JPH0765237B2 - Draining method - Google Patents
Draining methodInfo
- Publication number
- JPH0765237B2 JPH0765237B2 JP12275186A JP12275186A JPH0765237B2 JP H0765237 B2 JPH0765237 B2 JP H0765237B2 JP 12275186 A JP12275186 A JP 12275186A JP 12275186 A JP12275186 A JP 12275186A JP H0765237 B2 JPH0765237 B2 JP H0765237B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- work
- plating
- draining
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、液体を使用した行程の液切り方法に関する。TECHNICAL FIELD The present invention relates to a process drainage method using a liquid.
従来の液体を使用した行程、例えばメッキ行程における
液切り方法は、第2図及び第3図の如く、手または機械
的操作13によりワーク引掛治具1に振動を与えるか、第
4図の如くメッキ槽2上において一定時間静止し液を滴
下させ液切りを行う方法が一般的であった。The conventional process using a liquid, for example, the liquid removing method in the plating process, is as shown in FIGS. 2 and 3, by vibrating the work catching jig 1 by hand or mechanical operation 13, or by the process shown in FIG. The method in which the solution is drained by allowing the solution to stand still for a certain period of time on the plating tank 2 and draining the solution is common.
揺動による液切り方法では、ワーク引掛力の弱い治具か
らワークが落下してしまうという問題がある。また一定
時間静止させることにより液切りをする方法では、時間
をかけると液の乾燥による斑点が残ったり、時間を短く
すると充分な液切りができずメッキ槽外へのメッキ液の
持ち出しが多い等の問題があった。In the liquid draining method by rocking, there is a problem that the work is dropped from a jig having a weak work hooking force. Also, in the method of draining by leaving it stationary for a certain period of time, spots due to drying of the liquid remain over time, and if the time is shortened, sufficient draining cannot be performed and the plating liquid is often brought out of the plating tank. There was a problem.
本発明は、液体処理を行う行程において、ワークを表面
張力の影響を受ける速度で液面から露出させることを特
徴とする。The present invention is characterized in that in the process of performing liquid treatment, the work is exposed from the liquid surface at a speed affected by the surface tension.
また槽内のワークを20mm/sec以下で液面より上昇させる
ことを特徴とする。It is also characterized in that the work in the tank is raised above the liquid level at 20 mm / sec or less.
前記方法により、ワーク及びワーク引掛治具に付着した
液は、槽内の液と引き合い槽内に残ろうとする。この現
象によるワークの液が剥離し、ワーク及びワーク引掛治
具の残留液量が減少する。By the above method, the liquid adhering to the workpiece and the workpiece catching jig tries to remain in the attracting bath with the liquid in the bath. The liquid of the work is peeled off due to this phenomenon, and the residual liquid amount of the work and the work hooking jig is reduced.
以下に本発明をメッキ行程に用いた場合の実施例を図面
を用いて説明する。An embodiment in which the present invention is applied to a plating process will be described below with reference to the drawings.
第1図において、ワーク引掛治具1を入れるメッキ槽2
を設ける。このメッキ槽の外に逆L字型のフレーム4を
設置し、上部先端にモータ取り付け板7を固定する。更
にワーク引掛治具1を上下に移動させるためのピニオン
ラック5を有した回転速度調整可能な駆動用モータ6
を、モータ取り付け板に固定する。ピニオンラック5の
一端にワーク引掛治具1を吊るすフック8を取り付ける
ことにより、ワークのメッキ液3への出し入れが可能と
なる。In FIG. 1, a plating tank 2 in which a work hooking jig 1 is placed
To provide. An inverted L-shaped frame 4 is installed outside the plating tank, and a motor mounting plate 7 is fixed to the top end of the frame. Further, a drive motor 6 having a pinion rack 5 for moving the workpiece hooking jig 1 up and down and having an adjustable rotation speed
Is fixed to the motor mounting plate. By attaching a hook 8 for suspending the workpiece hooking jig 1 to one end of the pinion rack 5, the workpiece can be taken in and out of the plating liquid 3.
ピニオンラックをメッキ槽内のワーク引掛治具のハンド
ル部12の位置まで降下させ、フックをハンドル部に引っ
かけた後駆動用モータによりワークの引き上げを開始す
る。このときワークの上昇速度を20mm/sec以下で行う。
表面張力が働く結果、ワークの残留液量が少なくなる。
この引き上げは、ワーク引掛治具の最下端がメッキ槽内
の液面から離脱するまで行い、離脱終了後駆動用モータ
を停止する。以上によりワーク11及びワーク引掛治具の
液切りを行い、メッキ槽外への液の持ち出しを減少させ
ることができた。The pinion rack is lowered to the position of the handle portion 12 of the workpiece hooking jig in the plating tank, the hook is hooked on the handle portion, and then the work motor is started to be pulled up. At this time, the work rising speed should be 20 mm / sec or less.
