JPS62280400A - Method for removing solution - Google Patents
Method for removing solutionInfo
- Publication number
- JPS62280400A JPS62280400A JP12275186A JP12275186A JPS62280400A JP S62280400 A JPS62280400 A JP S62280400A JP 12275186 A JP12275186 A JP 12275186A JP 12275186 A JP12275186 A JP 12275186A JP S62280400 A JPS62280400 A JP S62280400A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- workpiece
- liquid
- amount
- soln
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 12
- 238000007747 plating Methods 0.000 claims abstract description 41
- 239000007788 liquid Substances 0.000 claims description 31
- 230000000694 effects Effects 0.000 description 6
- 235000008708 Morus alba Nutrition 0.000 description 1
- 240000000249 Morus alba Species 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
〔産業上の利用分野〕
本発明は、メッキ作業工程における液切り方法に関する
。Detailed Description of the Invention 3. Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a method for draining liquid in a plating process.
従来のメッキ作業における液切り方法は、第２図及び第
３図の如く、手又は機械的操作１３によりワーク引掛治
具に振動を与え、又は第４図の如くメッキ槽上において
一定時間静止し液を滴下させ、液切りを行なう方法が一
般的であった。The liquid draining method in conventional plating work involves applying vibration to the workpiece hooking jig by hand or mechanical operation 13, as shown in FIGS. A common method was to drip the liquid and drain it.
手又は機械的１桑作の振動による液切りについては、ワ
ーク引掛力の弱い治具からワーク落下が問題となり、メ
ッキ槽上での一定時間静止による液切りについては、十
分な液切りができずメッキの槽外へ持ち出しが、多くな
って１７まっていた。When removing liquid by hand or mechanical vibration due to mulberry plating, there is a problem of workpieces falling from jigs with weak work-holding force, and when removing liquid by standing still on the plating tank for a certain period of time, sufficient liquid removal cannot be achieved. The number of items taken out of the plating tank increased to 17.
そこで、本発明はこれらの欠点を解決するもので、メッ
キ槽上での一定時間静止によるもの以上の液切能力を有
し、ワーク引掛力の弱い冶具に対してもワークが落下せ
ず液切りができる事を、目的としている。Therefore, the present invention solves these drawbacks, and has a liquid draining ability that is greater than that achieved by standing still on the plating bath for a certain period of time, and can drain the liquid without dropping the workpiece even with a jig with a weak workpiece hooking force. The purpose is to do what is possible.
上記問題を解決する為に、本発明は液のもつ表面張力を
利用し、ワーク及びワーク引掛治具をメッキ槽内より２
０ ｎｍ／ｓｅｃ以下の速度で引き上げにより、ワーク
及びワーク引掛治具の残留液量を減少させる事を特徴と
する液切り方法である。第５図において、２０１■／ｓ
ｅｃの引き上げ速度におけるワークの残留液量は、従来
のメッキ槽上での一定時間静止による残留液量と同等で
あり、本発明の効果は２０ 盲５７ｓｅｃが分岐点とな
る。よって引き上げ速度２０ ｎ＋７ｓｅｃ以上におい
ては、メッキ槽上での一定時間静止による残留量と同等
となってしまい本発明の効果は得られない、又、引き上
げ速度の実用範囲はＬ ｗｍ／ｓｅｃ〜２０ ｎｍ／ｓ
ｅｃであり実用上置も好ましい範囲はｌ ｎｍ／ｓｅｅ
〜５ ｇ＋＋／ｓｅｃである。In order to solve the above problem, the present invention utilizes the surface tension of the liquid to move the workpiece and workpiece hooking jig from within the plating bath.
This liquid draining method is characterized by reducing the amount of liquid remaining in the workpiece and the workpiece hooking jig by pulling the workpiece at a speed of 0 nm/sec or less. In Figure 5, 201■/s
The amount of residual liquid on the workpiece at the pulling speed of EC is equivalent to the amount of residual liquid on the conventional plating bath when the workpiece remains stationary for a certain period of time, and the effect of the present invention reaches a turning point at 57 seconds. Therefore, at a pulling rate of 20 n+7 sec or more, the amount remaining is equivalent to the residual amount due to standing still on the plating tank for a certain period of time, and the effect of the present invention cannot be obtained, and the practical range of the pulling rate is L wm/sec to 20 nm. /s
ec, and the preferred range for practical use is l nm/see.
~5 g++/sec.
前記方法により、ワーク及びワーク引掛治具についた液
は、メッキ槽内の液と引き合い槽内に残ろうとする、こ
の現象がワーク及びワーク引掛治具より液を剥離させ、
ワーク及びワーク引掛治具の残留液量を減少させる。With the above method, the liquid attached to the workpiece and the workpiece hooking jig tends to remain in the plating tank and the liquid in the plating tank, and this phenomenon causes the liquid to separate from the workpiece and the workpiece hooking jig.
Reduces the amount of residual liquid in the workpiece and workpiece hooking jig.
以下に本発明の実施例を図面にて説明する。第１図にお
いて、ワーク引掛治具１を入れるメッキ槽２を設け、こ
のメッキ槽２裏に逆り字形状に構成されたフレーム４を
設置し、上部先端にモータ取り付は板７を固定する、更
にワーク引掛冶具１を上方に可動させる為のピニオンラ
ック５を有した回転速度調整可能な駆動用モータ６を、
モータ取り付は板７に固定する６次にピニオンラック５
の下方先端にワーク引掛治具１をつるすフック８を取り
付ける。このフック８を取り付けたピニオンラック５を
、メッキ槽２内のワーク引掛治具１のハンドル部１２位
置迄下降させ、駆動用モータ６を停止する、更にハンド
ル部１２にフック８を引掛は駆動用モータ６によりピニ
オンラック５を上方に２０ ｓ１１／ｓｅｃ以下の速度
で、ワーク引掛治具１の引き上げを開始する、この引き
上げは、ワーク引掛治具１の最下端がメッキ槽２内の液
面から離脱する巡行ない、離脱終了後、駆動用モータ６
を停止する０以上により、ワーク１１及びワーク引掛治
具１の表面の液切りを行ない、メッキＪ￥！２外へのメ
ッキ液３の持ち出しｉ減少を可能としている。第５図は
、液切り装置を使用した場合のワーク残留液量と引き上
げ速度との関係を表わす。Embodiments of the present invention will be described below with reference to the drawings. In Fig. 1, a plating tank 2 is provided in which a workpiece hooking jig 1 is placed, a frame 4 configured in an inverted shape is installed on the back side of the plating tank 2, and a plate 7 for mounting a motor is fixed to the top end of the plating tank 2. , furthermore, a drive motor 6 having an adjustable rotation speed and having a pinion rack 5 for moving the workpiece hooking jig 1 upward,
The motor is mounted on the pinion rack 5, which is fixed to the plate 7.
A hook 8 for hanging the workpiece hooking jig 1 is attached to the lower end of the hook. The pinion rack 5 with this hook 8 attached is lowered to the position of the handle part 12 of the workpiece hooking jig 1 in the plating tank 2, the drive motor 6 is stopped, and the hook 8 is hooked to the handle part 12. The motor 6 moves the pinion rack 5 upward at a speed of 20 s11/sec or less to start lifting the workpiece hooking jig 1. After the departure cruise, after the departure, the drive motor 6
By stopping 0 or more, drain the liquid from the surfaces of the workpiece 11 and the workpiece hooking jig 1, and plating J￥! 2, it is possible to reduce the amount of plating solution 3 carried out to the outside. FIG. 5 shows the relationship between the amount of liquid remaining on the workpiece and the lifting speed when a liquid draining device is used.
従来の方法であるメッキ槽上での一定時間静止による液
切り方法のワーク残留液量は、本発明の２３Ｎ／ｓｅｃ
の引き上げ速度時点の、残留／（！量と同等であり２０
ｍ／ｓｅｅ以上では本発明の効果は得られない。よっ
てメッキ槽上での、一定時間静止による液切以上の能力
を有し、メッキ液の槽外持ち出し１減少効果を出す為に
は、本発明の引き上げ速度を、２０ ＋ｎ／ｓｅｃ以下
とする必要がある、又実施例におけるメッキ槽内の温度
は、３０℃±５℃であり、メッキ液は、シアン系金メッ
キ液を使用している。The amount of liquid remaining on the workpiece in the conventional method of draining the liquid by standing still on the plating tank for a certain period of time is 23N/sec in the present invention.
It is equivalent to the residual/(! amount at the pulling speed of 20
m/see or more, the effect of the present invention cannot be obtained. Therefore, in order to have the ability to drain the plating solution by standing still for a certain period of time on the plating tank, and to achieve the effect of reducing plating solution taken out of the tank by 1, the pulling speed of the present invention needs to be 20 + n/sec or less. In addition, the temperature inside the plating tank in the example is 30°C±5°C, and the plating solution is a cyan-based gold plating solution.
本発明は、以上の説明のとおり、液の表面張力を利用し
、モータ等による簡単な引き上げ装置を組み込み、遅速
にて、ワーク及びワーク引■ト冶具をメッキ液（槽）中
より引き上げる為、強い振動等の外力により、ワーク引
掛治具よりワークが落下する事もなく、ワーク及びワー
ク引掛治具の残留液量を減少でき、メッキ槽外へのメッ
キ液の持ち出しを減少させる効果がある。As explained above, the present invention utilizes the surface tension of the liquid and incorporates a simple lifting device such as a motor to slowly pull up the workpiece and workpiece pulling jig from the plating liquid (tank). The workpiece does not fall from the workpiece hooking jig due to external forces such as strong vibrations, and the amount of liquid remaining on the workpiece and the workpiece hooking jig can be reduced, which has the effect of reducing the plating solution carried out of the plating tank.
第１図は、本発明における液切り装置の側面図。
第２図、第３図、第４図は、従来の液切り方法の側面図
。第５図は、本発明における、ワーク残留液量と引き上
げ速度との関係図。
以 上
出願人 セイコーエプソン株式会社
第 １ 図
図面の浄Ｘ（内容に変更なし）
第５図
手続補正８〔方式〕
昭和 ６Ｐ ｓ月 ２７日
１、事件の表示
昭和６１年 特許願 第１２２７５１、発明の名称
液 切 シ 方 法
１ 補正をする考
４、代 理 人FIG. 1 is a side view of the liquid draining device according to the present invention. 2, 3, and 4 are side views of the conventional liquid draining method. FIG. 5 is a diagram showing the relationship between workpiece residual liquid amount and lifting speed in the present invention. Applicant Seiko Epson Co., Ltd. Figure 1 Drawing X (No change in content) Figure 5 Procedural amendment 8 [Method] Showa 6Ps Month 27, 1, Case indication 1988 Patent application No. 122751, Invention Method 1 Amendment idea 4, agent
Claims (1)
でワーク及びワーク引掛治具と、液の表面張力を利用し
ながらメッキ液（槽）中より引き上げる事を特徴とする
液切り方法。A liquid draining method characterized in that, in a plating work process, a workpiece and a workpiece hooking jig are used to lift the workpiece out of the plating liquid (tank) at a speed of 20 nm/sec or less using the surface tension of the liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12275186A JPH0765237B2 (en) | 1986-05-28 | 1986-05-28 | Draining method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12275186A JPH0765237B2 (en) | 1986-05-28 | 1986-05-28 | Draining method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62280400A true JPS62280400A (en) | 1987-12-05 |
| JPH0765237B2 JPH0765237B2 (en) | 1995-07-12 |
Family
ID=14843699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12275186A Expired - Fee Related JPH0765237B2 (en) | 1986-05-28 | 1986-05-28 | Draining method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0765237B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017095762A (en) * | 2015-11-25 | 2017-06-01 | 三光製作株式会社 | Metal plating processing system |
| WO2023032191A1 (en) * | 2021-09-06 | 2023-03-09 | 株式会社荏原製作所 | Plating method and plating apparatus |
-
1986
- 1986-05-28 JP JP12275186A patent/JPH0765237B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017095762A (en) * | 2015-11-25 | 2017-06-01 | 三光製作株式会社 | Metal plating processing system |
| WO2023032191A1 (en) * | 2021-09-06 | 2023-03-09 | 株式会社荏原製作所 | Plating method and plating apparatus |
| JPWO2023032191A1 (en) * | 2021-09-06 | 2023-03-09 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0765237B2 (en) | 1995-07-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |