付けること
によって形成される。To manufacture the electric circuit board shown in FIG. 2, an aluminum plate 100 is coated with an insulating layer 101, and then the insulating layer 1 is added.
A copper foil 102 (copper foil of the one-layer portion 104) is put on 01. Then, an etching process is performed to leave the copper foil 102 in the portion of the one-layer portion 104, and the shape of the one-layer portion 104 is arbitrarily formed.
On the other hand, copper foil 1 on both sides of the double-sided glass epoxy resin plate 105
02 is attached to form a through hole 105a at an arbitrary position and copper plating is performed. Next, an etching process is performed to arbitrarily form a circuit using the copper foil 102. Then, the double-sided glass epoxy resin plate 105 to which the copper foil 102 is stuck is stuck to the insulating layer 101 to be formed.
【0005】[0005]
【発明が解決しようとする課題】しかし、上記した従来
の技術では、1層部の銅箔上に発熱素子を接着するよう
になっているものであるため、1層部を形成する工程と
しては、絶縁層上に銅箔を張る工程、発熱部品が半田付
けされる部分をエッチングする工程、並びに放熱材を半
田付けする工程を経なければならない。これにより、製
造コストが高いとった問題がある。However, in the above-mentioned conventional technique, the heating element is adhered to the copper foil of one layer, so that the step of forming the one layer is , A step of applying a copper foil on the insulating layer, a step of etching a portion to which the heat generating component is soldered, and a step of soldering a heat dissipation material must be performed. This causes a problem that the manufacturing cost is high.
【0006】本発明は、製造コストを低減できる構成と
することを技術的課題とする。A technical object of the present invention is to provide a structure capable of reducing the manufacturing cost.
【0007】[0007]
【課題を解決するための手段】上記した技術的課題を解
決するため本発明において講じた技術的手段は、金属基
板の少なくとも一部表面に絶縁被覆した電気回路基板に
おいて、絶縁被覆上の一部に多層プリント基板を固着
し、絶縁被覆上の多層プリント基板が固着されていない
部分に発熱素子を固着することである。Means for Solving the Problems In order to solve the above-mentioned technical problems, the technical means taken by the present invention is to provide an electric circuit board in which at least a part of the surface of a metal substrate is insulation-coated, and a part of the insulation coating is used. Is to fix the multi-layer printed circuit board to, and to fix the heating element to the portion of the insulating coating where the multi-layer printed circuit board is not fixed.
【0008】[0008]
【作用】本発明の作用を説明する。発熱素子は、絶縁被
覆上に直接接着されため、絶縁層上に銅箔を張る工程、
及び、発熱素子が半田付けされる部分をエッチングする
工程を省略することができるため、製造コストをダウン
させることができる。The function of the present invention will be described. Since the heating element is directly bonded on the insulating coating, a step of placing a copper foil on the insulating layer,
Also, the manufacturing cost can be reduced because the step of etching the portion to which the heating element is soldered can be omitted.
【0009】[0009]
【実施例】本発明に係る一実施例を図面に基づいて説明
する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described with reference to the drawings.
【0010】図1は、本実施例の電気回路基板の断面図
である。同図において、アルミニウム板10上に樹脂よ
りなる絶縁層11が形成され、この絶縁層11上は、回
路を構成する銅箔12が12a部・12b部の2層より
なる多層プリント基板20が接着されている多層プリン
ト基板部20aと、多層プリント基板20を接着せず発
熱素子13が接着される固定部21とに分けられてい
る。多層プリント基板部20aの絶縁層11上には、両
面ガラスエポキシ樹脂板14の両面に銅箔12が張りつ
けられたものが接着されていて、30は接着剤層であ
る。固定部21には、発熱素子となる半導体15がヒー
トシンク(例えばモリブデン、銅)13を介して接着さ
れ、30は接着層である。本実施例では、このヒートシ
ンク13に半導体15が半田付けされていて、この半導
体15は多層プリント基板部20aの銅箔12にワイヤ
16によって導通するようになっている。FIG. 1 is a sectional view of an electric circuit board of this embodiment. In the figure, an insulating layer 11 made of resin is formed on an aluminum plate 10, and a multi-layer printed circuit board 20 made of two layers of a copper foil 12 constituting a circuit and a portion 12a and a portion 12b is adhered on the insulating layer 11. The multi-layer printed circuit board portion 20a is divided into a fixed portion 21 to which the heating element 13 is adhered without adhering the multilayer printed circuit board 20. On the insulating layer 11 of the multilayer printed circuit board portion 20a, a double-sided glass epoxy resin plate 14 to which copper foils 12 are attached on both sides is adhered, and 30 is an adhesive layer. A semiconductor 15 serving as a heating element is bonded to the fixing portion 21 via a heat sink (for example, molybdenum or copper) 13, and 30 is an adhesive layer. In this embodiment, the semiconductor 15 is soldered to the heat sink 13, and the semiconductor 15 is electrically connected to the copper foil 12 of the multilayer printed board portion 20a by the wire 16.
【0011】本実施例では、半導体15の熱による悪影
響を及ぼさない程度にヒートシンク13及び接着剤層3
0の厚さ、材質等を自由に設定すればよい。又、ヒート
シンク13を接着するだけなのでエッチング等の製造時
の作業工数が低減されて、製造コストをダウンさせるこ
とができる。In the present embodiment, the heat sink 13 and the adhesive layer 3 are provided to the extent that the semiconductor 15 is not adversely affected by heat.
The thickness, material, etc. of 0 may be freely set. Further, since the heat sink 13 is simply bonded, the number of man-hours required for manufacturing such as etching can be reduced, and the manufacturing cost can be reduced.
【0012】[0012]
【発明の効果】本発明の効果を説明する。発熱素子は、
絶縁被覆上に直接接着されため、絶縁層上に銅箔を張る
工程、及び、発熱素子が半田付けされる部分をエッチン
グする工程を省略することができるため、製造コストが
ダウンする。The effects of the present invention will be described. The heating element is
Since it is directly adhered to the insulating coating, the step of placing a copper foil on the insulating layer and the step of etching the portion to which the heating element is soldered can be omitted, so that the manufacturing cost is reduced.
【図1】本発明に係る電気回路基板の断面図を示す。FIG. 1 shows a cross-sectional view of an electric circuit board according to the present invention.
【図2】従来の電気回路基板の断面図を示す。FIG. 2 shows a cross-sectional view of a conventional electric circuit board.
10・・・アルミニウム板 11・・・絶縁層 12・・・銅箔 13・・・ヒートシンク 15・・・半導体 20・・・多層プリント基板 20a・・・多層プリント基板部 21・・・固定部 30・・・接着層 10 ... Aluminum plate 11 ... Insulating layer 12 ... Copper foil 13 ... Heat sink 15 ... Semiconductor 20 ... Multilayer printed circuit board 20a ... Multilayer printed circuit board part 21 ... Fixed part 30 ... Adhesive layers
Claims (1)
覆した電気回路基板において、前記絶縁被覆上の一部に
多層プリント基板を固着し、前記絶縁不服上の前記多層
プリント基板が固着されていない部分に発熱素子を固着
することを特徴とする電気回路基板。1. An electric circuit board in which at least a part of a surface of a metal substrate is insulation-coated, a multi-layer printed board is fixed to a part of the insulation coating, and the multi-layer printed board on the insulation is not fixed. An electric circuit board having a heating element fixed to a portion thereof.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5211826A JPH0766514A (en) | 1993-08-26 | 1993-08-26 | Electric circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5211826A JPH0766514A (en) | 1993-08-26 | 1993-08-26 | Electric circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0766514A true JPH0766514A (en) | 1995-03-10 |
Family
ID=16612237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5211826A Pending JPH0766514A (en) | 1993-08-26 | 1993-08-26 | Electric circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0766514A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009075314A (en) * | 2007-09-20 | 2009-04-09 | Konica Minolta Opto Inc | Method of manufacturing retardation film, retardation film, polarizing plate using the same, and liquid crystal display device |
-
1993
- 1993-08-26 JP JP5211826A patent/JPH0766514A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009075314A (en) * | 2007-09-20 | 2009-04-09 | Konica Minolta Opto Inc | Method of manufacturing retardation film, retardation film, polarizing plate using the same, and liquid crystal display device |
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