As a result of the surface tension, the residual liquid amount of the work becomes small.
This lifting is carried out until the lowermost end of the workpiece catching jig is separated from the liquid surface in the plating tank, and the driving motor is stopped after the separation is completed. As described above, the work 11 and the work catching jig were drained, and the carry-out of the liquid to the outside of the plating tank could be reduced.
第5図は、シアン系金メッキ液、メッキ槽内の温度を30
±5℃の条件で、液切り装置を使用した場合のワーク残
留液量と引き上げ速度との関係図である。Fig. 5 shows the temperature of the cyan gold plating solution and the plating bath at 30
FIG. 9 is a relationship diagram between the amount of residual liquid of a work and the pulling rate when a liquid draining device is used under the condition of ± 5 ° C.
従来の方法であるメッキ槽上での一定時間静止による液
切り方法のワーク残留液量は、ワークを20mm/secで引き
上げた時点の残留液量と同程度であり、それ以上の速度
では本発明の効果は得られない。また引き上げ速度も実
用的には1mm/sec以上であることが必要であるため、望
ましい引き上げ速度は、残留液量の許容限度にもよるが
1〜5mm/secである。The residual liquid amount of the work of the conventional method, which is a stationary draining method on the plating tank for a certain period of time, is the same as the residual liquid amount when the work is pulled up at 20 mm / sec. Can not be obtained. Further, since the pulling rate is also required to be 1 mm / sec or more for practical use, the desirable pulling rate is 1 to 5 mm / sec depending on the allowable limit of the residual liquid amount.
以上のように液体の表面張力を利用して液切りを行うた
めに、振動によりワークが落下する等の問題もない。ま
た、一定時間停止させることによる液切り方法に比べワ
ークの残留液量を減少させることができる。実施例にお
いては、メッキ層において説明したが、メッキ液に限定
されるものではなく、通常の洗浄装置からの引き上げ等
にも応用することが可能である。また、ワークを引き上
げるのではなく、メッキ槽から液を抜くことにより相対
的に液面からワークを上昇させても良い。Since the liquid is drained by utilizing the surface tension of the liquid as described above, there is no problem that the work falls due to vibration. Further, the residual liquid amount of the work can be reduced as compared with the liquid draining method in which the work is stopped for a certain time. In the embodiments, the explanation has been made on the plating layer, but the present invention is not limited to the plating liquid, and can be applied to pulling up from a normal cleaning device. Further, instead of pulling up the work, the work may be relatively raised from the liquid surface by draining the liquid from the plating bath.
第1図は、本発明における液切り装置の側面図。第2
図、第3図、第4図は従来の液切り方法を示す図。第5
図は、ワーク残留液量と引き上げ速度との関係図。FIG. 1 is a side view of the liquid draining device according to the present invention. Second
FIGS. 3, 3 and 4 are views showing a conventional liquid draining method. Fifth
The figure shows the relationship between the residual liquid volume of the work and the pulling speed.
Claims (2)
面から露出させることを特徴とする液切り方法。1. A liquid draining method, wherein in a liquid draining step of a plating operation, a work is exposed from the liquid surface at a speed at which the liquid surface of the liquid is affected by surface tension.
ことを特徴とする特許請求の範囲第1項記載の液切り方
法。2. The liquid draining method according to claim 1, wherein in the liquid draining step of the plating operation, the speed of the work is raised above the liquid surface at 20 mm / sec or less.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12275186A JPH0765237B2 (en) | 1986-05-28 | 1986-05-28 | Draining method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12275186A JPH0765237B2 (en) | 1986-05-28 | 1986-05-28 | Draining method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62280400A JPS62280400A (en) | 1987-12-05 |
JPH0765237B2 true JPH0765237B2 (en) | 1995-07-12 |
Family
ID=14843699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12275186A Expired - Fee Related JPH0765237B2 (en) | 1986-05-28 | 1986-05-28 | Draining method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0765237B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017095762A (en) * | 2015-11-25 | 2017-06-01 | 三光製作株式会社 | Metal plating processing system |
JPWO2023032191A1 (en) * | 2021-09-06 | 2023-03-09 |
-
1986
- 1986-05-28 JP JP12275186A patent/JPH0765237B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPS62280400A (en) | 1987-12-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |